DE69734158D1 - Prüfkopfstruktur mit mehreren getrennten isolierten prüfspitzen - Google Patents

Prüfkopfstruktur mit mehreren getrennten isolierten prüfspitzen

Info

Publication number
DE69734158D1
DE69734158D1 DE69734158T DE69734158T DE69734158D1 DE 69734158 D1 DE69734158 D1 DE 69734158D1 DE 69734158 T DE69734158 T DE 69734158T DE 69734158 T DE69734158 T DE 69734158T DE 69734158 D1 DE69734158 D1 DE 69734158D1
Authority
DE
Germany
Prior art keywords
test head
head structure
several isolated
tips
isolated tips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69734158T
Other languages
English (en)
Other versions
DE69734158T2 (de
Inventor
Brian Samuel Beaman
Keith Edard Fogel
Paul Afred Lauro
Yun-Hsin Liao
Peter Morris
Da-Yuan Shih
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE69734158D1 publication Critical patent/DE69734158D1/de
Application granted granted Critical
Publication of DE69734158T2 publication Critical patent/DE69734158T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/0675—Needle-like
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G01R1/06761—Material aspects related to layers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/1134—Stud bumping, i.e. using a wire-bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00013—Fully indexed content
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
DE69734158T 1996-09-13 1997-09-12 Prüfkopfstruktur mit mehreren getrennten isolierten prüfspitzen Expired - Lifetime DE69734158T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US2605096P 1996-09-13 1996-09-13
US26050P 1996-09-13
PCT/US1997/013698 WO1998011445A1 (en) 1996-09-13 1997-09-12 Probe structure having a plurality of discrete insulated probe tips

Publications (2)

Publication Number Publication Date
DE69734158D1 true DE69734158D1 (de) 2005-10-13
DE69734158T2 DE69734158T2 (de) 2006-06-22

Family

ID=21829590

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69734158T Expired - Lifetime DE69734158T2 (de) 1996-09-13 1997-09-12 Prüfkopfstruktur mit mehreren getrennten isolierten prüfspitzen

Country Status (5)

Country Link
US (3) US6452406B1 (de)
EP (1) EP0925509B1 (de)
JP (1) JP2000502810A (de)
DE (1) DE69734158T2 (de)
WO (1) WO1998011445A1 (de)

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US7771208B2 (en) 2004-12-16 2010-08-10 International Business Machines Corporation Metalized elastomeric electrical contacts
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US20060267605A1 (en) * 2005-05-27 2006-11-30 Yang Kei-Wean C Differential measurement probe having a ground clip system for the probing tips
US7721430B2 (en) * 2006-02-22 2010-05-25 Sv Probe Pte Ltd. Approach for fabricating cantilever probes
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7338300B1 (en) * 2006-11-28 2008-03-04 Inventec Corporation Static electricity conductive mechanism
US8832936B2 (en) * 2007-04-30 2014-09-16 International Business Machines Corporation Method of forming metallized elastomeric electrical contacts
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
US7888957B2 (en) 2008-10-06 2011-02-15 Cascade Microtech, Inc. Probing apparatus with impedance optimized interface
WO2010059247A2 (en) 2008-11-21 2010-05-27 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus
JP5683943B2 (ja) * 2010-12-27 2015-03-11 三菱電線工業株式会社 プローブピン及びプローブピンの製造方法
KR101284362B1 (ko) * 2011-05-30 2013-07-08 주식회사 코엠테크 검사 지그 및 그 제조방법
US10177054B2 (en) * 2011-10-27 2019-01-08 Global Circuit Innovations, Inc. Method for remapping a packaged extracted die
US9059545B2 (en) * 2012-07-11 2015-06-16 Tyco Electronics Corporations Socket connectors and methods of assembling socket connectors
TWI472772B (zh) * 2013-01-11 2015-02-11 Mpi Corp 探針、探針卡與製作探針的方法
JP6759213B2 (ja) * 2014-12-30 2020-09-23 テクノプローベ エス．ピー．エー． テストヘッド用コンタクトプローブ
JP6569377B2 (ja) * 2015-08-14 2019-09-04 富士通株式会社 ケーブルコネクタ及び配線基板
TWI642940B (zh) * 2017-09-01 2018-12-01 中華精測科技股份有限公司 探針組件及其探針結構
JP7254450B2 (ja) * 2018-05-16 2023-04-10 日本電産リード株式会社 プローブ、検査治具、検査装置、及びプローブの製造方法
TWI680300B (zh) * 2019-03-18 2019-12-21 中華精測科技股份有限公司 探針卡裝置及其導電探針
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Also Published As

Publication number Publication date
US6452406B1 (en) 2002-09-17
EP0925509A1 (de) 1999-06-30
EP0925509B1 (de) 2005-09-07
US20020089344A1 (en) 2002-07-11
US8486250B2 (en) 2013-07-16
WO1998011445A1 (en) 1998-03-19
US8491772B2 (en) 2013-07-23
DE69734158T2 (de) 2006-06-22
US20090308756A1 (en) 2009-12-17
JP2000502810A (ja) 2000-03-07

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Legal Events

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8320 Willingness to grant licences declared (paragraph 23)