DE69628161D1 - Eine löthöckerstruktur für ein mikroelektronisches substrat - Google Patents

Eine löthöckerstruktur für ein mikroelektronisches substrat

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Publication number
DE69628161D1
DE69628161D1 DE69628161T DE69628161T DE69628161D1 DE 69628161 D1 DE69628161 D1 DE 69628161D1 DE 69628161 T DE69628161 T DE 69628161T DE 69628161 T DE69628161 T DE 69628161T DE 69628161 D1 DE69628161 D1 DE 69628161D1
Authority
DE
Germany
Prior art keywords
solder
forming
solder structure
under bump
metallurgy layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69628161T
Other languages
English (en)
Other versions
DE69628161T2 (de
Inventor
A Rinne
Daniel Mis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Unitive International Ltd
Original Assignee
Unitive International Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unitive International Ltd filed Critical Unitive International Ltd
Publication of DE69628161D1 publication Critical patent/DE69628161D1/de
Application granted granted Critical
Publication of DE69628161T2 publication Critical patent/DE69628161T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
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DE69628161T 1995-04-05 1996-03-21 Eine löthöckerstruktur für ein mikroelektronisches substrat Expired - Fee Related DE69628161T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US41661995A 1995-04-05 1995-04-05
US416619 1995-04-05
PCT/US1996/003751 WO1996031905A1 (en) 1995-04-05 1996-03-21 A solder bump structure for a microelectronic substrate

Publications (2)

Publication Number Publication Date
DE69628161D1 true DE69628161D1 (de) 2003-06-18
DE69628161T2 DE69628161T2 (de) 2004-03-25

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Application Number Title Priority Date Filing Date
DE69628161T Expired - Fee Related DE69628161T2 (de) 1995-04-05 1996-03-21 Eine löthöckerstruktur für ein mikroelektronisches substrat

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Country Link
US (3) US5892179A (de)
EP (1) EP0819318B1 (de)
JP (1) JP3549208B2 (de)
KR (2) KR100425750B1 (de)
CN (1) CN1179412C (de)
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KR19987003571A (en) 1998-11-05
AU5316996A (en) 1996-10-23
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US5892179A (en) 1999-04-06
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DE69628161T2 (de) 2004-03-25
JPH11503566A (ja) 1999-03-26
US6329608B1 (en) 2001-12-11
CN1179412C (zh) 2004-12-08
JP3549208B2 (ja) 2004-08-04
ATE240586T1 (de) 2003-05-15
US6389691B1 (en) 2002-05-21
KR100425750B1 (ko) 2004-07-16
KR19980703571A (ko) 1998-11-05
CN1183169A (zh) 1998-05-27
EP0819318B1 (de) 2003-05-14
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