DE69606508D1 - Kopf mit integriertem Dünnfilmtrieb für wärmegetriebene Tintenstrahldrucker - Google Patents
Kopf mit integriertem Dünnfilmtrieb für wärmegetriebene TintenstrahldruckerInfo
- Publication number
- DE69606508D1 DE69606508D1 DE69606508T DE69606508T DE69606508D1 DE 69606508 D1 DE69606508 D1 DE 69606508D1 DE 69606508 T DE69606508 T DE 69606508T DE 69606508 T DE69606508 T DE 69606508T DE 69606508 D1 DE69606508 D1 DE 69606508D1
- Authority
- DE
- Germany
- Prior art keywords
- head
- heat
- thin film
- inkjet printers
- film drive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000010409 thin film Substances 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1628—Manufacturing processes etching dry etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14088—Structure of heating means
- B41J2/14112—Resistive element
- B41J2/14129—Layer structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1603—Production of bubble jet print heads of the front shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/07—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common
- H01L27/0705—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common comprising components of the field effect type
- H01L27/0727—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common comprising components of the field effect type in combination with diodes, or capacitors or resistors
- H01L27/0738—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common comprising components of the field effect type in combination with diodes, or capacitors or resistors in combination with resistors only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/13—Heads having an integrated circuit
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/568,209 US6758552B1 (en) | 1995-12-06 | 1995-12-06 | Integrated thin-film drive head for thermal ink-jet printer |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69606508D1 true DE69606508D1 (de) | 2000-03-09 |
DE69606508T2 DE69606508T2 (de) | 2000-10-12 |
Family
ID=24270369
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69606508T Expired - Lifetime DE69606508T2 (de) | 1995-12-06 | 1996-05-07 | Kopf mit integriertem Dünnfilmtrieb für wärmegetriebene Tintenstrahldrucker |
Country Status (5)
Country | Link |
---|---|
US (1) | US6758552B1 (de) |
EP (1) | EP0778139B1 (de) |
JP (1) | JP4332227B2 (de) |
KR (1) | KR100387548B1 (de) |
DE (1) | DE69606508T2 (de) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11105286A (ja) * | 1997-07-03 | 1999-04-20 | Lexmark Internatl Inc | 離間した別個の平面に位置する加熱要素導体を有するプリントヘッド |
AUPP654398A0 (en) | 1998-10-16 | 1998-11-05 | Silverbrook Research Pty Ltd | Micromechanical device and method (ij46g) |
AUPP653998A0 (en) | 1998-10-16 | 1998-11-05 | Silverbrook Research Pty Ltd | Micromechanical device and method (ij46B) |
AUPP654598A0 (en) | 1998-10-16 | 1998-11-05 | Silverbrook Research Pty Ltd | Micromechanical device and method (ij46h) |
US5980025A (en) * | 1997-11-21 | 1999-11-09 | Xerox Corporation | Thermal inkjet printhead with increased resistance control and method for making the printhead |
US6742873B1 (en) | 2001-04-16 | 2004-06-01 | Silverbrook Research Pty Ltd | Inkjet printhead construction |
US7419250B2 (en) | 1999-10-15 | 2008-09-02 | Silverbrook Research Pty Ltd | Micro-electromechanical liquid ejection device |
US7028474B2 (en) | 1998-10-16 | 2006-04-18 | Silverbook Research Pty Ltd | Micro-electromechanical actuator with control logic circuitry |
US7677686B2 (en) | 1998-10-16 | 2010-03-16 | Silverbrook Research Pty Ltd | High nozzle density printhead ejecting low drop volumes |
US7182431B2 (en) | 1999-10-19 | 2007-02-27 | Silverbrook Research Pty Ltd | Nozzle arrangement |
US7815291B2 (en) | 1998-10-16 | 2010-10-19 | Silverbrook Research Pty Ltd | Printhead integrated circuit with low drive transistor to nozzle area ratio |
US7216956B2 (en) | 1998-10-16 | 2007-05-15 | Silverbrook Research Pty Ltd | Printhead assembly with power and ground connections along single edge |
EP1121249B1 (de) | 1998-10-16 | 2007-07-25 | Silverbrook Research Pty. Limited | Verfahren zur herstellung einer düse für einen tintenstrahldruckkopf |
US6863378B2 (en) | 1998-10-16 | 2005-03-08 | Silverbrook Research Pty Ltd | Inkjet printer having enclosed actuators |
US6994424B2 (en) | 1998-10-16 | 2006-02-07 | Silverbrook Research Pty Ltd | Printhead assembly incorporating an array of printhead chips on an ink distribution structure |
US6132032A (en) * | 1999-08-13 | 2000-10-17 | Hewlett-Packard Company | Thin-film print head for thermal ink-jet printers |
JP2002052725A (ja) | 2000-08-07 | 2002-02-19 | Sony Corp | プリンタ、プリンタヘッド及びプリンタヘッドの製造方法 |
US6465856B2 (en) * | 2001-03-19 | 2002-10-15 | Xerox Corporation | Micro-fabricated shielded conductors |
US6504226B1 (en) * | 2001-12-20 | 2003-01-07 | Stmicroelectronics, Inc. | Thin-film transistor used as heating element for microreaction chamber |
KR20040079509A (ko) * | 2003-03-07 | 2004-09-16 | 삼성전자주식회사 | 저항 소자를 구비하는 반도체 장치 및 그 제조 방법 |
GB0500111D0 (en) * | 2005-01-06 | 2005-02-09 | Koninkl Philips Electronics Nv | Inkjet print head |
GB0500114D0 (en) * | 2005-01-06 | 2005-02-09 | Koninkl Philips Electronics Nv | Inkjet print head |
WO2006088387A1 (fr) * | 2005-02-17 | 2006-08-24 | Zakrytoe Aktsionernoe Obshchestvo 'elox-Prom' | Ensemble de traversee electrique hermetique moyenne tension |
JP5145636B2 (ja) * | 2005-12-27 | 2013-02-20 | 富士ゼロックス株式会社 | 液滴吐出ヘッド及び液滴吐出装置 |
WO2009067123A1 (en) * | 2007-11-24 | 2009-05-28 | Hewlett-Packard Development Company, L.P. | Inkjet-printing device printhead die having edge protection layer for heating resistor |
US8333459B2 (en) | 2008-04-29 | 2012-12-18 | Hewlett-Packard Development Company, L.P. | Printing device |
EP2515337B1 (de) * | 2008-12-24 | 2016-02-24 | Semiconductor Energy Laboratory Co., Ltd. | Treiberschaltung und halbleiterbauelement |
US8816436B2 (en) * | 2012-05-16 | 2014-08-26 | International Business Machines Corporation | Method and structure for forming fin resistors |
JP6380890B2 (ja) * | 2013-08-12 | 2018-08-29 | Tianma Japan株式会社 | インクジェットプリンタヘッド及びその製造方法、並びにインクジェットプリンタヘッドを搭載した描画装置 |
JP6322448B2 (ja) * | 2014-03-12 | 2018-05-09 | エスアイアイ・プリンテック株式会社 | 液体噴射ヘッドの製造方法、液体噴射ヘッド、及び液体噴射装置 |
US11787180B2 (en) | 2019-04-29 | 2023-10-17 | Hewlett-Packard Development Company, L.P. | Corrosion tolerant micro-electromechanical fluid ejection device |
CN113211985B (zh) * | 2020-01-21 | 2022-10-14 | 国际联合科技股份有限公司 | 热气泡喷墨头装置 |
Family Cites Families (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3700852A (en) | 1970-10-09 | 1972-10-24 | Displaytek Corp | Thermal display module |
US3852563A (en) | 1974-02-01 | 1974-12-03 | Hewlett Packard Co | Thermal printing head |
US3973106A (en) | 1974-11-15 | 1976-08-03 | Hewlett-Packard Company | Thin film thermal print head |
JPS5299786A (en) * | 1976-02-18 | 1977-08-22 | Agency Of Ind Science & Technol | Mos integrated circuit |
US4429321A (en) * | 1980-10-23 | 1984-01-31 | Canon Kabushiki Kaisha | Liquid jet recording device |
US4490728A (en) | 1981-08-14 | 1984-12-25 | Hewlett-Packard Company | Thermal ink jet printer |
JPS58153672A (ja) | 1982-03-10 | 1983-09-12 | Nippon Telegr & Teleph Corp <Ntt> | 薄膜トランジスタ回路を内蔵する記録ヘツド |
US4514741A (en) | 1982-11-22 | 1985-04-30 | Hewlett-Packard Company | Thermal ink jet printer utilizing a printhead resistor having a central cold spot |
US4616408A (en) | 1982-11-24 | 1986-10-14 | Hewlett-Packard Company | Inversely processed resistance heater |
US4528574A (en) | 1983-03-28 | 1985-07-09 | Hewlett-Packard Company | Apparatus for reducing erosion due to cavitation in ink jet printers |
US4513298A (en) | 1983-05-25 | 1985-04-23 | Hewlett-Packard Company | Thermal ink jet printhead |
US4535343A (en) | 1983-10-31 | 1985-08-13 | Hewlett-Packard Company | Thermal ink jet printhead with self-passivating elements |
JPS60116452A (ja) | 1983-11-30 | 1985-06-22 | Canon Inc | インクジェットヘッド |
US4716423A (en) | 1985-11-22 | 1987-12-29 | Hewlett-Packard Company | Barrier layer and orifice plate for thermal ink jet print head assembly and method of manufacture |
US4719477A (en) | 1986-01-17 | 1988-01-12 | Hewlett-Packard Company | Integrated thermal ink jet printhead and method of manufacture |
JPH0737146B2 (ja) | 1986-03-06 | 1995-04-26 | ソニー株式会社 | 薄膜サ−マルヘツド |
JPS62242552A (ja) | 1986-04-15 | 1987-10-23 | Sony Corp | 薄膜サ−マルヘツド |
US4922265A (en) | 1986-04-28 | 1990-05-01 | Hewlett-Packard Company | Ink jet printhead with self-aligned orifice plate and method of manufacture |
US4862197A (en) | 1986-08-28 | 1989-08-29 | Hewlett-Packard Co. | Process for manufacturing thermal ink jet printhead and integrated circuit (IC) structures produced thereby |
US4695853A (en) | 1986-12-12 | 1987-09-22 | Hewlett-Packard Company | Thin film vertical resistor devices for a thermal ink jet printhead and methods of manufacture |
US4931813A (en) | 1987-09-21 | 1990-06-05 | Hewlett-Packard Company | Ink jet head incorporating a thick unpassivated TaAl resistor |
US4809428A (en) | 1987-12-10 | 1989-03-07 | Hewlett-Packard Company | Thin film device for an ink jet printhead and process for the manufacturing same |
US4847630A (en) | 1987-12-17 | 1989-07-11 | Hewlett-Packard Company | Integrated thermal ink jet printhead and method of manufacture |
US5008689A (en) | 1988-03-16 | 1991-04-16 | Hewlett-Packard Company | Plastic substrate for thermal ink jet printer |
US4927505A (en) | 1988-07-05 | 1990-05-22 | Motorola Inc. | Metallization scheme providing adhesion and barrier properties |
ES2066963T3 (es) * | 1989-01-13 | 1995-03-16 | Canon Kk | Cabezal de impresion. |
US4965611A (en) | 1989-03-22 | 1990-10-23 | Hewlett-Packard Company | Amorphous diffusion barrier for thermal ink jet print heads |
US5010355A (en) | 1989-12-26 | 1991-04-23 | Xerox Corporation | Ink jet printhead having ionic passivation of electrical circuitry |
US5081473A (en) * | 1990-07-26 | 1992-01-14 | Xerox Corporation | Temperature control transducer and MOS driver for thermal ink jet printing chips |
JPH04110161A (ja) | 1990-08-30 | 1992-04-10 | Ricoh Co Ltd | サーマルヘッド用発熱抵抗体およびそれを用いたサーマルヘッド |
US5229785A (en) | 1990-11-08 | 1993-07-20 | Hewlett-Packard Company | Method of manufacture of a thermal inkjet thin film printhead having a plastic orifice plate |
US5122812A (en) | 1991-01-03 | 1992-06-16 | Hewlett-Packard Company | Thermal inkjet printhead having driver circuitry thereon and method for making the same |
US5159353A (en) | 1991-07-02 | 1992-10-27 | Hewlett-Packard Company | Thermal inkjet printhead structure and method for making the same |
EP0525787B1 (de) | 1991-08-01 | 1996-10-16 | Canon Kabushiki Kaisha | Aufzeichnungskopfherstellungsverfahren |
US5420627A (en) | 1992-04-02 | 1995-05-30 | Hewlett-Packard Company | Inkjet printhead |
-
1995
- 1995-12-06 US US08/568,209 patent/US6758552B1/en not_active Expired - Fee Related
-
1996
- 1996-05-07 EP EP96303148A patent/EP0778139B1/de not_active Expired - Lifetime
- 1996-05-07 DE DE69606508T patent/DE69606508T2/de not_active Expired - Lifetime
- 1996-12-05 KR KR1019960062069A patent/KR100387548B1/ko not_active IP Right Cessation
- 1996-12-06 JP JP32630696A patent/JP4332227B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0778139A1 (de) | 1997-06-11 |
JPH09174844A (ja) | 1997-07-08 |
US6758552B1 (en) | 2004-07-06 |
KR100387548B1 (ko) | 2003-09-19 |
DE69606508T2 (de) | 2000-10-12 |
EP0778139B1 (de) | 2000-02-02 |
JP4332227B2 (ja) | 2009-09-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: HEWLETT-PACKARD CO. (N.D.GES.D.STAATES DELAWARE), |
|
8327 | Change in the person/name/address of the patent owner |
Owner name: HEWLETT-PACKARD DEVELOPMENT CO., L.P., HOUSTON, TE |