DE69721111D1 - Poliervorrichtung und Verfahren - Google Patents
Poliervorrichtung und VerfahrenInfo
- Publication number
- DE69721111D1 DE69721111D1 DE69721111T DE69721111T DE69721111D1 DE 69721111 D1 DE69721111 D1 DE 69721111D1 DE 69721111 T DE69721111 T DE 69721111T DE 69721111 T DE69721111 T DE 69721111T DE 69721111 D1 DE69721111 D1 DE 69721111D1
- Authority
- DE
- Germany
- Prior art keywords
- polisher
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/04—Protective covers for the grinding wheel
- B24B55/045—Protective covers for the grinding wheel with cooling means incorporated
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3007296A JPH09193005A (ja) | 1996-01-23 | 1996-01-23 | ポリッシング装置の水飛散防止カバー |
JP3007296 | 1996-01-23 | ||
JP10353296 | 1996-03-28 | ||
JP10353296A JPH09262767A (ja) | 1996-03-28 | 1996-03-28 | ポリッシング装置の排気構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69721111D1 true DE69721111D1 (de) | 2003-05-28 |
DE69721111T2 DE69721111T2 (de) | 2004-02-05 |
Family
ID=26368354
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69721111T Expired - Fee Related DE69721111T2 (de) | 1996-01-23 | 1997-01-23 | Poliervorrichtung und Verfahren |
Country Status (4)
Country | Link |
---|---|
US (2) | US6139677A (de) |
EP (1) | EP0796702B1 (de) |
KR (1) | KR100445139B1 (de) |
DE (1) | DE69721111T2 (de) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100445139B1 (ko) * | 1996-01-23 | 2004-11-17 | 가부시키 가이샤 에바라 세이사꾸쇼 | 폴리싱장치 |
DE69841223D1 (de) * | 1997-12-26 | 2009-11-19 | Ebara Corp | Poliervorrichtung |
US8795032B2 (en) | 2008-06-04 | 2014-08-05 | Ebara Corporation | Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method |
SG10201503374QA (en) | 2014-04-30 | 2015-11-27 | Ebara Corp | Substrate Polishing Apparatus |
JP6345474B2 (ja) * | 2014-04-30 | 2018-06-20 | 株式会社荏原製作所 | 基板研磨装置 |
US20180136094A1 (en) * | 2014-11-12 | 2018-05-17 | Illinois Tool Works Inc. | Planar grinder |
CN109719611B (zh) * | 2019-01-17 | 2020-04-17 | 天长市恒鑫机电设备有限公司 | 一种拉丝模研磨加工用除尘装置 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3000148A (en) * | 1959-12-28 | 1961-09-19 | Bovensiepen Hans Friedrich | Two-lap lapping machine |
JPS6222055A (ja) * | 1985-07-22 | 1987-01-30 | Matsushita Electric Ind Co Ltd | 調理器 |
JPH0756879B2 (ja) * | 1988-03-31 | 1995-06-14 | 日鉄セミコンダクター株式会社 | 半導体の無塵化製造装置 |
US4974370A (en) * | 1988-12-07 | 1990-12-04 | General Signal Corp. | Lapping and polishing machine |
US5245796A (en) * | 1992-04-02 | 1993-09-21 | At&T Bell Laboratories | Slurry polisher using ultrasonic agitation |
US5299393A (en) * | 1992-07-21 | 1994-04-05 | International Business Machines Corporation | Slurry containment device for polishing semiconductor wafers |
JP2622069B2 (ja) * | 1993-06-30 | 1997-06-18 | 三菱マテリアル株式会社 | 研磨布のドレッシング装置 |
US5653623A (en) * | 1993-12-14 | 1997-08-05 | Ebara Corporation | Polishing apparatus with improved exhaust |
JP3733973B2 (ja) * | 1993-12-14 | 2006-01-11 | 株式会社荏原製作所 | ポリッシング装置 |
US5655954A (en) * | 1994-11-29 | 1997-08-12 | Toshiba Kikai Kabushiki Kaisha | Polishing apparatus |
JP3594357B2 (ja) * | 1995-04-10 | 2004-11-24 | 株式会社荏原製作所 | ポリッシング方法及び装置 |
JP3778594B2 (ja) * | 1995-07-18 | 2006-05-24 | 株式会社荏原製作所 | ドレッシング方法 |
JP3678468B2 (ja) * | 1995-07-18 | 2005-08-03 | 株式会社荏原製作所 | ポリッシング装置 |
US5653624A (en) * | 1995-09-13 | 1997-08-05 | Ebara Corporation | Polishing apparatus with swinging structures |
KR100445139B1 (ko) * | 1996-01-23 | 2004-11-17 | 가부시키 가이샤 에바라 세이사꾸쇼 | 폴리싱장치 |
US5896870A (en) * | 1997-03-11 | 1999-04-27 | International Business Machines Corporation | Method of removing slurry particles |
-
1997
- 1997-01-22 KR KR1019970001687A patent/KR100445139B1/ko not_active IP Right Cessation
- 1997-01-23 EP EP97101060A patent/EP0796702B1/de not_active Expired - Lifetime
- 1997-01-23 US US08/787,916 patent/US6139677A/en not_active Expired - Fee Related
- 1997-01-23 DE DE69721111T patent/DE69721111T2/de not_active Expired - Fee Related
-
2000
- 2000-09-21 US US09/666,855 patent/US6413357B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US6413357B1 (en) | 2002-07-02 |
DE69721111T2 (de) | 2004-02-05 |
EP0796702A2 (de) | 1997-09-24 |
KR100445139B1 (ko) | 2004-11-17 |
EP0796702B1 (de) | 2003-04-23 |
US6139677A (en) | 2000-10-31 |
KR970067675A (ko) | 1997-10-13 |
EP0796702A3 (de) | 1997-10-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |