DE69515626D1 - Plasmabehandlungsverfahren und -vorrichtung - Google Patents

Plasmabehandlungsverfahren und -vorrichtung

Info

Publication number
DE69515626D1
DE69515626D1 DE69515626T DE69515626T DE69515626D1 DE 69515626 D1 DE69515626 D1 DE 69515626D1 DE 69515626 T DE69515626 T DE 69515626T DE 69515626 T DE69515626 T DE 69515626T DE 69515626 D1 DE69515626 D1 DE 69515626D1
Authority
DE
Germany
Prior art keywords
treatment method
plasma treatment
plasma
treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69515626T
Other languages
English (en)
Other versions
DE69515626T2 (de
Inventor
Toshiyuki Sakemi
Masaru Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Heavy Industries Ltd
Original Assignee
Sumitomo Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Heavy Industries Ltd filed Critical Sumitomo Heavy Industries Ltd
Application granted granted Critical
Publication of DE69515626D1 publication Critical patent/DE69515626D1/de
Publication of DE69515626T2 publication Critical patent/DE69515626T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32422—Arrangement for selecting ions or species in the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3266—Magnetic control means
DE69515626T 1994-12-28 1995-12-28 Plasmabehandlungsverfahren und -vorrichtung Expired - Lifetime DE69515626T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32871394 1994-12-28

Publications (2)

Publication Number Publication Date
DE69515626D1 true DE69515626D1 (de) 2000-04-20
DE69515626T2 DE69515626T2 (de) 2000-08-31

Family

ID=18213358

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69515626T Expired - Lifetime DE69515626T2 (de) 1994-12-28 1995-12-28 Plasmabehandlungsverfahren und -vorrichtung

Country Status (4)

Country Link
US (1) US5677012A (de)
EP (1) EP0720206B1 (de)
CN (1) CN1165635C (de)
DE (1) DE69515626T2 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5852434A (en) * 1992-04-03 1998-12-22 Sekendur; Oral F. Absolute optical position determination
JPH10176263A (ja) * 1996-12-17 1998-06-30 Sumitomo Heavy Ind Ltd イオンプレーティング装置の運転方法
JP3275166B2 (ja) * 1997-02-28 2002-04-15 住友重機械工業株式会社 プラズマビームの偏り修正機構を備えた真空成膜装置
JP4287936B2 (ja) * 1999-02-01 2009-07-01 中外炉工業株式会社 真空成膜装置
JP3944317B2 (ja) * 1998-06-09 2007-07-11 住友重機械工業株式会社 Ｃｕ成膜方法
JP4405973B2 (ja) * 2006-01-17 2010-01-27 キヤノンアネルバ株式会社 薄膜作製装置
CN1845292B (zh) * 2006-04-30 2011-07-20 哈尔滨工业大学 磁场辅助的自辉光等离子体离子注入装置
US7498587B2 (en) * 2006-05-01 2009-03-03 Vapor Technologies, Inc. Bi-directional filtered arc plasma source
JP5968666B2 (ja) * 2012-04-09 2016-08-10 中外炉工業株式会社 プラズマ発生装置および蒸着装置
JP5421438B1 (ja) 2012-08-15 2014-02-19 中外炉工業株式会社 プラズマ処理装置
CN103732788B (zh) * 2012-08-15 2016-06-29 中外炉工业株式会社 等离子体处理装置
JP6054249B2 (ja) * 2013-05-27 2016-12-27 住友重機械工業株式会社 成膜装置
JP6013274B2 (ja) * 2013-05-28 2016-10-25 住友重機械工業株式会社 成膜装置
JP5989601B2 (ja) * 2013-05-29 2016-09-07 住友重機械工業株式会社 プラズマ蒸発装置
JP6013279B2 (ja) * 2013-06-13 2016-10-25 住友重機械工業株式会社 成膜装置
WO2016073796A1 (en) * 2014-11-05 2016-05-12 Solarcity Corporation System and method for efficient deposition of transparent conductive oxide
US11056324B2 (en) 2018-08-13 2021-07-06 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for particle control in MRAM processing
DE102020124270A1 (de) 2020-09-17 2022-03-17 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Verfahren und Vorrichtung zur anodischen Bogenverdampfung
FR3118280B1 (fr) 2020-12-18 2022-12-02 Commissariat Energie Atomique Dispositif pour le depot de films minces assisté par plasma micro-onde

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3956093A (en) * 1974-12-16 1976-05-11 Airco, Inc. Planar magnetron sputtering method and apparatus
CA1336180C (en) * 1987-03-27 1995-07-04 Kazuaki Ohmi Substrate-treating apparatus and method
US4885070A (en) * 1988-02-12 1989-12-05 Leybold Aktiengesellschaft Method and apparatus for the application of materials
US5009922A (en) * 1989-03-02 1991-04-23 Ashahi Glass Company, Ltd. Method of forming a transparent conductive film
JP2501948B2 (ja) * 1990-10-26 1996-05-29 三菱電機株式会社 プラズマ処理方法及びプラズマ処理装置
JPH04254583A (ja) * 1990-12-28 1992-09-09 Sumitomo Heavy Ind Ltd イオンプレーティング装置における膜質制御装置
JPH04365854A (ja) * 1991-06-11 1992-12-17 Ulvac Japan Ltd イオンプレーティング装置
JPH0688216A (ja) * 1992-09-07 1994-03-29 Nippon Sheet Glass Co Ltd 真空成膜方法
JP2946387B2 (ja) * 1993-11-17 1999-09-06 住友重機械工業株式会社 イオンプレーティング装置

Also Published As

Publication number Publication date
DE69515626T2 (de) 2000-08-31
EP0720206B1 (de) 2000-03-15
EP0720206A1 (de) 1996-07-03
CN1165635C (zh) 2004-09-08
US5677012A (en) 1997-10-14
CN1135538A (zh) 1996-11-13

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