DE69830659D1 - Leitgährige zusammensetzung,verbundstoff dafür und verfahren zur herstellung dieser zusammensetzung und dieses verbundstoffes - Google Patents

Leitgährige zusammensetzung,verbundstoff dafür und verfahren zur herstellung dieser zusammensetzung und dieses verbundstoffes

Info

Publication number
DE69830659D1
DE69830659D1 DE69830659T DE69830659T DE69830659D1 DE 69830659 D1 DE69830659 D1 DE 69830659D1 DE 69830659 T DE69830659 T DE 69830659T DE 69830659 T DE69830659 T DE 69830659T DE 69830659 D1 DE69830659 D1 DE 69830659D1
Authority
DE
Germany
Prior art keywords
composition
compound
manufacturing
guide
guide composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69830659T
Other languages
English (en)
Other versions
DE69830659T2 (de
Inventor
A Schleifstein
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Potters Industries LLC
Original Assignee
Potters Industries LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Potters Industries LLC filed Critical Potters Industries LLC
Publication of DE69830659D1 publication Critical patent/DE69830659D1/de
Application granted granted Critical
Publication of DE69830659T2 publication Critical patent/DE69830659T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y10T428/2998—Coated including synthetic resin or polymer
DE69830659T 1997-04-11 1998-04-02 Leitgährige zusammensetzung,verbundstoff dafür und verfahren zur herstellung dieser zusammensetzung und dieses verbundstoffes Expired - Lifetime DE69830659T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US834038 1997-04-11
US08/834,038 US6010646A (en) 1997-04-11 1997-04-11 Electroconductive composition and methods for producing such composition
PCT/US1998/006520 WO1998047154A1 (en) 1997-04-11 1998-04-02 Electroconductive composition, composite suitable for making same, and methods for producing such composition and composite

Publications (2)

Publication Number Publication Date
DE69830659D1 true DE69830659D1 (de) 2005-07-28
DE69830659T2 DE69830659T2 (de) 2006-05-24

Family

ID=25265940

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69830659T Expired - Lifetime DE69830659T2 (de) 1997-04-11 1998-04-02 Leitgährige zusammensetzung,verbundstoff dafür und verfahren zur herstellung dieser zusammensetzung und dieses verbundstoffes

Country Status (5)

Country Link
US (2) US6010646A (de)
EP (1) EP1008149B1 (de)
JP (1) JP2001525107A (de)
DE (1) DE69830659T2 (de)
WO (1) WO1998047154A1 (de)

Families Citing this family (28)

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CN1140587C (zh) * 1996-12-20 2004-03-03 株式会社三键 有机聚硅氧烷组合物
JP3420473B2 (ja) * 1997-04-30 2003-06-23 東レ・ダウコーニング・シリコーン株式会社 シリコーン系接着性シート、その製造方法、および半導体装置
DE69922317D1 (de) * 1998-09-29 2005-01-05 Koninkl Philips Electronics Nv Bildverarbeitungsverfahren für medizinische Ultraschall-Abbildungen der Knochenstruktur, und ein Gerät für rechnerunterstützte Chirurgie
JP3603945B2 (ja) * 1999-10-06 2004-12-22 信越化学工業株式会社 導電性シリコーンゴム組成物
US6617392B2 (en) * 1999-10-27 2003-09-09 Wen-Chen Yang Molding composition of siloxane capable of extending mold lifetime
US6228288B1 (en) 2000-04-27 2001-05-08 Cts Corporation Electrically conductive compositions and films for position sensors
US6361716B1 (en) * 2000-07-20 2002-03-26 Dow Corning Corporation Silicone composition and electrically conductive silicone adhesive formed therefrom
US6465550B1 (en) * 2000-08-08 2002-10-15 Dow Corning Corporation Silicone composition and electrically conductive, cured silicone product
JP3705344B2 (ja) * 2000-08-17 2005-10-12 信越化学工業株式会社 導電性シリコーンゴム組成物
US6433055B1 (en) * 2000-09-13 2002-08-13 Dow Corning Corporation Electrically conductive hot-melt silicone adhesive composition
JP3554703B2 (ja) * 2000-10-12 2004-08-18 リバーベル株式会社 情報端末装置
US20030151030A1 (en) * 2000-11-22 2003-08-14 Gurin Michael H. Enhanced conductivity nanocomposites and method of use thereof
JP4784720B2 (ja) * 2001-09-25 2011-10-05 信越化学工業株式会社 粘着テープ
JP4568472B2 (ja) * 2002-11-29 2010-10-27 東レ・ダウコーニング株式会社 銀粉末の製造方法および硬化性シリコーン組成物
TW200427111A (en) * 2003-03-12 2004-12-01 Shinetsu Chemical Co Material for coating/protecting light-emitting semiconductor and the light-emitting semiconductor device
US7569626B2 (en) 2003-06-05 2009-08-04 Dfine, Inc. Polymer composites for biomedical applications and methods of making
JP5082187B2 (ja) * 2003-10-06 2012-11-28 日産自動車株式会社 固体高分子型燃料電池用電極触媒粒子の製造方法
US7794629B2 (en) * 2003-11-25 2010-09-14 Qinetiq Limited Composite materials
DE102005044433A1 (de) * 2005-09-16 2007-03-22 Universität Bremen Katalytisch aktive Zusammensetzung, Membran-Elektroden-Einheit mit der Zusammensetzung und Katalysator mit/aus der Zusammensetzung
EP2191482B1 (de) * 2007-09-13 2017-03-08 Henkel AG & Co. KGaA Elektrisch leitfähige zusammensetzung
US8231808B2 (en) * 2008-05-27 2012-07-31 Hong Kong University Of Science And Technology Percolation efficiency of the conductivity of electrically conductive adhesives
US8299159B2 (en) * 2009-08-17 2012-10-30 Laird Technologies, Inc. Highly thermally-conductive moldable thermoplastic composites and compositions
US9428680B2 (en) * 2013-03-14 2016-08-30 Dow Corning Corporation Conductive silicone materials and uses
JP2017012674A (ja) * 2015-07-06 2017-01-19 住友ベークライト株式会社 ウェアラブルセンサーデバイス
US11431100B2 (en) * 2016-03-25 2022-08-30 Commscope Technologies Llc Antennas having lenses formed of lightweight dielectric materials and related dielectric materials
US11527835B2 (en) 2017-09-15 2022-12-13 Commscope Technologies Llc Methods of preparing a composite dielectric material
CN111372514B (zh) * 2018-01-15 2023-06-02 Nok株式会社 生物电极
CN111372515B (zh) 2018-01-15 2023-03-24 Nok株式会社 生物电极

Family Cites Families (20)

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Publication number Priority date Publication date Assignee Title
US4299736A (en) * 1980-05-19 1981-11-10 Rca Corporation Conductive molding composition and discs therefrom
US4419279A (en) * 1980-09-15 1983-12-06 Potters Industries, Inc. Conductive paste, electroconductive body and fabrication of same
US4547312A (en) * 1984-08-31 1985-10-15 Dow Corning Corporation Electrically conductive elastomers from emulsions
US4683082A (en) * 1985-03-27 1987-07-28 Ercon, Inc. One-component, particle-filled compositions
US4716081A (en) * 1985-07-19 1987-12-29 Ercon, Inc. Conductive compositions and conductive powders for use therein
FR2605326A1 (fr) * 1986-10-20 1988-04-22 Rhone Poulenc Multi Tech Composition potentiellement adhesive electriquement conductrice.
US4777205A (en) * 1987-07-22 1988-10-11 Wacker Silicones Corporation Electrically conductive compositions
US4857233A (en) * 1988-05-26 1989-08-15 Potters Industries, Inc. Nickel particle plating system
US5091114A (en) * 1988-08-23 1992-02-25 Asahi Kasei Kogyo Kabushiki Kaisha Conductive metal powders, process for preparation thereof and use thereof
US5075038A (en) * 1988-11-04 1991-12-24 Dow Corning Corporation Electrically conductive silicone compositions
US5207950A (en) * 1989-03-16 1993-05-04 Ercon, Inc. Polymer composition containing chlorided conductive particles
JPH0791464B2 (ja) * 1989-10-31 1995-10-04 信越化学工業株式会社 導電性シリコーンゴム組成物およびその硬化物
US5399432A (en) * 1990-06-08 1995-03-21 Potters Industries, Inc. Galvanically compatible conductive filler and methods of making same
US5175056A (en) * 1990-06-08 1992-12-29 Potters Industries, Inc. Galvanically compatible conductive filler
JP3134333B2 (ja) * 1991-03-27 2001-02-13 ジェイエスアール株式会社 導電性エラストマー用組成物
US5643592A (en) * 1991-08-09 1997-07-01 E. I. Du Pont De Nemours And Company Surface-coated particulate additives for polymers
US5227093A (en) * 1991-11-29 1993-07-13 Dow Corning Corporation Curable organosiloxane compositions yielding electrically conductive materials
JPH05271548A (ja) * 1992-03-27 1993-10-19 Shin Etsu Chem Co Ltd オルガノポリシロキサン組成物及びその硬化物の形成方法
US5498644A (en) * 1993-09-10 1996-03-12 Specialty Silicone Products, Inc. Silcone elastomer incorporating electrically conductive microballoons and method for producing same
US5653875A (en) * 1994-02-04 1997-08-05 Supelco, Inc. Nucleophilic bodies bonded to siloxane and use thereof for separations from sample matrices

Also Published As

Publication number Publication date
EP1008149B1 (de) 2005-06-22
DE69830659T2 (de) 2006-05-24
EP1008149A1 (de) 2000-06-14
WO1998047154A1 (en) 1998-10-22
JP2001525107A (ja) 2001-12-04
US6241914B1 (en) 2001-06-05
US6010646A (en) 2000-01-04
EP1008149A4 (de) 2000-07-19

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