DE69431565T2 - Verfahren zum herstellung einer kontaktstruktur für verbindungen, zwischenstück, halbleiteranordnung - Google Patents

Verfahren zum herstellung einer kontaktstruktur für verbindungen, zwischenstück, halbleiteranordnung

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Publication number
DE69431565T2
DE69431565T2 DE69431565T DE69431565T DE69431565T2 DE 69431565 T2 DE69431565 T2 DE 69431565T2 DE 69431565 T DE69431565 T DE 69431565T DE 69431565 T DE69431565 T DE 69431565T DE 69431565 T2 DE69431565 T2 DE 69431565T2
Authority
DE
Germany
Prior art keywords
connections
interface
producing
contact structure
semiconductor arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69431565T
Other languages
English (en)
Other versions
DE69431565D1 (de
Inventor
Igor Y Khandros
Gaetan L Mathieu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FormFactor Inc
Original Assignee
FormFactor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/152,812 external-priority patent/US5476211A/en
Application filed by FormFactor Inc filed Critical FormFactor Inc
Publication of DE69431565D1 publication Critical patent/DE69431565D1/de
Application granted granted Critical
Publication of DE69431565T2 publication Critical patent/DE69431565T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H05K7/1069—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
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    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
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    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G—PHYSICS
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    • G01R1/06716—Elastic
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    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
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    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
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    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
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    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10909—Materials of terminal, e.g. of leads or electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10946—Leads attached onto leadless component after manufacturing the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49162—Manufacturing circuit on or in base by using wire as conductive path
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    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/49217—Contact or terminal manufacturing by assembling plural parts by elastic joining
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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DE69431565T 1993-11-16 1994-11-16 Verfahren zum herstellung einer kontaktstruktur für verbindungen, zwischenstück, halbleiteranordnung Expired - Lifetime DE69431565T2 (de)

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US08/152,812 US5476211A (en) 1993-11-16 1993-11-16 Method of manufacturing electrical contacts, using a sacrificial member
US08/340,144 US5917707A (en) 1993-11-16 1994-11-15 Flexible contact structure with an electrically conductive shell
PCT/US1994/013373 WO1995014314A1 (en) 1993-11-16 1994-11-16 Contact structure for interconnections, interposer, semiconductor assembly and method

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JP (4) JP3006885B2 (de)
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10340297A1 (de) * 2003-09-02 2005-03-31 Semikron Elektronik Gmbh Schaltungsanordnung für aktive und passive elektrische und elektronische Bauelemente
US7952373B2 (en) * 2000-05-23 2011-05-31 Verigy (Singapore) Pte. Ltd. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies

Families Citing this family (529)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5829128A (en) * 1993-11-16 1998-11-03 Formfactor, Inc. Method of mounting resilient contact structures to semiconductor devices
US6043563A (en) * 1997-05-06 2000-03-28 Formfactor, Inc. Electronic components with terminals and spring contact elements extending from areas which are remote from the terminals
US5476211A (en) * 1993-11-16 1995-12-19 Form Factor, Inc. Method of manufacturing electrical contacts, using a sacrificial member
US20050062492A1 (en) * 2001-08-03 2005-03-24 Beaman Brian Samuel High density integrated circuit apparatus, test probe and methods of use thereof
US6295729B1 (en) * 1992-10-19 2001-10-02 International Business Machines Corporation Angled flying lead wire bonding process
US5810607A (en) * 1995-09-13 1998-09-22 International Business Machines Corporation Interconnector with contact pads having enhanced durability
US6722032B2 (en) * 1995-11-27 2004-04-20 International Business Machines Corporation Method of forming a structure for electronic devices contact locations
US7368924B2 (en) * 1993-04-30 2008-05-06 International Business Machines Corporation Probe structure having a plurality of discrete insulated probe tips projecting from a support surface, apparatus for use thereof and methods of fabrication thereof
US6482013B2 (en) * 1993-11-16 2002-11-19 Formfactor, Inc. Microelectronic spring contact element and electronic component having a plurality of spring contact elements
US7200930B2 (en) * 1994-11-15 2007-04-10 Formfactor, Inc. Probe for semiconductor devices
US6741085B1 (en) * 1993-11-16 2004-05-25 Formfactor, Inc. Contact carriers (tiles) for populating larger substrates with spring contacts
US7073254B2 (en) 1993-11-16 2006-07-11 Formfactor, Inc. Method for mounting a plurality of spring contact elements
US7064566B2 (en) * 1993-11-16 2006-06-20 Formfactor, Inc. Probe card assembly and kit
US5772451A (en) * 1993-11-16 1998-06-30 Form Factor, Inc. Sockets for electronic components and methods of connecting to electronic components
US6525555B1 (en) 1993-11-16 2003-02-25 Formfactor, Inc. Wafer-level burn-in and test
US6836962B2 (en) 1993-11-16 2005-01-04 Formfactor, Inc. Method and apparatus for shaping spring elements
US20020053734A1 (en) * 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US6246247B1 (en) * 1994-11-15 2001-06-12 Formfactor, Inc. Probe card assembly and kit, and methods of using same
US6064213A (en) * 1993-11-16 2000-05-16 Formfactor, Inc. Wafer-level burn-in and test
US7579269B2 (en) * 1993-11-16 2009-08-25 Formfactor, Inc. Microelectronic spring contact elements
US6184053B1 (en) * 1993-11-16 2001-02-06 Formfactor, Inc. Method of making microelectronic spring contact elements
US6727580B1 (en) 1993-11-16 2004-04-27 Formfactor, Inc. Microelectronic spring contact elements
US6442831B1 (en) * 1993-11-16 2002-09-03 Formfactor, Inc. Method for shaping spring elements
US6624648B2 (en) 1993-11-16 2003-09-23 Formfactor, Inc. Probe card assembly
US20070228110A1 (en) * 1993-11-16 2007-10-04 Formfactor, Inc. Method Of Wirebonding That Utilizes A Gas Flow Within A Capillary From Which A Wire Is Played Out
US6690186B2 (en) 1994-07-07 2004-02-10 Tessera, Inc. Methods and structures for electronic probing arrays
US6429112B1 (en) * 1994-07-07 2002-08-06 Tessera, Inc. Multi-layer substrates and fabrication processes
US5688716A (en) 1994-07-07 1997-11-18 Tessera, Inc. Fan-out semiconductor chip assembly
US6499216B1 (en) * 1994-07-07 2002-12-31 Tessera, Inc. Methods and structures for electronic probing arrays
US6848173B2 (en) * 1994-07-07 2005-02-01 Tessera, Inc. Microelectric packages having deformed bonded leads and methods therefor
US5495667A (en) * 1994-11-07 1996-03-05 Micron Technology, Inc. Method for forming contact pins for semiconductor dice and interconnects
US6232789B1 (en) * 1997-05-28 2001-05-15 Cascade Microtech, Inc. Probe holder for low current measurements
US20020004320A1 (en) * 1995-05-26 2002-01-10 David V. Pedersen Attaratus for socketably receiving interconnection elements of an electronic component
US5998864A (en) * 1995-05-26 1999-12-07 Formfactor, Inc. Stacking semiconductor devices, particularly memory chips
US6150186A (en) * 1995-05-26 2000-11-21 Formfactor, Inc. Method of making a product with improved material properties by moderate heat-treatment of a metal incorporating a dilute additive
US20100065963A1 (en) * 1995-05-26 2010-03-18 Formfactor, Inc. Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out
EP1610132B1 (de) 1995-05-26 2009-01-14 FormFactor, Inc. Herstellung von Verbindungen unter Verwendung von Opfersubstraten
US5729150A (en) 1995-12-01 1998-03-17 Cascade Microtech, Inc. Low-current probe card with reduced triboelectric current generating cables
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US6880245B2 (en) * 1996-03-12 2005-04-19 International Business Machines Corporation Method for fabricating a structure for making contact with an IC device
JPH09260428A (ja) * 1996-03-19 1997-10-03 Toshiba Corp 半導体装置及びその実装方法
AU3073997A (en) * 1996-05-17 1997-12-05 Formfactor, Inc. Contact tip structures for microelectronic interconnection elements and methods of making same
EP1321978B1 (de) * 1996-05-17 2010-02-17 FormFactor, Inc. Kontaktstruktur
DE69733928T2 (de) 1996-05-17 2006-06-14 Formfactor Inc Mikroelektronische kontaktstruktur und herstellungsverfahren dazu
EP0898712B1 (de) * 1996-05-17 2003-08-06 Formfactor, Inc. Einbrennen und testen eines halbleiterwafers
JP3328135B2 (ja) * 1996-05-28 2002-09-24 田中電子工業株式会社 バンプ形成用金合金線及びバンプ形成方法
US5914613A (en) 1996-08-08 1999-06-22 Cascade Microtech, Inc. Membrane probing system with local contact scrub
DE69734158T2 (de) 1996-09-13 2006-06-22 International Business Machines Corp. Prüfkopfstruktur mit mehreren getrennten isolierten prüfspitzen
JP2000502812A (ja) 1996-09-13 2000-03-07 インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン ウエハ・レベルのテストおよびバーンインのための集積化コンプライアント・プローブ
US7282945B1 (en) 1996-09-13 2007-10-16 International Business Machines Corporation Wafer scale high density probe assembly, apparatus for use thereof and methods of fabrication thereof
EP0834919B1 (de) * 1996-10-01 2007-04-18 Matsushita Electric Industrial Co., Ltd. Halbleiterelement mit einer Höckerelektrode
TW406454B (en) 1996-10-10 2000-09-21 Berg Tech Inc High density connector and method of manufacture
US5989939A (en) * 1996-12-13 1999-11-23 Tessera, Inc. Process of manufacturing compliant wirebond packages
US6690185B1 (en) 1997-01-15 2004-02-10 Formfactor, Inc. Large contactor with multiple, aligned contactor units
US7063541B2 (en) 1997-03-17 2006-06-20 Formfactor, Inc. Composite microelectronic spring structure and method for making same
US5929521A (en) * 1997-03-26 1999-07-27 Micron Technology, Inc. Projected contact structure for bumped semiconductor device and resulting articles and assemblies
US7321485B2 (en) 1997-04-08 2008-01-22 X2Y Attenuators, Llc Arrangement for energy conditioning
US9054094B2 (en) 1997-04-08 2015-06-09 X2Y Attenuators, Llc Energy conditioning circuit arrangement for integrated circuit
US7110235B2 (en) * 1997-04-08 2006-09-19 Xzy Altenuators, Llc Arrangement for energy conditioning
US7336468B2 (en) 1997-04-08 2008-02-26 X2Y Attenuators, Llc Arrangement for energy conditioning
US7301748B2 (en) 1997-04-08 2007-11-27 Anthony Anthony A Universal energy conditioning interposer with circuit architecture
US6215166B1 (en) * 1997-04-30 2001-04-10 Motorola, Inc. Radio frequency electronic device and method for regulating an amount of power delivered to a radio frequency electronic device
US7714235B1 (en) 1997-05-06 2010-05-11 Formfactor, Inc. Lithographically defined microelectronic contact structures
US6034533A (en) 1997-06-10 2000-03-07 Tervo; Paul A. Low-current pogo probe card
US6215196B1 (en) * 1997-06-30 2001-04-10 Formfactor, Inc. Electronic component with terminals and spring contact elements extending from areas which are remote from the terminals
WO1999000844A2 (en) 1997-06-30 1999-01-07 Formfactor, Inc. Sockets for semiconductor devices with spring contact elements
US6534855B1 (en) * 1997-08-22 2003-03-18 Micron Technology, Inc. Wireless communications system and method of making
US6329829B1 (en) 1997-08-22 2001-12-11 Micron Technology, Inc. Interconnect and system for making temporary electrical connections to semiconductor components
JPH11121897A (ja) * 1997-10-14 1999-04-30 Fujitsu Ltd 複数の回路素子を基板上に搭載するプリント配線基板の製造方法及びプリント配線基板の構造
US6114240A (en) 1997-12-18 2000-09-05 Micron Technology, Inc. Method for fabricating semiconductor components using focused laser beam
US5994221A (en) * 1998-01-30 1999-11-30 Lucent Technologies Inc. Method of fabricating aluminum-indium (or thallium) vias for ULSI metallization and interconnects
US6281446B1 (en) 1998-02-16 2001-08-28 Matsushita Electric Industrial Co., Ltd. Multi-layered circuit board and method of manufacturing the same
JP4006081B2 (ja) * 1998-03-19 2007-11-14 株式会社ルネサステクノロジ 半導体装置の製造方法
US6222276B1 (en) * 1998-04-07 2001-04-24 International Business Machines Corporation Through-chip conductors for low inductance chip-to-chip integration and off-chip connections
US6720501B1 (en) 1998-04-14 2004-04-13 Formfactor, Inc. PC board having clustered blind vias
TW366548B (en) * 1998-04-18 1999-08-11 United Microelectronics Corp Trench bump block and the application of the same
SG108210A1 (en) * 1998-06-19 2005-01-28 Advantest Corp Probe contactor formed by photolithography process
US6164523A (en) * 1998-07-01 2000-12-26 Semiconductor Components Industries, Llc Electronic component and method of manufacture
US7304486B2 (en) * 1998-07-08 2007-12-04 Capres A/S Nano-drive for high resolution positioning and for positioning of a multi-point probe
EP1095282B1 (de) * 1998-07-08 2007-09-19 Capres Aps Mehrspitzenfühler
US6664628B2 (en) 1998-07-13 2003-12-16 Formfactor, Inc. Electronic component overlapping dice of unsingulated semiconductor wafer
US6705876B2 (en) * 1998-07-13 2004-03-16 Formfactor, Inc. Electrical interconnect assemblies and methods
US6256882B1 (en) 1998-07-14 2001-07-10 Cascade Microtech, Inc. Membrane probing system
JP2000138104A (ja) * 1998-08-26 2000-05-16 Yazaki Corp 回路保護素子の検査構造
US6184576B1 (en) * 1998-09-21 2001-02-06 Advantest Corp. Packaging and interconnection of contact structure
US6414501B2 (en) * 1998-10-01 2002-07-02 Amst Co., Ltd. Micro cantilever style contact pin structure for wafer probing
GB2342509A (en) * 1998-10-05 2000-04-12 Standex Int Corp Surface mount reed switch having transverse feet formed from leads
JP2000311915A (ja) * 1998-10-14 2000-11-07 Texas Instr Inc <Ti> 半導体デバイス及びボンディング方法
JP2000200804A (ja) * 1998-10-30 2000-07-18 Shinko Electric Ind Co Ltd 半導体装置及びその製造方法
US6441315B1 (en) * 1998-11-10 2002-08-27 Formfactor, Inc. Contact structures with blades having a wiping motion
US6608385B2 (en) 1998-11-30 2003-08-19 Advantest Corp. Contact structure and production method thereof and probe contact assembly using same
US6504223B1 (en) * 1998-11-30 2003-01-07 Advantest Corp. Contact structure and production method thereof and probe contact assembly using same
US6540524B1 (en) * 2000-02-14 2003-04-01 Advantest Corp. Contact structure and production method thereof
US6579804B1 (en) * 1998-11-30 2003-06-17 Advantest, Corp. Contact structure and production method thereof and probe contact assembly using same
US6456099B1 (en) 1998-12-31 2002-09-24 Formfactor, Inc. Special contact points for accessing internal circuitry of an integrated circuit
JP3530761B2 (ja) 1999-01-18 2004-05-24 新光電気工業株式会社 半導体装置
JP3160583B2 (ja) * 1999-01-27 2001-04-25 日本特殊陶業株式会社 樹脂製基板
US6274937B1 (en) * 1999-02-01 2001-08-14 Micron Technology, Inc. Silicon multi-chip module packaging with integrated passive components and method of making
US6079990A (en) * 1999-02-02 2000-06-27 Molex Incorporated Terminal-receiving socket for mounting on a circuit board
US6492251B1 (en) * 1999-03-10 2002-12-10 Tessera, Inc. Microelectronic joining processes with bonding material application
US6183267B1 (en) * 1999-03-11 2001-02-06 Murray Hill Devices Ultra-miniature electrical contacts and method of manufacture
US6531662B1 (en) * 1999-04-22 2003-03-11 Rohm Co., Ltd. Circuit board, battery pack, and method of manufacturing circuit board
US7349223B2 (en) * 2000-05-23 2008-03-25 Nanonexus, Inc. Enhanced compliant probe card systems having improved planarity
US7382142B2 (en) * 2000-05-23 2008-06-03 Nanonexus, Inc. High density interconnect system having rapid fabrication cycle
WO2001098793A2 (en) * 2000-06-20 2001-12-27 Nanonexus, Inc. Systems for testing integraged circuits during burn-in
US6799976B1 (en) * 1999-07-28 2004-10-05 Nanonexus, Inc. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
US7126220B2 (en) * 2002-03-18 2006-10-24 Nanonexus, Inc. Miniaturized contact spring
US6812718B1 (en) * 1999-05-27 2004-11-02 Nanonexus, Inc. Massively parallel interface for electronic circuits
US6917525B2 (en) * 2001-11-27 2005-07-12 Nanonexus, Inc. Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs
US6710609B2 (en) * 2002-07-15 2004-03-23 Nanonexus, Inc. Mosaic decal probe
US7247035B2 (en) * 2000-06-20 2007-07-24 Nanonexus, Inc. Enhanced stress metal spring contactor
US6578264B1 (en) * 1999-06-04 2003-06-17 Cascade Microtech, Inc. Method for constructing a membrane probe using a depression
US7215131B1 (en) 1999-06-07 2007-05-08 Formfactor, Inc. Segmented contactor
US6287126B1 (en) * 1999-06-25 2001-09-11 International Business Machines Corporation Mechanical attachment means used as electrical connection
US6329722B1 (en) * 1999-07-01 2001-12-11 Texas Instruments Incorporated Bonding pads for integrated circuits having copper interconnect metallization
US6407562B1 (en) * 1999-07-29 2002-06-18 Agilent Technologies, Inc. Probe tip terminating device providing an easily changeable feed-through termination
US7435108B1 (en) * 1999-07-30 2008-10-14 Formfactor, Inc. Variable width resilient conductive contact structures
US6713374B2 (en) 1999-07-30 2004-03-30 Formfactor, Inc. Interconnect assemblies and methods
JP2010192928A (ja) * 1999-08-12 2010-09-02 Fujitsu Semiconductor Ltd 半導体装置及びその製造方法
US6468098B1 (en) 1999-08-17 2002-10-22 Formfactor, Inc. Electrical contactor especially wafer level contactor using fluid pressure
JP2001060596A (ja) * 1999-08-19 2001-03-06 Shinko Electric Ind Co Ltd 半導体装置の製造方法
US7695644B2 (en) * 1999-08-27 2010-04-13 Shocking Technologies, Inc. Device applications for voltage switchable dielectric material having high aspect ratio particles
US7825491B2 (en) 2005-11-22 2010-11-02 Shocking Technologies, Inc. Light-emitting device using voltage switchable dielectric material
AU6531600A (en) * 1999-08-27 2001-03-26 Lex Kosowsky Current carrying structure using voltage switchable dielectric material
US7446030B2 (en) * 1999-08-27 2008-11-04 Shocking Technologies, Inc. Methods for fabricating current-carrying structures using voltage switchable dielectric materials
US6340822B1 (en) * 1999-10-05 2002-01-22 Agere Systems Guardian Corp. Article comprising vertically nano-interconnected circuit devices and method for making the same
US6853067B1 (en) 1999-10-12 2005-02-08 Microassembly Technologies, Inc. Microelectromechanical systems using thermocompression bonding
EP1096674B1 (de) * 1999-10-29 2013-03-27 Kyocera Corporation Schaltungssubstrat
US6342399B1 (en) * 1999-11-08 2002-01-29 Agere Systems Guardian Corp. Testing integrated circuits
US6392428B1 (en) 1999-11-16 2002-05-21 Eaglestone Partners I, Llc Wafer level interposer
DE19961791C2 (de) * 1999-12-21 2002-11-28 Infineon Technologies Ag Anordnung zum Testen von Chips mittels einer gedruckten Schaltungsplatte
JP2001174482A (ja) * 1999-12-21 2001-06-29 Toshiba Corp 電気的特性評価用接触針、プローブ構造体、プローブカード、および電気的特性評価用接触針の製造方法
US6827584B2 (en) * 1999-12-28 2004-12-07 Formfactor, Inc. Interconnect for microelectronic structures with enhanced spring characteristics
SG94730A1 (en) * 2000-01-19 2003-03-18 Advantest Corp Contact structure having contact bumps
EP1121009A3 (de) * 2000-01-28 2004-06-16 Kabushiki Kaisha Toshiba Halbleitende Baugruppe für Stromrichter-Einheiten mit Verkleinerungsanforderungen
US6641430B2 (en) 2000-02-14 2003-11-04 Advantest Corp. Contact structure and production method thereof and probe contact assembly using same
US6676438B2 (en) 2000-02-14 2004-01-13 Advantest Corp. Contact structure and production method thereof and probe contact assembly using same
US6838890B2 (en) * 2000-02-25 2005-01-04 Cascade Microtech, Inc. Membrane probing system
US7262611B2 (en) * 2000-03-17 2007-08-28 Formfactor, Inc. Apparatuses and methods for planarizing a semiconductor contactor
US6424167B1 (en) 2000-03-22 2002-07-23 National Semiconductor Corporation Vibration resistant test module for use with semiconductor device test apparatus
JP4323055B2 (ja) * 2000-03-22 2009-09-02 富士通マイクロエレクトロニクス株式会社 半導体装置試験用コンタクタ及びその製造方法
JP4088015B2 (ja) * 2000-03-24 2008-05-21 株式会社新川 湾曲状ワイヤの形成方法
DE10017746B4 (de) * 2000-04-10 2005-10-13 Infineon Technologies Ag Verfahren zur Herstellung eines elektronischen Bauteils mit mikroskopisch kleinen Kontaktflächen
US7458816B1 (en) 2000-04-12 2008-12-02 Formfactor, Inc. Shaped spring
US6640432B1 (en) * 2000-04-12 2003-11-04 Formfactor, Inc. Method of fabricating shaped springs
US6833984B1 (en) 2000-05-03 2004-12-21 Rambus, Inc. Semiconductor module with serial bus connection to multiple dies
US7122889B2 (en) * 2000-05-03 2006-10-17 Rambus, Inc. Semiconductor module
US6396296B1 (en) * 2000-05-15 2002-05-28 Advanced Micro Devices, Inc. Method and apparatus for electrical characterization of an integrated circuit package using a vertical probe station
US20050068054A1 (en) * 2000-05-23 2005-03-31 Sammy Mok Standardized layout patterns and routing structures for integrated circuit wafer probe card assemblies
JP3879816B2 (ja) * 2000-06-02 2007-02-14 セイコーエプソン株式会社 半導体装置及びその製造方法、積層型半導体装置、回路基板並びに電子機器
US20020113322A1 (en) * 2000-06-12 2002-08-22 Shinichi Terashima Semiconductor device and method to produce the same
US6332782B1 (en) 2000-06-19 2001-12-25 International Business Machines Corporation Spatial transformation interposer for electronic packaging
US6459039B1 (en) 2000-06-19 2002-10-01 International Business Machines Corporation Method and apparatus to manufacture an electronic package with direct wiring pattern
US6717062B2 (en) * 2000-07-03 2004-04-06 Rohm Co., Ltd. Battery pack and battery case used for the same, and method for producing the same
US6822469B1 (en) 2000-07-31 2004-11-23 Eaglestone Partners I, Llc Method for testing multiple semiconductor wafers
US6812048B1 (en) 2000-07-31 2004-11-02 Eaglestone Partners I, Llc Method for manufacturing a wafer-interposer assembly
US6537831B1 (en) * 2000-07-31 2003-03-25 Eaglestone Partners I, Llc Method for selecting components for a matched set using a multi wafer interposer
US6462575B1 (en) * 2000-08-28 2002-10-08 Micron Technology, Inc. Method and system for wafer level testing and burning-in semiconductor components
MY137479A (en) * 2000-09-18 2009-01-30 Nippon Steel Corp Bonding wire for semiconductor device and method for producing the same
US6589819B2 (en) * 2000-09-29 2003-07-08 Tessera, Inc. Microelectronic packages having an array of resilient leads and methods therefor
US6815712B1 (en) 2000-10-02 2004-11-09 Eaglestone Partners I, Llc Method for selecting components for a matched set from a wafer-interposer assembly
JP3450290B2 (ja) * 2000-10-17 2003-09-22 山形日本電気株式会社 液晶パネル駆動回路
US6686657B1 (en) * 2000-11-07 2004-02-03 Eaglestone Partners I, Llc Interposer for improved handling of semiconductor wafers and method of use of same
US20020096421A1 (en) * 2000-11-29 2002-07-25 Cohn Michael B. MEMS device with integral packaging
DE10143173A1 (de) 2000-12-04 2002-06-06 Cascade Microtech Inc Wafersonde
US6750396B2 (en) 2000-12-15 2004-06-15 Di/Dt, Inc. I-channel surface-mount connector
US6524885B2 (en) * 2000-12-15 2003-02-25 Eaglestone Partners I, Llc Method, apparatus and system for building an interposer onto a semiconductor wafer using laser techniques
US20020078401A1 (en) * 2000-12-15 2002-06-20 Fry Michael Andrew Test coverage analysis system
US6529022B2 (en) * 2000-12-15 2003-03-04 Eaglestone Pareners I, Llc Wafer testing interposer for a conventional package
US7348494B1 (en) * 2000-12-15 2008-03-25 Nortel Networks Limited Signal layer interconnects
JP3910363B2 (ja) 2000-12-28 2007-04-25 富士通株式会社 外部接続端子
JP4674970B2 (ja) * 2001-01-09 2011-04-20 Ｏｋｉセミコンダクタ株式会社 金属線のボンディング方法
US6885106B1 (en) * 2001-01-11 2005-04-26 Tessera, Inc. Stacked microelectronic assemblies and methods of making same
US6539625B2 (en) * 2001-01-11 2003-04-01 International Business Machines Corporation Chromium adhesion layer for copper vias in low-k technology
US6532654B2 (en) * 2001-01-12 2003-03-18 International Business Machines Corporation Method of forming an electrical connector
JP3486872B2 (ja) * 2001-01-26 2004-01-13 Ｎｅｃセミコンダクターズ九州株式会社 半導体装置及びその製造方法
JP2002231399A (ja) * 2001-02-02 2002-08-16 Fujitsu Ltd 半導体装置試験用コンタクタ及びその製造方法
US6673653B2 (en) * 2001-02-23 2004-01-06 Eaglestone Partners I, Llc Wafer-interposer using a ceramic substrate
US20020163062A1 (en) * 2001-02-26 2002-11-07 International Business Machines Corporation Multiple material stacks with a stress relief layer between a metal structure and a passivation layer
US7396236B2 (en) * 2001-03-16 2008-07-08 Formfactor, Inc. Wafer level interposer
US6884653B2 (en) * 2001-03-21 2005-04-26 Micron Technology, Inc. Folded interposer
US6627980B2 (en) 2001-04-12 2003-09-30 Formfactor, Inc. Stacked semiconductor device assembly with microelectronic spring contacts
US6655018B2 (en) * 2001-04-30 2003-12-02 Delphi Technologies, Inc. Technique for surface mounting electrical components to a circuit board
JP2002343478A (ja) 2001-05-16 2002-11-29 Tyco Electronics Amp Kk 電気コンタクトおよびそれを用いた電気接続部材
US20020173072A1 (en) * 2001-05-18 2002-11-21 Larson Thane M. Data capture plate for substrate components
US6585527B2 (en) 2001-05-31 2003-07-01 Samtec, Inc. Compliant connector for land grid array
US6545226B2 (en) * 2001-05-31 2003-04-08 International Business Machines Corporation Printed wiring board interposer sub-assembly
US6729019B2 (en) * 2001-07-11 2004-05-04 Formfactor, Inc. Method of manufacturing a probe card
US6788085B2 (en) * 2001-07-11 2004-09-07 International Business Machines Corporation Self-aligning wafer burn-in probe
US6560861B2 (en) * 2001-07-11 2003-05-13 Xerox Corporation Microspring with conductive coating deposited on tip after release
US6806568B2 (en) 2001-07-20 2004-10-19 The Board Of Trustees Of The University Of Arkansas Decoupling capacitor for integrated circuit package and electrical components using the decoupling capacitor and associated methods
US20030017781A1 (en) * 2001-07-20 2003-01-23 Alex Chang Eye structure for dolls
US7182672B2 (en) * 2001-08-02 2007-02-27 Sv Probe Pte. Ltd. Method of probe tip shaping and cleaning
AU2002327490A1 (en) 2001-08-21 2003-06-30 Cascade Microtech, Inc. Membrane probing system
US20030038356A1 (en) * 2001-08-24 2003-02-27 Derderian James M Semiconductor devices including stacking spacers thereon, assemblies including the semiconductor devices, and methods
US20030042615A1 (en) 2001-08-30 2003-03-06 Tongbi Jiang Stacked microelectronic devices and methods of fabricating same
US20030176066A1 (en) * 2001-09-12 2003-09-18 Yu Zhou Contact structure and production method thereof and probe contact assemly using same
US6764869B2 (en) 2001-09-12 2004-07-20 Formfactor, Inc. Method of assembling and testing an electronics module
US6714828B2 (en) * 2001-09-17 2004-03-30 Formfactor, Inc. Method and system for designing a probe card
US6906540B2 (en) * 2001-09-20 2005-06-14 Wentworth Laboratories, Inc. Method for chemically etching photo-defined micro electrical contacts
US6977515B2 (en) * 2001-09-20 2005-12-20 Wentworth Laboratories, Inc. Method for forming photo-defined micro electrical contacts
US6882546B2 (en) * 2001-10-03 2005-04-19 Formfactor, Inc. Multiple die interconnect system
US6817052B2 (en) * 2001-11-09 2004-11-16 Formfactor, Inc. Apparatuses and methods for cleaning test probes
US6608390B2 (en) * 2001-11-13 2003-08-19 Kulicke & Soffa Investments, Inc. Wirebonded semiconductor package structure and method of manufacture
US7244367B2 (en) * 2001-12-11 2007-07-17 Jds Uniphase Corporation Metal alloy elements in micromachined devices
US6798073B2 (en) * 2001-12-13 2004-09-28 Megic Corporation Chip structure and process for forming the same
US6960923B2 (en) 2001-12-19 2005-11-01 Formfactor, Inc. Probe card covering system and method
US7168160B2 (en) * 2001-12-21 2007-01-30 Formfactor, Inc. Method for mounting and heating a plurality of microelectronic components
AU2002361863A1 (en) 2001-12-27 2003-07-24 Formfactor, Inc. Cooling assembly with direct cooling of active electronic components
US7064953B2 (en) * 2001-12-27 2006-06-20 Formfactor, Inc. Electronic package with direct cooling of active electronic components
US6891385B2 (en) * 2001-12-27 2005-05-10 Formfactor, Inc. Probe card cooling assembly with direct cooling of active electronic components
US6896760B1 (en) * 2002-01-16 2005-05-24 Micron Technology, Inc. Fabrication of stacked microelectronic devices
US6840374B2 (en) 2002-01-18 2005-01-11 Igor Y. Khandros Apparatus and method for cleaning test probes
US6712621B2 (en) * 2002-01-23 2004-03-30 High Connection Density, Inc. Thermally enhanced interposer and method
US6721189B1 (en) * 2002-03-13 2004-04-13 Rambus, Inc. Memory module
WO2003081725A2 (en) * 2002-03-18 2003-10-02 Nanonexus, Inc. A miniaturized contact spring
JP4054208B2 (ja) * 2002-04-01 2008-02-27 富士通株式会社 コンタクタの製造方法
US7010854B2 (en) * 2002-04-10 2006-03-14 Formfactor, Inc. Re-assembly process for MEMS structures
US7265565B2 (en) 2003-02-04 2007-09-04 Microfabrica Inc. Cantilever microprobes for contacting electronic components and methods for making such probes
US7640651B2 (en) * 2003-12-31 2010-01-05 Microfabrica Inc. Fabrication process for co-fabricating multilayer probe array and a space transformer
US20060051948A1 (en) * 2003-02-04 2006-03-09 Microfabrica Inc. Microprobe tips and methods for making
US20060053625A1 (en) * 2002-05-07 2006-03-16 Microfabrica Inc. Microprobe tips and methods for making
US20050184748A1 (en) * 2003-02-04 2005-08-25 Microfabrica Inc. Pin-type probes for contacting electronic circuits and methods for making such probes
US7531077B2 (en) 2003-02-04 2009-05-12 Microfabrica Inc. Electrochemical fabrication process for forming multilayer multimaterial microprobe structures
US7273812B2 (en) * 2002-05-07 2007-09-25 Microfabrica Inc. Microprobe tips and methods for making
US20050104609A1 (en) * 2003-02-04 2005-05-19 Microfabrica Inc. Microprobe tips and methods for making
US20060006888A1 (en) * 2003-02-04 2006-01-12 Microfabrica Inc. Electrochemically fabricated microprobes
US20060108678A1 (en) 2002-05-07 2006-05-25 Microfabrica Inc. Probe arrays and method for making
US7412767B2 (en) * 2003-02-04 2008-08-19 Microfabrica, Inc. Microprobe tips and methods for making
US20070045121A1 (en) * 2002-05-07 2007-03-01 Microfabrica Inc. Electrochemically fabricated hermetically sealed microstructures and methods of and apparatus for producing such structures
US20050067292A1 (en) * 2002-05-07 2005-03-31 Microfabrica Inc. Electrochemically fabricated structures having dielectric or active bases and methods of and apparatus for producing such structures
US20050142739A1 (en) * 2002-05-07 2005-06-30 Microfabrica Inc. Probe arrays and method for making
US7363705B2 (en) * 2003-02-04 2008-04-29 Microfabrica, Inc. Method of making a contact
US20060238209A1 (en) * 2002-05-07 2006-10-26 Microfabrica Inc. Vertical microprobes for contacting electronic components and method for making such probes
AU2003234398A1 (en) * 2002-05-07 2003-11-11 Memgen Corporation Electrochemically fabricated structures having dielectric or active bases
US6911835B2 (en) * 2002-05-08 2005-06-28 Formfactor, Inc. High performance probe system
US6965244B2 (en) * 2002-05-08 2005-11-15 Formfactor, Inc. High performance probe system
US20040000428A1 (en) * 2002-06-26 2004-01-01 Mirng-Ji Lii Socketless package to circuit board assemblies and methods of using same
JP2005533263A (ja) * 2002-07-15 2005-11-04 フォームファクター，インコーポレイテッド 超小型電子ばね接触子の基準位置合わせ目標
US6612161B1 (en) * 2002-07-23 2003-09-02 Fidelica Microsystems, Inc. Atomic force microscopy measurements of contact resistance and current-dependent stiction
DE10242521A1 (de) * 2002-09-12 2004-03-25 Robert Bosch Gmbh Diode
US6917102B2 (en) * 2002-10-10 2005-07-12 Advantest Corp. Contact structure and production method thereof and probe contact assembly using same
US6724205B1 (en) 2002-11-13 2004-04-20 Cascade Microtech, Inc. Probe for combined signals
JP2004172477A (ja) 2002-11-21 2004-06-17 Kaijo Corp ワイヤループ形状、そのワイヤループ形状を備えた半導体装置、ワイヤボンディング方法及び半導体製造装置
US6920689B2 (en) * 2002-12-06 2005-07-26 Formfactor, Inc. Method for making a socket to perform testing on integrated circuits
US7084650B2 (en) * 2002-12-16 2006-08-01 Formfactor, Inc. Apparatus and method for limiting over travel in a probe card assembly
US20040114338A1 (en) * 2002-12-17 2004-06-17 Blasko Raymond J. Direct connection to a circuit board
US6945827B2 (en) * 2002-12-23 2005-09-20 Formfactor, Inc. Microelectronic contact structure
US20040124507A1 (en) * 2002-12-30 2004-07-01 Aldaz Robert Edward Contact structure and production method thereof
US8613846B2 (en) * 2003-02-04 2013-12-24 Microfabrica Inc. Multi-layer, multi-material fabrication methods for producing micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties
US10416192B2 (en) 2003-02-04 2019-09-17 Microfabrica Inc. Cantilever microprobes for contacting electronic components
US20080211524A1 (en) * 2003-02-04 2008-09-04 Microfabrica Inc. Electrochemically Fabricated Microprobes
US9244101B2 (en) * 2003-02-04 2016-01-26 University Of Southern California Electrochemical fabrication process for forming multilayer multimaterial microprobe structures
US20080106280A1 (en) * 2003-02-04 2008-05-08 Microfabrica Inc. Vertical Microprobes for Contacting Electronic Components and Method for Making Such Probes
US7567089B2 (en) * 2003-02-04 2009-07-28 Microfabrica Inc. Two-part microprobes for contacting electronic components and methods for making such probes
US7505862B2 (en) * 2003-03-07 2009-03-17 Salmon Technologies, Llc Apparatus and method for testing electronic systems
SG124273A1 (en) * 2004-03-08 2006-08-30 Tan Yin Leong Non-abrasive electrical test contact
US6815836B2 (en) * 2003-03-24 2004-11-09 Texas Instruments Incorporated Wire bonding for thin semiconductor package
US6948940B2 (en) * 2003-04-10 2005-09-27 Formfactor, Inc. Helical microelectronic contact and method for fabricating same
US6965245B2 (en) 2003-05-01 2005-11-15 K&S Interconnect, Inc. Prefabricated and attached interconnect structure
US9671429B2 (en) 2003-05-07 2017-06-06 University Of Southern California Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties
US7057404B2 (en) 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
US6953707B2 (en) * 2003-05-28 2005-10-11 Texas Instruments Incorporated Method and system for chip-to-package interconnection
US7326327B2 (en) * 2003-06-06 2008-02-05 Formfactor, Inc. Rhodium electroplated structures and methods of making same
US7242097B2 (en) * 2003-06-30 2007-07-10 Intel Corporation Electromigration barrier layers for solder joints
US7456050B2 (en) * 2003-07-01 2008-11-25 Stmicroelectronics, Inc. System and method for controlling integrated circuit die height and planarity
US7304376B2 (en) * 2003-07-30 2007-12-04 Tessers, Inc. Microelectronic assemblies with springs
US6958670B2 (en) * 2003-08-01 2005-10-25 Raytheon Company Offset connector with compressible conductor
US7408258B2 (en) * 2003-08-20 2008-08-05 Salmon Technologies, Llc Interconnection circuit and electronic module utilizing same
WO2005031861A1 (en) * 2003-09-26 2005-04-07 Tessera, Inc. Structure and method of making capped chips including a flowable conductive medium
US6881074B1 (en) * 2003-09-29 2005-04-19 Cookson Electronics, Inc. Electrical circuit assembly with micro-socket
US7179688B2 (en) * 2003-10-16 2007-02-20 Kulicke And Soffa Industries, Inc. Method for reducing or eliminating semiconductor device wire sweep in a multi-tier bonding device and a device produced by the method
US6847122B1 (en) * 2003-10-16 2005-01-25 Kulicke & Soffa Investments, Inc. System and method for preventing and alleviating short circuiting in a semiconductor device
JP2005127952A (ja) * 2003-10-27 2005-05-19 Sumitomo Electric Ind Ltd コンタクトプローブおよびその製造方法
US7243421B2 (en) * 2003-10-29 2007-07-17 Conductive Inkjet Technology Limited Electrical connection of components
US20050116344A1 (en) * 2003-10-29 2005-06-02 Tessera, Inc. Microelectronic element having trace formed after bond layer
WO2005044451A1 (en) * 2003-10-29 2005-05-19 Conductive Inkjet Technology Limited Electrical connection of components
JP4732360B2 (ja) 2003-11-14 2011-07-27 ウエントワース ラボラトリーズ，インコーポレイテッド 組立補助材が組み込まれたダイ設計
US7024763B2 (en) 2003-11-26 2006-04-11 Formfactor, Inc. Methods for making plated through holes usable as interconnection wire or probe attachments
JP2007515794A (ja) 2003-12-22 2007-06-14 エックストゥーワイ アテニュエイターズ，エルエルシー 内部で遮蔽されたエネルギー調節器
US7427868B2 (en) 2003-12-24 2008-09-23 Cascade Microtech, Inc. Active wafer probe
US20080105355A1 (en) * 2003-12-31 2008-05-08 Microfabrica Inc. Probe Arrays and Method for Making
US10641792B2 (en) 2003-12-31 2020-05-05 University Of Southern California Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties
US20080108221A1 (en) * 2003-12-31 2008-05-08 Microfabrica Inc. Microprobe Tips and Methods for Making
TWI266057B (en) * 2004-02-05 2006-11-11 Ind Tech Res Inst Integrated probe card and the packaging method
JP4140012B2 (ja) * 2004-02-06 2008-08-27 ソニー株式会社 チップ状電子部品、その製造方法及び実装構造
US20050184376A1 (en) * 2004-02-19 2005-08-25 Salmon Peter C. System in package
US7282932B2 (en) 2004-03-02 2007-10-16 Micron Technology, Inc. Compliant contact pin assembly, card system and methods thereof
WO2005091916A2 (en) * 2004-03-10 2005-10-06 Wentworth Laboratories, Inc. Flexible microcircuit space transformer assembly
US7378742B2 (en) * 2004-10-27 2008-05-27 Intel Corporation Compliant interconnects for semiconductors and micromachines
US7202541B2 (en) * 2004-04-29 2007-04-10 Hewlett-Packard Development Company, L.P. Apparatus and method for transverse characterization of materials
US20050255722A1 (en) * 2004-05-07 2005-11-17 Salmon Peter C Micro blade assembly
US7733101B2 (en) * 2004-05-21 2010-06-08 Microprobe, Inc. Knee probe having increased scrub motion
US7659739B2 (en) * 2006-09-14 2010-02-09 Micro Porbe, Inc. Knee probe having reduced thickness section for control of scrub motion
US8988091B2 (en) * 2004-05-21 2015-03-24 Microprobe, Inc. Multiple contact probes
US9476911B2 (en) 2004-05-21 2016-10-25 Microprobe, Inc. Probes with high current carrying capability and laser machining methods
US9097740B2 (en) * 2004-05-21 2015-08-04 Formfactor, Inc. Layered probes with core
USRE43503E1 (en) 2006-06-29 2012-07-10 Microprobe, Inc. Probe skates for electrical testing of convex pad topologies
US7759949B2 (en) * 2004-05-21 2010-07-20 Microprobe, Inc. Probes with self-cleaning blunt skates for contacting conductive pads
US20050277281A1 (en) * 2004-06-10 2005-12-15 Dubin Valery M Compliant interconnect and method of formation
US7183493B2 (en) 2004-06-30 2007-02-27 Intel Corporation Electronic assembly having multi-material interconnects
JP2006019636A (ja) * 2004-07-05 2006-01-19 Renesas Technology Corp 半導体装置
DE202005021386U1 (de) * 2004-07-07 2007-11-29 Cascade Microtech, Inc., Beaverton Prüfkopf mit einem Messfühler mit Membranaufhängung
US20090174423A1 (en) * 2004-07-21 2009-07-09 Klaerner Peter J Bond Reinforcement Layer for Probe Test Cards
EP1831703A1 (de) * 2004-07-21 2007-09-12 SV Probe Pte Ltd. Verstärkte sonde zum testen von halbleiterbauelementen
KR100618342B1 (ko) * 2004-07-29 2006-09-04 삼성전자주식회사 소형 구조물 및 그 제작방법
US7750487B2 (en) * 2004-08-11 2010-07-06 Intel Corporation Metal-metal bonding of compliant interconnect
US7385411B2 (en) * 2004-08-31 2008-06-10 Formfactor, Inc. Method of designing a probe card apparatus with desired compliance characteristics
KR100845497B1 (ko) * 2004-09-08 2008-07-10 가부시키가이샤 무라타 세이사쿠쇼 복합 세라믹 기판
US7420381B2 (en) 2004-09-13 2008-09-02 Cascade Microtech, Inc. Double sided probing structures
KR100648039B1 (ko) * 2004-09-13 2006-11-23 삼성전자주식회사 솔더 볼 형성 방법과 이를 이용한 반도체 패키지의 제조방법 및 구조
JP2006108431A (ja) * 2004-10-06 2006-04-20 Sharp Corp 半導体装置
US7659619B1 (en) * 2004-10-13 2010-02-09 Sun Microsystems, Inc. Structures for Z-aligned proximity communication
US7046027B2 (en) * 2004-10-15 2006-05-16 Teradyne, Inc. Interface apparatus for semiconductor device tester
KR100585561B1 (ko) * 2004-10-26 2006-06-07 주식회사 파이컴 수직형 전기적 접촉체 및 그 제조방법
CN101053079A (zh) * 2004-11-03 2007-10-10 德塞拉股份有限公司 堆叠式封装的改进
US7771208B2 (en) * 2004-12-16 2010-08-10 International Business Machines Corporation Metalized elastomeric electrical contacts
CN101218515B (zh) * 2004-12-16 2011-08-24 国际商业机器公司 金属化弹性探针结构
US7427809B2 (en) * 2004-12-16 2008-09-23 Salmon Technologies, Llc Repairable three-dimensional semiconductor subsystem
US20060132152A1 (en) * 2004-12-20 2006-06-22 Wang Chih Y Contact-type film probe
US20070007983A1 (en) * 2005-01-06 2007-01-11 Salmon Peter C Semiconductor wafer tester
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US20060170114A1 (en) * 2005-01-31 2006-08-03 Chao-Yuan Su Novel method for copper wafer wire bonding
JP2006216911A (ja) * 2005-02-07 2006-08-17 Renesas Technology Corp 半導体装置およびカプセル型半導体パッケージ
US20060180927A1 (en) * 2005-02-14 2006-08-17 Daisuke Takai Contact structure and method for manufacturing the same
US20060183270A1 (en) * 2005-02-14 2006-08-17 Tessera, Inc. Tools and methods for forming conductive bumps on microelectronic elements
KR20070107746A (ko) 2005-03-01 2007-11-07 엑스2와이 어테뉴에이터스, 엘.엘.씨 내부 중첩된 조절기
WO2006093831A2 (en) 2005-03-01 2006-09-08 X2Y Attenuators, Llc Energy conditioner with tied through electrodes
JP2006245336A (ja) * 2005-03-03 2006-09-14 Koito Mfg Co Ltd 発光装置
US8143095B2 (en) 2005-03-22 2012-03-27 Tessera, Inc. Sequential fabrication of vertical conductive interconnects in capped chips
EP1866830B1 (de) * 2005-03-30 2008-12-24 Nxp B.V. Anschliessbares gehäuse für ein tragbares objekt
US7371676B2 (en) 2005-04-08 2008-05-13 Micron Technology, Inc. Method for fabricating semiconductor components with through wire interconnects
JP4534062B2 (ja) 2005-04-19 2010-09-01 ルネサスエレクトロニクス株式会社 半導体装置
US8016182B2 (en) 2005-05-10 2011-09-13 Kaijo Corporation Wire loop, semiconductor device having same and wire bonding method
US7692521B1 (en) 2005-05-12 2010-04-06 Microassembly Technologies, Inc. High force MEMS device
US7541826B2 (en) * 2005-05-13 2009-06-02 Kla-Tencor Corporation Compliant pad wafer chuck
JP4036872B2 (ja) * 2005-05-18 2008-01-23 アルプス電気株式会社 半導体装置の製造方法
US7393770B2 (en) * 2005-05-19 2008-07-01 Micron Technology, Inc. Backside method for fabricating semiconductor components with conductive interconnects
US7449899B2 (en) * 2005-06-08 2008-11-11 Cascade Microtech, Inc. Probe for high frequency signals
US7388296B2 (en) * 2005-06-09 2008-06-17 Ngk Spark Plug Co., Ltd. Wiring substrate and bonding pad composition
JP5080459B2 (ja) * 2005-06-13 2012-11-21 カスケード マイクロテック インコーポレイテッド 広帯域能動／受動差動信号プローブ
DE102005028951B4 (de) 2005-06-22 2018-05-30 Infineon Technologies Ag Anordnung zur elektrischen Verbindung einer Halbleiter-Schaltungsanordnung mit einer äusseren Kontakteinrichtung
US7589406B2 (en) * 2005-06-27 2009-09-15 Micron Technology, Inc. Stacked semiconductor component
DE102005034485B4 (de) * 2005-07-20 2013-08-29 Infineon Technologies Ag Verbindungselement für ein Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterleistungsbauelements
US20070023889A1 (en) * 2005-08-01 2007-02-01 Salmon Peter C Copper substrate with feedthroughs and interconnection circuits
US20070023923A1 (en) * 2005-08-01 2007-02-01 Salmon Peter C Flip chip interface including a mixed array of heat bumps and signal bumps
US7245135B2 (en) * 2005-08-01 2007-07-17 Touchdown Technologies, Inc. Post and tip design for a probe contact
US7362119B2 (en) * 2005-08-01 2008-04-22 Touchdown Technologies, Inc Torsion spring probe contactor design
US20070023904A1 (en) * 2005-08-01 2007-02-01 Salmon Peter C Electro-optic interconnection apparatus and method
US7586747B2 (en) * 2005-08-01 2009-09-08 Salmon Technologies, Llc. Scalable subsystem architecture having integrated cooling channels
US7331796B2 (en) * 2005-09-08 2008-02-19 International Business Machines Corporation Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries
US20070057685A1 (en) * 2005-09-14 2007-03-15 Touchdown Technologies, Inc. Lateral interposer contact design and probe card assembly
KR100790685B1 (ko) * 2005-09-16 2008-01-02 삼성전기주식회사 무선통신 단말기의 내장형 안테나 모듈
JP4923494B2 (ja) * 2005-09-22 2012-04-25 富士通株式会社 多層回路基板設計支援方法、プログラム、装置及び多層回路基板
US20070090156A1 (en) * 2005-10-25 2007-04-26 Ramanathan Lakshmi N Method for forming solder contacts on mounted substrates
US7923844B2 (en) 2005-11-22 2011-04-12 Shocking Technologies, Inc. Semiconductor devices including voltage switchable materials for over-voltage protection
US7649367B2 (en) * 2005-12-07 2010-01-19 Microprobe, Inc. Low profile probe having improved mechanical scrub and reduced contact inductance
US7307348B2 (en) * 2005-12-07 2007-12-11 Micron Technology, Inc. Semiconductor components having through wire interconnects (TWI)
US20070138644A1 (en) * 2005-12-15 2007-06-21 Tessera, Inc. Structure and method of making capped chip having discrete article assembled into vertical interconnect
US7365553B2 (en) * 2005-12-22 2008-04-29 Touchdown Technologies, Inc. Probe card assembly
US8058101B2 (en) 2005-12-23 2011-11-15 Tessera, Inc. Microelectronic packages and methods therefor
US20070152685A1 (en) * 2006-01-03 2007-07-05 Formfactor, Inc. A probe array structure and a method of making a probe array structure
US7936062B2 (en) 2006-01-23 2011-05-03 Tessera Technologies Ireland Limited Wafer level chip packaging
FR2896914B1 (fr) * 2006-01-30 2008-07-04 Valeo Electronique Sys Liaison Module electronique et procede d'assemblage d'un tel module
EP1991996A1 (de) * 2006-03-07 2008-11-19 X2Y Attenuators, L.L.C. Energiekonditionierungsstrukturen
US7312617B2 (en) 2006-03-20 2007-12-25 Microprobe, Inc. Space transformers employing wire bonds for interconnections with fine pitch contacts
US7659612B2 (en) 2006-04-24 2010-02-09 Micron Technology, Inc. Semiconductor components having encapsulated through wire interconnects (TWI)
WO2007125802A1 (ja) * 2006-04-24 2007-11-08 Sumitomo Electric Industries, Ltd. 熱伝達部材、凸状構造部材、電子機器、および電気製品
US7444253B2 (en) * 2006-05-09 2008-10-28 Formfactor, Inc. Air bridge structures and methods of making and using air bridge structures
ATE495561T1 (de) * 2006-05-23 2011-01-15 Delphi Tech Inc Elektronisches bauteil mit kontaktelementen
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7723224B2 (en) * 2006-06-14 2010-05-25 Freescale Semiconductor, Inc. Microelectronic assembly with back side metallization and method for forming the same
US20080022522A1 (en) * 2006-07-19 2008-01-31 Lotes Co., Ltd. Manufacturing method for electrical connector
US7331797B1 (en) * 2006-07-26 2008-02-19 Lotes Co., Ltd. Electrical connector and a manufacturing method thereof
US7981325B2 (en) 2006-07-29 2011-07-19 Shocking Technologies, Inc. Electronic device for voltage switchable dielectric material having high aspect ratio particles
EP2084748A4 (de) 2006-09-24 2011-09-28 Shocking Technologies Inc Formulierungen für ein spannungsumschaltbares dielektrisches material mit einem abgestuften spannungsansprechverhalten und herstellungsverfahren dafür
JPWO2008041484A1 (ja) * 2006-09-26 2010-02-04 アルプス電気株式会社 弾性接触子を用いた金属端子間の接合方法
US8907689B2 (en) * 2006-10-11 2014-12-09 Microprobe, Inc. Probe retention arrangement
US7786740B2 (en) * 2006-10-11 2010-08-31 Astria Semiconductor Holdings, Inc. Probe cards employing probes having retaining portions for potting in a potting region
EP1930216A1 (de) * 2006-12-07 2008-06-11 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO Drahtstrahl
US8604605B2 (en) 2007-01-05 2013-12-10 Invensas Corp. Microelectronic assembly with multi-layer support structure
DE102007012500A1 (de) * 2007-03-15 2008-09-18 Continental Automotive Gmbh Leiterplattenkontaktiervorrichtung
US7675131B2 (en) * 2007-04-05 2010-03-09 Micron Technology, Inc. Flip-chip image sensor packages and methods of fabricating the same
US7514948B2 (en) 2007-04-10 2009-04-07 Microprobe, Inc. Vertical probe array arranged to provide space transformation
US8832936B2 (en) * 2007-04-30 2014-09-16 International Business Machines Corporation Method of forming metallized elastomeric electrical contacts
US7793236B2 (en) 2007-06-13 2010-09-07 Shocking Technologies, Inc. System and method for including protective voltage switchable dielectric material in the design or simulation of substrate devices
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
JP2009071156A (ja) * 2007-09-14 2009-04-02 Toshiba Corp 半導体装置及びその製造方法
US7888955B2 (en) 2007-09-25 2011-02-15 Formfactor, Inc. Method and apparatus for testing devices using serially controlled resources
US7977959B2 (en) 2007-09-27 2011-07-12 Formfactor, Inc. Method and apparatus for testing devices using serially controlled intelligent switches
US20090091025A1 (en) * 2007-10-04 2009-04-09 Agency For Science, Technology And Research Method for forming and releasing interconnects
US7671610B2 (en) * 2007-10-19 2010-03-02 Microprobe, Inc. Vertical guided probe array providing sideways scrub motion
US8723546B2 (en) * 2007-10-19 2014-05-13 Microprobe, Inc. Vertical guided layered probe
US9147665B2 (en) 2007-11-06 2015-09-29 Fairchild Semiconductor Corporation High bond line thickness for semiconductor devices
TWI389290B (zh) * 2007-11-08 2013-03-11 Ind Tech Res Inst 晶片結構及其製程、晶片堆疊結構及其製程
JP4443598B2 (ja) * 2007-11-26 2010-03-31 シャープ株式会社 両面配線基板
TW200922009A (en) * 2007-12-07 2009-05-16 Jye Chuang Electronic Co Ltd Contact terminal
ATE481735T1 (de) * 2007-12-27 2010-10-15 Imec Methode zur justage und zum bonding von teilen und ein bauteil aus justierten und gebondeten teilen
FR2926435B1 (fr) * 2008-01-10 2012-02-03 Johnson Controls Tech Co Carte electronique comportant une plaque de circuit imprime et un equipement porte par cette plaque.
US8206614B2 (en) 2008-01-18 2012-06-26 Shocking Technologies, Inc. Voltage switchable dielectric material having bonded particle constituents
JP2009176947A (ja) * 2008-01-24 2009-08-06 Olympus Corp ３次元モジュール
US20090224793A1 (en) * 2008-03-07 2009-09-10 Formfactor, Inc. Method And Apparatus For Designing A Custom Test System
US8122309B2 (en) * 2008-03-11 2012-02-21 Formfactor, Inc. Method and apparatus for processing failures during semiconductor device testing
JP5194932B2 (ja) * 2008-03-26 2013-05-08 富士通セミコンダクター株式会社 半導体装置および半導体装置の製造方法
US8203421B2 (en) 2008-04-14 2012-06-19 Shocking Technologies, Inc. Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration
DE102008023761B9 (de) * 2008-05-09 2012-11-08 Feinmetall Gmbh Elektrisches Kontaktelement zum Berührungskontaktieren von elektrischen Prüflingen sowie entsprechende Kontaktieranordnung
US8230593B2 (en) * 2008-05-29 2012-07-31 Microprobe, Inc. Probe bonding method having improved control of bonding material
US8963323B2 (en) * 2008-06-20 2015-02-24 Alcatel Lucent Heat-transfer structure
KR101004911B1 (ko) * 2008-08-12 2010-12-28 삼성전기주식회사 마이크로 전자기계적 부품 제조방법
US8095841B2 (en) 2008-08-19 2012-01-10 Formfactor, Inc. Method and apparatus for testing semiconductor devices with autonomous expected value generation
TWI372250B (en) * 2008-08-27 2012-09-11 King Yuan Electronics Co Ltd Probe card
US7944225B2 (en) * 2008-09-26 2011-05-17 Formfactor, Inc. Method and apparatus for providing a tester integrated circuit for testing a semiconductor device under test
WO2010039902A2 (en) 2008-09-30 2010-04-08 Shocking Technologies, Inc. Voltage switchable dielectric material containing conductive core shelled particles
US9208931B2 (en) 2008-09-30 2015-12-08 Littelfuse, Inc. Voltage switchable dielectric material containing conductor-on-conductor core shelled particles
US7888957B2 (en) 2008-10-06 2011-02-15 Cascade Microtech, Inc. Probing apparatus with impedance optimized interface
US8794322B2 (en) * 2008-10-10 2014-08-05 Halliburton Energy Services, Inc. Additives to suppress silica scale build-up
US7982305B1 (en) * 2008-10-20 2011-07-19 Maxim Integrated Products, Inc. Integrated circuit package including a three-dimensional fan-out / fan-in signal routing
US8362871B2 (en) 2008-11-05 2013-01-29 Shocking Technologies, Inc. Geometric and electric field considerations for including transient protective material in substrate devices
US8410806B2 (en) 2008-11-21 2013-04-02 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus
US8399773B2 (en) 2009-01-27 2013-03-19 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
US8272123B2 (en) 2009-01-27 2012-09-25 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
US9226391B2 (en) 2009-01-27 2015-12-29 Littelfuse, Inc. Substrates having voltage switchable dielectric materials
US8073019B2 (en) * 2009-03-02 2011-12-06 Jian Liu 810 nm ultra-short pulsed fiber laser
CA2753890A1 (en) * 2009-03-10 2010-09-16 Johnstech International Corporation Electrically conductive pins for microcircuit tester
CN102550132A (zh) 2009-03-26 2012-07-04 肖克科技有限公司 具有电压可切换电介质材料的元件
JP5062283B2 (ja) * 2009-04-30 2012-10-31 日亜化学工業株式会社 半導体装置及びその製造方法
US8531042B2 (en) * 2009-06-30 2013-09-10 Oracle America, Inc. Technique for fabricating microsprings on non-planar surfaces
US8436251B2 (en) * 2009-07-08 2013-05-07 Medtronic, Inc. Ribbon connecting electrical components
US9053844B2 (en) 2009-09-09 2015-06-09 Littelfuse, Inc. Geometric configuration or alignment of protective material in a gap structure for electrical devices
EP2478555A1 (de) * 2009-09-17 2012-07-25 Koninklijke Philips Electronics N.V. Geometrie von kontaktstellen auf anorganischen spröden schichten bei elektronischen vorrichtungen
BR112012010870A2 (pt) 2009-11-12 2019-09-24 Dow Global Technologies Inc composição de resina de oxazolidona com funcionalidade epóxi,composição de resina epóxi curável ,processo para reparar uma composição de resina de oxazolodona com funcionalidadde epóxi,processo para preparar uma composição de resina epóxi curável e produto termofixo curado
JP5488024B2 (ja) * 2010-02-17 2014-05-14 ミツミ電機株式会社 Ａｃアダプタ
US9320135B2 (en) 2010-02-26 2016-04-19 Littelfuse, Inc. Electric discharge protection for surface mounted and embedded components
US9082622B2 (en) 2010-02-26 2015-07-14 Littelfuse, Inc. Circuit elements comprising ferroic materials
US9224728B2 (en) 2010-02-26 2015-12-29 Littelfuse, Inc. Embedded protection against spurious electrical events
US8215966B2 (en) * 2010-04-20 2012-07-10 Tyco Electronics Corporation Interposer connector assembly
US8407888B2 (en) 2010-05-07 2013-04-02 Oracle International Corporation Method of assembling a circuit board assembly
JP2011258364A (ja) * 2010-06-08 2011-12-22 Shinko Electric Ind Co Ltd ソケット
US8172615B2 (en) 2010-06-30 2012-05-08 Tyco Electronics Corporation Electrical connector for an electronic module
US8167644B2 (en) 2010-06-30 2012-05-01 Tyco Electronics Corporation Electrical connector for an electronic module
US9159708B2 (en) 2010-07-19 2015-10-13 Tessera, Inc. Stackable molded microelectronic packages with area array unit connectors
US8482111B2 (en) 2010-07-19 2013-07-09 Tessera, Inc. Stackable molded microelectronic packages
JP5713598B2 (ja) 2010-07-20 2015-05-07 新光電気工業株式会社 ソケット及びその製造方法
US8274798B2 (en) * 2010-07-28 2012-09-25 Unimicron Technology Corp. Carrier substrate and method for making the same
JP5788166B2 (ja) 2010-11-02 2015-09-30 新光電気工業株式会社 接続端子構造及びその製造方法、並びにソケット
US8191246B1 (en) * 2010-11-11 2012-06-05 Qi Luo Method of manufacturing a plurality of miniaturized spring contacts
KR101075241B1 (ko) 2010-11-15 2011-11-01 테세라, 인코포레이티드 유전체 부재에 단자를 구비하는 마이크로전자 패키지
US20120146206A1 (en) 2010-12-13 2012-06-14 Tessera Research Llc Pin attachment
US20120208379A1 (en) * 2011-02-14 2012-08-16 Chicony Power Technology Co., Ltd. Ac inlet
US9702904B2 (en) * 2011-03-21 2017-07-11 Formfactor, Inc. Non-linear vertical leaf spring
KR101128063B1 (ko) 2011-05-03 2012-04-23 테세라, 인코포레이티드 캡슐화 층의 표면에 와이어 본드를 구비하는 패키지 적층형 어셈블리
US8404520B1 (en) 2011-10-17 2013-03-26 Invensas Corporation Package-on-package assembly with wire bond vias
JP2013101043A (ja) * 2011-11-08 2013-05-23 Renesas Electronics Corp 半導体装置の製造方法
US8917106B2 (en) 2011-11-09 2014-12-23 Advantest America, Inc. Fine pitch microelectronic contact array and method of making same
TWI453425B (zh) 2012-09-07 2014-09-21 Mjc Probe Inc 晶片電性偵測裝置及其形成方法
US8946757B2 (en) 2012-02-17 2015-02-03 Invensas Corporation Heat spreading substrate with embedded interconnects
US9349706B2 (en) 2012-02-24 2016-05-24 Invensas Corporation Method for package-on-package assembly with wire bonds to encapsulation surface
US8372741B1 (en) 2012-02-24 2013-02-12 Invensas Corporation Method for package-on-package assembly with wire bonds to encapsulation surface
US9082763B2 (en) * 2012-03-15 2015-07-14 Taiwan Semiconductor Manufacturing Company, Ltd. Joint structure for substrates and methods of forming
US8835228B2 (en) 2012-05-22 2014-09-16 Invensas Corporation Substrate-less stackable package with wire-bond interconnect
US8902605B2 (en) * 2012-06-13 2014-12-02 International Business Machines Corporation Adapter for plated through hole mounting of surface mount component
US9391008B2 (en) 2012-07-31 2016-07-12 Invensas Corporation Reconstituted wafer-level package DRAM
US9502390B2 (en) 2012-08-03 2016-11-22 Invensas Corporation BVA interposer
US8927877B2 (en) * 2012-08-08 2015-01-06 Taiwan Semiconductor Manufacturing Company, Ltd. Looped interconnect structure
US8902606B2 (en) * 2012-10-17 2014-12-02 Microelectronics Assembly Technologies Electronic interconnect system
US20140104776A1 (en) * 2012-10-17 2014-04-17 James E. Clayton Rigid circuit board with flexibly attached module
US9338895B2 (en) * 2012-10-17 2016-05-10 Microelectronics Assembly Technologies Method for making an electrical circuit
US8975738B2 (en) 2012-11-12 2015-03-10 Invensas Corporation Structure for microelectronic packaging with terminals on dielectric mass
US8878353B2 (en) 2012-12-20 2014-11-04 Invensas Corporation Structure for microelectronic packaging with bond elements to encapsulation surface
US9202782B2 (en) 2013-01-07 2015-12-01 Intel Corporation Embedded package in PCB build up
US9136254B2 (en) 2013-02-01 2015-09-15 Invensas Corporation Microelectronic package having wire bond vias and stiffening layer
JP6161918B2 (ja) * 2013-02-25 2017-07-12 新光電気工業株式会社 半導体装置
US9167710B2 (en) 2013-08-07 2015-10-20 Invensas Corporation Embedded packaging with preformed vias
US9685365B2 (en) 2013-08-08 2017-06-20 Invensas Corporation Method of forming a wire bond having a free end
US20150076714A1 (en) 2013-09-16 2015-03-19 Invensas Corporation Microelectronic element with bond elements to encapsulation surface
EP2854170B1 (de) 2013-09-27 2022-01-26 Alcatel Lucent Struktur für eine Wärmeübertragungsschnittstelle und Verfahren zur Herstellung davon
CN105723225B (zh) * 2013-11-07 2019-01-11 贺利氏德国有限两合公司 测试针和制造测试针的方法
US9379074B2 (en) 2013-11-22 2016-06-28 Invensas Corporation Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects
US9583456B2 (en) 2013-11-22 2017-02-28 Invensas Corporation Multiple bond via arrays of different wire heights on a same substrate
US9263394B2 (en) 2013-11-22 2016-02-16 Invensas Corporation Multiple bond via arrays of different wire heights on a same substrate
US9196577B2 (en) 2014-01-09 2015-11-24 Infineon Technologies Ag Semiconductor packaging arrangement
US9583411B2 (en) 2014-01-17 2017-02-28 Invensas Corporation Fine pitch BVA using reconstituted wafer with area array accessible for testing
TWI587412B (zh) * 2014-05-08 2017-06-11 矽品精密工業股份有限公司 封裝結構及其製法
US10381326B2 (en) 2014-05-28 2019-08-13 Invensas Corporation Structure and method for integrated circuits packaging with increased density
US9646917B2 (en) 2014-05-29 2017-05-09 Invensas Corporation Low CTE component with wire bond interconnects
US9412714B2 (en) 2014-05-30 2016-08-09 Invensas Corporation Wire bond support structure and microelectronic package including wire bonds therefrom
GB2529678B (en) * 2014-08-28 2017-01-25 Cambium Networks Ltd Radio frequency connection arrangement
US9735084B2 (en) 2014-12-11 2017-08-15 Invensas Corporation Bond via array for thermal conductivity
US10679866B2 (en) 2015-02-13 2020-06-09 Taiwan Semiconductor Manufacturing Co., Ltd. Interconnect structure for semiconductor package and method of fabricating the interconnect structure
US9888579B2 (en) 2015-03-05 2018-02-06 Invensas Corporation Pressing of wire bond wire tips to provide bent-over tips
KR101663826B1 (ko) 2015-03-11 2016-10-10 주식회사 듀링플러스 탄성 시그널 핀
US9668344B2 (en) * 2015-04-23 2017-05-30 SK Hynix Inc. Semiconductor packages having interconnection members
US9502372B1 (en) 2015-04-30 2016-11-22 Invensas Corporation Wafer-level packaging using wire bond wires in place of a redistribution layer
US9761554B2 (en) 2015-05-07 2017-09-12 Invensas Corporation Ball bonding metal wire bond wires to metal pads
US10685943B2 (en) * 2015-05-14 2020-06-16 Mediatek Inc. Semiconductor chip package with resilient conductive paste post and fabrication method thereof
US10490528B2 (en) 2015-10-12 2019-11-26 Invensas Corporation Embedded wire bond wires
US9490222B1 (en) 2015-10-12 2016-11-08 Invensas Corporation Wire bond wires for interference shielding
US10332854B2 (en) 2015-10-23 2019-06-25 Invensas Corporation Anchoring structure of fine pitch bva
US10181457B2 (en) 2015-10-26 2019-01-15 Invensas Corporation Microelectronic package for wafer-level chip scale packaging with fan-out
US9911718B2 (en) 2015-11-17 2018-03-06 Invensas Corporation ‘RDL-First’ packaged microelectronic device for a package-on-package device
US9659848B1 (en) 2015-11-18 2017-05-23 Invensas Corporation Stiffened wires for offset BVA
CN105467176A (zh) * 2015-12-10 2016-04-06 苏州世纪福智能装备股份有限公司 双层浮动式高密度连接器
US9984992B2 (en) 2015-12-30 2018-05-29 Invensas Corporation Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces
US10104773B2 (en) * 2016-01-27 2018-10-16 Northrop Grumman Systems Corporation Resilient micro lattice electrical interconnection assembly
CN105719978B (zh) * 2016-05-09 2018-12-04 中芯长电半导体（江阴）有限公司 一种近间距铜针封装结构及其制备方法
US10643965B2 (en) * 2016-05-25 2020-05-05 Taiwan Semiconductor Manufacturing Company, Ltd. Structure and method of forming a joint assembly
US10120020B2 (en) 2016-06-16 2018-11-06 Formfactor Beaverton, Inc. Probe head assemblies and probe systems for testing integrated circuit devices
US10299368B2 (en) 2016-12-21 2019-05-21 Invensas Corporation Surface integrated waveguides and circuit structures therefor
JP6387426B2 (ja) * 2017-01-25 2018-09-05 日鉄住金マイクロメタル株式会社 ボンディングワイヤ
CN106852021A (zh) * 2017-04-03 2017-06-13 东莞市仪锐电子有限公司 一种pcb电路板焊片脉冲热压机
US11489038B2 (en) * 2017-08-29 2022-11-01 Micron Technology, Inc. Capacitors having vertical contacts extending through conductive tiers
CN112904057B (zh) * 2018-01-11 2022-06-07 欧姆龙株式会社 探针、检查工具、检查单元和检查装置
CN109300859B (zh) * 2018-09-18 2020-08-28 苏州施密科微电子设备有限公司 一种半导体芯片封装框架
US11262383B1 (en) 2018-09-26 2022-03-01 Microfabrica Inc. Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making
CN109046495A (zh) * 2018-10-17 2018-12-21 皖南医学院 一种实验器皿的摆放盒
DE102018220089A1 (de) * 2018-11-22 2020-05-28 Infineon Technologies Ag Digitale Vorverzerrungstechnik für eine Schaltungsanordnung mit einem Leistungsverstärker
CN216698775U (zh) 2019-02-11 2022-06-07 怡得乐工业有限公司 用于将基板连接在一起的电触头及包括其的电学组件
US11768227B1 (en) 2019-02-22 2023-09-26 Microfabrica Inc. Multi-layer probes having longitudinal axes and preferential probe bending axes that lie in planes that are nominally parallel to planes of probe layers
CN111786159B (zh) * 2019-04-03 2022-02-11 高天星 传导装置
TWI706139B (zh) * 2019-10-25 2020-10-01 巨擘科技股份有限公司 金屬探針結構及其製造方法
US11761982B1 (en) 2019-12-31 2023-09-19 Microfabrica Inc. Probes with planar unbiased spring elements for electronic component contact and methods for making such probes
US11867721B1 (en) 2019-12-31 2024-01-09 Microfabrica Inc. Probes with multiple springs, methods for making, and methods for using
JP2021174864A (ja) * 2020-04-24 2021-11-01 株式会社村田製作所 積層セラミックコンデンサ
EP4161726A1 (de) * 2020-06-03 2023-04-12 Kulicke and Soffa Industries, Inc. Ultraschallschweisssysteme, verfahren zur verwendung davon und zugehörige werkstücke mit geschweissten leitfähigen stiften
US11774467B1 (en) 2020-09-01 2023-10-03 Microfabrica Inc. Method of in situ modulation of structural material properties and/or template shape
CN113451791B (zh) * 2021-05-22 2024-01-05 深圳市越疆科技股份有限公司 检测电路板与电极的连接结构、电子皮肤、外壳及机械臂

Family Cites Families (481)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3258736A (en) 1966-06-28 Electrical connector
US3302067A (en) 1967-01-31 Modular circuit package utilizing solder coated
US2432275A (en) * 1943-02-01 1947-12-09 Hazeltine Research Inc Coupling device
DE1026876B (de) 1953-06-17 1958-03-27 Telefunken Gmbh Verfahren zur Herstellung von p-n-UEbergaengen bestimmter Sperrschichtgroesse
US2869040A (en) * 1954-01-11 1959-01-13 Sylvania Electric Prod Solder-dipped stamped wiring
US2923859A (en) 1955-07-20 1960-02-02 Philco Corp Manufacture of electrical appliances with printed wiring panels
US3087239A (en) * 1959-06-19 1963-04-30 Western Electric Co Methods of bonding leads to semiconductive devices
US3075282A (en) 1959-07-24 1963-01-29 Bell Telephone Labor Inc Semiconductor device contact
US3202489A (en) 1959-12-01 1965-08-24 Hughes Aircraft Co Gold-aluminum alloy bond electrode attachment
US3070650A (en) 1960-09-23 1962-12-25 Sanders Associates Inc Solder connection for electrical circuits
US3047683A (en) 1961-03-22 1962-07-31 Jr Bernard Edward Shlesinger Multiple contact switch
US3217213A (en) * 1961-06-02 1965-11-09 Slater Electric Inc Semiconductor diode construction with heat dissipating housing
US3274456A (en) * 1962-11-21 1966-09-20 Gen Instrument Corp Rectifier assembly and method of making same
US3281751A (en) 1963-08-30 1966-10-25 Raymond H Blair Spring connector for printed circuit board
US3296692A (en) 1963-09-13 1967-01-10 Bell Telephone Labor Inc Thermocompression wire attachments to quartz crystals
US3286340A (en) 1964-02-28 1966-11-22 Philco Corp Fabrication of semiconductor units
DE1514304A1 (de) 1964-04-03 1969-05-14 Philco Ford Corp Halbleiteranordnung und Herstellungsverfahren hierfuer
US3344228A (en) 1964-11-19 1967-09-26 Thermal barriers for electric cables
US3336433A (en) * 1965-02-11 1967-08-15 Texas Instruments Inc Electronic package
US3429040A (en) 1965-06-18 1969-02-25 Ibm Method of joining a component to a substrate
US3373481A (en) * 1965-06-22 1968-03-19 Sperry Rand Corp Method of electrically interconnecting conductors
FR1483574A (de) 1965-06-24 1967-09-06
US3368114A (en) 1965-07-06 1968-02-06 Radiation Inc Microelectronic circuit packages with improved connection structure
US3467765A (en) 1965-10-04 1969-09-16 Contemporary Research Inc Solder composition
GB1100697A (en) * 1965-11-22 1968-01-24 Matsushita Electronics Corp Alternator semiconductor diode and rectifying circuit assembly
US3445770A (en) * 1965-12-27 1969-05-20 Philco Ford Corp Microelectronic test probe with defect marker access
US3614832A (en) 1966-03-09 1971-10-26 Ibm Decal connectors and methods of forming decal connections to solid state devices
US3390308A (en) 1966-03-31 1968-06-25 Itt Multiple chip integrated circuit assembly
US3397451A (en) 1966-04-06 1968-08-20 Western Electric Co Sequential wire and articlebonding methods
US3426252A (en) 1966-05-03 1969-02-04 Bell Telephone Labor Inc Semiconductive device including beam leads
US3517438A (en) 1966-05-12 1970-06-30 Ibm Method of packaging a circuit module and joining same to a circuit substrate
DE1539692A1 (de) 1966-06-23 1969-10-16 Blume & Redecker Gmbh Umklebevorrichtung fuer Spulen
NL6613526A (de) 1966-09-26 1968-03-27
US3460238A (en) * 1967-04-20 1969-08-12 Motorola Inc Wire severing in wire bonding machines
US3474297A (en) 1967-06-30 1969-10-21 Texas Instruments Inc Interconnection system for complex semiconductor arrays
US3573617A (en) * 1967-10-27 1971-04-06 Aai Corp Method and apparatus for testing packaged integrated circuits
US3495170A (en) 1967-11-24 1970-02-10 James R Biard Method for the indirect measurement of resistivities and impurity concentrations in a semiconductor body including an epitaxial film
US3689991A (en) 1968-03-01 1972-09-12 Gen Electric A method of manufacturing a semiconductor device utilizing a flexible carrier
US3519890A (en) * 1968-04-01 1970-07-07 North American Rockwell Low stress lead
US3509270A (en) * 1968-04-08 1970-04-28 Ney Co J M Interconnection for printed circuits and method of making same
US3567846A (en) 1968-05-31 1971-03-02 Gen Cable Corp Metallic sheathed cables with roam cellular polyolefin insulation and method of making
US3553499A (en) * 1968-07-17 1971-01-05 Sperry Rand Corp Fast-acting avalanche mode transistor switch
US3590480A (en) 1968-10-03 1971-07-06 Theodore H Johnson Jr Method of manufacturing a pulse transformer package
US3550645A (en) 1968-10-03 1970-12-29 Photocircuits Corp Wire wound armature,method and apparatus for making same
US3555477A (en) 1969-01-21 1971-01-12 Standard Int Corp Electrical inductor and method of making the same
US3673681A (en) 1969-04-01 1972-07-04 Inforex Electrical circuit board wiring
US3623649A (en) 1969-06-09 1971-11-30 Gen Motors Corp Wedge bonding tool for the attachment of semiconductor leads
US3680206A (en) 1969-06-23 1972-08-01 Ferranti Ltd Assemblies of semiconductor devices having mounting pillars as circuit connections
US3871015A (en) 1969-08-14 1975-03-11 Ibm Flip chip module with non-uniform connector joints
US3871014A (en) 1969-08-14 1975-03-11 Ibm Flip chip module with non-uniform solder wettable areas on the substrate
US3591839A (en) 1969-08-27 1971-07-06 Siliconix Inc Micro-electronic circuit with novel hermetic sealing structure and method of manufacture
US3569610A (en) 1969-10-15 1971-03-09 Gen Cable Corp Ethylene-propylene rubber insulated cable with cross-linked polyethylene strand shielding
JPS4919634B1 (de) 1969-12-29 1974-05-18
US3627124A (en) 1970-01-29 1971-12-14 Western Electric Co Method for separating selected articles from an array
US3616532A (en) 1970-02-02 1971-11-02 Sperry Rand Corp Multilayer printed circuit electrical interconnection device
US3662454A (en) * 1970-03-18 1972-05-16 Rca Corp Method of bonding metals together
DE2119567C2 (de) 1970-05-05 1983-07-14 International Computers Ltd., London Elektrische Verbindungsvorrichtung und Verfahren zu ihrer Herstellung
US3683105A (en) 1970-10-13 1972-08-08 Westinghouse Electric Corp Microcircuit modular package
US3680037A (en) 1970-11-05 1972-07-25 Tech Wire Prod Inc Electrical interconnector
US3844909A (en) 1970-11-12 1974-10-29 Gen Electric Magnetic film plated wire and substrates therefor
US3753665A (en) 1970-11-12 1973-08-21 Gen Electric Magnetic film plated wire
US3864728A (en) 1970-11-20 1975-02-04 Siemens Ag Semiconductor components having bimetallic lead connected thereto
DE2104207C3 (de) * 1971-01-29 1974-04-11 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zum Verbinden eines Kontaktierungsdrahtes
US3724068A (en) 1971-02-25 1973-04-03 Du Pont Semiconductor chip packaging apparatus and method
US3772575A (en) 1971-04-28 1973-11-13 Rca Corp High heat dissipation solder-reflow flip chip transistor
US3832769A (en) 1971-05-26 1974-09-03 Minnesota Mining & Mfg Circuitry and method
US3611061A (en) 1971-07-07 1971-10-05 Motorola Inc Multiple lead integrated circuit device and frame member for the fabrication thereof
GB1387587A (en) 1971-07-22 1975-03-19 Plessey Co Ltd Electrical interconnectors and connector assemblies
US3917900A (en) 1971-07-26 1975-11-04 Anaconda Co Electric cable with expanded-metal shield and method of making
US3846823A (en) * 1971-08-05 1974-11-05 Lucerne Products Inc Semiconductor assembly
US3747198A (en) * 1971-08-19 1973-07-24 Gen Electric Tailless wedge bonding of gold wire to palladium-silver cermets
US3832632A (en) 1971-11-22 1974-08-27 F Ardezzone Multi-point probe head assembly
US3719981A (en) 1971-11-24 1973-03-13 Rca Corp Method of joining solder balls to solder bumps
CA954635A (en) 1972-06-06 1974-09-10 Microsystems International Limited Mounting leads and method of fabrication
DE2228703A1 (de) 1972-06-13 1974-01-10 Licentia Gmbh Verfahren zum herstellen einer vorgegebenen lotschichtstaerke bei der fertigung von halbleiterbauelementen
DE2232794B1 (de) 1972-07-04 1973-01-25 Matsuo Electric Co., Ltd., Toyonaka, Osaka (Japan) Plättchenförmiges elektronisches Bauelement
US3939559A (en) 1972-10-03 1976-02-24 Western Electric Company, Inc. Methods of solid-phase bonding mating members through an interposed pre-shaped compliant medium
US3811186A (en) 1972-12-11 1974-05-21 Ibm Method of aligning and attaching circuit devices on a substrate
US3842189A (en) * 1973-01-08 1974-10-15 Rca Corp Contact array and method of making the same
US3861135A (en) 1973-02-08 1975-01-21 Chomerics Inc Electrical interconnector and method of making
US3795884A (en) 1973-03-06 1974-03-05 Amp Inc Electrical connector formed from coil spring
US3862791A (en) 1973-06-13 1975-01-28 Northern Electric Co Terminal pin block and method of making it
US3839727A (en) 1973-06-25 1974-10-01 Ibm Semiconductor chip to substrate solder bond using a locally dispersed, ternary intermetallic compound
US3849728A (en) * 1973-08-21 1974-11-19 Wentworth Labor Inc Fixed point probe card and an assembly and repair fixture therefor
US3873173A (en) 1973-10-05 1975-03-25 Itt Electrical connector assembly
US3868724A (en) 1973-11-21 1975-02-25 Fairchild Camera Instr Co Multi-layer connecting structures for packaging semiconductor devices mounted on a flexible carrier
US3877064A (en) 1974-02-22 1975-04-08 Amp Inc Device for connecting leadless integrated circuit packages to a printed-circuit board
US3926360A (en) 1974-05-28 1975-12-16 Burroughs Corp Method of attaching a flexible printed circuit board to a rigid printed circuit board
US3921285A (en) 1974-07-15 1975-11-25 Ibm Method for joining microminiature components to a carrying structure
US3904262A (en) 1974-09-27 1975-09-09 John M Cutchaw Connector for leadless integrated circuit packages
US4074342A (en) 1974-12-20 1978-02-14 International Business Machines Corporation Electrical package for lsi devices and assembly process therefor
US4009485A (en) 1974-12-23 1977-02-22 General Electric Company Semiconductor pellet assembly mounted on ceramic substrate
US3982320A (en) 1975-02-05 1976-09-28 Technical Wire Products, Inc. Method of making electrically conductive connector
US3984166A (en) 1975-05-07 1976-10-05 Burroughs Corporation Semiconductor device package having lead frame structure with integral spring contacts
US3991463A (en) 1975-05-19 1976-11-16 Chomerics, Inc. Method of forming an interconnector
US4189825A (en) 1975-06-04 1980-02-26 Raytheon Company Integrated test and assembly device
US4003621A (en) 1975-06-16 1977-01-18 Technical Wire Products, Inc. Electrical connector employing conductive rectilinear elements
US3990689A (en) 1975-08-11 1976-11-09 Eklund Sr Ralph H Adjustable holder assembly for positioning a vacuum chuck
US3982811A (en) * 1975-09-22 1976-09-28 Rockwell International Corporation Electrical terminal
DE2608250C3 (de) 1976-02-28 1985-06-05 Telefunken electronic GmbH, 7100 Heilbronn Verfahren zum Thermokompressions-Verbinden von auf Halbleiterkörpern befindlichen Metall-Anschlußkontakten mit zugeordneten Gehäuseanschlußteilen und Vorrichtung zur Durchführung des Verfahrens
US4080722A (en) 1976-03-22 1978-03-28 Rca Corporation Method of manufacturing semiconductor devices having a copper heat capacitor and/or copper heat sink
US4047780A (en) * 1976-04-07 1977-09-13 Cedrone Nicholas J Test contactor system for semiconductor device handling apparatus
DE2617465C3 (de) 1976-04-21 1978-10-19 Siemens Ag, 1000 Berlin Und 8000 Muenchen Elektrische Spule und Verfahren zu ihrer Herstellung
US4085502A (en) * 1977-04-12 1978-04-25 Advanced Circuit Technology, Inc. Jumper cable
US4034468A (en) 1976-09-03 1977-07-12 Ibm Corporation Method for making conduction-cooled circuit package
US4067104A (en) 1977-02-24 1978-01-10 Rockwell International Corporation Method of fabricating an array of flexible metallic interconnects for coupling microelectronics components
US4246595A (en) 1977-03-08 1981-01-20 Matsushita Electric Industrial Co., Ltd. Electronics circuit device and method of making the same
US4125308A (en) * 1977-05-26 1978-11-14 Emc Technology, Inc. Transitional RF connector
JPS53149763A (en) 1977-06-01 1978-12-27 Citizen Watch Co Ltd Mounting method of semiconductor integrate circuit
US4139936A (en) 1977-07-05 1979-02-20 Hughes Aircraft Company Method of making hermetic coaxial cable
US4161692A (en) 1977-07-18 1979-07-17 Cerprobe Corporation Probe device for integrated circuit wafers
US4312117A (en) 1977-09-01 1982-01-26 Raytheon Company Integrated test and assembly device
EP0002166A3 (de) * 1977-11-18 1979-08-08 International Business Machines Corporation Plättchenträger für integrierte Schaltungen und Verfahren zu seiner Herstellung
US4155615A (en) 1978-01-24 1979-05-22 Amp Incorporated Multi-contact connector for ceramic substrate packages and the like
US4179802A (en) 1978-03-27 1979-12-25 International Business Machines Corporation Studded chip attachment process
JPS54146581A (en) 1978-05-09 1979-11-15 Mitsubishi Electric Corp Electric chracteristic measuring device for semiconductor chip
US4326663A (en) 1978-07-20 1982-04-27 Eltec Instruments, Inc. Pyroelectric detector
JPS5555985U (de) 1978-10-12 1980-04-16
US4225900A (en) 1978-10-25 1980-09-30 Raytheon Company Integrated circuit device package interconnect means
US4216350A (en) 1978-11-01 1980-08-05 Burroughs Corporation Multiple solder pre-form with non-fusible web
US4231154A (en) 1979-01-10 1980-11-04 International Business Machines Corporation Electronic package assembly method
US4195193A (en) 1979-02-23 1980-03-25 Amp Incorporated Lead frame and chip carrier housing
US4278311A (en) 1979-04-06 1981-07-14 Amp Incorporated Surface to surface connector
JPS568081U (de) 1979-06-29 1981-01-23
JPS5626446A (en) 1979-08-09 1981-03-14 Nec Corp Semiconductor device
US4272140A (en) 1979-12-19 1981-06-09 Gte Automatic Electric Laboratories Incorporated Arrangement for mounting dual-in-line packaged integrated circuits to thick/thin film circuits
US4332341A (en) * 1979-12-26 1982-06-01 Bell Telephone Laboratories, Incorporated Fabrication of circuit packages using solid phase solder bonding
US4322778A (en) 1980-01-25 1982-03-30 International Business Machines Corp. High performance semiconductor package assembly
SU1003396A1 (ru) 1980-02-08 1983-03-07 Институт коллоидной химии и химии воды АН УССР Электрический соединитель
JPS56116282A (en) 1980-02-19 1981-09-11 Sharp Kk Electronic part with plural terminals
US4417392A (en) 1980-05-15 1983-11-29 Cts Corporation Process of making multi-layer ceramic package
US4523144A (en) 1980-05-27 1985-06-11 Japan Electronic Materials Corp. Complex probe card for testing a semiconductor wafer
JPS5728337A (en) * 1980-07-28 1982-02-16 Hitachi Ltd Connecting constructin of semiconductor element
US4374457A (en) 1980-08-04 1983-02-22 Wiech Raymond E Jr Method of fabricating complex micro-circuit boards and substrates
US4546406A (en) 1980-09-25 1985-10-08 Texas Instruments Incorporated Electronic circuit interconnection system
US4385202A (en) 1980-09-25 1983-05-24 Texas Instruments Incorporated Electronic circuit interconnection system
US4472762A (en) 1980-09-25 1984-09-18 Texas Instruments Incorporated Electronic circuit interconnection system
US4396935A (en) 1980-10-06 1983-08-02 Ncr Corporation VLSI Packaging system
US4418857A (en) * 1980-12-31 1983-12-06 International Business Machines Corp. High melting point process for Au:Sn:80:20 brazing alloy for chip carriers
US4422568A (en) 1981-01-12 1983-12-27 Kulicke And Soffa Industries, Inc. Method of making constant bonding wire tail lengths
FR2498814B1 (fr) 1981-01-26 1985-12-20 Burroughs Corp Boitier pour circuit integre, moyen pour le montage et procede de fabrication
US4385341A (en) * 1981-03-19 1983-05-24 Northern Telecom Limited Strain relief member for flat flexible cables
NL184184C (nl) 1981-03-20 1989-05-01 Philips Nv Werkwijze voor het aanbrengen van kontaktverhogingen op kontaktplaatsen van een electronische microketen.
US4408218A (en) 1981-03-27 1983-10-04 Amp Incorporated Ceramic chip carrier with lead frame having removable rim
US4407007A (en) 1981-05-28 1983-09-27 International Business Machines Corporation Process and structure for minimizing delamination in the fabrication of multi-layer ceramic substrate
US4419818A (en) 1981-10-26 1983-12-13 Amp Incorporated Method for manufacturing substrate with selectively trimmable resistors between signal leads and ground structure
US4410905A (en) 1981-08-14 1983-10-18 Amp Incorporated Power, ground and decoupling structure for chip carriers
US4402450A (en) 1981-08-21 1983-09-06 Western Electric Company, Inc. Adapting contacts for connection thereto
JPS5842262A (ja) 1981-09-07 1983-03-11 Toshiba Corp 混成集積回路のリ−ド線接続方法
DE3280233D1 (de) 1981-09-11 1990-10-04 Toshiba Kawasaki Kk Verfahren zum herstellen eines substrats fuer multischichtschaltung.
US4447857A (en) 1981-12-09 1984-05-08 International Business Machines Corporation Substrate with multiple type connections
EP0082902B1 (de) 1981-12-29 1985-11-27 International Business Machines Corporation Verfahren zum Anlöten von Stiften an Lötaugen von auf einem keramischen Substrat ausgebildeten Leitern
US4453176A (en) 1981-12-31 1984-06-05 International Business Machines Corporation LSI Chip carrier with buried repairable capacitor with low inductance leads
US4514750A (en) 1982-01-11 1985-04-30 Texas Instruments Incorporated Integrated circuit package having interconnected leads adjacent the package ends
US4532152A (en) * 1982-03-05 1985-07-30 Elarde Vito D Fabrication of a printed circuit board with metal-filled channels
US4412642A (en) 1982-03-15 1983-11-01 Western Electric Co., Inc. Cast solder leads for leadless semiconductor circuits
JPS58173790A (ja) 1982-04-06 1983-10-12 シチズン時計株式会社 表示装置と半導体装置の接続構造
US4754316A (en) 1982-06-03 1988-06-28 Texas Instruments Incorporated Solid state interconnection system for three dimensional integrated circuit structures
US4551746A (en) 1982-10-05 1985-11-05 Mayo Foundation Leadless chip carrier apparatus providing an improved transmission line environment and improved heat dissipation
JPS5988860A (ja) 1982-11-12 1984-05-22 Matsushita Electric Ind Co Ltd 金属リ−ドへの金属突起物形成方法
US4442938A (en) 1983-03-22 1984-04-17 Advanced Interconnections Socket terminal positioning method and construction
JPS59195856A (ja) * 1983-04-20 1984-11-07 Fujitsu Ltd 半導体装置及びその製造方法
US4567432A (en) * 1983-06-09 1986-01-28 Texas Instruments Incorporated Apparatus for testing integrated circuits
US4513355A (en) 1983-06-15 1985-04-23 Motorola, Inc. Metallization and bonding means and method for VLSI packages
JPS6010298A (ja) 1983-06-29 1985-01-19 富士通株式会社 音声メツセ−ジ長予測方式
US4705205A (en) 1983-06-30 1987-11-10 Raychem Corporation Chip carrier mounting device
US4664309A (en) 1983-06-30 1987-05-12 Raychem Corporation Chip mounting device
US4553192A (en) 1983-08-25 1985-11-12 International Business Machines Corporation High density planar interconnected integrated circuit package
US4615573A (en) 1983-10-28 1986-10-07 Honeywell Inc. Spring finger interconnect for IC chip carrier
US4677458A (en) 1983-11-04 1987-06-30 Control Data Corporation Ceramic IC package attachment apparatus
US4545610A (en) * 1983-11-25 1985-10-08 International Business Machines Corporation Method for forming elongated solder connections between a semiconductor device and a supporting substrate
US4751199A (en) 1983-12-06 1988-06-14 Fairchild Semiconductor Corporation Process of forming a compliant lead frame for array-type semiconductor packages
US4520561A (en) 1983-12-16 1985-06-04 Rca Corporation Method of fabricating an electronic circuit including an aperture through the substrate thereof
KR900001273B1 (ko) 1983-12-23 1990-03-05 후지쑤 가부시끼가이샤 반도체 집적회로 장치
US4547833A (en) 1983-12-23 1985-10-15 Schlumberger Technology Corporation High density electronics packaging system for hostile environment
US4597522A (en) 1983-12-26 1986-07-01 Kabushiki Kaisha Toshiba Wire bonding method and device
US4581291A (en) 1983-12-29 1986-04-08 Bongianni Wayne L Microminiature coaxial cable and methods manufacture
JPS60150657A (ja) * 1984-01-18 1985-08-08 Hitachi Ltd レジンモ−ルド半導体装置
US4670770A (en) 1984-02-21 1987-06-02 American Telephone And Telegraph Company Integrated circuit chip-and-substrate assembly
US4597617A (en) 1984-03-19 1986-07-01 Tektronix, Inc. Pressure interconnect package for integrated circuits
US4574470A (en) 1984-03-19 1986-03-11 Trilogy Computer Development Partners, Ltd. Semiconductor chip mounting system
US4595794A (en) 1984-03-19 1986-06-17 At&T Bell Laboratories Component mounting apparatus
US4627151A (en) 1984-03-22 1986-12-09 Thomson Components-Mostek Corporation Automatic assembly of integrated circuits
US4685998A (en) 1984-03-22 1987-08-11 Thomson Components - Mostek Corp. Process of forming integrated circuits with contact pads in a standard array
US4548451A (en) * 1984-04-27 1985-10-22 International Business Machines Corporation Pinless connector interposer and method for making the same
US4667219A (en) * 1984-04-27 1987-05-19 Trilogy Computer Development Partners, Ltd. Semiconductor chip interface
DK291184D0 (da) * 1984-06-13 1984-06-13 Boeegh Petersen Allan Fremgangsmaade og indretning til test af kredsloebsplader
JPS6132490A (ja) 1984-07-24 1986-02-15 富士通株式会社 フラツトリ−ドパツケ−ジ型電子部品の取付け構造
US4600138A (en) 1984-07-25 1986-07-15 Hughes Aircraft Company Bonding tool and clamp assembly and wire handling method
DE3577371D1 (de) 1984-07-27 1990-05-31 Toshiba Kawasaki Kk Apparat zum herstellen einer halbleiteranordnung.
US4772936A (en) 1984-09-24 1988-09-20 United Technologies Corporation Pretestable double-sided tab design
GB2167228B (en) 1984-10-11 1988-05-05 Anamartic Ltd Integrated circuit package
US4747784A (en) * 1986-05-16 1988-05-31 Daymarc Corporation Contactor for integrated circuits
DE3536908A1 (de) 1984-10-18 1986-04-24 Sanyo Electric Co., Ltd., Moriguchi, Osaka Induktivitaetselement und verfahren zur herstellung desselben
DE3442131A1 (de) * 1984-11-17 1986-05-22 Messerschmitt-Bölkow-Blohm GmbH, 8012 Ottobrunn Verfahren zum einkapseln von mikroelektronischen halbleiter- und schichtschaltungen
US4649415A (en) 1985-01-15 1987-03-10 National Semiconductor Corporation Semiconductor package with tape mounted die
US4659437A (en) 1985-01-19 1987-04-21 Tokusen Kogyo Kabushiki Kaisha Method of thermal diffusion alloy plating for steel wire on continuous basis
US4634199A (en) 1985-01-22 1987-01-06 Itt Corporation Connector assembly for making multiple connections in a thin space
JPS61170054A (ja) * 1985-01-23 1986-07-31 Mitsubishi Electric Corp クリツプリ−ド
US4604644A (en) 1985-01-28 1986-08-05 International Business Machines Corporation Solder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making
US4673967A (en) 1985-01-29 1987-06-16 Texas Instruments Incorporated Surface mounted system for leaded semiconductor devices
US4592617A (en) * 1985-02-06 1986-06-03 North American Specialties Corporation Solder-bearing terminal
US4982264A (en) 1985-02-27 1991-01-01 Texas Instruments Incorporated High density integrated circuit package
US4628410A (en) 1985-04-10 1986-12-09 Itt Corporation Surface mounting connector
JPH0763083B2 (ja) 1985-04-22 1995-07-05 日本特殊陶業株式会社 端子接続構造およびその接続方法
US4642889A (en) 1985-04-29 1987-02-17 Amp Incorporated Compliant interconnection and method therefor
US4640499A (en) 1985-05-01 1987-02-03 The United States Of America As Represented By The Secretary Of The Air Force Hermetic chip carrier compliant soldering pads
US4724383A (en) 1985-05-03 1988-02-09 Testsystems, Inc. PC board test fixture
US4837622A (en) 1985-05-10 1989-06-06 Micro-Probe, Inc. High density probe card
US4757256A (en) 1985-05-10 1988-07-12 Micro-Probe, Inc. High density probe card
US4628406A (en) 1985-05-20 1986-12-09 Tektronix, Inc. Method of packaging integrated circuit chips, and integrated circuit package
US4647959A (en) 1985-05-20 1987-03-03 Tektronix, Inc. Integrated circuit package, and method of forming an integrated circuit package
FR2583254A1 (fr) 1985-06-10 1986-12-12 Thevenin Gilles Panneau de montage d'elements amovibles, en particulier pour jouets pedagogiques
JPS61287254A (ja) * 1985-06-14 1986-12-17 Hitachi Device Eng Co Ltd 半導体装置
JPS61287155A (ja) 1985-06-14 1986-12-17 Hitachi Ltd 半導体装置及び半導体装置の製造方法
US4647126A (en) 1985-06-17 1987-03-03 Sperry Corporation Compliant lead clip
US4641426A (en) 1985-06-21 1987-02-10 Associated Enterprises, Inc. Surface mount compatible connector system with mechanical integrity
US4780836A (en) 1985-08-14 1988-10-25 Kabushiki Kaisha Toshiba Method of testing semiconductor devices using a probe card
US4661192A (en) 1985-08-22 1987-04-28 Motorola, Inc. Low cost integrated circuit bonding process
CA1226966A (en) 1985-09-10 1987-09-15 Gabriel Marcantonio Integrated circuit chip package
JPS6273650A (ja) 1985-09-27 1987-04-04 Hitachi Ltd 電気部品
US4646435A (en) 1985-10-04 1987-03-03 Raychem Corporation Chip carrier alignment device and alignment method
US5476211A (en) * 1993-11-16 1995-12-19 Form Factor, Inc. Method of manufacturing electrical contacts, using a sacrificial member
US4764722A (en) * 1985-10-28 1988-08-16 International Business Machines Corporation Coaxial probe
US4874721A (en) 1985-11-11 1989-10-17 Nec Corporation Method of manufacturing a multichip package with increased adhesive strength
US4903120A (en) 1985-11-22 1990-02-20 Texas Instruments Incorporated Chip carrier with interconnects on lid
US4750089A (en) 1985-11-22 1988-06-07 Texas Instruments Incorporated Circuit board with a chip carrier and mounting structure connected to the chip carrier
US4890194A (en) 1985-11-22 1989-12-26 Texas Instruments Incorporated A chip carrier and mounting structure connected to the chip carrier
JPS62123707A (ja) 1985-11-22 1987-06-05 株式会社村田製作所 電子部品の製造方法
AT385932B (de) 1985-12-13 1988-06-10 Neumayer Karl Band- bzw. drahtfoermiges material
US4924353A (en) 1985-12-20 1990-05-08 Hughes Aircraft Company Connector system for coupling to an integrated circuit chip
US4716049A (en) 1985-12-20 1987-12-29 Hughes Aircraft Company Compressive pedestal for microminiature connections
US4902606A (en) 1985-12-20 1990-02-20 Hughes Aircraft Company Compressive pedestal for microminiature connections
US4700276A (en) 1986-01-03 1987-10-13 Motorola Inc. Ultra high density pad array chip carrier
US4700473A (en) 1986-01-03 1987-10-20 Motorola Inc. Method of making an ultra high density pad array chip carrier
JPS62160373A (ja) 1986-01-09 1987-07-16 三菱重工業株式会社 廃船利用式屋内工場形成方法
US4793814A (en) 1986-07-21 1988-12-27 Rogers Corporation Electrical circuit board interconnect
US4709468A (en) 1986-01-31 1987-12-01 Texas Instruments Incorporated Method for producing an integrated circuit product having a polyimide film interconnection structure
US4721993A (en) 1986-01-31 1988-01-26 Olin Corporation Interconnect tape for use in tape automated bonding
JPS62194652A (ja) 1986-02-21 1987-08-27 Hitachi Ltd 半導体装置
US4807021A (en) 1986-03-10 1989-02-21 Kabushiki Kaisha Toshiba Semiconductor device having stacking structure
US4695870A (en) 1986-03-27 1987-09-22 Hughes Aircraft Company Inverted chip carrier
JPS62246480A (ja) * 1986-04-16 1987-10-27 信濃空圧工業株式会社 締め付け装置
US4681654A (en) 1986-05-21 1987-07-21 International Business Machines Corporation Flexible film semiconductor chip carrier
US4878611A (en) * 1986-05-30 1989-11-07 American Telephone And Telegraph Company, At&T Bell Laboratories Process for controlling solder joint geometry when surface mounting a leadless integrated circuit package on a substrate
US4695872A (en) 1986-08-01 1987-09-22 Texas Instruments Incorporated High density micropackage for IC chips
US4767344A (en) 1986-08-22 1988-08-30 Burndy Corporation Solder mounting of electrical contacts
KR900007231B1 (ko) 1986-09-16 1990-10-05 가부시키가이샤 도시바 반도체집적회로장치
US4918811A (en) 1986-09-26 1990-04-24 General Electric Company Multichip integrated circuit packaging method
US4884122A (en) 1988-08-05 1989-11-28 General Electric Company Method and configuration for testing electronic circuits and integrated circuit chips using a removable overlay layer
US4937203A (en) 1986-09-26 1990-06-26 General Electric Company Method and configuration for testing electronic circuits and integrated circuit chips using a removable overlay layer
US4728751A (en) * 1986-10-06 1988-03-01 International Business Machines Corporation Flexible electrical connection and method of making same
US4777564A (en) 1986-10-16 1988-10-11 Motorola, Inc. Leadform for use with surface mounted components
US4970570A (en) 1986-10-28 1990-11-13 International Business Machines Corporation Use of tapered head pin design to improve the stress distribution in the braze joint
US4811082A (en) 1986-11-12 1989-03-07 International Business Machines Corporation High performance integrated circuit packaging structure
EP0268181B1 (de) 1986-11-15 1992-07-29 Matsushita Electric Works, Ltd. Gegossenes Kunststoff-Chip-Gehäuse mit Steckermuster
US4764848A (en) * 1986-11-24 1988-08-16 International Business Machines Corporation Surface mounted array strain relief device
US4814295A (en) 1986-11-26 1989-03-21 Northern Telecom Limited Mounting of semiconductor chips on a plastic substrate
JPH07112041B2 (ja) 1986-12-03 1995-11-29 シャープ株式会社 半導体装置の製造方法
US5189507A (en) * 1986-12-17 1993-02-23 Raychem Corporation Interconnection of electronic components
US4955523A (en) * 1986-12-17 1990-09-11 Raychem Corporation Interconnection of electronic components
US5086337A (en) 1987-01-19 1992-02-04 Hitachi, Ltd. Connecting structure of electronic part and electronic device using the structure
JP2533511B2 (ja) * 1987-01-19 1996-09-11 株式会社日立製作所 電子部品の接続構造とその製造方法
US4783719A (en) 1987-01-20 1988-11-08 Hughes Aircraft Company Test connector for electrical devices
US5285949A (en) 1987-01-26 1994-02-15 Hitachi, Ltd. Wire-bonding method, wire-bonding apparatus, and semiconductor device produced by the wire-bonding method
US4855867A (en) 1987-02-02 1989-08-08 International Business Machines Corporation Full panel electronic packaging structure
US4776804A (en) * 1987-02-05 1988-10-11 Texas Instruments Incorporated Circuit board systems, connectors used therein, and methods for making the connectors and systems
US4816426A (en) 1987-02-19 1989-03-28 Olin Corporation Process for manufacturing plastic pin grid arrays and the product produced thereby
US5196268A (en) 1987-03-19 1993-03-23 Texas Instruments Incorporated Integrated circuit interconnect leads releasably mounted on film
US5057461A (en) 1987-03-19 1991-10-15 Texas Instruments Incorporated Method of mounting integrated circuit interconnect leads releasably on film
US4942140A (en) 1987-03-25 1990-07-17 Mitsubishi Denki Kabushiki Kaisha Method of packaging semiconductor device
US5024746A (en) 1987-04-13 1991-06-18 Texas Instruments Incorporated Fixture and a method for plating contact bumps for integrated circuits
US4874476A (en) 1987-04-13 1989-10-17 Texas Instruments Incorporated Fixture for plating tall contact bumps on integrated circuit
US4861452A (en) 1987-04-13 1989-08-29 Texas Instruments Incorporated Fixture for plating tall contact bumps on integrated circuit
US4931149A (en) 1987-04-13 1990-06-05 Texas Instruments Incorporated Fixture and a method for plating contact bumps for integrated circuits
US5106784A (en) 1987-04-16 1992-04-21 Texas Instruments Incorporated Method of making a post molded cavity package with internal dam bar for integrated circuit
US4874722A (en) 1987-04-16 1989-10-17 Texas Instruments Incorporated Process of packaging a semiconductor device with reduced stress forces
US4983907A (en) 1987-05-14 1991-01-08 Intel Corporation Driven guard probe card
US5195237A (en) * 1987-05-21 1993-03-23 Cray Computer Corporation Flying leads for integrated circuits
US5045975A (en) 1987-05-21 1991-09-03 Cray Computer Corporation Three dimensionally interconnected module assembly
US4796078A (en) 1987-06-15 1989-01-03 International Business Machines Corporation Peripheral/area wire bonding technique
US4857482A (en) 1987-06-30 1989-08-15 Kabushiki Kaisha Toshiba Method of forming bump electrode and electronic circuit device
US4818823A (en) 1987-07-06 1989-04-04 Micro-Circuits, Inc. Adhesive component means for attaching electrical components to conductors
US4967261A (en) 1987-07-30 1990-10-30 Mitsubishi Denki Kabushiki Kaisha Tape carrier for assembling an IC chip on a substrate
US4956749A (en) 1987-11-20 1990-09-11 Hewlett-Packard Company Interconnect structure for integrated circuits
US5014111A (en) 1987-12-08 1991-05-07 Matsushita Electric Industrial Co., Ltd. Electrical contact bump and a package provided with the same
US4926241A (en) 1988-02-19 1990-05-15 Microelectronics And Computer Technology Corporation Flip substrate for chip mount
US4827611A (en) 1988-03-28 1989-05-09 Control Data Corporation Compliant S-leads for chip carriers
US4858819A (en) 1988-03-29 1989-08-22 Hughes Aircraft Company Orthogonal bonding method and equipment
US4878846A (en) 1988-04-06 1989-11-07 Schroeder Jon M Electronic circuit chip connection assembly and method
US4985310A (en) * 1988-04-08 1991-01-15 International Business Machines Corp. Multilayered metallurgical structure for an electronic component
US4871964A (en) * 1988-04-12 1989-10-03 G. G. B. Industries, Inc. Integrated circuit probing apparatus
US4918032A (en) 1988-04-13 1990-04-17 General Motors Corporation Method for fabricating three-dimensional microstructures and a high-sensitivity integrated vibration sensor using such microstructures
US5103557A (en) 1988-05-16 1992-04-14 Leedy Glenn J Making and testing an integrated circuit using high density probe points
JPH01313969A (ja) * 1988-06-13 1989-12-19 Hitachi Ltd 半導体装置
US5185073A (en) 1988-06-21 1993-02-09 International Business Machines Corporation Method of fabricating nendritic materials
US4842184A (en) 1988-06-23 1989-06-27 Ltv Aerospace & Defense Company Method and apparatus for applying solder preforms
US4887148A (en) 1988-07-15 1989-12-12 Advanced Micro Devices, Inc. Pin grid array package structure
US4943845A (en) 1988-08-02 1990-07-24 Northern Telecom Limited Thick film packages with common wafer aperture placement
US5025306A (en) 1988-08-09 1991-06-18 Texas Instruments Incorporated Assembly of semiconductor chips
US5059143A (en) * 1988-09-08 1991-10-22 Amp Incorporated Connector contact
US4907734A (en) 1988-10-28 1990-03-13 International Business Machines Corporation Method of bonding gold or gold alloy wire to lead tin solder
DE3838413A1 (de) 1988-11-12 1990-05-17 Mania Gmbh Adapter fuer elektronische pruefvorrichtungen fuer leiterplatten und dergl.
US4903889A (en) 1988-11-14 1990-02-27 Raychem Corporation Connection to a component for use in an electronics assembly
US4996629A (en) * 1988-11-14 1991-02-26 International Business Machines Corporation Circuit board with self-supporting connection between sides
US5037023A (en) * 1988-11-28 1991-08-06 Hitachi, Ltd. Method and apparatus for wire bonding
JPH02174255A (ja) 1988-12-27 1990-07-05 Mitsubishi Electric Corp 半導体集積回路装置
US5024372A (en) 1989-01-03 1991-06-18 Motorola, Inc. Method of making high density solder bumps and a substrate socket for high density solder bumps
FR2643753A1 (fr) * 1989-02-28 1990-08-31 Commissariat Energie Atomique Procede d'interconnexion de composants electriques au moyen d'elements conducteurs, deformables et sensiblement spheriques
JPH02237047A (ja) 1989-03-09 1990-09-19 Mitsubishi Electric Corp 半導体試験装置
US4932902A (en) 1989-03-21 1990-06-12 Crane Electronics, Inc. Ultra-high density electrical interconnect system
EP0416133B1 (de) * 1989-03-28 1995-01-25 Nippon Steel Corporation Harzbeschichteter verbindungsdraht, verfahren zur herstellung und halbleiteranordnung
US4922376A (en) 1989-04-10 1990-05-01 Unistructure, Inc. Spring grid array interconnection for active microelectronic elements
JP2810101B2 (ja) * 1989-04-17 1998-10-15 日本エー・エム・ピー株式会社 電気ピンおよびその製造方法
US5077633A (en) 1989-05-01 1991-12-31 Motorola Inc. Grounding an ultra high density pad array chip carrier
US4914814A (en) * 1989-05-04 1990-04-10 International Business Machines Corporation Process of fabricating a circuit package
US5041901A (en) 1989-05-10 1991-08-20 Hitachi, Ltd. Lead frame and semiconductor device using the same
JP2598129B2 (ja) * 1989-05-18 1997-04-09 三菱電機株式会社 半導体装置
US5202061A (en) 1989-05-26 1993-04-13 International Business Machines Corporation Electrically conductive polymeric materials and uses thereof
US5198153A (en) 1989-05-26 1993-03-30 International Business Machines Corporation Electrically conductive polymeric
US5200112A (en) 1989-05-26 1993-04-06 International Business Machines Corporation Electrically conductive polymeric materials and uses thereof
US5060843A (en) 1989-06-07 1991-10-29 Nec Corporation Process of forming bump on electrode of semiconductor chip and apparatus used therefor
US5366380A (en) 1989-06-13 1994-11-22 General Datacomm, Inc. Spring biased tapered contact elements for electrical connectors and integrated circuit packages
US5349495A (en) * 1989-06-23 1994-09-20 Vlsi Technology, Inc. System for securing and electrically connecting a semiconductor chip to a substrate
US4954878A (en) 1989-06-29 1990-09-04 Digital Equipment Corp. Method of packaging and powering integrated circuit chips and the chip assembly formed thereby
US5246159A (en) 1989-07-19 1993-09-21 Nec Corporation Method for forming a bump by bonding a ball on an electrode of an electronic device and apparatus for forming the same
US5059557A (en) 1989-08-08 1991-10-22 Texas Instruments Incorporated Method of electrically connecting integrated circuits by edge-insertion in grooved support members
US5047711A (en) 1989-08-23 1991-09-10 Silicon Connections Corporation Wafer-level burn-in testing of integrated circuits
US5299730A (en) 1989-08-28 1994-04-05 Lsi Logic Corporation Method and apparatus for isolation of flux materials in flip-chip manufacturing
US5053922A (en) 1989-08-31 1991-10-01 Hewlett-Packard Company Demountable tape-automated bonding system
US5055778A (en) * 1989-10-02 1991-10-08 Nihon Denshizairyo Kabushiki Kaisha Probe card in which contact pressure and relative position of each probe end are correctly maintained
US5156983A (en) * 1989-10-26 1992-10-20 Digtial Equipment Corporation Method of manufacturing tape automated bonding semiconductor package
US4998885A (en) 1989-10-27 1991-03-12 International Business Machines Corporation Elastomeric area array interposer
JPH03142847A (ja) 1989-10-30 1991-06-18 Hitachi Ltd 半導体集積回路装置
US5012187A (en) 1989-11-03 1991-04-30 Motorola, Inc. Method for parallel testing of semiconductor devices
US5077598A (en) * 1989-11-08 1991-12-31 Hewlett-Packard Company Strain relief flip-chip integrated circuit assembly with test fixturing
US5399982A (en) 1989-11-13 1995-03-21 Mania Gmbh & Co. Printed circuit board testing device with foil adapter
US5006673A (en) 1989-12-07 1991-04-09 Motorola, Inc. Fabrication of pad array carriers from a universal interconnect structure
US5379515A (en) 1989-12-11 1995-01-10 Canon Kabushiki Kaisha Process for preparing electrical connecting member
US5095187A (en) * 1989-12-20 1992-03-10 Raychem Corporation Weakening wire supplied through a wire bonder
US5007576A (en) 1989-12-26 1991-04-16 Hughes Aircraft Company Testable ribbon bonding method and wedge bonding tool for microcircuit device fabrication
US5045921A (en) 1989-12-26 1991-09-03 Motorola, Inc. Pad array carrier IC device using flexible tape
JPH03212006A (ja) * 1990-01-17 1991-09-17 Sony Corp 高周波回路用パッケージ
US4989069A (en) 1990-01-29 1991-01-29 Motorola, Inc. Semiconductor package having leads that break-away from supports
US5066907A (en) 1990-02-06 1991-11-19 Cerprobe Corporation Probe system for device and circuit testing
US5065281A (en) 1990-02-12 1991-11-12 Rogers Corporation Molded integrated circuit package incorporating heat sink
US5471151A (en) 1990-02-14 1995-11-28 Particle Interconnect, Inc. Electrical interconnect using particle enhanced joining of metal surfaces
US5083697A (en) 1990-02-14 1992-01-28 Difrancesco Louis Particle-enhanced joining of metal surfaces
US4975079A (en) 1990-02-23 1990-12-04 International Business Machines Corp. Connector assembly for chip testing
DE4115043A1 (de) 1991-05-08 1997-07-17 Gen Electric Dichtgepackte Verbindungsstruktur, die eine Kammer enthält
US5123850A (en) 1990-04-06 1992-06-23 Texas Instruments Incorporated Non-destructive burn-in test socket for integrated circuit die
US5245751A (en) * 1990-04-27 1993-09-21 Circuit Components, Incorporated Array connector
US5071359A (en) 1990-04-27 1991-12-10 Rogers Corporation Array connector
JPH0412483A (ja) 1990-04-27 1992-01-17 Kel Corp Ｉｃソケット
US5047830A (en) 1990-05-22 1991-09-10 Amp Incorporated Field emitter array integrated circuit chip interconnection
US5227662A (en) 1990-05-24 1993-07-13 Nippon Steel Corporation Composite lead frame and semiconductor device using the same
US5130779A (en) 1990-06-19 1992-07-14 International Business Machines Corporation Solder mass having conductive encapsulating arrangement
US5127570A (en) 1990-06-28 1992-07-07 Cray Research, Inc. Flexible automated bonding method and apparatus
US5147084A (en) 1990-07-18 1992-09-15 International Business Machines Corporation Interconnection structure and test method
US5187020A (en) 1990-07-31 1993-02-16 Texas Instruments Incorporated Compliant contact pad
US5128612A (en) 1990-07-31 1992-07-07 Texas Instruments Incorporated Disposable high performance test head
US5134462A (en) 1990-08-27 1992-07-28 Motorola, Inc. Flexible film chip carrier having a flexible film substrate and means for maintaining planarity of the substrate
US5088190A (en) * 1990-08-30 1992-02-18 Texas Instruments Incorporated Method of forming an apparatus for burn in testing of integrated circuit chip
US5029325A (en) 1990-08-31 1991-07-02 Motorola, Inc. TAB tape translator for use with semiconductor devices
US5136367A (en) 1990-08-31 1992-08-04 Texas Instruments Incorporated Low cost erasable programmable read only memory package
US5192681A (en) 1990-08-31 1993-03-09 Texas Instruments Incorporated Low cost erasable programmable read only memory package
US5258330A (en) 1990-09-24 1993-11-02 Tessera, Inc. Semiconductor chip assemblies with fan-in leads
US5148266A (en) 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies having interposer and flexible lead
US5148265A (en) 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies with fan-in leads
US5166774A (en) * 1990-10-05 1992-11-24 Motorola, Inc. Selectively releasing conductive runner and substrate assembly having non-planar areas
US5072520A (en) 1990-10-23 1991-12-17 Rogers Corporation Method of manufacturing an interconnect device having coplanar contact bumps
US5148103A (en) 1990-10-31 1992-09-15 Hughes Aircraft Company Apparatus for testing integrated circuits
US5136366A (en) 1990-11-05 1992-08-04 Motorola, Inc. Overmolded semiconductor package with anchoring means
US5154341A (en) * 1990-12-06 1992-10-13 Motorola Inc. Noncollapsing multisolder interconnection
US5241133A (en) 1990-12-21 1993-08-31 Motorola, Inc. Leadless pad array chip carrier
US5321277A (en) 1990-12-31 1994-06-14 Texas Instruments Incorporated Multi-chip module testing
US5239199A (en) 1991-01-14 1993-08-24 Texas Instruments Incorporated Vertical lead-on-chip package
US5097100A (en) * 1991-01-25 1992-03-17 Sundstrand Data Control, Inc. Noble metal plated wire and terminal assembly, and method of making the same
US5148968A (en) * 1991-02-11 1992-09-22 Motorola, Inc. Solder bump stretch device
US5157325A (en) * 1991-02-15 1992-10-20 Compaq Computer Corporation Compact, wireless apparatus for electrically testing printed circuit boards
JP2852134B2 (ja) 1991-02-20 1999-01-27 日本電気株式会社 バンプ形成方法
JPH04264758A (ja) 1991-02-20 1992-09-21 Nec Corp 半導体チップキャリア
US5289346A (en) 1991-02-26 1994-02-22 Microelectronics And Computer Technology Corporation Peripheral to area adapter with protective bumper for an integrated circuit chip
US5379191A (en) 1991-02-26 1995-01-03 Microelectronics And Computer Technology Corporation Compact adapter package providing peripheral to area translation for an integrated circuit chip
JP2814151B2 (ja) 1991-02-27 1998-10-22 株式会社新川 ワイヤボンデイング方法
US5130783A (en) 1991-03-04 1992-07-14 Texas Instruments Incorporated Flexible film semiconductor package
US5283104A (en) 1991-03-20 1994-02-01 International Business Machines Corporation Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates
US5217597A (en) 1991-04-01 1993-06-08 Motorola, Inc. Solder bump transfer method
US5088007A (en) 1991-04-04 1992-02-11 Motorola, Inc. Compliant solder interconnection
US5118027A (en) 1991-04-24 1992-06-02 International Business Machines Corporation Method of aligning and mounting solder balls to a substrate
US5237203A (en) 1991-05-03 1993-08-17 Trw Inc. Multilayer overlay interconnect for high-density packaging of circuit elements
US5559444A (en) * 1991-06-04 1996-09-24 Micron Technology, Inc. Method and apparatus for testing unpackaged semiconductor dice
US5296744A (en) * 1991-07-12 1994-03-22 Vlsi Technology, Inc. Lead frame assembly and method for wiring same
US5221815A (en) 1991-07-26 1993-06-22 Raychem Corporation Heat recoverable soldering device
US5173055A (en) 1991-08-08 1992-12-22 Amp Incorporated Area array connector
FR2680284B1 (fr) * 1991-08-09 1993-12-03 Thomson Csf Dispositif de connexion a tres faible pas et procede de fabrication.
JPH0548000A (ja) * 1991-08-13 1993-02-26 Fujitsu Ltd 半導体装置
JP3061954B2 (ja) 1991-08-20 2000-07-10 株式会社東芝 半導体装置
US5131852A (en) 1991-08-23 1992-07-21 Amp Incorporated Electrical socket
US5264787A (en) 1991-08-30 1993-11-23 Hughes Aircraft Company Rigid-flex circuits with raised features as IC test probes
JP2967621B2 (ja) * 1991-08-27 1999-10-25 日本電気株式会社 半導体装置用パッケージの製造方法
US5239447A (en) 1991-09-13 1993-08-24 International Business Machines Corporation Stepped electronic device package
US5574382A (en) * 1991-09-17 1996-11-12 Japan Synthetic Rubber Co., Ltd. Inspection electrode unit for printed wiring board
US5139427A (en) * 1991-09-23 1992-08-18 Amp Incorporated Planar array connector and flexible contact therefor
JP3138969B2 (ja) 1991-09-24 2001-02-26 日本ユニット株式会社 ブラシ用素材
EP0678232B1 (de) * 1991-09-30 1997-10-29 Ceridian Corporation Plattierter nachgiebiger leiter
US5201454A (en) 1991-09-30 1993-04-13 Texas Instruments Incorporated Process for enhanced intermetallic growth in IC interconnections
US5288007A (en) 1991-10-04 1994-02-22 International Business Machine Corporation Apparatus and methods for making simultaneous electrical connections
US5326643A (en) 1991-10-07 1994-07-05 International Business Machines Corporation Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier
US5152695A (en) 1991-10-10 1992-10-06 Amp Incorporated Surface mount electrical connector
DE69230660T2 (de) * 1991-10-29 2000-12-07 Sumitomo Wiring Systems Kabelbaum
JP2558976B2 (ja) 1991-11-08 1996-11-27 松下電器産業株式会社 電子部品の電極とリードとの接合方法
US5350947A (en) 1991-11-12 1994-09-27 Nec Corporation Film carrier semiconductor device
US5309324A (en) 1991-11-26 1994-05-03 Herandez Jorge M Device for interconnecting integrated circuit packages to circuit boards
US5180977A (en) 1991-12-02 1993-01-19 Hoya Corporation Usa Membrane probe contact bump compliancy system
DE69109869T2 (de) 1991-12-06 1995-09-21 Sigmatech Co Ltd Apparat zur Inspektion der inneren Schaltung eines Halbleiters.
JP3187904B2 (ja) 1991-12-20 2001-07-16 山一電機株式会社 電気部品用接続器
JPH05182729A (ja) 1991-12-26 1993-07-23 Yamaichi Electron Co Ltd 電気部品用接触子
US5214563A (en) 1991-12-31 1993-05-25 Compaq Computer Corporation Thermally reactive lead assembly and method for making same
US5282312A (en) 1991-12-31 1994-02-01 Tessera, Inc. Multi-layer circuit construction methods with customization features
US5367764A (en) 1991-12-31 1994-11-29 Tessera, Inc. Method of making a multi-layer circuit assembly
US5311059A (en) * 1992-01-24 1994-05-10 Motorola, Inc. Backplane grounding for flip-chip integrated circuit
US5299939A (en) 1992-03-05 1994-04-05 International Business Machines Corporation Spring array connector
US5210939A (en) 1992-04-17 1993-05-18 Intel Corporation Lead grid array integrated circuit
US5424652A (en) 1992-06-10 1995-06-13 Micron Technology, Inc. Method and apparatus for testing an unpackaged semiconductor die
US5345170A (en) * 1992-06-11 1994-09-06 Cascade Microtech, Inc. Wafer probe station having integrated guarding, Kelvin connection and shielding systems
US5228861A (en) * 1992-06-12 1993-07-20 Amp Incorporated High density electrical connector system
US5237743A (en) 1992-06-19 1993-08-24 International Business Machines Corporation Method of forming a conductive end portion on a flexible circuit member
US5442282A (en) 1992-07-02 1995-08-15 Lsi Logic Corporation Testing and exercising individual, unsingulated dies on a wafer
US5347711A (en) * 1992-07-15 1994-09-20 The Whitaker Corporation Termination of multi-conductor electrical cables
US5915752A (en) 1992-07-24 1999-06-29 Tessera, Inc. Method of making connections to a semiconductor chip assembly
US5338705A (en) 1992-09-10 1994-08-16 Texas Instruments Incorporated Pressure differential downset
US5497546A (en) * 1992-09-21 1996-03-12 Matsushita Electric Works, Ltd. Method for mounting lead terminals to circuit board
US5382898A (en) 1992-09-21 1995-01-17 Cerprobe Corporation High density probe card for testing electrical circuits
US5371654A (en) * 1992-10-19 1994-12-06 International Business Machines Corporation Three dimensional high performance interconnection package
US5327327A (en) 1992-10-30 1994-07-05 Texas Instruments Incorporated Three dimensional assembly of integrated circuit chips
US5535101A (en) * 1992-11-03 1996-07-09 Motorola, Inc. Leadless integrated circuit package
US5334804A (en) * 1992-11-17 1994-08-02 Fujitsu Limited Wire interconnect structures for connecting an integrated circuit to a substrate
US5308797A (en) 1992-11-24 1994-05-03 Texas Instruments Incorporated Leads for semiconductor chip assembly and method
US5656830A (en) * 1992-12-10 1997-08-12 International Business Machines Corp. Integrated circuit chip composite having a parylene coating
US5389743A (en) * 1992-12-21 1995-02-14 Hughes Aircraft Company Rivet design for enhanced copper thick-film I/O pad adhesion
US5497456A (en) * 1992-12-31 1996-03-05 Intel Corporation Apparatus for transferring information between an interrupt producer and an interrupt service environment
US5422574A (en) 1993-01-14 1995-06-06 Probe Technology Corporation Large scale protrusion membrane for semiconductor devices under test with very high pin counts
US5386344A (en) 1993-01-26 1995-01-31 International Business Machines Corporation Flex circuit card elastomeric cable connector assembly
US5313368A (en) 1993-02-02 1994-05-17 The Whitaker Corporation Electrical connections between printed circuit boards and integrated circuits surface mounted thereon
US5306670A (en) 1993-02-09 1994-04-26 Texas Instruments Incorporated Multi-chip integrated circuit module and method for fabrication thereof
US5378982A (en) 1993-02-25 1995-01-03 Hughes Aircraft Company Test probe for panel having an overlying protective member adjacent panel contacts
CA2110472C (en) 1993-03-01 1999-08-10 Anilkumar Chinuprasad Bhatt Method and apparatus for in-situ testing of integrated circuit chips
EP0615131A1 (de) * 1993-03-10 1994-09-14 Co-Operative Facility For Aging Tester Development Sonde für Halbleiterscheiben mit integrierten Schaltelementen
US5414298A (en) 1993-03-26 1995-05-09 Tessera, Inc. Semiconductor chip assemblies and components with pressure contact
US5355283A (en) * 1993-04-14 1994-10-11 Amkor Electronics, Inc. Ball grid array with via interconnection
US5453583A (en) 1993-05-05 1995-09-26 Lsi Logic Corporation Interior bond pad arrangements for alleviating thermal stresses
JP3115155B2 (ja) * 1993-05-28 2000-12-04 株式会社東芝 半導体装置およびその製造方法
US5359493A (en) 1993-07-09 1994-10-25 Texas Instruments Incorporated Three dimensional multi-chip module with integral heat sink
US5550482A (en) * 1993-07-20 1996-08-27 Tokyo Electron Kabushiki Kaisha Probe device
US5398863A (en) 1993-07-23 1995-03-21 Tessera, Inc. Shaped lead structure and method
US5390844A (en) 1993-07-23 1995-02-21 Tessera, Inc. Semiconductor inner lead bonding tool
US5525911A (en) * 1993-08-04 1996-06-11 Tokyo Electron Limited Vertical probe tester card with coaxial probes
US5621263A (en) * 1993-08-09 1997-04-15 Murata Manufacturing Co., Ltd. Piezoelectric resonance component
US5621313A (en) * 1993-09-09 1997-04-15 Tokyo Seimitsu Co., Ltd. Wafer probing system and method that stores reference pattern and movement value data for different kinds of wafers
US5381848A (en) 1993-09-15 1995-01-17 Lsi Logic Corporation Casting of raised bump contacts on a substrate
US5388327A (en) 1993-09-15 1995-02-14 Lsi Logic Corporation Fabrication of a dissolvable film carrier containing conductive bump contacts for placement on a semiconductor device package
US5477611A (en) 1993-09-20 1995-12-26 Tessera, Inc. Method of forming interface between die and chip carrier
US5414299A (en) 1993-09-24 1995-05-09 Vlsi Technology, Inc. Semi-conductor device interconnect package assembly for improved package performance
US5463324A (en) * 1993-10-26 1995-10-31 Hewlett-Packard Company Probe with contacts that interdigitate with and wedge between adjacent legs of an IC or the like
US5397245A (en) 1993-10-29 1995-03-14 Texas Instruments Incorporated Non-destructive interconnect system for semiconductor devices
US5386341A (en) * 1993-11-01 1995-01-31 Motorola, Inc. Flexible substrate folded in a U-shape with a rigidizer plate located in the notch of the U-shape
US6482013B2 (en) * 1993-11-16 2002-11-19 Formfactor, Inc. Microelectronic spring contact element and electronic component having a plurality of spring contact elements
US5455390A (en) 1994-02-01 1995-10-03 Tessera, Inc. Microelectronics unit mounting with multiple lead bonding
US5435482A (en) 1994-02-04 1995-07-25 Lsi Logic Corporation Integrated circuit having a coplanar solder ball contact array
JP3256367B2 (ja) * 1994-03-10 2002-02-12 新日本製鐵株式会社 樹脂被覆絶縁ボンディングワイヤ
US5518964A (en) 1994-07-07 1996-05-21 Tessera, Inc. Microelectronic mounting with multiple lead deformation and bonding
US5590460A (en) 1994-07-19 1997-01-07 Tessera, Inc. Method of making multilayer circuit
US5491302A (en) 1994-09-19 1996-02-13 Tessera, Inc. Microelectronic bonding with lead motion
JPH08122463A (ja) 1994-10-21 1996-05-17 Shoichi Shinozuka ストップウォッチ及び計時システム
US5495667A (en) * 1994-11-07 1996-03-05 Micron Technology, Inc. Method for forming contact pins for semiconductor dice and interconnects
US5557501A (en) 1994-11-18 1996-09-17 Tessera, Inc. Compliant thermal connectors and assemblies incorporating the same
WO1996019829A1 (en) * 1994-12-22 1996-06-27 Pace Benedict G Device for superheating steam
US5613861A (en) 1995-06-07 1997-03-25 Xerox Corporation Photolithographically patterned spring contact
KR0156334B1 (ko) * 1995-10-14 1998-10-15 김광호 차폐 본딩 와이어를 구비하는 고주파, 고밀도용 반도체 칩 패키지
JP3142847B2 (ja) 2000-01-01 2001-03-07 株式会社ソフィア パチンコ遊技機

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7952373B2 (en) * 2000-05-23 2011-05-31 Verigy (Singapore) Pte. Ltd. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
DE10340297A1 (de) * 2003-09-02 2005-03-31 Semikron Elektronik Gmbh Schaltungsanordnung für aktive und passive elektrische und elektronische Bauelemente
DE10340297B4 (de) * 2003-09-02 2006-07-20 Semikron Elektronik Gmbh & Co. Kg Verbindugsanordnung zur Verbindung von aktiven und passiven elektrischen und elektronischen Bauelementen

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US5926951A (en) 1999-07-27
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US6956174B2 (en) 2005-10-18
US6184587B1 (en) 2001-02-06
US6476333B1 (en) 2002-11-05
CN1045693C (zh) 1999-10-13
EP1241481A2 (de) 2002-09-18
DE69431565D1 (de) 2002-11-21
EP1241481A3 (de) 2004-01-02
KR960706207A (ko) 1996-11-08
US6279227B1 (en) 2001-08-28
US5900738A (en) 1999-05-04
CN1135268A (zh) 1996-11-06
US6274823B1 (en) 2001-08-14
EP0729652A1 (de) 1996-09-04
US20010002624A1 (en) 2001-06-07
WO1995014314A1 (en) 1995-05-26
JP3996172B2 (ja) 2007-10-24
EP0729652A4 (de) 1998-06-24
JP3006885B2 (ja) 2000-02-07
JPH09505439A (ja) 1997-05-27
US5917707A (en) 1999-06-29
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US6242803B1 (en) 2001-06-05
KR100210691B1 (ko) 1999-07-15
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