DE69712213D1 - Polierkissen konturenanzeiger für mechanisches oder chemisch-mechanisches polieren - Google Patents

Polierkissen konturenanzeiger für mechanisches oder chemisch-mechanisches polieren

Info

Publication number
DE69712213D1
DE69712213D1 DE69712213T DE69712213T DE69712213D1 DE 69712213 D1 DE69712213 D1 DE 69712213D1 DE 69712213 T DE69712213 T DE 69712213T DE 69712213 T DE69712213 T DE 69712213T DE 69712213 D1 DE69712213 D1 DE 69712213D1
Authority
DE
Germany
Prior art keywords
polishing
mechanical
contour indicator
planarizing surface
contour
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69712213T
Other languages
English (en)
Other versions
DE69712213T2 (de
Inventor
O Henderson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Micron Technology Inc
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Application granted granted Critical
Publication of DE69712213D1 publication Critical patent/DE69712213D1/de
Publication of DE69712213T2 publication Critical patent/DE69712213T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
DE69712213T 1996-10-08 1997-10-03 Polierkissen konturenanzeiger für mechanisches oder chemisch-mechanisches polieren Expired - Lifetime DE69712213T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/727,021 US5736427A (en) 1996-10-08 1996-10-08 Polishing pad contour indicator for mechanical or chemical-mechanical planarization
PCT/US1997/017799 WO1998015384A1 (en) 1996-10-08 1997-10-03 Polishing pad contour indicator for mechanical or chemical-mechanical planarization

Publications (2)

Publication Number Publication Date
DE69712213D1 true DE69712213D1 (de) 2002-05-29
DE69712213T2 DE69712213T2 (de) 2002-11-14

Family

ID=24921008

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69712213T Expired - Lifetime DE69712213T2 (de) 1996-10-08 1997-10-03 Polierkissen konturenanzeiger für mechanisches oder chemisch-mechanisches polieren

Country Status (7)

Country Link
US (1) US5736427A (de)
EP (1) EP0930955B1 (de)
KR (1) KR100445818B1 (de)
AT (1) ATE216645T1 (de)
AU (1) AU4743297A (de)
DE (1) DE69712213T2 (de)
WO (1) WO1998015384A1 (de)

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6075606A (en) 1996-02-16 2000-06-13 Doan; Trung T. Endpoint detector and method for measuring a change in wafer thickness in chemical-mechanical polishing of semiconductor wafers and other microelectronic substrates
US6090475A (en) * 1996-05-24 2000-07-18 Micron Technology Inc. Polishing pad, methods of manufacturing and use
JPH09321001A (ja) * 1996-05-31 1997-12-12 Komatsu Electron Metals Co Ltd 半導体ウェハの研磨方法
JPH10217149A (ja) * 1997-02-05 1998-08-18 Ebara Corp ターンテーブル用クロスの剥離治具
US6117777A (en) * 1997-07-30 2000-09-12 Chartered Semiconductor Manufacturing Co. Chemical mechanical polish (CMP) endpoint detection by colorimetry
US5951370A (en) * 1997-10-02 1999-09-14 Speedfam-Ipec Corp. Method and apparatus for monitoring and controlling the flatness of a polishing pad
JP2000011327A (ja) * 1998-06-29 2000-01-14 Fujitsu Ltd 薄膜ヘッドスライダの加工方法及び加工装置
CN1076253C (zh) * 1998-10-23 2001-12-19 联华电子股份有限公司 化学机械研磨垫
GB2345657B (en) * 1999-01-13 2001-08-15 United Microelectronics Corp Lifetime self-indicated polishing pad
NL1011163C2 (nl) * 1999-01-28 2000-07-31 United Microelectronics Corp Polijstvlak met zelf-indicatie van de levensduur.
US6383934B1 (en) 1999-09-02 2002-05-07 Micron Technology, Inc. Method and apparatus for chemical-mechanical planarization of microelectronic substrates with selected planarizing liquids
US6306768B1 (en) 1999-11-17 2001-10-23 Micron Technology, Inc. Method for planarizing microelectronic substrates having apertures
US6705930B2 (en) * 2000-01-28 2004-03-16 Lam Research Corporation System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques
US6340326B1 (en) 2000-01-28 2002-01-22 Lam Research Corporation System and method for controlled polishing and planarization of semiconductor wafers
US6498101B1 (en) 2000-02-28 2002-12-24 Micron Technology, Inc. Planarizing pads, planarizing machines and methods for making and using planarizing pads in mechanical and chemical-mechanical planarization of microelectronic device substrate assemblies
US6313038B1 (en) 2000-04-26 2001-11-06 Micron Technology, Inc. Method and apparatus for controlling chemical interactions during planarization of microelectronic substrates
US6612901B1 (en) * 2000-06-07 2003-09-02 Micron Technology, Inc. Apparatus for in-situ optical endpointing of web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
US6520834B1 (en) * 2000-08-09 2003-02-18 Micron Technology, Inc. Methods and apparatuses for analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates
US6736869B1 (en) 2000-08-28 2004-05-18 Micron Technology, Inc. Method for forming a planarizing pad for planarization of microelectronic substrates
US6838382B1 (en) 2000-08-28 2005-01-04 Micron Technology, Inc. Method and apparatus for forming a planarizing pad having a film and texture elements for planarization of microelectronic substrates
US6609947B1 (en) * 2000-08-30 2003-08-26 Micron Technology, Inc. Planarizing machines and control systems for mechanical and/or chemical-mechanical planarization of micro electronic substrates
US6592443B1 (en) * 2000-08-30 2003-07-15 Micron Technology, Inc. Method and apparatus for forming and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates
US6652764B1 (en) 2000-08-31 2003-11-25 Micron Technology, Inc. Methods and apparatuses for making and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates
US6623329B1 (en) 2000-08-31 2003-09-23 Micron Technology, Inc. Method and apparatus for supporting a microelectronic substrate relative to a planarization pad
US6514858B1 (en) * 2001-04-09 2003-02-04 Advanced Micro Devices, Inc. Test structure for providing depth of polish feedback
WO2003011517A1 (en) * 2001-08-01 2003-02-13 Entegris, Inc. Wafer carrier wear indicator
US6866566B2 (en) * 2001-08-24 2005-03-15 Micron Technology, Inc. Apparatus and method for conditioning a contact surface of a processing pad used in processing microelectronic workpieces
US6722943B2 (en) * 2001-08-24 2004-04-20 Micron Technology, Inc. Planarizing machines and methods for dispensing planarizing solutions in the processing of microelectronic workpieces
US6666749B2 (en) 2001-08-30 2003-12-23 Micron Technology, Inc. Apparatus and method for enhanced processing of microelectronic workpieces
JP3793810B2 (ja) * 2002-07-09 2006-07-05 独立行政法人国立高等専門学校機構 研削工具の砥面状態検査方法
US7341502B2 (en) * 2002-07-18 2008-03-11 Micron Technology, Inc. Methods and systems for planarizing workpieces, e.g., microelectronic workpieces
US7235488B2 (en) * 2002-08-28 2007-06-26 Micron Technology, Inc. In-situ chemical-mechanical planarization pad metrology using ultrasonic imaging
US6884152B2 (en) * 2003-02-11 2005-04-26 Micron Technology, Inc. Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces
US7442113B2 (en) * 2003-04-23 2008-10-28 Lsi Corporation Visual wear confirmation polishing pad
US6935929B2 (en) 2003-04-28 2005-08-30 Micron Technology, Inc. Polishing machines including under-pads and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces
GB2402641B (en) * 2003-06-12 2005-05-25 Bosch Gmbh Robert Sanding plate for a motor-driven hand-held sanding tool
US7030603B2 (en) * 2003-08-21 2006-04-18 Micron Technology, Inc. Apparatuses and methods for monitoring rotation of a conductive microfeature workpiece
US7066792B2 (en) * 2004-08-06 2006-06-27 Micron Technology, Inc. Shaped polishing pads for beveling microfeature workpiece edges, and associate system and methods
US7264539B2 (en) 2005-07-13 2007-09-04 Micron Technology, Inc. Systems and methods for removing microfeature workpiece surface defects
US7294049B2 (en) * 2005-09-01 2007-11-13 Micron Technology, Inc. Method and apparatus for removing material from microfeature workpieces
US7849281B2 (en) * 2006-04-03 2010-12-07 Emc Corporation Method and system for implementing hierarchical permission maps in a layered volume graph
US8118644B2 (en) * 2008-10-16 2012-02-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having integral identification feature
US20120115398A1 (en) * 2010-11-09 2012-05-10 James Bopp Chemical-mechanical polishing wafer and method of use
GB2537161B (en) * 2015-04-10 2019-06-19 Reckitt Benckiser Brands Ltd Novel material
CN106853610B (zh) * 2015-12-08 2019-11-01 中芯国际集成电路制造(北京)有限公司 抛光垫及其监测方法和监测系统
CN108608317A (zh) * 2018-05-23 2018-10-02 长江存储科技有限责任公司 研磨垫及研磨垫使用寿命监测方法
EP3616840A1 (de) * 2018-09-03 2020-03-04 3M Innovative Properties Company Schleifartikel

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4019289A (en) * 1976-02-23 1977-04-26 Clayton Paul Korver Replaceable lens surfacing pad with integral wear indicating pattern
EP0054368B1 (de) * 1980-11-28 1986-05-21 Thomas Hunter Limited Polierkissen
SE450352B (sv) * 1985-11-07 1987-06-22 Santrade Ltd Sker med indikering av forslitning
US4793895A (en) * 1988-01-25 1988-12-27 Ibm Corporation In situ conductivity monitoring technique for chemical/mechanical planarization endpoint detection
US5081421A (en) * 1990-05-01 1992-01-14 At&T Bell Laboratories In situ monitoring technique and apparatus for chemical/mechanical planarization endpoint detection
US5433650A (en) * 1993-05-03 1995-07-18 Motorola, Inc. Method for polishing a substrate
US5635083A (en) * 1993-08-06 1997-06-03 Intel Corporation Method and apparatus for chemical-mechanical polishing using pneumatic pressure applied to the backside of a substrate
DE4424203C2 (de) * 1994-07-09 1996-05-09 Wernicke & Co Gmbh Schleifscheibe zum Schleifen des Randes von Brillengläsern

Also Published As

Publication number Publication date
ATE216645T1 (de) 2002-05-15
EP0930955B1 (de) 2002-04-24
DE69712213T2 (de) 2002-11-14
WO1998015384A1 (en) 1998-04-16
EP0930955A1 (de) 1999-07-28
KR100445818B1 (ko) 2004-08-30
US5736427A (en) 1998-04-07
AU4743297A (en) 1998-05-05
KR20000048984A (ko) 2000-07-25

Similar Documents

Publication Publication Date Title
DE69712213D1 (de) Polierkissen konturenanzeiger für mechanisches oder chemisch-mechanisches polieren
IL155856A0 (en) Abrasive article having a window system for polishing wafers, and methods
AU4661997A (en) Polishing pad and method for making polishing pad with elongated microcolumns
TW283109B (en) In-situ polishing pad flatness control
MY126569A (en) Abrasive articles comprising a fluorochemical agent for wafer surface modification
TW374049B (en) Composite polish pad for CMP
EP1293297A4 (de) Polierkissen
DE69720212T2 (de) Verfahren zur chemisch-mechanischen planarisierung von stopschicht halbleiterscheiben
AU5148198A (en) Method for chemical-mechanical planarization of a substrate on a fixed-abrasive polishing pad
EP0684634A3 (de) Verfahren zum Grobpolieren von Halbleiterscheiben zur Verminderung der Rauheit der Oberfläche
DE69904313T2 (de) Chemisch-mechanisches polierverfahren mit mehreren polierkissen
SG152899A1 (en) Chemical mechanical planarization or polishing pad with sections having varied groove patterns
ES2029676T3 (es) Herramienta de rectificado para muelas abrasivas
EP1002626A3 (de) Lineares chemisch-mechanisches Polierwerkzeug mit an Ort und Stelle Verteilung der Polierzusammensetzung und gleichzeitiges Abrichten des Polierkissens
DE3470291D1 (en) Abrasive belt
ES2134999T3 (es) Herramienta de soporte con inserciones de diamante para maquinas automaticas y manuales para planeado, alisado y pulido para las industrias de la piedra, de ceramica y de baldosas.
JPS57168856A (en) Grinding machine selectively performing rough and finish grinding
FR2786118B1 (fr) Dispositif de rodage ou polissage
MY112675A (en) Method of producing semiconductor wafers
TW356436B (en) Polishing pad and method and apparatus for planarizing and polishing the surface of a workpiece
EP0934801A3 (de) Verfahren und Vorrichtung zum Polieren von Werkstücken
JPS6471661A (en) Mirror polishing method for semiconductor wafer
SE8404871L (sv) Slipmedel for framstellning av slipmassa
TW358057B (en) Method for instant monitoring and controlling chemical-mechanical polishing pads
IT1218068B (it) Ruota di contatto per lavorazioni di smerigliatura,lucidatura e simili mediante nastri abrasivi

Legal Events

Date Code Title Description
8364 No opposition during term of opposition