DE69430457D1 - Verfahren zum teilweisen Sägen von intergrierter Schaltkreise - Google Patents
Verfahren zum teilweisen Sägen von intergrierter SchaltkreiseInfo
- Publication number
- DE69430457D1 DE69430457D1 DE69430457T DE69430457T DE69430457D1 DE 69430457 D1 DE69430457 D1 DE 69430457D1 DE 69430457 T DE69430457 T DE 69430457T DE 69430457 T DE69430457 T DE 69430457T DE 69430457 D1 DE69430457 D1 DE 69430457D1
- Authority
- DE
- Germany
- Prior art keywords
- integrated circuits
- partial sawing
- sawing
- partial
- circuits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00865—Multistep processes for the separation of wafers into individual elements
- B81C1/00896—Temporary protection during separation into individual elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
- B28D5/0023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0041—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking
- B28D5/0047—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking using fluid or gas pressure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/028—Dicing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1062—Prior to assembly
- Y10T156/1064—Partial cutting [e.g., grooving or incising]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/10—Methods
- Y10T225/12—With preliminary weakening
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/001,378 US5393706A (en) | 1993-01-07 | 1993-01-07 | Integrated partial sawing process |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69430457D1 true DE69430457D1 (de) | 2002-05-29 |
DE69430457T2 DE69430457T2 (de) | 2002-10-31 |
Family
ID=21695744
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1994630457 Expired - Fee Related DE69430457T2 (de) | 1993-01-07 | 1994-01-07 | Verfahren zum teilweisen Sägen von intergrierter Schaltkreise |
Country Status (6)
Country | Link |
---|---|
US (2) | US5393706A (de) |
EP (1) | EP0610657B1 (de) |
JP (1) | JPH0745563A (de) |
CA (1) | CA2113019C (de) |
DE (1) | DE69430457T2 (de) |
TW (1) | TW291570B (de) |
Families Citing this family (71)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5445559A (en) * | 1993-06-24 | 1995-08-29 | Texas Instruments Incorporated | Wafer-like processing after sawing DMDs |
US5580831A (en) * | 1993-07-28 | 1996-12-03 | Fujitsu Limited | Sawcut method of forming alignment marks on two faces of a substrate |
JPH07111254A (ja) * | 1993-10-12 | 1995-04-25 | Sumitomo Electric Ind Ltd | 半導体装置の製造方法 |
JP3156896B2 (ja) * | 1994-01-28 | 2001-04-16 | 富士通株式会社 | 半導体装置の製造方法およびかかる製造方法により製造された半導体装置 |
US5516728A (en) * | 1994-03-31 | 1996-05-14 | At&T Corp. | Process for fabircating an integrated circuit |
US5654204A (en) * | 1994-07-20 | 1997-08-05 | Anderson; James C. | Die sorter |
US5521125A (en) * | 1994-10-28 | 1996-05-28 | Xerox Corporation | Precision dicing of silicon chips from a wafer |
US5597767A (en) * | 1995-01-06 | 1997-01-28 | Texas Instruments Incorporated | Separation of wafer into die with wafer-level processing |
US6969635B2 (en) * | 2000-12-07 | 2005-11-29 | Reflectivity, Inc. | Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
US5882988A (en) * | 1995-08-16 | 1999-03-16 | Philips Electronics North America Corporation | Semiconductor chip-making without scribing |
US5668062A (en) * | 1995-08-23 | 1997-09-16 | Texas Instruments Incorporated | Method for processing semiconductor wafer with reduced particle contamination during saw |
US6083811A (en) * | 1996-02-07 | 2000-07-04 | Northrop Grumman Corporation | Method for producing thin dice from fragile materials |
US5915370A (en) * | 1996-03-13 | 1999-06-29 | Micron Technology, Inc. | Saw for segmenting a semiconductor wafer |
US5872046A (en) * | 1996-04-10 | 1999-02-16 | Texas Instruments Incorporated | Method of cleaning wafer after partial saw |
US6225191B1 (en) * | 1996-04-12 | 2001-05-01 | Lucent Technologies Inc. | Process for the manufacture of optical integrated circuits |
US6686291B1 (en) | 1996-05-24 | 2004-02-03 | Texas Instruments Incorporated | Undercut process with isotropic plasma etching at package level |
JPH1027971A (ja) * | 1996-07-10 | 1998-01-27 | Nec Corp | 有機薄膜多層配線基板の切断方法 |
US5832585A (en) * | 1996-08-13 | 1998-11-10 | National Semiconductor Corporation | Method of separating micro-devices formed on a substrate |
KR0178134B1 (ko) * | 1996-10-01 | 1999-04-15 | 삼성전자주식회사 | 불연속 절연층 영역을 갖는 반도체 집적회로 소자 및 그 제조방법 |
US5803797A (en) * | 1996-11-26 | 1998-09-08 | Micron Technology, Inc. | Method and apparatus to hold intergrated circuit chips onto a chuck and to simultaneously remove multiple intergrated circuit chips from a cutting chuck |
US5809987A (en) | 1996-11-26 | 1998-09-22 | Micron Technology,Inc. | Apparatus for reducing damage to wafer cutting blades during wafer dicing |
US5923995A (en) * | 1997-04-18 | 1999-07-13 | National Semiconductor Corporation | Methods and apparatuses for singulation of microelectromechanical systems |
US5817569A (en) * | 1997-05-08 | 1998-10-06 | Texas Instruments Incorporated | Method of reducing wafer particles after partial saw |
JP2001523046A (ja) * | 1997-11-11 | 2001-11-20 | アービン・センサーズ・コーポレイション | 回路を備える半導体ウェハをシンニングするための方法および同方法によって作られるウェハ |
KR100273704B1 (ko) * | 1997-12-20 | 2000-12-15 | 윤종용 | 반도체기판제조방법 |
JP3516592B2 (ja) * | 1998-08-18 | 2004-04-05 | 沖電気工業株式会社 | 半導体装置およびその製造方法 |
DE19850873A1 (de) * | 1998-11-05 | 2000-05-11 | Philips Corp Intellectual Pty | Verfahren zum Bearbeiten eines Erzeugnisses der Halbleitertechnik |
US6339251B2 (en) | 1998-11-10 | 2002-01-15 | Samsung Electronics Co., Ltd | Wafer grooves for reducing semiconductor wafer warping |
DE19939318A1 (de) * | 1999-08-19 | 2001-02-22 | Bosch Gmbh Robert | Verfahren zur Herstellung eines mikromechanischen Bauelements |
US6995034B2 (en) * | 2000-12-07 | 2006-02-07 | Reflectivity, Inc | Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
US7307775B2 (en) * | 2000-12-07 | 2007-12-11 | Texas Instruments Incorporated | Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
EP1370497B1 (de) * | 2001-03-09 | 2007-08-22 | Datec Coating Corporation | Im sol-gel-verfahren hergestellte widerstands- und leitfähige beschichtung |
US6580153B1 (en) | 2001-03-14 | 2003-06-17 | Amkor Technology, Inc. | Structure for protecting a micromachine with a cavity in a UV tape |
JP4042347B2 (ja) * | 2001-05-18 | 2008-02-06 | 新科實業有限公司 | 磁気ヘッドスライダの浮上面形状加工方法及び磁気ヘッドスライダの製造方法 |
DE10140046B4 (de) * | 2001-08-16 | 2006-12-07 | Infineon Technologies Ag | Verfahren zum Vereinzeln von Halbleiterchips |
JP2003078063A (ja) * | 2001-09-05 | 2003-03-14 | Sharp Corp | 半導体装置の製造方法 |
DE10163506A1 (de) * | 2001-12-21 | 2003-07-10 | Infineon Technologies Ag | Verfahren und Vorrichtung zur Herstellung eines Bauelements mit einer beweglichen Struktur |
US20050224902A1 (en) * | 2002-02-06 | 2005-10-13 | Ramsey Craig C | Wireless substrate-like sensor |
US20050233770A1 (en) * | 2002-02-06 | 2005-10-20 | Ramsey Craig C | Wireless substrate-like sensor |
US7289230B2 (en) * | 2002-02-06 | 2007-10-30 | Cyberoptics Semiconductors, Inc. | Wireless substrate-like sensor |
US20050224899A1 (en) * | 2002-02-06 | 2005-10-13 | Ramsey Craig C | Wireless substrate-like sensor |
US7405860B2 (en) * | 2002-11-26 | 2008-07-29 | Texas Instruments Incorporated | Spatial light modulators with light blocking/absorbing areas |
US6993818B2 (en) * | 2003-03-17 | 2006-02-07 | Memx, Inc. | Multi-fixture assembly of cutting tools |
US20040181950A1 (en) * | 2003-03-17 | 2004-09-23 | Rodgers Murray Steven | Alignment of microkeratome blade to blade handle |
US20040186493A1 (en) * | 2003-03-17 | 2004-09-23 | Mcwhorter Paul Jackson | Microkeratome cutting head assembly with single bevel cutting blade |
US20040232535A1 (en) * | 2003-05-22 | 2004-11-25 | Terry Tarn | Microelectromechanical device packages with integral heaters |
JP4398686B2 (ja) * | 2003-09-11 | 2010-01-13 | 株式会社ディスコ | ウエーハの加工方法 |
JP4590174B2 (ja) * | 2003-09-11 | 2010-12-01 | 株式会社ディスコ | ウエーハの加工方法 |
US20050093134A1 (en) | 2003-10-30 | 2005-05-05 | Terry Tarn | Device packages with low stress assembly process |
JP4342992B2 (ja) * | 2004-03-17 | 2009-10-14 | 株式会社ディスコ | レーザー加工装置のチャックテーブル |
FR2869455B1 (fr) * | 2004-04-27 | 2006-07-14 | Soitec Silicon On Insulator | Procede de fabrication de puces et support associe |
US7408250B2 (en) * | 2005-04-05 | 2008-08-05 | Texas Instruments Incorporated | Micromirror array device with compliant adhesive |
US7508063B2 (en) * | 2005-04-05 | 2009-03-24 | Texas Instruments Incorporated | Low cost hermetically sealed package |
US7893697B2 (en) * | 2006-02-21 | 2011-02-22 | Cyberoptics Semiconductor, Inc. | Capacitive distance sensing in semiconductor processing tools |
CN101410690B (zh) * | 2006-02-21 | 2011-11-23 | 赛博光学半导体公司 | 半导体加工工具中的电容性距离感测 |
US8067258B2 (en) * | 2006-06-05 | 2011-11-29 | Applied Microstructures, Inc. | Protective thin films for use during fabrication of semiconductors, MEMS, and microstructures |
WO2008042199A2 (en) | 2006-09-29 | 2008-04-10 | Cyberoptics Semiconductor, Inc. | Particles sensor integrated with substrate |
US8900695B2 (en) * | 2007-02-23 | 2014-12-02 | Applied Microstructures, Inc. | Durable conformal wear-resistant carbon-doped metal oxide-comprising coating |
US20080248263A1 (en) * | 2007-04-02 | 2008-10-09 | Applied Microstructures, Inc. | Method of creating super-hydrophobic and-or super-hydrophilic surfaces on substrates, and articles created thereby |
US8236379B2 (en) * | 2007-04-02 | 2012-08-07 | Applied Microstructures, Inc. | Articles with super-hydrophobic and-or super-hydrophilic surfaces and method of formation |
TW200849444A (en) * | 2007-04-05 | 2008-12-16 | Cyberoptics Semiconductor Inc | Semiconductor processing system with integrated showerhead distance measuring device |
US20090015268A1 (en) * | 2007-07-13 | 2009-01-15 | Gardner Delrae H | Device and method for compensating a capacitive sensor measurement for variations caused by environmental conditions in a semiconductor processing environment |
US7662669B2 (en) * | 2007-07-24 | 2010-02-16 | Northrop Grumman Space & Mission Systems Corp. | Method of exposing circuit lateral interconnect contacts by wafer saw |
US7696062B2 (en) | 2007-07-25 | 2010-04-13 | Northrop Grumman Systems Corporation | Method of batch integration of low dielectric substrates with MMICs |
US20090061597A1 (en) * | 2007-08-30 | 2009-03-05 | Kavlico Corporation | Singulator method and apparatus |
TWM330516U (en) | 2007-10-03 | 2008-04-11 | yuan-rong Zhang | Mouse with cable orientations adjustment |
US20110061711A1 (en) * | 2009-09-12 | 2011-03-17 | Yuhao Luo | Building-integrated solar photovoltaic panel |
TWI450325B (zh) * | 2012-03-22 | 2014-08-21 | Alpha & Omega Semiconductor | 一種支援從晶圓背面實施切割的晶片封裝方法 |
CN103645078B (zh) * | 2013-12-05 | 2016-01-20 | 广东工业大学 | 一种单晶半导体基片的截面快速制作及亚表面微裂纹检测方法 |
JP6765949B2 (ja) * | 2016-12-12 | 2020-10-07 | 株式会社ディスコ | ウェーハの加工方法 |
CN114030094B (zh) * | 2021-11-18 | 2022-12-09 | 江苏纳沛斯半导体有限公司 | 一种可防止产生崩边的半导体晶圆制备的硅片划片系统 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL284964A (de) * | 1961-11-10 | 1900-01-01 | ||
DE1932371B2 (de) * | 1969-06-26 | 1972-11-30 | Deutsche Itt Industries Gmbh, 7800 Freiburg | Verfahren zum herstellen von halbleiterplaettchen |
US3699402A (en) * | 1970-07-27 | 1972-10-17 | Gen Electric | Hybrid circuit power module |
DE2730130C2 (de) * | 1976-09-14 | 1987-11-12 | Mitsubishi Denki K.K., Tokyo | Verfahren zum Herstellen von Halbleiterbauelementen |
JPS5412563A (en) * | 1977-06-29 | 1979-01-30 | Toshiba Corp | Fabricating method of semiconductor crystals |
JPS5437468A (en) * | 1977-08-29 | 1979-03-19 | Toshiba Corp | Breaking device for semiconductor wafer |
JPS54131872A (en) * | 1978-04-04 | 1979-10-13 | Toshiba Corp | Forming method for dielectric layer of semiconductor device |
JPS5678137A (en) * | 1979-11-29 | 1981-06-26 | Nec Home Electronics Ltd | Manufacture of semiconductor device |
US4296542A (en) * | 1980-07-11 | 1981-10-27 | Presco, Inc. | Control of small parts in a manufacturing operation |
JPS5752143A (en) * | 1980-09-16 | 1982-03-27 | Toshiba Corp | Mounting method and device for semiconductor pellet |
JPS59186345A (ja) * | 1983-04-06 | 1984-10-23 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法 |
US5196378A (en) * | 1987-12-17 | 1993-03-23 | Texas Instruments Incorporated | Method of fabricating an integrated circuit having active regions near a die edge |
US4904610A (en) * | 1988-01-27 | 1990-02-27 | General Instrument Corporation | Wafer level process for fabricating passivated semiconductor devices |
JPH0353546A (ja) * | 1989-07-21 | 1991-03-07 | Mitsubishi Electric Corp | 半導体装置の製造方法およびその製造装置 |
US4997792A (en) * | 1989-11-21 | 1991-03-05 | Eastman Kodak Company | Method for separation of diode array chips during fabrication thereof |
JPH03236258A (ja) * | 1990-02-13 | 1991-10-22 | Fujitsu Ltd | 半導体装置の製造方法 |
JP2859412B2 (ja) * | 1990-10-01 | 1999-02-17 | 富士通株式会社 | 半導体装置の製造方法 |
US5272114A (en) * | 1990-12-10 | 1993-12-21 | Amoco Corporation | Method for cleaving a semiconductor crystal body |
US5130276A (en) * | 1991-05-16 | 1992-07-14 | Motorola Inc. | Method of fabricating surface micromachined structures |
JPH0574932A (ja) * | 1991-09-17 | 1993-03-26 | Fujitsu Ltd | 半導体ウエハのダイシング方法 |
US5318855A (en) * | 1992-08-25 | 1994-06-07 | International Business Machines Corporation | Electronic assembly with flexible film cover for providing electrical and environmental protection |
-
1993
- 1993-01-07 US US08/001,378 patent/US5393706A/en not_active Expired - Lifetime
-
1994
- 1994-01-07 JP JP2301994A patent/JPH0745563A/ja active Pending
- 1994-01-07 DE DE1994630457 patent/DE69430457T2/de not_active Expired - Fee Related
- 1994-01-07 CA CA 2113019 patent/CA2113019C/en not_active Expired - Fee Related
- 1994-01-07 EP EP19940100206 patent/EP0610657B1/de not_active Expired - Lifetime
- 1994-09-16 TW TW83108548A patent/TW291570B/zh active
- 1994-11-21 US US08/342,988 patent/US5527744A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0610657A2 (de) | 1994-08-17 |
JPH0745563A (ja) | 1995-02-14 |
US5393706A (en) | 1995-02-28 |
TW291570B (de) | 1996-11-21 |
CA2113019C (en) | 2005-03-29 |
DE69430457T2 (de) | 2002-10-31 |
EP0610657A3 (de) | 1997-02-05 |
EP0610657B1 (de) | 2002-04-24 |
CA2113019A1 (en) | 1994-07-08 |
US5527744A (en) | 1996-06-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69430457D1 (de) | Verfahren zum teilweisen Sägen von intergrierter Schaltkreise | |
DE69301393D1 (de) | Fassung zum testen von integrierten schaltkreisen | |
DE69302420T2 (de) | Verfahren zum Fotoformen | |
DE69222396T2 (de) | Verfahren zum Aufbereiten von Kohlenwasserstoffen | |
DE69410514D1 (de) | Verfahren zum Herstellen von Halbleiterscheiben | |
DE69522809D1 (de) | Verfahren zum Verblasen von Kupferstein | |
DE69409347T2 (de) | Verfahren zum Herstellen von Halbleitervorrichtungen | |
DE69724192D1 (de) | Verfahren zum Ätzen von Polyzidstrukturen | |
DE59506147D1 (de) | Verfahren zum Reinigen von Halbleiterscheiben | |
DE69219063T2 (de) | Verfahren zum Regenerieren von Ätzmitteln | |
DE69702586D1 (de) | Verfahren zum Acetoxylieren von Olefinen | |
DE69522745D1 (de) | Verfahren zum Abbau von Polysiloxanen | |
DE69433634D1 (de) | Verfahren zur Umsetzung von Kohlenwasserstoffen | |
DE69329351D1 (de) | Verfahren zum Bewerten von Halbleiterscheiben | |
DE69306782T2 (de) | Verfahren zum verbinden von perfluorelastomeren | |
DE69322994D1 (de) | Verfahren zum Löten | |
DE69727410D1 (de) | Verfahren zum Entgräten von Leiterrahmen | |
DE59609735D1 (de) | Verfahren zum Bearbeiten der Oberflächen von Werkstücken | |
DE69207442D1 (de) | Verfahren zum Herstellen von integrierten Schaltstrukturen | |
ATA253591A (de) | Verfahren zum reinigen von werkstücken | |
DE59406203D1 (de) | Verfahren zur Photooxidation von Terpenolefinen | |
DE59004416D1 (de) | Verfahren zum Reinigen von Dimethylterephthalat. | |
DE9315408U1 (de) | Vorrichtung zum Reinigen der Hohlstruktur von Werkstücken | |
DE69410249D1 (de) | Verfahren zur reduzierung der entflammbarkeit von aramiden | |
DE69302105T3 (de) | Verfahren zum Löten von Rohren |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8339 | Ceased/non-payment of the annual fee |