DE69423833D1 - In Situ gebildete elektromagnetische Dichtungen - Google Patents

In Situ gebildete elektromagnetische Dichtungen

Info

Publication number
DE69423833D1
DE69423833D1 DE69423833T DE69423833T DE69423833D1 DE 69423833 D1 DE69423833 D1 DE 69423833D1 DE 69423833 T DE69423833 T DE 69423833T DE 69423833 T DE69423833 T DE 69423833T DE 69423833 D1 DE69423833 D1 DE 69423833D1
Authority
DE
Germany
Prior art keywords
situ
seals formed
electromagnetic seals
electromagnetic
seals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69423833T
Other languages
English (en)
Other versions
DE69423833T2 (de
Inventor
John P Kalinoski
Michael H Bunyan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Parker Hannifin Corp
Original Assignee
Parker Hannifin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Parker Hannifin Corp filed Critical Parker Hannifin Corp
Publication of DE69423833D1 publication Critical patent/DE69423833D1/de
Application granted granted Critical
Publication of DE69423833T2 publication Critical patent/DE69423833T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0015—Gaskets or seals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16J—PISTONS; CYLINDERS; SEALINGS
    • F16J15/00—Sealings
    • F16J15/02—Sealings between relatively-stationary surfaces
    • F16J15/06—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces
    • F16J15/064—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces the packing combining the sealing function with other functions
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16J—PISTONS; CYLINDERS; SEALINGS
    • F16J15/00—Sealings
    • F16J15/02—Sealings between relatively-stationary surfaces
    • F16J15/14—Sealings between relatively-stationary surfaces by means of granular or plastic material, or fluid
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256—Heavy metal or aluminum or compound thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/30—Self-sustaining carbon mass or layer with impregnant or other layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y10T428/31605—Next to free metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y10T428/31609—Particulate metal or metal compound-containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31786—Of polyester [e.g., alkyd, etc.]
DE69423833T 1993-09-10 1994-09-05 In Situ gebildete elektromagnetische Dichtungen Expired - Lifetime DE69423833T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11940393A 1993-09-10 1993-09-10

Publications (2)

Publication Number Publication Date
DE69423833D1 true DE69423833D1 (de) 2000-05-11
DE69423833T2 DE69423833T2 (de) 2000-10-12

Family

ID=22384234

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69423833T Expired - Lifetime DE69423833T2 (de) 1993-09-10 1994-09-05 In Situ gebildete elektromagnetische Dichtungen

Country Status (9)

Country Link
US (4) US6096413A (de)
EP (2) EP0643551B1 (de)
JP (1) JPH0796962A (de)
CA (1) CA2129073C (de)
DE (1) DE69423833T2 (de)
ES (1) ES2145103T3 (de)
FI (1) FI944154A (de)
NO (1) NO313260B1 (de)
WO (1) WO1995007603A1 (de)

Families Citing this family (101)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4319965C3 (de) 1993-06-14 2000-09-14 Emi Tec Elektronische Material Verfahren zur Herstellung eines Gehäuses mit elektromagnetischer Abschirmung
US6303180B1 (en) 1993-09-10 2001-10-16 Parker-Hannifin Corporation Form-in-place EMI gaskets
CA2129073C (en) * 1993-09-10 2007-06-05 John P. Kalinoski Form-in-place emi gaskets
DE4340108C3 (de) * 1993-11-22 2003-08-14 Emi Tec Elektronische Material Abschirmelement und Verfahren zu dessen Herstellung
US5811050A (en) * 1994-06-06 1998-09-22 Gabower; John F. Electromagnetic interference shield for electronic devices
US6635354B2 (en) 1995-01-20 2003-10-21 Parker-Hannifin Corporation Form-in place EMI gaskets
US5910524A (en) * 1995-01-20 1999-06-08 Parker-Hannifin Corporation Corrosion-resistant, form-in-place EMI shielding gasket
CN1099223C (zh) * 1996-08-01 2003-01-15 赫尔穆特·卡尔 一种电磁屏蔽密封件的制造方法
TW486238U (en) 1996-08-18 2002-05-01 Helmut Kahl Shielding cap
US6051779A (en) * 1996-11-21 2000-04-18 Ericsson Inc. Shield can with integrally molded gasket
TW355163B (en) * 1997-01-23 1999-04-01 Shiyouritsu Plast Kogyo Kk Sheet-like laminate and preparation thereof
TR199902208T2 (xx) 1997-03-05 2000-06-21 Tiburtius Bernd Blendajl� bir g�vdenin olu�turulmas�na ili�kin metod.
DK1055356T3 (da) * 1998-02-09 2002-04-02 Helmut Kahl Hus
DE19833063A1 (de) * 1998-07-22 2000-02-03 Reinz Dichtungs Gmbh Lösemittelfreier applizierbarer wärmehärtender Beschichtungsstoff
FR2783588B1 (fr) * 1998-09-18 2000-11-24 Axo Scintex Cie Equip Automobi Procede de realisation de joints le long d'une arete
US20070137653A1 (en) * 2000-03-13 2007-06-21 Wood Thomas J Ventilation interface for sleep apnea therapy
NL1011718C2 (nl) * 1999-04-01 2000-10-03 Beele Eng Bv Elektrisch geleidende pasta.
US6223603B1 (en) * 1999-05-18 2001-05-01 Texas Instruments Incorporated Capacitive pressure transducer having reduced output error
KR200182519Y1 (ko) * 1999-12-24 2000-05-15 익스팬전자주식회사 클립형 도전성 개스킷
US6483023B1 (en) * 2000-01-04 2002-11-19 Fujitsu Network Communications, Inc. Fabric wrapped over spring EMI gasket
US20020046849A1 (en) * 2000-01-24 2002-04-25 Rapp Martin L. Methods and apparatus for EMI shielding
US6475933B1 (en) * 2000-01-27 2002-11-05 Northrop Grumman Corporation Highly conductive elastomeric sheet
BR0017076B1 (pt) 2000-02-18 2014-09-02 Parker Hannifin Corp Método de fabricação de gaxeta de blindagem emi de formação no lugar, de força de fechamento baixa
AU2001241847A1 (en) * 2000-02-28 2001-09-12 Amesbury Group, Inc. Methods and apparatus for emi shielding
US6652777B2 (en) 2000-02-28 2003-11-25 Amesbury Group, Inc. Method and apparatus for EMI shielding
SE517978C2 (sv) * 2000-03-03 2002-08-13 Ericsson Telefon Ab L M Elektriskt ledande beläggningsarrangemang
US6787221B2 (en) 2000-03-24 2004-09-07 Chemque Incorporated Co-dispensed compositions for gaskets and other objects
US20010033478A1 (en) * 2000-04-21 2001-10-25 Shielding For Electronics, Inc. EMI and RFI shielding for printed circuit boards
US6625025B1 (en) * 2000-07-10 2003-09-23 Nortel Networks Limited Component cooling in electronic devices
US6768654B2 (en) * 2000-09-18 2004-07-27 Wavezero, Inc. Multi-layered structures and methods for manufacturing the multi-layered structures
US6348654B1 (en) 2000-10-12 2002-02-19 Parker-Hannifin Corporation Compound waveform gasket for low closure force EMI shielding applications
US6670017B2 (en) 2000-12-14 2003-12-30 3M Innovative Properties Company Photocurable form-in-place gasket for electronic applications
US6346330B1 (en) 2000-12-14 2002-02-12 3M Innovative Properties Company Form-in-place gasket for electronic applications
DE10064968B4 (de) * 2000-12-23 2006-01-19 Helmut Kahl Verfahren zur Herstellung einer Abschirmdichtung
US20060119046A1 (en) * 2000-12-23 2006-06-08 Helmut Kahl Method for producing a shielding gasket
JP2002198678A (ja) * 2000-12-26 2002-07-12 Inoac Corp 電磁波シールド用筐体およびその製造方法
US6850387B2 (en) * 2001-01-17 2005-02-01 Seagate Technology Llc Form-in-place gasket height variability control for a disc drive
US6595525B2 (en) 2001-01-25 2003-07-22 Glen D. Schmidt Attachable sealant bead and strip for use with a vehicle part
EP1399928B1 (de) 2001-04-06 2012-06-13 World Properties, Inc. Elelktrisch leitfähige silikondichtungen und verfahren zu ihrer herstellung
EP1386527A1 (de) 2001-05-10 2004-02-04 Parker Hannifin Corporation Herstellung eines gehäuses für elektronik mit einer metallisierten schutzschicht
WO2002093997A1 (en) 2001-05-11 2002-11-21 Parker Hannifin Corporation Notched gasket for low closure force emi shielding applications
US6836409B1 (en) * 2001-07-10 2004-12-28 Nortel Networks Limited Component cooling in electronic devices
US6809254B2 (en) 2001-07-20 2004-10-26 Parker-Hannifin Corporation Electronics enclosure having an interior EMI shielding and cosmetic coating
US20030091777A1 (en) * 2001-08-14 2003-05-15 Peter Jones Clean release tape for EMI shielding
WO2003030610A1 (en) 2001-10-02 2003-04-10 Parker Hannifin Corporation Emi shielding gasket construction
EP1345485A3 (de) * 2002-03-11 2006-04-19 Helmut Kahl Gerätegehäuse mit einem elektromagnetisch abgeschirmten Raumbereich
CN1444439A (zh) * 2002-03-11 2003-09-24 赫尔穆特·卡尔 带有导电涂覆的屏蔽密封层或屏蔽壁的设备罩
US6723916B2 (en) 2002-03-15 2004-04-20 Parker-Hannifin Corporation Combination EMI shielding and environmental seal gasket construction
US7208192B2 (en) 2002-05-31 2007-04-24 Parker-Hannifin Corporation Thermally or electrically-conductive form-in-place gap filter
US6663431B1 (en) * 2002-08-30 2003-12-16 International Business Machines Corporation Shielding in a power connector
US8119191B2 (en) 2003-01-16 2012-02-21 Parker-Hannifin Corporation Dispensable cured resin
WO2005020228A1 (en) * 2003-08-14 2005-03-03 Seagate Technology Llc Base deck with formed-in-place gaskets and impact dissipation members for a data storage device
US7372662B2 (en) * 2003-08-14 2008-05-13 Seagate Technology Llc Base deck with formed-in-place gaskets and impact dissipation members for a data storage device
US7294919B2 (en) * 2003-11-26 2007-11-13 Avago Technologies General Ip (Singapore) Pte. Ltd. Device having a complaint element pressed between substrates
JP2005187793A (ja) * 2003-12-24 2005-07-14 Rohm & Haas Electronic Materials Llc 改良された接着剤
US20050236171A1 (en) * 2004-04-23 2005-10-27 Garcia Jorge L Shield frame for a radio frequency shielding assembly
US20060012070A1 (en) * 2004-07-13 2006-01-19 Nordson Corporation Gasket assembly
US7087835B2 (en) * 2004-10-19 2006-08-08 Bi-Link Metal Specialties Inc. Apparatus and method for shielding printed circuit boards
TWI381399B (zh) * 2005-07-12 2013-01-01 Sulzer Metco Canada Inc 性能增進之導電性填料及由該填料製成的聚合物
US7968012B2 (en) 2005-11-23 2011-06-28 Laird Technologies, Inc. Method and apparatus for EMI shielding
US7518880B1 (en) 2006-02-08 2009-04-14 Bi-Link Shielding arrangement for electronic device
EP1999529B1 (de) * 2006-03-28 2014-07-16 Parker-Hannifin Corporation Dispensierbares gehärtetes harz
JP4397390B2 (ja) * 2006-10-20 2010-01-13 行雄 土屋 パッキン付き製造蓋の製造方法及び製造装置
CN101600758B (zh) * 2007-02-06 2012-07-04 环球产权公司 导电聚合物泡沫及其制造方法和用途
US20080280040A1 (en) * 2007-03-28 2008-11-13 Jeffery Barrall Gasket Formed From Various Materials And Methods Of Making Same
US8216418B2 (en) * 2007-06-13 2012-07-10 Lam Research Corporation Electrode assembly and plasma processing chamber utilizing thermally conductive gasket and o-rings
KR101399920B1 (ko) * 2007-09-13 2014-05-28 헨켈 아게 운트 코. 카게아아 전기 전도성 조성물
KR20100061672A (ko) * 2007-10-02 2010-06-08 파커-한니핀 코포레이션 Ｅｍｉ 가스켓용 나노 코팅
US8152954B2 (en) * 2007-10-12 2012-04-10 Lam Research Corporation Showerhead electrode assemblies and plasma processing chambers incorporating the same
US8187414B2 (en) 2007-10-12 2012-05-29 Lam Research Corporation Anchoring inserts, electrode assemblies, and plasma processing chambers
US8187413B2 (en) * 2008-03-18 2012-05-29 Lam Research Corporation Electrode assembly and plasma processing chamber utilizing thermally conductive gasket
US8679288B2 (en) 2008-06-09 2014-03-25 Lam Research Corporation Showerhead electrode assemblies for plasma processing apparatuses
DE102008028259A1 (de) * 2008-06-13 2009-12-17 Bmdsys Gmbh Verfahren zur Verbindung hochpermeabler Teile einer magnetischen Abschirmung
US8449679B2 (en) 2008-08-15 2013-05-28 Lam Research Corporation Temperature controlled hot edge ring assembly
US20100257732A1 (en) * 2009-04-14 2010-10-14 Ziberna Frank J Shielding Arrangement for Electronic Device
BR112012000203B1 (pt) * 2009-06-12 2020-01-28 Lord Corp método para proteção de um substrato contra relâmpagos
WO2011019719A1 (en) 2009-08-12 2011-02-17 Parker-Hannifin Corporation Fully-cured thermally or electrically-conductive form-in-place gap filler
WO2011041379A1 (en) * 2009-09-29 2011-04-07 Hyperion Catalysis International, Inc. Gasket containing carbon nanotubes
MX2012003346A (es) * 2009-10-02 2012-04-20 Saint Gobain Performance Plast Sello modular de polimero de interferencia electromagnetica/interf erencia de radiofrecuencia (emi/rfi).
JP5532948B2 (ja) * 2010-01-19 2014-06-25 株式会社島津製作所 Ｘ線検出器
KR20140048134A (ko) * 2011-05-23 2014-04-23 쓰리엠 이노베이티브 프로퍼티즈 컴파니 전자기 차폐 개스킷 및 그 제조 방법
DE102011054759A1 (de) * 2011-10-24 2013-04-25 Boris Lutterbach Radiofrequenz-Abschirmungsanordnung für eine elektrodenlose Plasma-Beleuchtungsvorrichtung sowie elektrodenlose Plasma-Beleuchtungsvorrichtung und Herstellungsverfahren dafür
CN103999165B (zh) 2011-12-15 2016-12-07 西门子公司 用于制造电晕防护部的方法、快速硬化的电晕防护系统和电机械
DE102012202225B4 (de) * 2012-02-14 2015-10-22 Te Connectivity Germany Gmbh Steckergehäuse mit Dichtung
EP2645540A1 (de) * 2012-03-28 2013-10-02 Siemens Aktiengesellschaft Glimmschutzwerkstoff für eine elektrische Maschine
FR2993894B1 (fr) * 2012-07-25 2014-08-01 Hutchinson Composition de caoutchouc a base d'un elastomere silicone et d'un mcp, son procede de preparation, element souple et systeme de controle/regulation thermique l'incorporant.
KR101266390B1 (ko) * 2012-10-05 2013-05-22 주식회사 엘엠에스 열전도 조성물 및 시트
KR101266391B1 (ko) * 2012-10-17 2013-05-22 주식회사 엘엠에스 피복 입자, 이를 포함하는 조성물 및 열전달 시트
US9662258B2 (en) * 2013-05-21 2017-05-30 N.M. Beale Company, Inc. Patient colonoscopy abdominal compression device and method
CN104324866B (zh) * 2013-07-22 2016-05-11 泰科电子(上海)有限公司 在工件的凹槽中注入密封胶的方法
CN106659895B (zh) * 2014-07-11 2019-06-25 心脏起搏器股份公司 用于慢性可植入装置的聚合物馈通件
WO2016182643A1 (en) * 2015-05-08 2016-11-17 Laird Technologies, Inc. Soft and/or flexible board level shields and related methods
CN105400204A (zh) * 2015-12-24 2016-03-16 平湖阿莱德实业有限公司 一种电磁屏蔽体及其制备方法
US10389397B2 (en) 2016-07-26 2019-08-20 Laird Technologies, Inc. Small form-factor pluggable (SFP) transceivers
US10965333B2 (en) 2016-07-26 2021-03-30 Laird Technologies, Inc. Thermal management assemblies suitable for use with transceivers and other devices
MY197716A (en) * 2018-09-17 2023-07-10 Halliburton Energy Services Inc Two part bonded seal for static downhole tool applications
US11437328B2 (en) 2019-05-16 2022-09-06 Qualcomm Incorporated Device thermal management
US11483948B2 (en) 2019-08-28 2022-10-25 Laird Technologies, Inc. Thermal interface materials including memory foam cores
US11276436B1 (en) 2021-01-05 2022-03-15 Seagate Technology Llc Corrosive gas reduction for electronic devices
TW202302722A (zh) 2021-03-04 2023-01-16 美商摩曼帝夫特性材料公司 散熱凝膠組合物
DE102022207527A1 (de) 2022-07-22 2024-01-25 Volkswagen Aktiengesellschaft Dichtungsanordnung in einem Elektronikgehäuse

Family Cites Families (90)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3126440A (en) * 1964-03-24 Shielding and sealing gasket material
US2796457A (en) * 1952-06-23 1957-06-18 Walter E Stinger R-f gasket for radio interference attenuation
DE1047439B (de) 1953-12-21 1958-12-24 Dow Corning Verfahren zur Herstellung neuer fluorhaltiger Organopolysiloxane
US3032528A (en) * 1959-02-20 1962-05-01 Wacker Chemie Gmbh Silicone elastomers
US3140342A (en) * 1963-07-05 1964-07-07 Chomerics Inc Electrical shielding and sealing gasket
US3752899A (en) * 1970-05-25 1973-08-14 Metex Corp Shielding and gasketing material
FR2188910A5 (de) * 1972-06-09 1974-01-18 Ducros Emile
US3880627A (en) * 1973-07-02 1975-04-29 Donaldson Co Inc Filter with integral housing
US4011360A (en) * 1974-04-10 1977-03-08 Chomerics, Inc. Electrically conductive silicone rubber stock
US4037009A (en) * 1976-08-11 1977-07-19 Metex Corporation Conductive elastomeric elements
GB1600710A (en) * 1977-06-30 1981-10-21 Chomerics Inc Corrosion resistant electromagnetic energy shielding gasket
US4227037A (en) * 1979-05-29 1980-10-07 Gulf & Western Manufacturing Company Shielded non-metallic container
US4295573A (en) * 1979-12-21 1981-10-20 Nordson Corporation Method of obtaining a seal upon the interior surface of a container closure and resulting product
FR2480488A1 (fr) * 1980-04-15 1981-10-16 Eaton Manford Liant thermiquement conducteur et isolant electriquement pour composants electriques et electroniques, et son procede de fabrication
US4769280A (en) * 1980-12-22 1988-09-06 Chomerics, Inc. Electromagnetic shielding
US4434541A (en) * 1980-12-22 1984-03-06 Chomerics, Inc. Electromagnetic shielding
US4507359A (en) * 1980-12-22 1985-03-26 Chomerics, Inc. Electromagnetic shielding
GB2115084A (en) * 1981-12-23 1983-09-01 Plessey Co Plc A method of sealing a joint
US4596669A (en) * 1981-12-24 1986-06-24 Mitech Corporation Flame retardant thermoplastic molding compositions of high electroconductivity
NL193609C (nl) * 1981-12-30 2000-04-04 Bekaert Sa Nv Samengestelde streng voor verwerking als granulaat in kunststofproducten en werkwijze voor het vervaardigen van een kunststofmenggranulaat.
US4882089A (en) * 1982-03-16 1989-11-21 American Cyanamid Company Compositions convertible to reinforced conductive components and articles incorporating same
US4662967A (en) * 1983-01-05 1987-05-05 Bogan John J Method of making a gasket for an electronics enclosure to help keep out electrical interference
US4643924A (en) * 1985-03-25 1987-02-17 Raychem Corporation Protective article comprising an elastic gel
US4865905A (en) * 1983-06-23 1989-09-12 Raychem Corporation Article for protection of a substrate
US4690831A (en) * 1983-06-23 1987-09-01 Raychem Corp. Protective article
US4779762A (en) * 1984-05-30 1988-10-25 Nordson Corporation Method and apparatus for controlling the gas content of dispensed hot melt thermoplastic adhesive foam
IT1182305B (it) * 1984-10-01 1987-10-05 Tako Spa Procedimento di fabbricazione di guarnizioni di tenuta e prodotto ottenuto col procedimento
IT1180102B (it) * 1984-10-22 1987-09-23 Tako Spa Procedimento per la fabbricazione di guarnizioni di tenuta rinforzate e prodotto ottenuto col procedimento
EP0200296A3 (de) * 1985-02-22 1987-01-14 LOCTITE (IRELAND) Ltd. Verfahren und Vorrichtung zum Aufbringen einer härtbaren zweiteiligen Zusammensetzung auf eine Substratoberfläche
DE3507720C2 (de) * 1985-03-05 1997-08-14 Rieter Automotive Int Ag Verfahren und Vorrichtung zum Herstellen eines Rohlings aus glasfaserverstärktem Kunststoff
US4678863A (en) * 1985-06-27 1987-07-07 Rca Corporation Corrosion resistant conductive elastomers
US4915985A (en) * 1985-08-05 1990-04-10 Allied-Signal Inc. Process for forming articles of filled intrinsically conductive polymers
US4734140A (en) * 1985-08-06 1988-03-29 Chomerics, Inc. Heat treatment of electromagnetic shielding composition
US4678716A (en) * 1985-08-06 1987-07-07 Chomerics, Inc. Electromagnetic shielding
JPH0718080Y2 (ja) 1985-12-11 1995-04-26 信越化学工業株式会社 固定ディスク装置用カバ−
GB8607976D0 (en) * 1986-04-01 1986-05-08 Dowty Seals Ltd Seal/gasket
US4900877A (en) * 1987-01-13 1990-02-13 Raychem Corporation Shielding and sealing gaskets
US5047260A (en) * 1987-02-06 1991-09-10 Key-Tech, Inc. Method for producing a shielded plastic enclosure to house electronic equipment
JPH073086Y2 (ja) 1987-03-05 1995-01-30 日産自動車株式会社 シ−ル構造
US4861643A (en) * 1987-03-13 1989-08-29 The Boeing Company Aerospace structure having a cast-in-place noncompressible void filler
US4960612A (en) * 1987-07-02 1990-10-02 At&T Bell Laboratories Thermal conductor assembly method
US4869954A (en) * 1987-09-10 1989-09-26 Chomerics, Inc. Thermally conductive materials
US4857666A (en) 1987-09-11 1989-08-15 Uop Alkylation/transalkylation process
US5250607A (en) * 1988-01-05 1993-10-05 Norton Company Moisture cured elastomeric interpenetrating network sealants
CA1336461C (en) * 1988-01-05 1995-07-25 Ahmet Comert Moisture curable hot melt elastomers
DE3810598A1 (de) * 1988-03-29 1989-10-12 Bayer Ag Metallfasern enthaltende verbundstoffe sowie deren verwendung zur herstellung von formteilen zur abschirmung von elektromagnetischer strahlung
US4857668A (en) * 1988-04-15 1989-08-15 Schlegel Corporation Multi-function gasket
US4931326A (en) * 1988-04-25 1990-06-05 Davlyn Manufacturing Co., Inc. Reinforced flexible plastic tubing and methods of manufacture
US5049332A (en) * 1988-06-08 1991-09-17 Akzo Nv Method of making conductive metal-filled substrates without developing agents
US4948922A (en) * 1988-09-15 1990-08-14 The Pennsylvania State University Electromagnetic shielding and absorptive materials
JPH0817278B2 (ja) * 1988-10-26 1996-02-21 北川工業株式会社 電磁波シールド用ガスケット
JPH0787275B2 (ja) * 1988-10-28 1995-09-20 北川工業株式会社 導電性シール材
JPH02124990A (ja) * 1988-11-02 1990-05-14 Kitagawa Kogyo Kk 炭素繊維配合シール材組成物
US4931479B1 (en) * 1988-11-07 2000-10-10 Parker Intangibles Inc Foam in place conductive polyurethane foam
US5107070A (en) * 1988-11-10 1992-04-21 Vanguard Products Corporation Dual elastomer gasket for protection against magnetic interference
US5068493A (en) * 1988-11-10 1991-11-26 Vanguard Products Corporation Dual elastomer gasket shield for electronic equipment
US4964362A (en) * 1988-12-13 1990-10-23 Gilbert Dominguez Applicator for motor vehicle glass adhesives and sealants
US5045625A (en) 1989-02-21 1991-09-03 Hoechst Celanese Corp. Thermosetting polyimide prepolymers
US5045635A (en) * 1989-06-16 1991-09-03 Schlegel Corporation Conductive gasket with flame and abrasion resistant conductive coating
JPH0337482A (ja) 1989-07-03 1991-02-18 Shin Etsu Chem Co Ltd ハードディスク装置用カバー・パッキン組立体の製造方法
IE892231A1 (en) * 1989-07-11 1991-06-19 Loctite Ireland Ltd Method of forming gaskets by injection and compositions for¹use therein
US4977295A (en) * 1989-07-28 1990-12-11 Raytheon Company Gasket impervious to electromagnetic energy
US5164136A (en) * 1989-09-08 1992-11-17 Norton Company Method for forming flexible gaskets
US5061566A (en) * 1989-12-28 1991-10-29 Chomerics, Inc. Corrosion inhibiting emi/rfi shielding coating and method of its use
JPH0767784B2 (ja) * 1990-10-11 1995-07-26 信越化学工業株式会社 シリコーンゴム積層体及びその製造方法
US5115104A (en) * 1991-03-29 1992-05-19 Chomerics, Inc. EMI/RFI shielding gasket
JP2612979B2 (ja) 1991-07-25 1997-05-21 信越化学工業株式会社 ハードディスク装置用カバー・パッキング組立体
US5340847A (en) 1991-10-23 1994-08-23 Three Bond Co., Ltd. Curable silicon composition
JPH05125284A (ja) 1991-10-23 1993-05-21 Three Bond Co Ltd 硬化性シリコーン組成物
CA2080177C (en) * 1992-01-02 1997-02-25 Edward Allan Highum Electro-magnetic shield and method for making the same
US5202536A (en) * 1992-02-03 1993-04-13 Schlegel Corporation EMI shielding seal with partial conductive sheath
US5364574A (en) * 1992-04-02 1994-11-15 The United States Of America As Represented By The Secretary Of The Navy Method of forming a corrosion-resistant EMI shielding gasket between graphite and metal components
JP2538822B2 (ja) 1992-04-10 1996-10-02 信越化学工業株式会社 ハ―ドディスク装置用カバ―パッキン組立体及びその製造方法
US5366664A (en) 1992-05-04 1994-11-22 The Penn State Research Foundation Electromagnetic shielding materials
DE4219915A1 (de) * 1992-06-17 1993-12-23 Linde Ag Herstellung von Spritzgußteilen aus thermoplastischen Kunststoffen
IT1255364B (it) * 1992-09-15 1995-10-31 Himont Inc Processo per la preparazione di manufatti in polipropilene espanso mediante produzione di granuli pre-espansi e termoformatura per sinterizzazione degli stessi
JP2713059B2 (ja) * 1992-10-07 1998-02-16 三菱電機株式会社 電子部品または電子機器を収納する箱または蓋からなる筺体の製造方法。
DE4237217A1 (de) * 1992-11-04 1994-05-05 Spiess Kunststoff Recycling Verfahren und Anlage zum Befüllen einer oder mehrerer geschlossener Gießformen durch dosierte Intrusion plastifizierten Kunststoffes
JP2713093B2 (ja) * 1993-04-13 1998-02-16 信越化学工業株式会社 導電性シリコーンゴム組成物
AU672499B2 (en) * 1993-06-14 1996-10-03 Emi-Tec Elektronische Materialien Gmbh A process for producing a casing providing a screen against electromagnetic radiation
DE4319965C3 (de) 1993-06-14 2000-09-14 Emi Tec Elektronische Material Verfahren zur Herstellung eines Gehäuses mit elektromagnetischer Abschirmung
US6303180B1 (en) * 1993-09-10 2001-10-16 Parker-Hannifin Corporation Form-in-place EMI gaskets
CA2129073C (en) * 1993-09-10 2007-06-05 John P. Kalinoski Form-in-place emi gaskets
US6261508B1 (en) * 1994-04-01 2001-07-17 Maxwell Electronic Components Group, Inc. Method for making a shielding composition
US5910524A (en) * 1995-01-20 1999-06-08 Parker-Hannifin Corporation Corrosion-resistant, form-in-place EMI shielding gasket
US5641438A (en) * 1995-01-24 1997-06-24 Bunyan; Michael H. Method for forming an EMI shielding gasket
JPH0912892A (ja) 1995-07-04 1997-01-14 Toray Dow Corning Silicone Co Ltd 現場成形ガスケット用シリコーンゴム組成物
US5658509A (en) * 1995-11-06 1997-08-19 Ford Motor Company Method for forming a recyclable seal on an automotive climate control system door
TW486238U (en) * 1996-08-18 2002-05-01 Helmut Kahl Shielding cap
US6173970B1 (en) * 1998-10-02 2001-01-16 Instrument Specialties Co., Inc. Gasket and method of making a gasket

Also Published As

Publication number Publication date
FI944154A0 (fi) 1994-09-09
EP0643552A1 (de) 1995-03-15
WO1995007603A1 (en) 1995-03-16
US20070052125A1 (en) 2007-03-08
DE69423833T2 (de) 2000-10-12
NO942954L (no) 1995-03-13
US6096413A (en) 2000-08-01
JPH0796962A (ja) 1995-04-11
EP0643551B1 (de) 2000-04-05
ES2145103T3 (es) 2000-07-01
US20020076547A1 (en) 2002-06-20
FI944154A (fi) 1995-03-11
CA2129073C (en) 2007-06-05
EP0643551A1 (de) 1995-03-15
US6331349B1 (en) 2001-12-18
NO313260B1 (no) 2002-09-02
NO942954D0 (no) 1994-08-09
CA2129073A1 (en) 1995-03-11

Similar Documents

Publication Publication Date Title
DE69423833T2 (de) In Situ gebildete elektromagnetische Dichtungen
DE69433827D1 (de) Electromagnetic valve
DE69407801T2 (de) Gleitringdichtung
BR9402134A (pt) Vedação
FI960872A0 (fi) Tiivistysosa
NO941195D0 (no) Tetningselement
DK0694139T3 (da) Tætningssystem
DE69637903D1 (de) In Situ gebildete elektromagnetisch abschirmende Dichtungen
DE4494013T1 (de) Dichtleiste oder -streifen
KR950001480U (ko) 문틀
BR9407043A (pt) Lacre
DE69404287T3 (de) Verbesserte abdichtung
DE9300692U1 (de) Dichtungsprofil
DE69324961D1 (de) Mechanischer in situ Vulkameter
BR9407951A (pt) Vedaçao ambiental
DK0621429T3 (da) Tætningselement
DE9312448U1 (de) Dichtung
DE59402123D1 (de) Plombe
DE9317478U1 (de) Dichtungsprofil
DE59410294D1 (de) Treibstangenschloss
DE9319331U1 (de) Abdichtprofil
DE9310550U1 (de) Fensterflügelrahmen
DE59403930D1 (de) Gleitringdichtung
FI930368A0 (fi) Tiiviste
KR950019182U (ko) 문틀

Legal Events

Date Code Title Description
8364 No opposition during term of opposition