DE69706734T2 - Aluminiumnitrid-Sinterkörper, eingebetteter Metallgegenstand, Elektronikfunktionsmaterial und elektrostatische Einspannvorrichtung - Google Patents

Aluminiumnitrid-Sinterkörper, eingebetteter Metallgegenstand, Elektronikfunktionsmaterial und elektrostatische Einspannvorrichtung

Info

Publication number
DE69706734T2
DE69706734T2 DE69706734T DE69706734T DE69706734T2 DE 69706734 T2 DE69706734 T2 DE 69706734T2 DE 69706734 T DE69706734 T DE 69706734T DE 69706734 T DE69706734 T DE 69706734T DE 69706734 T2 DE69706734 T2 DE 69706734T2
Authority
DE
Germany
Prior art keywords
sintered body
aluminum nitride
electrostatic chuck
functional material
nitride sintered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69706734T
Other languages
English (en)
Other versions
DE69706734D1 (de
Inventor
Yuji Katsuda
Yukimasa Mori
Michio Takahashi
Yuki Bessho
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Publication of DE69706734D1 publication Critical patent/DE69706734D1/de
Application granted granted Critical
Publication of DE69706734T2 publication Critical patent/DE69706734T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
    • C04B35/581—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on aluminium nitride
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/23—Chucks or sockets with magnetic or electrostatic means
DE69706734T 1996-03-29 1997-03-26 Aluminiumnitrid-Sinterkörper, eingebetteter Metallgegenstand, Elektronikfunktionsmaterial und elektrostatische Einspannvorrichtung Expired - Lifetime DE69706734T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP9955796 1996-03-29
JP07279997A JP3457495B2 (ja) 1996-03-29 1997-03-11 窒化アルミニウム焼結体、金属埋設品、電子機能材料および静電チャック

Publications (2)

Publication Number Publication Date
DE69706734D1 DE69706734D1 (de) 2001-10-25
DE69706734T2 true DE69706734T2 (de) 2002-07-04

Family

ID=26413933

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69736205T Expired - Lifetime DE69736205T2 (de) 1996-03-29 1997-03-26 Aluminumnitridsinterkörper, Gegenstand mit eingebettetem Metall, elektronisch funktionalem Material und elektrostatische Einspannvorrichtung
DE69706734T Expired - Lifetime DE69706734T2 (de) 1996-03-29 1997-03-26 Aluminiumnitrid-Sinterkörper, eingebetteter Metallgegenstand, Elektronikfunktionsmaterial und elektrostatische Einspannvorrichtung

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE69736205T Expired - Lifetime DE69736205T2 (de) 1996-03-29 1997-03-26 Aluminumnitridsinterkörper, Gegenstand mit eingebettetem Metall, elektronisch funktionalem Material und elektrostatische Einspannvorrichtung

Country Status (6)

Country Link
US (1) US6001760A (de)
EP (2) EP0798278B1 (de)
JP (1) JP3457495B2 (de)
KR (1) KR100268481B1 (de)
DE (2) DE69736205T2 (de)
TW (1) TW561138B (de)

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KR102430454B1 (ko) 2014-08-15 2022-08-05 어플라이드 머티어리얼스, 인코포레이티드 플라즈마 강화 화학 기상 증착 시스템에서 높은 온도들로 압축 또는 인장 응력을 갖는 웨이퍼들을 프로세싱하는 방법 및 장치
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KR102552189B1 (ko) 2020-12-21 2023-07-05 한국세라믹기술원 질화 알루미늄 세라믹스 조성물 및 그의 제조방법
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US5250478A (en) * 1988-07-28 1993-10-05 Kyocera Corporation Aluminum nitride sintered body and process for preparation thereof
JP3214890B2 (ja) * 1991-05-30 2001-10-02 京セラ株式会社 窒化アルミニウム焼結体およびその製法、並びにそれを用いた焼成用治具
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JP3670416B2 (ja) * 1995-11-01 2005-07-13 日本碍子株式会社 金属包含材および静電チャック

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EP1128425A1 (de) 2001-08-29
EP0798278A3 (de) 1998-03-04
EP0798278B1 (de) 2001-09-19
TW561138B (en) 2003-11-11
JP3457495B2 (ja) 2003-10-20
DE69706734D1 (de) 2001-10-25
KR19980023985A (ko) 1998-07-06
EP1128425B1 (de) 2006-06-21
DE69736205T2 (de) 2007-05-16
EP0798278A2 (de) 1997-10-01
DE69736205D1 (de) 2006-08-03
JPH09315867A (ja) 1997-12-09
KR100268481B1 (ko) 2000-10-16
US6001760A (en) 1999-12-14

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