DE69532668D1 - Herstellungsvervahren einer elektronen emittierende Einrichtung mit Oberflächenleitung - Google Patents

Herstellungsvervahren einer elektronen emittierende Einrichtung mit Oberflächenleitung

Info

Publication number
DE69532668D1
DE69532668D1 DE69532668T DE69532668T DE69532668D1 DE 69532668 D1 DE69532668 D1 DE 69532668D1 DE 69532668 T DE69532668 T DE 69532668T DE 69532668 T DE69532668 T DE 69532668T DE 69532668 D1 DE69532668 D1 DE 69532668D1
Authority
DE
Germany
Prior art keywords
electron
emitting device
manufacturing process
surface conduction
conduction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69532668T
Other languages
English (en)
Other versions
DE69532668T2 (de
Inventor
Yoshikazu Banno
Etsuro Kishi
Mitsutoshi Hasegawa
Kazuhiro Sando
Kazuya Shigeoka
Masahiko Miyamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Application granted granted Critical
Publication of DE69532668D1 publication Critical patent/DE69532668D1/de
Publication of DE69532668T2 publication Critical patent/DE69532668T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J1/00Details of electrodes, of magnetic control means, of screens, or of the mounting or spacing thereof, common to two or more basic types of discharge tubes or lamps
    • H01J1/02Main electrodes
    • H01J1/30Cold cathodes, e.g. field-emissive cathode
    • H01J1/304Field-emissive cathodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J1/00Details of electrodes, of magnetic control means, of screens, or of the mounting or spacing thereof, common to two or more basic types of discharge tubes or lamps
    • H01J1/02Main electrodes
    • H01J1/30Cold cathodes, e.g. field-emissive cathode
    • H01J1/316Cold cathodes, e.g. field-emissive cathode having an electric field parallel to the surface, e.g. thin film cathodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02Manufacture of electrodes or electrode systems
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02Manufacture of electrodes or electrode systems
    • H01J9/022Manufacture of electrodes or electrode systems of cold cathodes
    • H01J9/027Manufacture of electrodes or electrode systems of cold cathodes of thin film cathodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2201/00Electrodes common to discharge tubes
    • H01J2201/30Cold cathodes
    • H01J2201/316Cold cathodes having an electric field parallel to the surface thereof, e.g. thin film cathodes
    • H01J2201/3165Surface conduction emission type cathodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2329/00Electron emission display panels, e.g. field emission display panels
DE1995632668 1994-12-16 1995-12-15 Herstellungsvervahren einer elektronen emittierende Einrichtung mit Oberflächenleitung Expired - Lifetime DE69532668T2 (de)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
JP31344094 1994-12-16
JP31344094 1994-12-16
JP31442094 1994-12-19
JP31442094 1994-12-19
JP458195 1995-01-17
JP458195 1995-01-17
JP15632195 1995-06-22
JP15632195 1995-06-22
JP32092795A JP3241251B2 (ja) 1994-12-16 1995-12-11 電子放出素子の製造方法及び電子源基板の製造方法
JP32092795 1995-12-11

Publications (2)

Publication Number Publication Date
DE69532668D1 true DE69532668D1 (de) 2004-04-15
DE69532668T2 DE69532668T2 (de) 2005-01-13

Family

ID=27518508

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1995632668 Expired - Lifetime DE69532668T2 (de) 1994-12-16 1995-12-15 Herstellungsvervahren einer elektronen emittierende Einrichtung mit Oberflächenleitung

Country Status (8)

Country Link
US (8) US6060113A (de)
EP (1) EP0717428B1 (de)
JP (1) JP3241251B2 (de)
KR (1) KR100229232B1 (de)
CN (1) CN1130747C (de)
AU (1) AU707487B2 (de)
CA (1) CA2165409C (de)
DE (1) DE69532668T2 (de)

Families Citing this family (99)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3241251B2 (ja) * 1994-12-16 2001-12-25 キヤノン株式会社 電子放出素子の製造方法及び電子源基板の製造方法
EP0736892B1 (de) 1995-04-03 2003-09-10 Canon Kabushiki Kaisha Verfahren zur Herstellung einer elektronenemittierende Vorrichtung, einer Elektronenquelle und eines Bilderzeugungsgerätes
JP3241613B2 (ja) * 1995-10-12 2001-12-25 キヤノン株式会社 電子放出素子、電子源および画像形成装置の製造方法
JP3229223B2 (ja) 1995-10-13 2001-11-19 キヤノン株式会社 電子放出素子、電子源及び画像形成装置の製造法並びに電子放出素子製造用金属組成物
DE69738794D1 (de) 1996-02-08 2008-08-14 Canon Kk Verfahren zur Herstellung einer elektronenemittierende Vorrichtung, einer Elektronenquelle und eines Bilderzeugungsgerätes und Verfahren zur Überprüfung der Herstellung
EP1225056B1 (de) 1997-03-21 2004-11-24 Canon Kabushiki Kaisha Verfahren zur Herstellung eines bedruckten Substrats
JP3352385B2 (ja) * 1997-03-21 2002-12-03 キヤノン株式会社 電子源基板およびそれを用いた電子装置の製造方法
JPH1125851A (ja) 1997-05-09 1999-01-29 Canon Inc 電子源、その製造方法及び製造装置並びに画像形成装置及びその製造方法
JP2004111367A (ja) * 1997-09-02 2004-04-08 Seiko Epson Corp 正孔注入輸送層用組成物、有機el素子及びその製造方法
JP2004031360A (ja) * 1997-09-02 2004-01-29 Seiko Epson Corp 正孔注入輸送層用組成物、有機el素子及びその製造方法
JP2004031362A (ja) * 1997-09-02 2004-01-29 Seiko Epson Corp 正孔注入輸送層用組成物、有機el素子及びその製造方法
JP3807621B2 (ja) * 1997-09-02 2006-08-09 セイコーエプソン株式会社 有機el素子の製造方法
JP2000106278A (ja) * 1997-09-02 2000-04-11 Seiko Epson Corp 有機el素子の製造方法及び有機el素子
JP2004031363A (ja) * 1997-09-02 2004-01-29 Seiko Epson Corp 正孔注入輸送層用組成物、有機el素子及びその製造方法
JP2004055555A (ja) * 1997-09-02 2004-02-19 Seiko Epson Corp 正孔注入輸送層用組成物、有機el素子及びその製造方法
KR100343240B1 (ko) 1997-09-16 2002-08-22 캐논 가부시끼가이샤 전자원제조방법,화상형성장치제조방법,및전자원제조장치
GB2330451B (en) * 1997-10-14 2002-11-20 Thin Film Technology Method of forming an electronic device
US5961722A (en) * 1997-11-26 1999-10-05 Micron Technology, Inc. Apparatus for establishing reference coordinates for a point on a component
JP3169926B2 (ja) 1998-02-13 2001-05-28 キヤノン株式会社 電子源の製造方法
EP1335399B1 (de) 1998-02-16 2007-09-05 Canon Kabushiki Kaisha Verfahren zur Herstellung einer elektronenemittierenden Vorrichtung, einer Elektronenquelle und eines Bilderzeugungsgeräts
US6878028B1 (en) * 1998-05-01 2005-04-12 Canon Kabushiki Kaisha Method of fabricating electron source and image forming apparatus
JP3102787B1 (ja) 1998-09-07 2000-10-23 キヤノン株式会社 電子放出素子、電子源、及び画像形成装置の製造方法
KR100472686B1 (ko) 1998-10-14 2005-03-08 캐논 가부시끼가이샤 화상 형성 장치의 제조 방법 및 그 제조 방법에 의해제조된 화상 형성 장치
EP1008571B1 (de) * 1998-12-11 2004-06-16 The Morgan Crucible Company Plc Verfahren zur Behandlung keramischer Oberflächen
JP4541560B2 (ja) 1999-02-08 2010-09-08 キヤノン株式会社 電子デバイス、電子源及び画像形成装置の製造方法
JP2000309734A (ja) 1999-02-17 2000-11-07 Canon Inc インクジェット用インク、導電性膜、電子放出素子、電子源および画像形成装置の製造方法
JP2000251666A (ja) 1999-02-24 2000-09-14 Canon Inc 電子源基板、電子源基板の製造装置、製造方法及び画像形成装置
JP3530796B2 (ja) 1999-03-05 2004-05-24 キヤノン株式会社 画像形成装置
DE60044482D1 (de) 1999-03-05 2010-07-15 Canon Kk Bilderzeugungsvorrichtung
JP3697131B2 (ja) * 2000-02-21 2005-09-21 キヤノン株式会社 カラーフィルタの製造方法、製造装置、カラーフィルタを備えた表示装置の製造方法及び該表示装置を備えた装置の製造方法
US6473190B1 (en) * 2000-03-13 2002-10-29 Bayer Corporation Optical volume sensor
EP1138489A1 (de) * 2000-03-24 2001-10-04 Seiko Epson Corporation Flüssigkeitsstrahlverfahren und dazugehörige Flüssigkeitsstrahlvorrichtung
SE518640C2 (sv) * 2000-07-11 2002-11-05 Mydata Automation Ab Förfarande, anordning för applicering av ett visköst medium på ett substrat, anordning för applicering av ytterligare visköst medium samt användningen av screentryckning
SE518642C2 (sv) * 2000-07-11 2002-11-05 Mydata Automation Ab Förfarande, anordning för att förse ett substrat med visköst medium, anordning för korrigering av applikationsfel samt användningen av utskjutnings- organ för korrigering av appliceringsfel
US20040049425A1 (en) * 2002-08-27 2004-03-11 Outsite Networks, Inc. Generic loyalty tag
WO2002099849A2 (en) * 2001-06-01 2002-12-12 Litrex Corporation Apparatus for microdeposition of multiple fluid materials
JP2003007976A (ja) * 2001-06-25 2003-01-10 Mitsubishi Electric Corp 半導体装置及びモジュール装置
US6973710B2 (en) 2001-08-03 2005-12-13 Seiko Epson Corporation Method and apparatus for making devices
JP3728281B2 (ja) 2001-08-28 2005-12-21 キヤノン株式会社 電子源基板及び画像形成装置
CN1213389C (zh) 2001-08-31 2005-08-03 佳能株式会社 图像显示装置及其制造方法
GB2379415A (en) * 2001-09-10 2003-03-12 Seiko Epson Corp Monitoring the deposition of organic polymer droplets onto a substrate
JP2003086123A (ja) * 2001-09-14 2003-03-20 Canon Inc 画像表示装置
JP2003159786A (ja) * 2001-11-28 2003-06-03 Seiko Epson Corp 吐出方法およびその装置、電気光学装置、その製造方法およびその製造装置、カラーフィルタ、その製造方法およびその製造装置、ならびに基材を有するデバイス、その製造方法およびその製造装置
JP2003237060A (ja) * 2002-02-20 2003-08-26 Seiko Epson Corp デバイスの製造装置及び製造方法、デバイスの製造装置の駆動方法
NL1020312C2 (nl) * 2002-04-05 2003-10-07 Otb Groep B V Werkwijze en inrichting voor het vervaardigen van een display, zoals bijvoorbeeld een polymere OLED display, een display en een substraat ten gebruike bij de werkwijze.
JP3578162B2 (ja) * 2002-04-16 2004-10-20 セイコーエプソン株式会社 パターンの形成方法、パターン形成装置、導電膜配線、デバイスの製造方法、電気光学装置、並びに電子機器
JP4200810B2 (ja) * 2002-05-17 2008-12-24 セイコーエプソン株式会社 ディスプレー製造装置、及び、ディスプレー製造方法
US6858464B2 (en) * 2002-06-19 2005-02-22 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing light emitting device
US7188919B2 (en) * 2002-07-08 2007-03-13 Canon Kabushiki Kaisha Liquid discharge method and apparatus using individually controllable nozzles
US7111755B2 (en) * 2002-07-08 2006-09-26 Canon Kabushiki Kaisha Liquid discharge method and apparatus and display device panel manufacturing method and apparatus
TWI276366B (en) * 2002-07-09 2007-03-11 Semiconductor Energy Lab Production apparatus and method of producing a light-emitting device by using the same apparatus
US7091662B2 (en) * 2002-07-23 2006-08-15 Canon Kabushiki Kaisha Image display device and method of manufacturing the same
US7138157B2 (en) 2002-07-30 2006-11-21 Canon Kabushiki Kaisha Electron emitting device manufacture method and image display apparatus manufacture method
JP3944026B2 (ja) * 2002-08-28 2007-07-11 キヤノン株式会社 外囲器及びその製造方法
JP3719431B2 (ja) * 2002-09-25 2005-11-24 セイコーエプソン株式会社 光学部品およびその製造方法、表示装置および撮像素子
US6852372B2 (en) * 2002-10-17 2005-02-08 Canon Kabushiki Kaisha Fabrication method for electron source substrate
CN101694871B (zh) 2002-11-11 2012-12-05 株式会社半导体能源研究所 发光装置的制造方法
JP4337348B2 (ja) * 2003-01-15 2009-09-30 セイコーエプソン株式会社 液滴吐出装置の描画精度検査装置、液滴吐出装置およびワーク、並びに電気光学装置の製造方法
JP4114060B2 (ja) * 2003-02-06 2008-07-09 セイコーエプソン株式会社 受光素子の製造方法
JP3966294B2 (ja) * 2003-03-11 2007-08-29 セイコーエプソン株式会社 パターンの形成方法及びデバイスの製造方法
JP3966292B2 (ja) * 2003-03-27 2007-08-29 セイコーエプソン株式会社 パターンの形成方法及びパターン形成装置、デバイスの製造方法、導電膜配線、電気光学装置、並びに電子機器
JP4320559B2 (ja) * 2003-05-14 2009-08-26 セイコーエプソン株式会社 液滴吐出装置
JP2005012179A (ja) * 2003-05-16 2005-01-13 Seiko Epson Corp 薄膜パターン形成方法、デバイスとその製造方法及び電気光学装置並びに電子機器、アクティブマトリクス基板の製造方法
US7964237B2 (en) * 2003-08-21 2011-06-21 International Business Machines Corporation Fully automated paste dispense process for dispensing small dots and lines
JP2005081335A (ja) * 2003-09-11 2005-03-31 Seiko Epson Corp パターン形成方法、導電性薄膜、電気光学装置、電子機器
JP4023422B2 (ja) * 2003-09-11 2007-12-19 セイコーエプソン株式会社 パターン形成方法
US7482742B2 (en) 2004-03-10 2009-01-27 Canon Kabushiki Kaisha Electron source substrate with high-impedance portion, and image-forming apparatus
WO2005090081A1 (ja) * 2004-03-17 2005-09-29 Matsushita Electric Industrial Co., Ltd. 液滴配置装置及び液滴配置方法
DE102004014207A1 (de) * 2004-03-23 2005-10-13 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil mit mehrteiligem Gehäusekörper
TWI230426B (en) * 2004-04-07 2005-04-01 Optimum Care Int Tech Inc Packaging method of integrated circuit
JP4393257B2 (ja) * 2004-04-15 2010-01-06 キヤノン株式会社 外囲器の製造方法および画像形成装置
KR20050104641A (ko) * 2004-04-29 2005-11-03 삼성에스디아이 주식회사 전자 방출 표시장치
US20050257738A1 (en) * 2004-05-21 2005-11-24 Semiconductor Energy Laboratory Co., Ltd. Manufacturing apparatus of semiconductor device and pattern-forming method
US20060000081A1 (en) * 2004-06-30 2006-01-05 Canon Kabushiki Kaisha Manufacturing method for electronic device with functional thin film
US7557369B2 (en) 2004-07-29 2009-07-07 Samsung Mobile Display Co., Ltd. Display and method for manufacturing the same
US20060042316A1 (en) * 2004-08-24 2006-03-02 Canon Kabushiki Kaisha Method of manufacturing hermetically sealed container and image display apparatus
JP2006126692A (ja) * 2004-11-01 2006-05-18 Seiko Epson Corp 薄膜パターン基板、デバイスの製造方法、及び電気光学装置、並びに電子機器
JP2006272035A (ja) * 2005-03-28 2006-10-12 Canon Inc 膜の形成方法及び電子源基板の製造方法
JP2006272297A (ja) * 2005-03-30 2006-10-12 Seiko Epson Corp 液滴吐出装置
TW200644746A (en) * 2005-05-12 2006-12-16 Matsushita Electric Ind Co Ltd Apparatus for forming phosphor layer and method for forming phosphor layer using the apparatus
JP5072220B2 (ja) * 2005-12-06 2012-11-14 キヤノン株式会社 薄膜の製造方法及び電子放出素子の製造方法
JP2007199684A (ja) * 2005-12-28 2007-08-09 Canon Inc 画像表示装置
US7626698B2 (en) * 2006-02-28 2009-12-01 Shimadzu Corporation Method of analysis in optical measurements
JP5194468B2 (ja) * 2006-03-07 2013-05-08 コニカミノルタホールディングス株式会社 有機薄膜トランジスタの製造方法及び有機薄膜トランジスタ
US7992956B2 (en) * 2006-06-07 2011-08-09 Applied Materials, Inc. Systems and methods for calibrating inkjet print head nozzles using light transmittance measured through deposited ink
JP5089092B2 (ja) * 2006-06-26 2012-12-05 キヤノン株式会社 機能性膜の製造方法
KR100858811B1 (ko) * 2006-11-10 2008-09-17 삼성에스디아이 주식회사 전자 방출 표시 소자의 제조 방법
US20100044890A1 (en) * 2007-03-22 2010-02-25 Hideo Ochi Semiconductor substrate manufacture apparatus, semiconductor substrate manufacture method, and semiconductor substrate
US7972461B2 (en) * 2007-06-27 2011-07-05 Canon Kabushiki Kaisha Hermetically sealed container and manufacturing method of image forming apparatus using the same
US20090185186A1 (en) * 2007-12-06 2009-07-23 Applied Materials, Inc. Systems and methods for improving measurement of light transmittance through ink deposited on a substrate
EP3496025A1 (de) * 2011-03-31 2019-06-12 Assurant, Inc. Verfahren, vorrichtung und computerprogrammprodukt zur bereitstellung der gezielten erfüllung in bezug auf ein schutzprogramm einer drahtlosen vorrichtung
KR20140093109A (ko) * 2013-01-17 2014-07-25 삼성디스플레이 주식회사 인쇄 장치
TW201434535A (zh) * 2013-03-05 2014-09-16 Genesis Photonics Inc 噴塗裝置
CN104056753A (zh) * 2013-03-20 2014-09-24 新世纪光电股份有限公司 喷涂装置
DE102014107122A1 (de) * 2014-05-20 2015-11-26 Phoenix Contact Gmbh & Co. Kg Modulares Messsystem
US10126894B2 (en) * 2015-05-08 2018-11-13 Egalax_Empia Technology Inc. Position detection device
US11515271B2 (en) * 2021-01-27 2022-11-29 Innolux Corporation Electronic device including wire on side surface of substrate and manufacturing method thereof
CN113171939B (zh) * 2021-05-08 2022-07-19 深圳市艾伦德科技有限公司 一种电子元件点胶贴装一体机
CN115106272B (zh) * 2022-07-26 2023-06-13 广西梧州华锋电子铝箔有限公司 一种低漏电流铝箔制造方法

Family Cites Families (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US62A (en) * 1836-10-20 Cooking-stove
US63A (en) * 1836-10-20 Kravxiig
US3A (en) * 1836-08-11 Thomas blanchard
US620581A (en) * 1899-03-07 gibson
US1A (en) * 1836-07-13 John Ruggles Locomotive steam-engine for rail and other roads
US4A (en) * 1836-08-10 Stock
US64A (en) * 1836-10-20 John blaokmab
US394698A (en) * 1888-12-18 Sash-balance
US256822A (en) * 1882-04-25 Car-coupling
US2A (en) * 1826-12-15 1836-07-29 mode of manufacturing wool or other fibrous materials
US658916A (en) * 1899-11-01 1900-10-02 Eugene E Jones Door-check.
US2013233A (en) * 1933-12-18 1935-09-03 William A Buckner Traveling sprinkler
US3611077A (en) * 1969-02-26 1971-10-05 Us Navy Thin film room-temperature electron emitter
US3801366A (en) * 1971-02-16 1974-04-02 J Lemelson Method of making an electrical circuit
US4488781A (en) * 1982-01-25 1984-12-18 American Cyanamid Company Method for manufacturing an electrochromic display device and device produced thereby
US4563617A (en) * 1983-01-10 1986-01-07 Davidson Allen S Flat panel television/display
US4566186A (en) * 1984-06-29 1986-01-28 Tektronix, Inc. Multilayer interconnect circuitry using photoimageable dielectric
US4600137A (en) * 1985-02-21 1986-07-15 Hollis Automation, Inc. Method and apparatus for mass soldering with subsequent reflow soldering
US4668533A (en) * 1985-05-10 1987-05-26 E. I. Du Pont De Nemours And Company Ink jet printing of printed circuit boards
US4661368A (en) * 1985-09-18 1987-04-28 Universal Instruments Corporation Surface locating and dispensed dosage sensing method and apparatus
JPS62181490A (ja) 1986-02-05 1987-08-08 株式会社豊田自動織機製作所 インクジエツト方式によるプリント回路板の作成方法及びその装置
DE3752249T2 (de) * 1986-07-04 1999-07-08 Canon Kk Elektronen emittierende Vorrichtung
JPH0797696B2 (ja) * 1986-07-05 1995-10-18 株式会社豊田自動織機製作所 ハイブリツドic基板と回路パタ−ン形成方法
JPS63200041A (ja) 1987-02-14 1988-08-18 Toyota Autom Loom Works Ltd インクジエツト式ハイブリツドicパタ−ン形成装置における配線不良検出装置
JPS645095A (en) 1987-06-26 1989-01-10 Tdk Corp Formation of conductive pattern
US5066883A (en) * 1987-07-15 1991-11-19 Canon Kabushiki Kaisha Electron-emitting device with electron-emitting region insulated from electrodes
JPS6437585A (en) * 1987-08-04 1989-02-08 Nippon Telegraph & Telephone Active matrix type display device
JPS6464290A (en) 1987-09-03 1989-03-10 Murata Manufacturing Co Conductor pattern forming method
US5023110A (en) * 1988-05-02 1991-06-11 Canon Kabushiki Kaisha Process for producing electron emission device
JPH0687392B2 (ja) * 1988-05-02 1994-11-02 キヤノン株式会社 電子放出素子の製造方法
JPH01296532A (ja) 1988-05-25 1989-11-29 Canon Inc 表面伝導形電子放出素子及び該素子の製造方法
JP2630988B2 (ja) * 1988-05-26 1997-07-16 キヤノン株式会社 電子線発生装置
JPH02247939A (ja) * 1989-03-22 1990-10-03 Canon Inc 表面伝導形電子放出素子,該素子を用いた画像形成装置及び該素子の製造方法
JP3044382B2 (ja) * 1989-03-30 2000-05-22 キヤノン株式会社 電子源及びそれを用いた画像表示装置
US5114744A (en) * 1989-08-21 1992-05-19 Hewlett-Packard Company Method for applying a conductive trace pattern to a substrate
US5052338A (en) * 1990-01-31 1991-10-01 Asymptotic Technologies, Inc. Apparatus for dispensing viscous materials a constant height above a workpiece surface
US5189549A (en) * 1990-02-26 1993-02-23 Molecular Displays, Inc. Electrochromic, electroluminescent and electrochemiluminescent displays
US5275646A (en) * 1990-06-27 1994-01-04 Domino Printing Sciences Plc Ink composition
JPH04121702A (ja) 1990-09-13 1992-04-22 Mitsubishi Electric Corp カラーフィルタの形成方法
US5320703A (en) * 1991-05-09 1994-06-14 Canon Kabushiki Kaisha Process for forming gold crystal film
US5281635A (en) * 1991-05-17 1994-01-25 Johnson Matthey Public Limited Company Precious metal composition
KR940000143B1 (ko) * 1991-06-25 1994-01-07 재단법인 한국전자통신연구소 대형 박막 트랜지스터(TFT) 액정 디스플레이 패널(LCD panel)의 제조방법
US5320250A (en) * 1991-12-02 1994-06-14 Asymptotic Technologies, Inc. Method for rapid dispensing of minute quantities of viscous material
US5334249A (en) * 1993-01-28 1994-08-02 Greg D. Thompson Programmable electrically controlled photoeye linked applicator for glue guns
JP3205167B2 (ja) * 1993-04-05 2001-09-04 キヤノン株式会社 電子源の製造方法及び画像形成装置の製造方法
JP3453803B2 (ja) * 1993-06-15 2003-10-06 株式会社日立製作所 電子回路基板の配線修正方法およびその装置
EP0658916B1 (de) * 1993-11-09 1998-04-15 Canon Kabushiki Kaisha Bildanzeigegerät
CA2126509C (en) 1993-12-27 2000-05-23 Toshikazu Ohnishi Electron-emitting device and method of manufacturing the same as well as electron source and image-forming apparatus
US5498444A (en) * 1994-02-28 1996-03-12 Microfab Technologies, Inc. Method for producing micro-optical components
US5861227A (en) 1994-09-29 1999-01-19 Canon Kabushiki Kaisha Methods and manufacturing electron-emitting device, electron source, and image-forming apparatus
JP3241251B2 (ja) * 1994-12-16 2001-12-25 キヤノン株式会社 電子放出素子の製造方法及び電子源基板の製造方法
US5593499A (en) * 1994-12-30 1997-01-14 Photocircuits Corporation Dual air knife for hot air solder levelling
US5650199A (en) * 1995-11-22 1997-07-22 Aem, Inc. Method of making a multilayer electronic component with inter-layer conductor connection utilizing a conductive via forming ink
US5786875A (en) * 1996-03-15 1998-07-28 Brader; Lawrence Allen Thermal liquid crystal display using thermoelectric link

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CN1130747C (zh) 2003-12-10
EP0717428A3 (de) 1997-03-19
US6390873B1 (en) 2002-05-21
KR960025997A (ko) 1996-07-20
AU4048695A (en) 1996-06-27
US20020098766A1 (en) 2002-07-25
US20040146637A1 (en) 2004-07-29
US6511545B2 (en) 2003-01-28
US6511358B2 (en) 2003-01-28
US6060113A (en) 2000-05-09
JP3241251B2 (ja) 2001-12-25
US20020007786A1 (en) 2002-01-24
US6761925B2 (en) 2004-07-13
JPH0969334A (ja) 1997-03-11
EP0717428B1 (de) 2004-03-10
US6419746B1 (en) 2002-07-16
EP0717428A2 (de) 1996-06-19
US20020028285A1 (en) 2002-03-07
US20030010287A1 (en) 2003-01-16
DE69532668T2 (de) 2005-01-13
CA2165409C (en) 2001-05-29
KR100229232B1 (ko) 1999-11-01
CN1131305A (zh) 1996-09-18
AU707487B2 (en) 1999-07-08
CA2165409A1 (en) 1996-06-17

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