DE69832249D1 - Chip-induktivität und sein herstellungsverfahren - Google Patents

Chip-induktivität und sein herstellungsverfahren

Info

Publication number
DE69832249D1
DE69832249D1 DE69832249T DE69832249T DE69832249D1 DE 69832249 D1 DE69832249 D1 DE 69832249D1 DE 69832249 T DE69832249 T DE 69832249T DE 69832249 T DE69832249 T DE 69832249T DE 69832249 D1 DE69832249 D1 DE 69832249D1
Authority
DE
Germany
Prior art keywords
inductivity
chip
manufacturing process
manufacturing
chip inductivity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69832249T
Other languages
English (en)
Other versions
DE69832249T2 (de
Inventor
Toyonori Kanetaka
Toshihiro Yoshizawa
Akira Fujimori
Mikio Taoka
Hideaki Nakayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP09076989A external-priority patent/JP3087679B2/ja
Priority claimed from JP09076990A external-priority patent/JP3123459B2/ja
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of DE69832249D1 publication Critical patent/DE69832249D1/de
Application granted granted Critical
Publication of DE69832249T2 publication Critical patent/DE69832249T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/29Terminals; Tapping arrangements for signal inductances
    • H01F27/292Surface mounted devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/12Insulating of windings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type 
    • H01F17/0006Printed inductances
    • H01F17/0033Printed inductances with the coil helically wound around a magnetic core
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type 
    • H01F17/04Fixed inductances of the signal type  with magnetic core
    • H01F17/045Fixed inductances of the signal type  with magnetic core with core of cylindric geometry and coil wound along its longitudinal axis, i.e. rod or drum core
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/32Insulating of coils, windings, or parts thereof
    • H01F27/327Encapsulating or impregnating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041Printed circuit coils
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/12Insulating of windings
    • H01F41/122Insulating between turns or between winding layers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/4902Electromagnet, transformer or inductor
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/4902Electromagnet, transformer or inductor
    • Y10T29/49073Electromagnet, transformer or inductor by assembling coil and core
DE69832249T 1997-03-28 1998-03-26 Chip-induktivität und sein herstellungsverfahren Expired - Fee Related DE69832249T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP09076989A JP3087679B2 (ja) 1997-03-28 1997-03-28 チップインダクタの製造方法
JP7699097 1997-03-28
JP09076990A JP3123459B2 (ja) 1997-03-28 1997-03-28 チップインダクタ
JP7698997 1997-03-28
PCT/JP1998/001349 WO1998044520A1 (fr) 1997-03-28 1998-03-26 Puce d'inductance et procede de fabrication

Publications (2)

Publication Number Publication Date
DE69832249D1 true DE69832249D1 (de) 2005-12-15
DE69832249T2 DE69832249T2 (de) 2006-05-24

Family

ID=26418097

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69832249T Expired - Fee Related DE69832249T2 (de) 1997-03-28 1998-03-26 Chip-induktivität und sein herstellungsverfahren

Country Status (5)

Country Link
US (2) US6084500A (de)
EP (1) EP0921542B1 (de)
KR (1) KR100283371B1 (de)
DE (1) DE69832249T2 (de)
WO (1) WO1998044520A1 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000243629A (ja) * 1998-12-21 2000-09-08 Murata Mfg Co Ltd インダクタおよびその製造方法
JP4039779B2 (ja) * 1999-01-28 2008-01-30 太陽誘電株式会社 チップ状電子部品の製造方法
FR2793330B1 (fr) * 1999-05-06 2001-08-10 Oberthur Card Systems Sas Procede de montage d'un microcircuit dans une cavite d'une carte formant support et carte ainsi obtenue
US6437676B1 (en) * 1999-06-29 2002-08-20 Matsushita Electric Industrial Co., Ltd. Inductance element
JP3583965B2 (ja) 1999-11-26 2004-11-04 太陽誘電株式会社 面実装型コイル及びその製造方法
EP1195781A4 (de) * 2000-04-12 2004-03-31 Matsushita Electric Ind Co Ltd Herstellungverfahren eines chip-induktors
JP2002008931A (ja) * 2000-04-18 2002-01-11 Taiyo Yuden Co Ltd 巻線型コモンモードチョークコイル
JP3395764B2 (ja) * 2000-07-17 2003-04-14 株式会社村田製作所 チップ型コモンモードチョークコイル
KR100381361B1 (ko) * 2000-11-08 2003-04-26 주식회사 쎄라텍 표면 실장형 칩 인덕터 제조방법
US6417755B1 (en) * 2000-08-25 2002-07-09 Conexant Systems, Inc. Method for fabrication of high inductance inductors and related structure
US6864774B2 (en) * 2000-10-19 2005-03-08 Matsushita Electric Industrial Co., Ltd. Inductance component and method of manufacturing the same
KR100372737B1 (ko) * 2001-05-28 2003-02-15 주식회사 쎄라텍 표면 실장형 칩 인덕터 및 제조 방법
JP2003115403A (ja) * 2001-10-03 2003-04-18 Matsushita Electric Ind Co Ltd 電子部品の製造方法
CN100562949C (zh) * 2003-05-08 2009-11-25 松下电器产业株式会社 电子部件及其制造方法
JP5287154B2 (ja) * 2007-11-08 2013-09-11 パナソニック株式会社 回路保護素子およびその製造方法
KR101219003B1 (ko) 2011-04-29 2013-01-04 삼성전기주식회사 칩형 코일 부품
KR20150080797A (ko) * 2014-01-02 2015-07-10 삼성전기주식회사 세라믹 전자 부품
CN103903838B (zh) * 2014-03-27 2016-02-10 西北核技术研究所 一种紧凑型电感一体化电极及其加工方法
KR101548879B1 (ko) * 2014-09-18 2015-08-31 삼성전기주식회사 칩 부품 및 이의 실장 기판
KR102052767B1 (ko) * 2014-12-12 2019-12-09 삼성전기주식회사 칩 전자부품 및 그 제조방법
US11277067B2 (en) 2016-03-03 2022-03-15 Delta Electronics, Inc. Power module and manufacturing method thereof
CN107154301B (zh) * 2016-03-03 2018-12-25 台达电子企业管理(上海)有限公司 磁性组件
JP7221583B2 (ja) * 2017-03-29 2023-02-14 太陽誘電株式会社 コイル部品
KR102064068B1 (ko) * 2018-04-25 2020-01-08 삼성전기주식회사 코일 전자부품
CN114758881A (zh) * 2022-04-18 2022-07-15 宁波中科毕普拉斯新材料科技有限公司 一种片式电感的制备方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3812442A (en) * 1972-02-29 1974-05-21 W Muckelroy Ceramic inductor
NZ200399A (en) * 1981-05-15 1985-12-13 Westinghouse Electric Corp Forming paperless electric coils:winding conductor on gelled insulation coating
US5441783A (en) * 1992-11-17 1995-08-15 Alliedsignal Inc. Edge coating for amorphous ribbon transformer cores
JPH06215950A (ja) * 1993-01-13 1994-08-05 Matsushita Electric Ind Co Ltd コイルおよびその製造方法
JP3241996B2 (ja) * 1995-06-08 2001-12-25 松下電器産業株式会社 チップコイル
CN1075661C (zh) * 1995-06-08 2001-11-28 松下电器产业株式会社 片状线圈

Also Published As

Publication number Publication date
US6084500A (en) 2000-07-04
KR100283371B1 (ko) 2001-04-02
EP0921542A1 (de) 1999-06-09
EP0921542B1 (de) 2005-11-09
US6388550B1 (en) 2002-05-14
WO1998044520A1 (fr) 1998-10-08
KR20000016006A (ko) 2000-03-25
DE69832249T2 (de) 2006-05-24
EP0921542A4 (de) 2000-06-07

Similar Documents

Publication Publication Date Title
DE69832249D1 (de) Chip-induktivität und sein herstellungsverfahren
DE69929456D1 (de) Nahfeldabtastkopf und herstellungsverfahren
DE69834561D1 (de) Halbleiteranordnung und herstellungsverfahren dafür
DE69831541D1 (de) Endoskop und sein herstellungsverfahren
DE69805936T2 (de) Wendelantenne und Erstellungsverfahren
DE69528938D1 (de) Induktivität und Herstellungsverfahren
DE69841064D1 (de) Widerstand und Herstellungsverfahren dafür
DE69808948T2 (de) Stossfänger und herstellungsverfahren
DE69811459D1 (de) Chip Kügelchen und Herstellungsverfahren
DE69935701D1 (de) Schalterstruktur und Herstellverfahren
DE69535861D1 (de) Wafer und sein Herstellungsverfahren
DE69831999D1 (de) Magnetkopf und Herstellungsverfahren
DE69802366D1 (de) Stossfänger- tragkörper und sein herstellungsverfahren
DE69904731D1 (de) Feinzerkleinerer und feinzerkleinerungsverfahren
DE69522846T2 (de) Verbesserte Speicheranordnung und Herstellungsverfahren
DE69820182D1 (de) Bodenbelag und zugehöriges Herstellungsverfahren
DE69801342T2 (de) Halbleiterlaser und dazugehöriges Herstellungsverfahren
DE19638373B8 (de) Halbleitersensor und sein Herstellungsverfahren
DE69941874D1 (de) Optielektronisches bauelement und herstellungsverfahren
DE69700155T2 (de) Durchscheinendes polykristalines Aluminiumoxyd und Herstellungsverfahren
DE69712541D1 (de) Halbleiterlaser und Herstellungsverfahren
DE69708771T2 (de) Laufrad und sein Herstellungsverfahren
DE69713155D1 (de) Halbleiteranordnung und herstellungsverfahren
DE69805736T2 (de) Umformverfahren und Umformwerkzeug
DE69837307D1 (de) Verbinder und Herstellungsverfahren

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

8320 Willingness to grant licences declared (paragraph 23)
8339 Ceased/non-payment of the annual fee