DE69802663T2 - Hochgeschwindigkeitsprüfsystem für speichereinrichtung - Google Patents

Hochgeschwindigkeitsprüfsystem für speichereinrichtung

Info

Publication number
DE69802663T2
DE69802663T2 DE69802663T DE69802663T DE69802663T2 DE 69802663 T2 DE69802663 T2 DE 69802663T2 DE 69802663 T DE69802663 T DE 69802663T DE 69802663 T DE69802663 T DE 69802663T DE 69802663 T2 DE69802663 T2 DE 69802663T2
Authority
DE
Germany
Prior art keywords
line
memory device
data
read
circuitry
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69802663T
Other languages
English (en)
Other versions
DE69802663D1 (de
Inventor
P Wright
Hua Zheng
M Fuller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Micron Technology Inc
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Application granted granted Critical
Publication of DE69802663D1 publication Critical patent/DE69802663D1/de
Publication of DE69802663T2 publication Critical patent/DE69802663T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/08Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
    • G11C29/12Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
    • G11C29/38Response verification devices
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/08Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
    • G11C29/12Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
    • G11C29/18Address generation devices; Devices for accessing memories, e.g. details of addressing circuits
    • G11C29/30Accessing single arrays
    • G11C29/34Accessing multiple bits simultaneously
DE69802663T 1997-01-06 1998-01-06 Hochgeschwindigkeitsprüfsystem für speichereinrichtung Expired - Lifetime DE69802663T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/779,036 US5966388A (en) 1997-01-06 1997-01-06 High-speed test system for a memory device
PCT/US1998/000455 WO1998031019A1 (en) 1997-01-06 1998-01-06 High-speed test system for a memory device

Publications (2)

Publication Number Publication Date
DE69802663D1 DE69802663D1 (de) 2002-01-10
DE69802663T2 true DE69802663T2 (de) 2002-05-23

Family

ID=25115119

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69802663T Expired - Lifetime DE69802663T2 (de) 1997-01-06 1998-01-06 Hochgeschwindigkeitsprüfsystem für speichereinrichtung

Country Status (8)

Country Link
US (3) US5966388A (de)
EP (1) EP0948793B1 (de)
JP (1) JP2001508223A (de)
KR (1) KR100487176B1 (de)
AT (1) ATE209821T1 (de)
AU (1) AU5912398A (de)
DE (1) DE69802663T2 (de)
WO (1) WO1998031019A1 (de)

Families Citing this family (72)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5966388A (en) * 1997-01-06 1999-10-12 Micron Technology, Inc. High-speed test system for a memory device
US6173425B1 (en) 1998-04-15 2001-01-09 Integrated Device Technology, Inc. Methods of testing integrated circuits to include data traversal path identification information and related status information in test data streams
JPH11306798A (ja) * 1998-04-22 1999-11-05 Oki Electric Ind Co Ltd メモリ装置のテスト容易化回路
US6178532B1 (en) * 1998-06-11 2001-01-23 Micron Technology, Inc. On-chip circuit and method for testing memory devices
JP3292145B2 (ja) * 1998-06-26 2002-06-17 日本電気株式会社 半導体記憶装置
US6115303A (en) * 1998-10-09 2000-09-05 Micron Technology, Inc. Method and apparatus for testing memory devices
JP2000322899A (ja) * 1999-05-12 2000-11-24 Nec Corp 半導体装置、そのテスト装置及びそのテスト方法
KR100529394B1 (ko) * 1999-06-28 2005-11-17 주식회사 하이닉스반도체 테스트 구현을 위한 반도체메모리장치의 데이터 압축 회로
US6484289B1 (en) * 1999-09-23 2002-11-19 Texas Instruments Incorporated Parallel data test for a semiconductor memory
JP3732702B2 (ja) * 2000-01-31 2006-01-11 株式会社リコー 画像処理装置
JP3734408B2 (ja) * 2000-07-03 2006-01-11 シャープ株式会社 半導体記憶装置
US7978219B1 (en) 2000-08-30 2011-07-12 Kevin Reid Imes Device, network, server, and methods for providing digital images and associated processing information
US8326352B1 (en) 2000-09-06 2012-12-04 Kevin Reid Imes Device, network, server, and methods for providing service requests for wireless communication devices
US6812726B1 (en) 2002-11-27 2004-11-02 Inapac Technology, Inc. Entering test mode and accessing of a packaged semiconductor device
US7444575B2 (en) * 2000-09-21 2008-10-28 Inapac Technology, Inc. Architecture and method for testing of an integrated circuit device
US6754866B1 (en) * 2001-09-28 2004-06-22 Inapac Technology, Inc. Testing of integrated circuit devices
US7240254B2 (en) * 2000-09-21 2007-07-03 Inapac Technology, Inc Multiple power levels for a chip within a multi-chip semiconductor package
US6732304B1 (en) * 2000-09-21 2004-05-04 Inapac Technology, Inc. Chip testing within a multi-chip semiconductor package
ITRM20010104A1 (it) * 2001-02-27 2002-08-27 Micron Technology Inc Modo di lettura a compressione di dati per il collaudo di memorie.
US6449203B1 (en) 2001-03-08 2002-09-10 Micron Technology, Inc. Refresh controller and address remapping circuit and method for dual mode full/reduced density DRAMs
DE10129625A1 (de) * 2001-06-20 2003-01-02 Infineon Technologies Ag Vorrichtung und Verfahren zum Testen einer Einrichtung zum Speichern von Daten
US8286046B2 (en) 2001-09-28 2012-10-09 Rambus Inc. Integrated circuit testing module including signal shaping interface
US8166361B2 (en) 2001-09-28 2012-04-24 Rambus Inc. Integrated circuit testing module configured for set-up and hold time testing
US7265570B2 (en) * 2001-09-28 2007-09-04 Inapac Technology, Inc. Integrated circuit testing module
US7313740B2 (en) * 2002-07-25 2007-12-25 Inapac Technology, Inc. Internally generating patterns for testing in an integrated circuit device
US20040019841A1 (en) * 2002-07-25 2004-01-29 Ong Adrian E. Internally generating patterns for testing in an integrated circuit device
US7370256B2 (en) * 2001-09-28 2008-05-06 Inapac Technology, Inc. Integrated circuit testing module including data compression
US8001439B2 (en) 2001-09-28 2011-08-16 Rambus Inc. Integrated circuit testing module including signal shaping interface
US7446551B1 (en) 2001-09-28 2008-11-04 Inapac Technology, Inc. Integrated circuit testing module including address generator
US7365557B1 (en) 2001-09-28 2008-04-29 Inapac Technology, Inc. Integrated circuit testing module including data generator
US7206369B2 (en) * 2001-10-12 2007-04-17 Agere Systems Inc. Programmable feedback delay phase-locked loop for high-speed input/output timing budget management and method of operation thereof
US6751159B2 (en) * 2001-10-26 2004-06-15 Micron Technology, Inc. Memory device operable in either a high-power, full-page size mode or a low-power, reduced-page size mode
US7061263B1 (en) 2001-11-15 2006-06-13 Inapac Technology, Inc. Layout and use of bond pads and probe pads for testing of integrated circuits devices
US6754094B2 (en) * 2002-01-31 2004-06-22 Stmicroelectronics, Inc. Circuit and method for testing a ferroelectric memory device
US20030182609A1 (en) * 2002-01-31 2003-09-25 Shirish Agrawal Pass gate multiplexer
US6838331B2 (en) * 2002-04-09 2005-01-04 Micron Technology, Inc. Method and system for dynamically operating memory in a power-saving error correction mode
US6751143B2 (en) * 2002-04-11 2004-06-15 Micron Technology, Inc. Method and system for low power refresh of dynamic random access memories
JP4447200B2 (ja) * 2002-07-19 2010-04-07 Necエレクトロニクス株式会社 映像データ転送方法、表示制御回路及び液晶表示装置
US7055076B2 (en) * 2002-08-28 2006-05-30 Micron Technology, Inc. Output data compression scheme using tri-state
DE10245713B4 (de) * 2002-10-01 2004-10-28 Infineon Technologies Ag Testsystem und Verfahren zum Testen von Speicherschaltungen
US8063650B2 (en) 2002-11-27 2011-11-22 Rambus Inc. Testing fuse configurations in semiconductor devices
ITRM20030040A1 (it) * 2003-01-31 2004-08-01 Micron Technology Inc Modo di lettura a compressione di dati per collaudo di memorie.
KR100527535B1 (ko) * 2003-04-17 2005-11-09 주식회사 하이닉스반도체 입출력 압축 회로
KR100541048B1 (ko) * 2003-06-16 2006-01-11 삼성전자주식회사 반도체 메모리 장치 및 이 장치의 테스트 방법
US6961269B2 (en) * 2003-06-24 2005-11-01 Micron Technology, Inc. Memory device having data paths with multiple speeds
DE102004024668A1 (de) * 2004-05-18 2005-12-15 Infineon Technologies Ag Verfahren zum Testen von elektronischen Schaltungseinheiten und Testvorrichtung
DE102004027275A1 (de) * 2004-06-04 2005-12-29 Infineon Technologies Ag Integrierter Halbleiterspeicher
ITRM20040418A1 (it) * 2004-08-25 2004-11-25 Micron Technology Inc Modo di lettura a compressione di dati a piu' livelli per il collaudo di memorie.
JP4370527B2 (ja) * 2005-05-20 2009-11-25 エルピーダメモリ株式会社 半導体記憶装置
KR100648490B1 (ko) * 2005-10-17 2006-11-27 삼성전자주식회사 반도체 메모리 장치의 테스트 회로, 테스트 방법, 및 이를포함하는 반도체 메모리 장치
KR100668496B1 (ko) 2005-11-09 2007-01-12 주식회사 하이닉스반도체 데이터 압축 회로
US20070109888A1 (en) * 2005-11-14 2007-05-17 Ronald Baker Integrated circuit with test circuit
US7457177B2 (en) 2005-12-21 2008-11-25 Infineon Technologies Ag Random access memory including circuit to compress comparison results
KR100695437B1 (ko) * 2006-04-13 2007-03-16 주식회사 하이닉스반도체 멀티 포트 메모리 소자
US7292487B1 (en) 2006-05-10 2007-11-06 Micron Technology, Inc. Independent polling for multi-page programming
DE102006024016B4 (de) * 2006-05-23 2008-04-03 Infineon Technologies Ag Speicher mit einem Ausgangsregister für Testdaten und Verfahren zum Testen eines Speichers
KR100809070B1 (ko) * 2006-06-08 2008-03-03 삼성전자주식회사 반도체 메모리 장치의 병렬 비트 테스트 회로 및 그 방법
US7466603B2 (en) 2006-10-03 2008-12-16 Inapac Technology, Inc. Memory accessing circuit system
US20080112255A1 (en) * 2006-11-15 2008-05-15 Aaron John Nygren Training of signal transfer channels between memory controller and memory device
US20080291760A1 (en) * 2007-05-23 2008-11-27 Micron Technology, Inc. Sub-array architecture memory devices and related systems and methods
US20090225610A1 (en) * 2008-03-05 2009-09-10 Wolfgang Hokenmaier Integrated circuit that selectively outputs subsets of a group of data bits
US8489912B2 (en) * 2009-09-09 2013-07-16 Ati Technologies Ulc Command protocol for adjustment of write timing delay
TWI451428B (zh) 2010-06-03 2014-09-01 Sunplus Technology Co Ltd 於完整記憶體系統中具有先進特徵的記憶體測試系統
KR101208960B1 (ko) * 2010-11-26 2012-12-06 에스케이하이닉스 주식회사 반도체 장치 및 이의 테스트 방법
US8713383B2 (en) * 2010-12-30 2014-04-29 Hynix Semiconductor Inc. Semiconductor memory device, test circuit, and test operation method thereof
US8612812B2 (en) * 2010-12-30 2013-12-17 Hynix Semiconductor Inc. Semiconductor memory device, test circuit, and test operation method thereof
US8595575B2 (en) * 2010-12-30 2013-11-26 Hynix Semiconductor Inc. Semiconductor memory device, test circuit, and test operation method thereof
US8873305B2 (en) * 2011-01-28 2014-10-28 SK Hynix Inc. Semiconductor memory device having data compression test circuit
KR20120113478A (ko) * 2011-04-05 2012-10-15 삼성전자주식회사 반도체 메모리 장치의 테스트 방법
US9412467B2 (en) * 2014-04-29 2016-08-09 Freescale Semiconductor, Inc. Semiconductor device having a test controller and method of operation
KR102538991B1 (ko) * 2016-07-15 2023-06-02 에스케이하이닉스 주식회사 반도체 테스트 장치 및 반도체 테스트 방법
CN117059155A (zh) * 2022-05-06 2023-11-14 长鑫存储技术有限公司 测试电路检查方法、测试平台、存储介质和测试系统

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4369511A (en) * 1979-11-21 1983-01-18 Nippon Telegraph & Telephone Public Corp. Semiconductor memory test equipment
DE3751002T2 (de) * 1986-10-20 1995-10-05 Nippon Telegraph & Telephone Halbleiterspeicher.
JP2613411B2 (ja) * 1987-12-29 1997-05-28 株式会社アドバンテスト メモリ試験装置
KR910005306B1 (ko) * 1988-12-31 1991-07-24 삼성전자 주식회사 고밀도 메모리의 테스트를 위한 병렬리드회로
EP0389203A3 (de) * 1989-03-20 1993-05-26 Fujitsu Limited Halbleiterspeichergerät beinhaltend Information, die die Anwesenheit mangelhafter Speicherzellen anzeigt
US5301155A (en) * 1990-03-20 1994-04-05 Mitsubishi Denki Kabushiki Kaisha Multiblock semiconduction storage device including simultaneous operation of a plurality of block defect determination circuits
JPH0831279B2 (ja) * 1990-12-20 1996-03-27 インターナショナル・ビジネス・マシーンズ・コーポレイション 冗長システム
US5457696A (en) * 1991-08-08 1995-10-10 Matsushita Electric Industrial Co., Ltd. Semiconductor memory having internal test circuit
KR100296850B1 (ko) * 1992-05-28 2001-10-24 썬 마이크로시스템즈, 인코포레이티드 캐시램용다수의뱅크열용장성초기화제어기
EP0578876A1 (de) * 1992-06-30 1994-01-19 Nec Corporation Statische Speicher mit wahlfreiem Zugriff mit Speicherzellenprüfungsanordnung
JP3533227B2 (ja) * 1992-09-10 2004-05-31 株式会社日立製作所 半導体記憶装置
US5396124A (en) * 1992-09-30 1995-03-07 Matsushita Electric Industrial Co., Ltd. Circuit redundancy having a variable impedance circuit
JP2741824B2 (ja) * 1992-10-14 1998-04-22 三菱電機株式会社 半導体記憶装置
JP2768175B2 (ja) * 1992-10-26 1998-06-25 日本電気株式会社 半導体メモリ
JPH06242181A (ja) * 1992-11-23 1994-09-02 Texas Instr Inc <Ti> 集積回路の試験装置及び方法
KR960002016B1 (ko) * 1993-02-15 1996-02-09 금성일렉트론주식회사 반도체 기억소자의 테스트 모드회로
JP2616544B2 (ja) * 1993-09-22 1997-06-04 日本電気株式会社 半導体記憶装置
KR960008824B1 (en) * 1993-11-17 1996-07-05 Samsung Electronics Co Ltd Multi bit test circuit and method of semiconductor memory device
JPH08161899A (ja) * 1994-04-29 1996-06-21 Texas Instr Inc <Ti> メモリデバイスおよび半導体デバイステスト方法
US5687387A (en) * 1994-08-26 1997-11-11 Packard Bell Nec Enhanced active port replicator having expansion and upgrade capabilities
US5528539A (en) * 1994-09-29 1996-06-18 Micron Semiconductor, Inc. High speed global row redundancy system
US5701441A (en) * 1995-08-18 1997-12-23 Xilinx, Inc. Computer-implemented method of optimizing a design in a time multiplexed programmable logic device
US5925142A (en) * 1995-10-06 1999-07-20 Micron Technology, Inc. Self-test RAM using external synchronous clock
JPH09128998A (ja) * 1995-10-31 1997-05-16 Nec Corp テスト回路
US5768287A (en) * 1996-10-24 1998-06-16 Micron Quantum Devices, Inc. Apparatus and method for programming multistate memory device
US5966388A (en) * 1997-01-06 1999-10-12 Micron Technology, Inc. High-speed test system for a memory device

Also Published As

Publication number Publication date
ATE209821T1 (de) 2001-12-15
US6154860A (en) 2000-11-28
EP0948793A1 (de) 1999-10-13
AU5912398A (en) 1998-08-03
US5966388A (en) 1999-10-12
KR20000069916A (ko) 2000-11-25
DE69802663D1 (de) 2002-01-10
JP2001508223A (ja) 2001-06-19
KR100487176B1 (ko) 2005-05-03
WO1998031019A1 (en) 1998-07-16
US6550026B1 (en) 2003-04-15
EP0948793B1 (de) 2001-11-28

Similar Documents

Publication Publication Date Title
DE69802663T2 (de) Hochgeschwindigkeitsprüfsystem für speichereinrichtung
KR100679586B1 (ko) 모니터및테스터모드를가진내장자가테스트회로를구비한집적회로메모리장치
KR900010417A (ko) 고밀도 메모리의 테스트를 위한 병렬 리드 회로
KR960035042A (ko) 다수의 메모리를 검사하기 위한 비스트(bist) 검사기 및 검사 방법
KR960042082A (ko) 매립 논리 회로 검사 시스템 및 그 검사 방법과 집적 회로 칩
TW200731273A (en) Testing device and testing method
US7596730B2 (en) Test method, test system and assist board
TW338106B (en) Semiconductor memory testing apparatus
KR970018600A (ko) 반도체 기억장치
TW366430B (en) IC testing device and method
WO2002021234A3 (en) Bist for parallel testing of on-chip memory
DE69704888D1 (de) Steuerschaltung für den Datenausgang für eine Halbleiterspeicheranordnung mit einer Pipelinestruktur
KR970076884A (ko) 반도체 메모리 장치의 멀티비트 테스트 회로 및 그 테스트 방법
TW347469B (en) Failure analysis memory for memory testing apparatus
TW375826B (en) Merged DQ circuit of semiconductor device and method thereof
US6480016B1 (en) Tester, a test system, and a testing method for a semiconductor integrated circuit
KR930003170A (ko) 메모리회로의 테스트 방법 및 반도체집적회로장치
KR100339502B1 (ko) 다수개의 데이터 라인을 구분되게 테스트하는 통합 데이터 라인 테스트 회로 및 이를 이용하는 테스트 방법
KR970017693A (ko) 테스트 회로
US7227810B2 (en) Semiconductor device and testing method for semiconductor device
KR20060124386A (ko) 반도체메모리소자의 입출력라인 공유장치
KR100346447B1 (ko) 반도체 메모리 소자의 병렬 테스트 장치
JPH03216899A (ja) 組み込み自己テスト回路
KR100244506B1 (ko) 광대역폭 메모리의 테스트장치
KR100830959B1 (ko) 낸드 플래쉬 메모리 소자의 테스트 장치

Legal Events

Date Code Title Description
8364 No opposition during term of opposition