DE69432396D1 - Beschleunigungsmessaufnehmer - Google Patents
BeschleunigungsmessaufnehmerInfo
- Publication number
- DE69432396D1 DE69432396D1 DE69432396T DE69432396T DE69432396D1 DE 69432396 D1 DE69432396 D1 DE 69432396D1 DE 69432396 T DE69432396 T DE 69432396T DE 69432396 T DE69432396 T DE 69432396T DE 69432396 D1 DE69432396 D1 DE 69432396D1
- Authority
- DE
- Germany
- Prior art keywords
- acceleration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000001133 acceleration Effects 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
- G01P2015/0825—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass
- G01P2015/0828—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass the mass being of the paddle type being suspended at one of its longitudinal ends
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33104093 | 1993-12-27 | ||
| JP33104093 | 1993-12-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69432396D1 true DE69432396D1 (de) | 2003-05-08 |
| DE69432396T2 DE69432396T2 (de) | 2004-03-04 |
Family
ID=18239167
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69432396T Expired - Fee Related DE69432396T2 (de) | 1993-12-27 | 1994-12-21 | Beschleunigungsmessaufnehmer |
Country Status (4)
| Country | Link |
|---|---|
| US (5) | US6305223B1 (de) |
| EP (1) | EP0660119B1 (de) |
| KR (1) | KR100349210B1 (de) |
| DE (1) | DE69432396T2 (de) |
Families Citing this family (49)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5554806A (en) * | 1994-06-15 | 1996-09-10 | Nippondenso Co., Ltd. | Physical-quantity detecting device |
| DE19800802A1 (de) * | 1998-01-13 | 1999-07-15 | Cit Alcatel | Steckverbinder mit elektronischem Bauelement |
| WO2000055652A1 (en) * | 1999-03-17 | 2000-09-21 | Input/Output, Inc. | Calibration of sensors |
| US7152473B1 (en) | 2000-03-17 | 2006-12-26 | Input/Output, Inc. | Integrated and multi-axis sensor assembly and packaging |
| US7434305B2 (en) | 2000-11-28 | 2008-10-14 | Knowles Electronics, Llc. | Method of manufacturing a microphone |
| US8629005B1 (en) | 2000-11-28 | 2014-01-14 | Knowles Electronics, Llc | Methods of manufacture of bottom port surface mount silicon condenser microphone packages |
| JP2002357619A (ja) * | 2001-06-01 | 2002-12-13 | Mitsubishi Electric Corp | 加速度センサ及びその製造方法 |
| US20070121423A1 (en) * | 2001-12-20 | 2007-05-31 | Daniel Rioux | Head-mounted display apparatus for profiling system |
| CA2366030A1 (en) * | 2001-12-20 | 2003-06-20 | Global E Bang Inc. | Profiling system |
| JP2005106584A (ja) * | 2003-09-30 | 2005-04-21 | Mitsubishi Electric Corp | 加速度センサユニット |
| US6946955B2 (en) * | 2004-01-21 | 2005-09-20 | Golder Thomas J | Initial movement indicator system and method for a wheeled ground vehicle |
| DE102004022822A1 (de) * | 2004-05-08 | 2005-12-01 | Conti Temic Microelectronic Gmbh | Aufnehmersystem/Auslösesensor, geeignet für Diagnose-/Sicherheitsvorrichtung, insbesondere für Unfallschutzeinrichtungen in einem Fahrzeug |
| DE102004022831A1 (de) * | 2004-05-08 | 2005-12-01 | Conti Temic Microelectronic Gmbh | Aufnehmersystem/Auslösesensor, geeignet für Diagnose-/Sicherheitsvorrichtung, insbesondere für Unfallschutzeinrichtungen in einem Fahrzeug |
| DE102004022830A1 (de) * | 2004-05-08 | 2005-12-01 | Conti Temic Microelectronic Gmbh | Aufnehmersystem/Auslösesensor, geeignet für Diagnose-/Sicherheitsvorrichtung, insbesondere für Unfallschutzeinrichtungen in einem Fahrzeug |
| DE102004022808A1 (de) * | 2004-05-08 | 2005-12-01 | Conti Temic Microelectronic Gmbh | Aufnehmersystem/Auslösesensor, geeignet für Diagnose-/Sicherheitsvorrichtung, insbesondere für Unfallschutzeinrichtungen in einem Fahrzeug |
| JP2006208360A (ja) * | 2004-12-27 | 2006-08-10 | Tokyo Keiso Co Ltd | 伝達時間計測装置 |
| US7373835B2 (en) * | 2005-01-31 | 2008-05-20 | Sanyo Electric Industries, Ltd. | Semiconductor sensor |
| JP2006214898A (ja) * | 2005-02-04 | 2006-08-17 | Seiko Epson Corp | 圧電デバイス及び電子機器 |
| JP2007033079A (ja) * | 2005-07-22 | 2007-02-08 | Advics:Kk | マルチチップセンサ |
| JP4740678B2 (ja) * | 2005-07-27 | 2011-08-03 | Ｏｋｉセミコンダクタ株式会社 | 半導体装置 |
| US7671478B2 (en) * | 2005-09-02 | 2010-03-02 | Honeywell International Inc. | Low height vertical sensor packaging |
| WO2009031285A1 (ja) | 2007-09-03 | 2009-03-12 | Panasonic Corporation | 慣性力センサ |
| US8421214B2 (en) | 2007-10-10 | 2013-04-16 | Vishay General Semiconductor Llc | Semiconductor device and method for manufacturing a semiconductor device |
| US8191428B2 (en) * | 2007-12-28 | 2012-06-05 | Ypoint Capital, Inc. | Thermal effect and off-center load compensation of a sensor |
| DE102008042366A1 (de) * | 2008-09-25 | 2010-04-01 | Robert Bosch Gmbh | Sensor und Verfahren zur Herstellung eines Sensors |
| FR2938974B1 (fr) * | 2008-11-25 | 2011-01-21 | Tronic S Microsystems | Composant microelectromecanique et procede de fabrication |
| CN101634662B (zh) * | 2009-08-07 | 2011-01-26 | 北京大学 | 微加速度计及其制备方法 |
| JP5527015B2 (ja) * | 2010-05-26 | 2014-06-18 | セイコーエプソン株式会社 | 素子構造体、慣性センサー、電子機器 |
| US9075078B2 (en) * | 2010-09-28 | 2015-07-07 | Infineon Technologies Ag | Microelectromechanical accelerometer with wireless transmission capabilities |
| US8991253B2 (en) | 2010-09-28 | 2015-03-31 | Infineon Technologies Ag | Microelectromechanical system |
| US20120085170A1 (en) * | 2010-10-07 | 2012-04-12 | Letterneau James C | Shock Resistant Mounting for High G Shock Accelerometer |
| EP2646773B1 (de) * | 2010-12-01 | 2015-06-24 | Analog Devices, Inc. | Vorrichtung und verfahren zur verankerung von elektroden in mems-vorrichtungen |
| US8387457B2 (en) * | 2011-01-11 | 2013-03-05 | Delphi Technologies, Inc. | Collision sensor housing and module |
| US8987840B2 (en) * | 2011-02-01 | 2015-03-24 | Honeywell International Inc. | Edge-mounted sensor |
| US8375793B2 (en) * | 2011-02-10 | 2013-02-19 | Dytran Instruments, Inc. | Accelerometer for high temperature applications |
| WO2013066343A1 (en) | 2011-11-04 | 2013-05-10 | Knowles Electronics, Llc | Embedded dielectric as a barrier in an acoustic device and method of manufacture |
| US8991251B1 (en) * | 2011-11-21 | 2015-03-31 | Western Digital (Fremont), Llc | Hybrid capacitive and piezoelectric motion sensing transducer |
| US8683870B2 (en) * | 2012-03-15 | 2014-04-01 | Meggitt (Orange County), Inc. | Sensor device with stepped pads for connectivity |
| US9078063B2 (en) | 2012-08-10 | 2015-07-07 | Knowles Electronics, Llc | Microphone assembly with barrier to prevent contaminant infiltration |
| KR101240918B1 (ko) * | 2012-09-06 | 2013-03-11 | 주식회사 티엘아이 | 보호캡에 플레이트 전극이 마련되는 관성 센서 패키지 및 그의 제작방법 |
| JP2014092531A (ja) * | 2012-11-07 | 2014-05-19 | Seiko Epson Corp | 物理量検出装置、電子機器および移動体 |
| JP2014126495A (ja) | 2012-12-27 | 2014-07-07 | Seiko Epson Corp | センサー、電子機器、および移動体 |
| US9837935B2 (en) * | 2013-10-29 | 2017-12-05 | Honeywell International Inc. | All-silicon electrode capacitive transducer on a glass substrate |
| US9709595B2 (en) | 2013-11-14 | 2017-07-18 | Analog Devices, Inc. | Method and apparatus for detecting linear and rotational movement |
| US9599471B2 (en) | 2013-11-14 | 2017-03-21 | Analog Devices, Inc. | Dual use of a ring structure as gyroscope and accelerometer |
| US10746548B2 (en) | 2014-11-04 | 2020-08-18 | Analog Devices, Inc. | Ring gyroscope structural features |
| US9794661B2 (en) | 2015-08-07 | 2017-10-17 | Knowles Electronics, Llc | Ingress protection for reducing particle infiltration into acoustic chamber of a MEMS microphone package |
| JP2018190580A (ja) * | 2017-05-01 | 2018-11-29 | ホシデン株式会社 | 近接センサ |
| US11656077B2 (en) | 2019-01-31 | 2023-05-23 | Analog Devices, Inc. | Pseudo-extensional mode MEMS ring gyroscope |
Family Cites Families (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2720484A1 (de) * | 1976-05-06 | 1977-11-24 | Alert O Drive Pty Ltd | Beschleunigungsempfindliche einrichtung |
| DE2655604C2 (de) * | 1976-12-08 | 1984-11-29 | Robert Bosch Gmbh, 7000 Stuttgart | Verzögerungsaufnehmer zur Auslösung von Insassenschutzvorrichtungen im Kraftfahrzeug |
| JPS607740A (ja) * | 1983-06-28 | 1985-01-16 | Narumi China Corp | 半導体装置 |
| US4679434A (en) * | 1985-07-25 | 1987-07-14 | Litton Systems, Inc. | Integrated force balanced accelerometer |
| US4835067A (en) | 1988-01-21 | 1989-05-30 | Electro Alloys Corp. | Corrosion resistant electroplating process, and plated article |
| JPH0623782B2 (ja) * | 1988-11-15 | 1994-03-30 | 株式会社日立製作所 | 静電容量式加速度センサ及び半導体圧力センサ |
| JPH0311653A (ja) * | 1989-06-07 | 1991-01-18 | Nec Yamagata Ltd | 半導体装置 |
| US5253526A (en) * | 1990-05-30 | 1993-10-19 | Copal Company Limited | Capacitive acceleration sensor with free diaphragm |
| DE69116435T2 (de) * | 1990-05-30 | 1996-08-14 | Hitachi Ltd | Halbleiterbeschleunigungsmesser und Kraftfahrzeugsteuerungssystem mit einem solchen |
| US5239871A (en) * | 1990-12-17 | 1993-08-31 | Texas Instruments Incorporated | Capacitive accelerometer |
| JP2772739B2 (ja) | 1991-06-20 | 1998-07-09 | いわき電子株式会社 | リードレスパッケージの外部電極構造及びその製造方法 |
| US5241133A (en) * | 1990-12-21 | 1993-08-31 | Motorola, Inc. | Leadless pad array chip carrier |
| JPH04268725A (ja) * | 1991-02-25 | 1992-09-24 | Canon Inc | 力学量検出センサおよびその製造方法 |
| JPH04312006A (ja) | 1991-04-11 | 1992-11-04 | Matsushita Electric Ind Co Ltd | チップ型表面波デバイスとその製造方法 |
| US5233873A (en) * | 1991-07-03 | 1993-08-10 | Texas Instruments Incorporated | Accelerometer |
| US5233871A (en) * | 1991-11-01 | 1993-08-10 | Delco Electronics Corporation | Hybrid accelerometer assembly |
| US5345823A (en) * | 1991-11-12 | 1994-09-13 | Texas Instruments Incorporated | Accelerometer |
| JPH05164775A (ja) | 1991-12-17 | 1993-06-29 | Atsugi Unisia Corp | 加速度センサ |
| JP2720697B2 (ja) | 1992-04-14 | 1998-03-04 | 株式会社村田製作所 | 加速度センサ |
| US5212345A (en) * | 1992-01-24 | 1993-05-18 | Pulse Engineering, Inc. | Self leaded surface mounted coplanar header |
| DE9202533U1 (de) * | 1992-02-27 | 1992-04-23 | Mannesmann Kienzle Gmbh, 7730 Villingen-Schwenningen, De | |
| FR2689642A1 (fr) * | 1992-04-03 | 1993-10-08 | Commissariat Energie Atomique | Capteur d'accélération du type capacitif omnidirectionnel dans un plan principal. |
| JPH05333056A (ja) * | 1992-05-27 | 1993-12-17 | Hitachi Ltd | 加速度センサ |
| JP2725952B2 (ja) * | 1992-06-30 | 1998-03-11 | 三菱電機株式会社 | 半導体パワーモジュール |
| FR2710741B1 (fr) * | 1993-09-30 | 1995-10-27 | Commissariat Energie Atomique | Capteur électronique destiné à la caractérisation de grandeurs physiques et procédé de réalisation d'un tel capteur. |
| US5503016A (en) * | 1994-02-01 | 1996-04-02 | Ic Sensors, Inc. | Vertically mounted accelerometer chip |
| US5554806A (en) | 1994-06-15 | 1996-09-10 | Nippondenso Co., Ltd. | Physical-quantity detecting device |
| US5747874A (en) | 1994-09-20 | 1998-05-05 | Fujitsu Limited | Semiconductor device, base member for semiconductor device and semiconductor device unit |
| US5535626A (en) * | 1994-12-21 | 1996-07-16 | Breed Technologies, Inc. | Sensor having direct-mounted sensing element |
| FR2734641B1 (fr) * | 1995-05-24 | 1997-08-14 | Sextant Avionique | Accelerometre electromagnetique |
| JP3423855B2 (ja) * | 1996-04-26 | 2003-07-07 | 株式会社デンソー | 電子部品搭載用構造体および電子部品の実装方法 |
| JP3576727B2 (ja) * | 1996-12-10 | 2004-10-13 | 株式会社デンソー | 表面実装型パッケージ |
-
1994
- 1994-12-21 EP EP94309624A patent/EP0660119B1/de not_active Expired - Lifetime
- 1994-12-21 DE DE69432396T patent/DE69432396T2/de not_active Expired - Fee Related
- 1994-12-27 KR KR1019940037134A patent/KR100349210B1/ko not_active IP Right Cessation
-
1997
- 1997-01-03 US US08/778,538 patent/US6305223B1/en not_active Expired - Fee Related
-
2000
- 2000-11-28 US US09/722,564 patent/US6388887B1/en not_active Expired - Fee Related
- 2000-11-28 US US09/722,530 patent/US6566742B1/en not_active Expired - Fee Related
-
2001
- 2001-05-25 US US09/864,279 patent/US6463804B2/en not_active Expired - Fee Related
- 2001-05-31 US US09/867,523 patent/US6561030B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US6561030B2 (en) | 2003-05-13 |
| EP0660119B1 (de) | 2003-04-02 |
| US20020029637A1 (en) | 2002-03-14 |
| US20010023615A1 (en) | 2001-09-27 |
| US6463804B2 (en) | 2002-10-15 |
| US6305223B1 (en) | 2001-10-23 |
| KR950019738A (ko) | 1995-07-24 |
| DE69432396T2 (de) | 2004-03-04 |
| KR100349210B1 (ko) | 2002-12-26 |
| US6388887B1 (en) | 2002-05-14 |
| EP0660119A1 (de) | 1995-06-28 |
| US6566742B1 (en) | 2003-05-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |