DE69711772D1 - Packungsstruktur für Multichip-Module - Google Patents

Packungsstruktur für Multichip-Module

Info

Publication number
DE69711772D1
DE69711772D1 DE69711772T DE69711772T DE69711772D1 DE 69711772 D1 DE69711772 D1 DE 69711772D1 DE 69711772 T DE69711772 T DE 69711772T DE 69711772 T DE69711772 T DE 69711772T DE 69711772 D1 DE69711772 D1 DE 69711772D1
Authority
DE
Germany
Prior art keywords
packing structure
multichip modules
multichip
modules
packing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69711772T
Other languages
English (en)
Other versions
DE69711772T2 (de
Inventor
Paul E Collander
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nokia Oyj
Original Assignee
Nokia Oyj
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nokia Oyj filed Critical Nokia Oyj
Application granted granted Critical
Publication of DE69711772D1 publication Critical patent/DE69711772D1/de
Publication of DE69711772T2 publication Critical patent/DE69711772T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657—Stacked arrangements of devices
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5387—Flexible insulating substrates
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    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
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    • H01L25/0652—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next and on each other, i.e. mixed assemblies
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    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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    • H01L2225/1041—Special adaptations for top connections of the lowermost container, e.g. redistribution layer, integral interposer
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
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    • H01L2924/30—Technical effects
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    • H01L2924/30107—Inductance
DE69711772T 1996-07-11 1997-07-08 Packungsstruktur für Multichip-Module Expired - Lifetime DE69711772T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI962816A FI962816A (fi) 1996-07-11 1996-07-11 Mikropiirimodulien kotelorakenne

Publications (2)

Publication Number Publication Date
DE69711772D1 true DE69711772D1 (de) 2002-05-16
DE69711772T2 DE69711772T2 (de) 2002-11-28

Family

ID=8546373

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69711772T Expired - Lifetime DE69711772T2 (de) 1996-07-11 1997-07-08 Packungsstruktur für Multichip-Module

Country Status (4)

Country Link
US (1) US5872700A (de)
EP (1) EP0818822B1 (de)
DE (1) DE69711772T2 (de)
FI (1) FI962816A (de)

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US6424034B1 (en) 1998-08-31 2002-07-23 Micron Technology, Inc. High performance packaging for microprocessors and DRAM chips which minimizes timing skews
SG93192A1 (en) * 1999-01-28 2002-12-17 United Microelectronics Corp Face-to-face multi chip package
JP3828673B2 (ja) * 1999-02-23 2006-10-04 ローム株式会社 半導体装置
US6164979A (en) * 1999-03-12 2000-12-26 Motorola, Inc. System for providing a removable high density electrical interconnect for flexible circuits
US6784541B2 (en) * 2000-01-27 2004-08-31 Hitachi, Ltd. Semiconductor module and mounting method for same
EP1198005A4 (de) * 1999-03-26 2004-11-24 Hitachi Ltd Halbleitermodul und seine montage
US6166444A (en) * 1999-06-21 2000-12-26 United Microelectronics Corp. Cascade-type chip module
US6282100B1 (en) * 1999-07-01 2001-08-28 Agere Systems Guardian Corp. Low cost ball grid array package
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US5872700A (en) 1999-02-16
EP0818822A3 (de) 1999-01-27
DE69711772T2 (de) 2002-11-28
FI962816A0 (fi) 1996-07-11
EP0818822A2 (de) 1998-01-14
FI962816A (fi) 1998-01-12
EP0818822B1 (de) 2002-04-10

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