DE69625964T2 - Methode und Vorrichtung zur Eichung eines Infrarot-Pyrometers in einer Wärmebehandlungsanlage - Google Patents

Methode und Vorrichtung zur Eichung eines Infrarot-Pyrometers in einer Wärmebehandlungsanlage

Info

Publication number
DE69625964T2
DE69625964T2 DE69625964T DE69625964T DE69625964T2 DE 69625964 T2 DE69625964 T2 DE 69625964T2 DE 69625964 T DE69625964 T DE 69625964T DE 69625964 T DE69625964 T DE 69625964T DE 69625964 T2 DE69625964 T2 DE 69625964T2
Authority
DE
Germany
Prior art keywords
calibrating
heat treatment
treatment plant
infrared pyrometer
temperature probe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69625964T
Other languages
English (en)
Other versions
DE69625964D1 (de
Inventor
Mark Yam
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of DE69625964D1 publication Critical patent/DE69625964D1/de
Publication of DE69625964T2 publication Critical patent/DE69625964T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C21METALLURGY OF IRON
    • C21DMODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D1/00General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/0003Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/52Radiation pyrometry, e.g. infrared or optical thermometry using comparison with reference sources, e.g. disappearing-filament pyrometer
    • G01J5/53Reference sources, e.g. standard lamps; Black bodies
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/52Radiation pyrometry, e.g. infrared or optical thermometry using comparison with reference sources, e.g. disappearing-filament pyrometer
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/80Calibration
DE69625964T 1995-07-26 1996-07-26 Methode und Vorrichtung zur Eichung eines Infrarot-Pyrometers in einer Wärmebehandlungsanlage Expired - Fee Related DE69625964T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/506,902 US5820261A (en) 1995-07-26 1995-07-26 Method and apparatus for infrared pyrometer calibration in a rapid thermal processing system

Publications (2)

Publication Number Publication Date
DE69625964D1 DE69625964D1 (de) 2003-03-06
DE69625964T2 true DE69625964T2 (de) 2003-11-13

Family

ID=24016396

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69625964T Expired - Fee Related DE69625964T2 (de) 1995-07-26 1996-07-26 Methode und Vorrichtung zur Eichung eines Infrarot-Pyrometers in einer Wärmebehandlungsanlage

Country Status (6)

Country Link
US (2) US5820261A (de)
EP (1) EP0756159B1 (de)
JP (1) JP2894999B2 (de)
KR (1) KR100450644B1 (de)
AT (1) ATE231964T1 (de)
DE (1) DE69625964T2 (de)

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US6179465B1 (en) * 1996-03-28 2001-01-30 Applied Materials, Inc. Method and apparatus for infrared pyrometer calibration in a thermal processing system using multiple light sources
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US6063196A (en) * 1998-10-30 2000-05-16 Applied Materials, Inc. Semiconductor processing chamber calibration tool
TW376990U (en) * 1999-02-25 1999-12-11 Ind Tech Res Inst Calibrator for contact and non-contact thermoneter
US6467952B2 (en) * 1999-03-19 2002-10-22 Tokyo Electron Limited Virtual blackbody radiation system and radiation temperature measuring system
US6151446A (en) * 1999-07-06 2000-11-21 Applied Materials, Inc. Apparatus and method for thermally processing substrates including a processor using multiple detection signals
US6280081B1 (en) * 1999-07-09 2001-08-28 Applied Materials, Inc. Methods and apparatus for calibrating temperature measurements and measuring currents
US6308523B1 (en) * 2000-03-20 2001-10-30 Mainstream Engineering Corporation Simplified subcooling or superheated indicator and method for air conditioning and other refrigeration systems
US6670278B2 (en) 2001-03-30 2003-12-30 Lam Research Corporation Method of plasma etching of silicon carbide
US6630407B2 (en) 2001-03-30 2003-10-07 Lam Research Corporation Plasma etching of organic antireflective coating
US7311852B2 (en) * 2001-03-30 2007-12-25 Lam Research Corporation Method of plasma etching low-k dielectric materials
US6746961B2 (en) 2001-06-19 2004-06-08 Lam Research Corporation Plasma etching of dielectric layer with etch profile control
US6987240B2 (en) * 2002-04-18 2006-01-17 Applied Materials, Inc. Thermal flux processing by scanning
US6818864B2 (en) 2002-08-09 2004-11-16 Asm America, Inc. LED heat lamp arrays for CVD heating
US7704327B2 (en) * 2002-09-30 2010-04-27 Applied Materials, Inc. High temperature anneal with improved substrate support
US6838012B2 (en) 2002-10-31 2005-01-04 Lam Research Corporation Methods for etching dielectric materials
US6835914B2 (en) * 2002-11-05 2004-12-28 Mattson Technology, Inc. Apparatus and method for reducing stray light in substrate processing chambers
US7098141B1 (en) 2003-03-03 2006-08-29 Lam Research Corporation Use of silicon containing gas for CD and profile feature enhancements of gate and shallow trench structures
US7297938B2 (en) * 2004-03-22 2007-11-20 Advanced Biophotonics, Inc. Integrated black body and lens cap assembly and methods for calibration of infrared cameras using same
DE102005018124B4 (de) * 2005-04-20 2007-06-28 Barke, Woldemar, Dipl.-Phys. Ing. Verfahren und Vorrichtung zur berührungslosen gleichzeitigen Bestimmung von Temperatur und Emissionsgrad eines Meßobjekts
JP2007042958A (ja) 2005-08-05 2007-02-15 Sumitomo Electric Ind Ltd ウェハプローバ用ウェハ保持体およびそれを搭載したウェハプローバ
KR100681693B1 (ko) * 2005-10-21 2007-02-09 재단법인 포항산업과학연구원 방사온도 계측기용 광학적 외란차단 시스템 및 방법
US7517804B2 (en) * 2006-08-31 2009-04-14 Micron Technologies, Inc. Selective etch chemistries for forming high aspect ratio features and associated structures
TWI547999B (zh) * 2007-09-17 2016-09-01 Dsgi公司 微波退火半導體材料的系統及方法
US8452166B2 (en) * 2008-07-01 2013-05-28 Applied Materials, Inc. Apparatus and method for measuring radiation energy during thermal processing
US9449858B2 (en) * 2010-08-09 2016-09-20 Applied Materials, Inc. Transparent reflector plate for rapid thermal processing chamber
CN102928086B (zh) * 2012-10-29 2015-04-15 中钢集团邢台机械轧辊有限公司 使测温仪快速对准测温孔的对正器
CN102967623B (zh) * 2012-11-06 2015-02-11 上海卫星装备研究所 红外灯阵热流密度标定装置及标定方法
KR101389003B1 (ko) 2013-02-05 2014-04-24 에이피시스템 주식회사 온도측정 파이로미터의 교정 장치
KR101432159B1 (ko) * 2013-02-05 2014-08-20 에이피시스템 주식회사 온도측정 파이로미터의 교정 장치
TWI624903B (zh) 2013-03-15 2018-05-21 應用材料股份有限公司 在雜訊環境中之現場溫度測量
CN104089703A (zh) * 2014-07-09 2014-10-08 北京智朗芯光科技有限公司 半导体薄膜反应腔辅助温度校准装置
CN104215659A (zh) * 2014-08-20 2014-12-17 上海卫星装备研究所 真空热环境下红外灯单灯辐射特性测试系统
CN108318522A (zh) * 2018-01-09 2018-07-24 北京航天长征飞行器研究所 一种石英灯加热器辐射热场热流分布均匀性测试装置
KR102029602B1 (ko) * 2018-11-30 2019-10-07 주식회사 이너센서 온도 센서의 보정 방법
CN116504685B (zh) * 2023-06-28 2023-09-15 盛吉盛半导体科技(北京)有限公司 一种红外测温探头校准装置

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Also Published As

Publication number Publication date
KR970006517A (ko) 1997-02-21
EP0756159B1 (de) 2003-01-29
JPH09119868A (ja) 1997-05-06
JP2894999B2 (ja) 1999-05-24
ATE231964T1 (de) 2003-02-15
US5820261A (en) 1998-10-13
KR100450644B1 (ko) 2004-12-04
DE69625964D1 (de) 2003-03-06
EP0756159A1 (de) 1997-01-29
US6086245A (en) 2000-07-11

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