DE69832566D1 - Halbleiterspeicher mit hierarchischer Bitleitungsstruktur aus nicht-uniformen lokalen Bitleitungen - Google Patents

Halbleiterspeicher mit hierarchischer Bitleitungsstruktur aus nicht-uniformen lokalen Bitleitungen

Info

Publication number
DE69832566D1
DE69832566D1 DE69832566T DE69832566T DE69832566D1 DE 69832566 D1 DE69832566 D1 DE 69832566D1 DE 69832566 T DE69832566 T DE 69832566T DE 69832566 T DE69832566 T DE 69832566T DE 69832566 D1 DE69832566 D1 DE 69832566D1
Authority
DE
Germany
Prior art keywords
semiconductor memory
line structure
bit line
bit lines
uniform local
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69832566T
Other languages
English (en)
Other versions
DE69832566T2 (de
Inventor
Gerhard Mueller
Heinz Hoenigschmid
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qimonda AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Publication of DE69832566D1 publication Critical patent/DE69832566D1/de
Application granted granted Critical
Publication of DE69832566T2 publication Critical patent/DE69832566T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/18—Bit line organisation; Bit line lay-out
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
    • G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
    • G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
    • G11C11/409—Read-write [R-W] circuits 
    • G11C11/4097—Bit-line organisation, e.g. bit-line layout, folded bit lines
DE69832566T 1997-09-30 1998-09-04 Halbleiterspeicher mit hierarchischer Bitleitungsstruktur aus nicht-uniformen lokalen Bitleitungen Expired - Lifetime DE69832566T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/942,275 US5966315A (en) 1997-09-30 1997-09-30 Semiconductor memory having hierarchical bit line architecture with non-uniform local bit lines
US942275 1997-09-30

Publications (2)

Publication Number Publication Date
DE69832566D1 true DE69832566D1 (de) 2006-01-05
DE69832566T2 DE69832566T2 (de) 2006-08-10

Family

ID=25477844

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69832566T Expired - Lifetime DE69832566T2 (de) 1997-09-30 1998-09-04 Halbleiterspeicher mit hierarchischer Bitleitungsstruktur aus nicht-uniformen lokalen Bitleitungen

Country Status (7)

Country Link
US (1) US5966315A (de)
EP (1) EP0905701B1 (de)
JP (1) JPH11167792A (de)
KR (1) KR100575044B1 (de)
CN (1) CN1124610C (de)
DE (1) DE69832566T2 (de)
TW (1) TW410350B (de)

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US6154864A (en) * 1998-05-19 2000-11-28 Micron Technology, Inc. Read only memory embedded in a dynamic random access memory
US6018489A (en) * 1998-09-17 2000-01-25 Vanguard International Semiconductor Corporation Mock wordline scheme for timing control
US6333866B1 (en) * 1998-09-28 2001-12-25 Texas Instruments Incorporated Semiconductor device array having dense memory cell array and heirarchical bit line scheme
DE19944738C2 (de) * 1999-09-17 2001-08-02 Infineon Technologies Ag Segmentierte Wortleitungsarchitektur zur Aufteilung einer Wortleitung in mehrere Bänke für Zellenfelder mit langen Bitleitungen
GB2363231B (en) * 1999-09-24 2002-05-08 Clearspeed Technology Ltd Memory devices
DE10004109C2 (de) * 2000-01-31 2001-11-29 Infineon Technologies Ag Speicherbaustein mit geringer Zugriffszeit
JP4936582B2 (ja) * 2000-07-28 2012-05-23 ルネサスエレクトロニクス株式会社 半導体記憶装置
DE10121837C1 (de) * 2001-05-04 2002-12-05 Infineon Technologies Ag Speicherschaltung mit mehreren Speicherbereichen
US6603693B2 (en) 2001-12-12 2003-08-05 Micron Technology, Inc. DRAM with bias sensing
US6545899B1 (en) 2001-12-12 2003-04-08 Micron Technology, Inc. ROM embedded DRAM with bias sensing
US6747889B2 (en) * 2001-12-12 2004-06-08 Micron Technology, Inc. Half density ROM embedded DRAM
US20030115538A1 (en) * 2001-12-13 2003-06-19 Micron Technology, Inc. Error correction in ROM embedded DRAM
US20030185062A1 (en) * 2002-03-28 2003-10-02 Micron Technology, Inc. Proximity lookup for large arrays
US6785167B2 (en) * 2002-06-18 2004-08-31 Micron Technology, Inc. ROM embedded DRAM with programming
US6781867B2 (en) * 2002-07-11 2004-08-24 Micron Technology, Inc. Embedded ROM device using substrate leakage
US6865100B2 (en) * 2002-08-12 2005-03-08 Micron Technology, Inc. 6F2 architecture ROM embedded DRAM
US7174477B2 (en) * 2003-02-04 2007-02-06 Micron Technology, Inc. ROM redundancy in ROM embedded DRAM
KR100612953B1 (ko) * 2004-03-31 2006-08-14 주식회사 하이닉스반도체 비트라인의 고속 센싱을 위한 반도체 메모리 소자
KR100600056B1 (ko) 2004-10-30 2006-07-13 주식회사 하이닉스반도체 저 전압용 반도체 메모리 장치
US7088638B1 (en) 2005-02-09 2006-08-08 International Business Machines Corporation Global and local read control synchronization method and system for a memory array configured with multiple memory subarrays
DE102006010762B3 (de) * 2006-03-08 2007-10-04 Infineon Technologies Ag Integrierter Halbleiterspeicher
KR100780954B1 (ko) 2006-08-04 2007-12-03 삼성전자주식회사 감지증폭기 및 이를 구비하는 반도체 메모리 장치, 그리고데이터 센싱 방법
US20080031029A1 (en) * 2006-08-05 2008-02-07 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor memory device with split bit-line structure
DE102007012902B3 (de) * 2007-03-19 2008-07-10 Qimonda Ag Kopplungsoptimierte Anschlusskonfiguration von Signalleitungen und Verstärkern
US8144537B2 (en) * 2008-11-11 2012-03-27 Stmicroelectronics Pvt. Ltd. Balanced sense amplifier for single ended bitline memory architecture
US8050127B2 (en) * 2009-02-06 2011-11-01 Hynix Semiconductor Inc. Semiconductor memory device
JP2010192052A (ja) * 2009-02-19 2010-09-02 Hitachi Ulsi Systems Co Ltd 半導体装置
TW201142869A (en) * 2010-02-09 2011-12-01 Samsung Electronics Co Ltd Memory device from which dummy edge memory block is removed
US9275721B2 (en) * 2010-07-30 2016-03-01 Taiwan Semiconductor Manufacturing Company, Ltd. Split bit line architecture circuits and methods for memory devices
KR102393976B1 (ko) 2015-05-20 2022-05-04 삼성전자주식회사 반도체 메모리 소자
US9601162B1 (en) 2015-09-10 2017-03-21 Taiwan Semiconductor Manufacturing Co., Ltd. Memory devices with strap cells
US9659635B1 (en) * 2016-01-29 2017-05-23 Taiwan Semiconductor Manufacturing Company, Ltd. Memory array with bit-lines connected to different sub-arrays through jumper structures
US10964683B2 (en) * 2017-08-30 2021-03-30 Taiwan Semiconductor Manufacturing Company, Ltd. Memory array circuit and method of manufacturing the same
US10776277B2 (en) 2017-10-31 2020-09-15 Sandisk Technologies Llc Partial memory die with inter-plane re-mapping
US10290354B1 (en) 2017-10-31 2019-05-14 Sandisk Technologies Llc Partial memory die
US10854619B2 (en) 2018-12-07 2020-12-01 Sandisk Technologies Llc Three-dimensional memory device containing bit line switches
US10734080B2 (en) 2018-12-07 2020-08-04 Sandisk Technologies Llc Three-dimensional memory device containing bit line switches
US10741535B1 (en) 2019-02-14 2020-08-11 Sandisk Technologies Llc Bonded assembly containing multiple memory dies sharing peripheral circuitry on a support die and methods for making the same
US10879260B2 (en) 2019-02-28 2020-12-29 Sandisk Technologies Llc Bonded assembly of a support die and plural memory dies containing laterally shifted vertical interconnections and methods for making the same
DE102020105669A1 (de) 2019-12-31 2021-07-01 Taiwan Semiconductor Manufacturing Co., Ltd. Integrierte schaltung
CN113129944A (zh) 2019-12-31 2021-07-16 台湾积体电路制造股份有限公司 集成电路及其方法
US11631690B2 (en) 2020-12-15 2023-04-18 Sandisk Technologies Llc Three-dimensional memory device including trench-isolated memory planes and method of making the same
US11587610B2 (en) 2021-05-28 2023-02-21 Microsoft Technology Licensing, Llc Memory having flying bitlines for improved burst mode read operations

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4636988A (en) * 1985-01-07 1987-01-13 Thomson Components-Mostek Corporation CMOS memory arrangement with reduced data line compacitance
JP3626510B2 (ja) * 1993-04-13 2005-03-09 株式会社ルネサステクノロジ 半導体記憶装置
JP3672946B2 (ja) * 1993-11-30 2005-07-20 株式会社ルネサステクノロジ 半導体記憶装置
JP4179402B2 (ja) * 1996-02-15 2008-11-12 富士通マイクロエレクトロニクス株式会社 半導体記憶装置
KR0166046B1 (ko) * 1995-10-06 1999-02-01 김주용 계층적 비트라인 구조를 갖는 반도체 메모리 장치

Also Published As

Publication number Publication date
EP0905701A3 (de) 1999-12-08
US5966315A (en) 1999-10-12
CN1124610C (zh) 2003-10-15
EP0905701A2 (de) 1999-03-31
JPH11167792A (ja) 1999-06-22
EP0905701B1 (de) 2005-11-30
DE69832566T2 (de) 2006-08-10
KR100575044B1 (ko) 2006-10-25
KR19990030297A (ko) 1999-04-26
CN1218960A (zh) 1999-06-09
TW410350B (en) 2000-11-01

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: QIMONDA AG, 81739 MUENCHEN, DE