EP0940851B1
(de)
|
1992-07-31 |
2005-10-05 |
Hughes Electronics Corporation |
Sicherheitssystem für eine integrierte Schaltung und Verfahren mit implantierten Verbindungen
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US5468990A
(en)
*
|
1993-07-22 |
1995-11-21 |
National Semiconductor Corp. |
Structures for preventing reverse engineering of integrated circuits
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EP0696056B1
(de)
*
|
1994-07-29 |
2000-01-19 |
STMicroelectronics, Inc. |
Verfahren zum Testen und Reparieren eines integrierten Schaltkreises und zum Herstellen einer Passivierungsstruktur
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US5783846A
(en)
*
|
1995-09-22 |
1998-07-21 |
Hughes Electronics Corporation |
Digital circuit with transistor geometry and channel stops providing camouflage against reverse engineering
|
US5719087A
(en)
*
|
1996-03-07 |
1998-02-17 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Process for bonding pad protection from damage
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US5891354A
(en)
*
|
1996-07-26 |
1999-04-06 |
Fujitsu Limited |
Methods of etching through wafers and substrates with a composite etch stop layer
|
DE19634135C2
(de)
*
|
1996-08-23 |
1998-07-02 |
Siemens Ag |
Halbleiterschaltung, insbesondere zur Verwendung in einem integrierten Baustein
|
US5863595A
(en)
*
|
1996-10-04 |
1999-01-26 |
Dow Corning Corporation |
Thick ceramic coatings for electronic devices
|
JP3587019B2
(ja)
*
|
1997-04-08 |
2004-11-10 |
ソニー株式会社 |
半導体装置の製造方法
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US5920081A
(en)
*
|
1997-04-25 |
1999-07-06 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Structure of a bond pad to prevent testing probe pin contamination
|
US5973375A
(en)
*
|
1997-06-06 |
1999-10-26 |
Hughes Electronics Corporation |
Camouflaged circuit structure with step implants
|
JP4033310B2
(ja)
*
|
1997-12-16 |
2008-01-16 |
富士通株式会社 |
情報機器の補助記憶装置及び情報機器
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US6875681B1
(en)
*
|
1997-12-31 |
2005-04-05 |
Intel Corporation |
Wafer passivation structure and method of fabrication
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JP3583633B2
(ja)
|
1998-12-21 |
2004-11-04 |
シャープ株式会社 |
半導体装置の製造方法
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US6160958A
(en)
*
|
1999-06-16 |
2000-12-12 |
Eastman Kodak Company |
Tamper resistant electronic flash unit for one-time-use camera
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WO2001020559A1
(en)
*
|
1999-09-14 |
2001-03-22 |
Neopost Inc. |
Method and apparatus for user-sealing of secured postage printing equipment
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US6396368B1
(en)
|
1999-11-10 |
2002-05-28 |
Hrl Laboratories, Llc |
CMOS-compatible MEM switches and method of making
|
US6258705B1
(en)
*
|
2000-08-21 |
2001-07-10 |
Siliconeware Precision Industries Co., Ltd. |
Method of forming circuit probing contact points on fine pitch peripheral bond pads on flip chip
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US7217977B2
(en)
|
2004-04-19 |
2007-05-15 |
Hrl Laboratories, Llc |
Covert transformation of transistor properties as a circuit protection method
|
US6815816B1
(en)
|
2000-10-25 |
2004-11-09 |
Hrl Laboratories, Llc |
Implanted hidden interconnections in a semiconductor device for preventing reverse engineering
|
US6901343B2
(en)
*
|
2001-01-10 |
2005-05-31 |
Matsushita Electric Industrial Co., Ltd. |
Multilayer board in which wiring of signal line that requires tamper-resistance is covered by component or foil, design apparatus, method, and program for the multilayer board, and medium recording the program
|
US7294935B2
(en)
*
|
2001-01-24 |
2007-11-13 |
Hrl Laboratories, Llc |
Integrated circuits protected against reverse engineering and method for fabricating the same using an apparent metal contact line terminating on field oxide
|
US20020096744A1
(en)
*
|
2001-01-24 |
2002-07-25 |
Hrl Laboratories, Llc |
Integrated circuits protected against reverse engineering and method for fabricating the same using etched passivation openings in integrated circuits
|
US6791191B2
(en)
|
2001-01-24 |
2004-09-14 |
Hrl Laboratories, Llc |
Integrated circuits protected against reverse engineering and method for fabricating the same using vias without metal terminations
|
US6774413B2
(en)
*
|
2001-06-15 |
2004-08-10 |
Hrl Laboratories, Llc |
Integrated circuit structure with programmable connector/isolator
|
US6740942B2
(en)
|
2001-06-15 |
2004-05-25 |
Hrl Laboratories, Llc. |
Permanently on transistor implemented using a double polysilicon layer CMOS process with buried contact
|
US6897535B2
(en)
|
2002-05-14 |
2005-05-24 |
Hrl Laboratories, Llc |
Integrated circuit with reverse engineering protection
|
US7049667B2
(en)
|
2002-09-27 |
2006-05-23 |
Hrl Laboratories, Llc |
Conductive channel pseudo block process and circuit to inhibit reverse engineering
|
US6979606B2
(en)
|
2002-11-22 |
2005-12-27 |
Hrl Laboratories, Llc |
Use of silicon block process step to camouflage a false transistor
|
AU2003293540A1
(en)
|
2002-12-13 |
2004-07-09 |
Raytheon Company |
Integrated circuit modification using well implants
|
US7242063B1
(en)
|
2004-06-29 |
2007-07-10 |
Hrl Laboratories, Llc |
Symmetric non-intrusive and covert technique to render a transistor permanently non-operable
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JP2006202938A
(ja)
*
|
2005-01-20 |
2006-08-03 |
Kojiro Kobayashi |
半導体装置及びその製造方法
|
DE102005005622B4
(de)
*
|
2005-02-08 |
2008-08-21 |
Infineon Technologies Ag |
Sicherheits-Chipstapel und ein Verfahren zum Herstellen eines Sicherheits-Chipstapels
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EP1691413A1
(de)
*
|
2005-02-11 |
2006-08-16 |
Axalto SA |
Falschungssichere elektronische Komponente
|
US7281667B2
(en)
*
|
2005-04-14 |
2007-10-16 |
International Business Machines Corporation |
Method and structure for implementing secure multichip modules for encryption applications
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US7402826B2
(en)
*
|
2005-05-13 |
2008-07-22 |
Honeywell International Inc. |
System and method for non-destructively determining thickness and uniformity of anti-tamper coatings
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US8168487B2
(en)
|
2006-09-28 |
2012-05-01 |
Hrl Laboratories, Llc |
Programmable connection and isolation of active regions in an integrated circuit using ambiguous features to confuse a reverse engineer
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DE102007046026A1
(de)
|
2007-09-26 |
2009-04-02 |
Rohde & Schwarz Sit Gmbh |
Schutzanordnung und Herstellungsverfahren für eine Schutzanordnung
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US8188374B2
(en)
*
|
2008-07-16 |
2012-05-29 |
The Boeing Company |
Circuit obfuscation
|
GB0900082D0
(en)
|
2009-01-06 |
2009-02-11 |
Fulvens Ltd |
Method and apparatus for secure energy delivery
|
US8455990B2
(en)
*
|
2009-02-25 |
2013-06-04 |
Conexant Systems, Inc. |
Systems and methods of tamper proof packaging of a semiconductor device
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US8429471B2
(en)
|
2010-06-25 |
2013-04-23 |
Via Technologies, Inc. |
Microprocessor apparatus and method for securing a programmable fuse array
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US8242800B2
(en)
|
2010-06-25 |
2012-08-14 |
Via Technologies, Inc. |
Apparatus and method for override access to a secured programmable fuse array
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US8341472B2
(en)
|
2010-06-25 |
2012-12-25 |
Via Technologies, Inc. |
Apparatus and method for tamper protection of a microprocessor fuse array
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US8451020B2
(en)
|
2010-09-30 |
2013-05-28 |
International Business Machines Corporation |
System and method for integrated circuit module tamperproof mode personalization
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US9117126B2
(en)
|
2013-03-13 |
2015-08-25 |
Magtek, Inc. |
Tamper resistant 3D magnetic stripe reader integrated circuit
|
US9997492B2
(en)
|
2013-11-21 |
2018-06-12 |
Nxp Usa, Inc. |
Optically-masked microelectronic packages and methods for the fabrication thereof
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FR3035267B1
(fr)
*
|
2015-04-20 |
2018-05-25 |
Commissariat A L'energie Atomique Et Aux Energies Alternatives |
Puce electronique comportant une face arriere protegee
|
US9942761B1
(en)
|
2016-10-10 |
2018-04-10 |
International Business Machines Corporation |
User access verification
|
US11587890B2
(en)
|
2020-07-20 |
2023-02-21 |
International Business Machines Corporation |
Tamper-resistant circuit, back-end of the line memory and physical unclonable function for supply chain protection
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US11748524B2
(en)
|
2020-07-20 |
2023-09-05 |
International Business Machines Corporation |
Tamper resistant obfuscation circuit
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US11877390B2
(en)
*
|
2021-08-30 |
2024-01-16 |
International Business Machines Corporation |
Fabricating tamper-respondent sensors with random three-dimensional security patterns
|