DE69834771D1 - Verbundkörper aus Keramik und Verfahren zu seiner Herstellung - Google Patents
Verbundkörper aus Keramik und Verfahren zu seiner HerstellungInfo
- Publication number
- DE69834771D1 DE69834771D1 DE69834771T DE69834771T DE69834771D1 DE 69834771 D1 DE69834771 D1 DE 69834771D1 DE 69834771 T DE69834771 T DE 69834771T DE 69834771 T DE69834771 T DE 69834771T DE 69834771 D1 DE69834771 D1 DE 69834771D1
- Authority
- DE
- Germany
- Prior art keywords
- production
- ceramic composite
- composite body
- ceramic
- composite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16458297A JP3746594B2 (ja) | 1997-06-20 | 1997-06-20 | セラミックスの接合構造およびその製造方法 |
JP16458297 | 1997-06-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69834771D1 true DE69834771D1 (de) | 2006-07-20 |
DE69834771T2 DE69834771T2 (de) | 2007-05-16 |
Family
ID=15795918
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69834771T Expired - Lifetime DE69834771T2 (de) | 1997-06-20 | 1998-06-15 | Verbundkörper aus Keramik und Verfahren zu seiner Herstellung |
Country Status (6)
Country | Link |
---|---|
US (1) | US6617514B1 (de) |
EP (1) | EP0886312B1 (de) |
JP (1) | JP3746594B2 (de) |
KR (1) | KR100283600B1 (de) |
DE (1) | DE69834771T2 (de) |
TW (1) | TW407298B (de) |
Families Citing this family (54)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4005268B2 (ja) | 1999-06-01 | 2007-11-07 | 日本碍子株式会社 | セラミックスと金属との接合構造およびこれに使用する中間挿入材 |
JP2001110879A (ja) * | 1999-06-09 | 2001-04-20 | Ibiden Co Ltd | 半導体製造・検査装置用セラミック基板 |
JP2001110878A (ja) * | 1999-06-09 | 2001-04-20 | Ibiden Co Ltd | 半導体製造・検査装置用セラミック基板 |
SG89286A1 (en) * | 1999-07-12 | 2002-06-18 | Mitsubishi Electric Corp | Insulating operating rod and manufacturing method therefor |
US20020022403A1 (en) * | 1999-08-06 | 2002-02-21 | Wing L. Cheng | Connectors for an eletrostatic chuck |
US6603650B1 (en) * | 1999-12-09 | 2003-08-05 | Saint-Gobain Ceramics And Plastics, Inc. | Electrostatic chuck susceptor and method for fabrication |
WO2001043184A2 (en) | 1999-12-09 | 2001-06-14 | Saint-Gobain Ceramics & Plastics, Inc. | Electrostatic chucks with flat film electrode |
US6723274B1 (en) | 1999-12-09 | 2004-04-20 | Saint-Gobain Ceramics & Plastics, Inc. | High-purity low-resistivity electrostatic chucks |
US6607843B2 (en) * | 2000-02-02 | 2003-08-19 | Quallion Llc | Brazed ceramic seal for batteries with titanium-titanium-6A1-4V cases |
JP3729785B2 (ja) | 2000-04-14 | 2005-12-21 | イビデン株式会社 | セラミックヒータ |
JP2002226281A (ja) * | 2001-01-25 | 2002-08-14 | Sumitomo Electric Ind Ltd | 接合構造とその製造方法 |
US7252872B2 (en) | 2003-01-29 | 2007-08-07 | Ngk Insulators, Ltd. | Joined structures of ceramics |
JP4542485B2 (ja) * | 2004-12-14 | 2010-09-15 | 日本碍子株式会社 | アルミナ部材及びその製造方法 |
JP2006236867A (ja) * | 2005-02-25 | 2006-09-07 | Ngk Insulators Ltd | プラズマ処理部材 |
JP4510745B2 (ja) | 2005-10-28 | 2010-07-28 | 日本碍子株式会社 | セラミックス基材と電力供給用コネクタの接合構造 |
JP2007258610A (ja) | 2006-03-24 | 2007-10-04 | Ngk Insulators Ltd | アルミナ焼成体 |
US20070251938A1 (en) * | 2006-04-26 | 2007-11-01 | Watlow Electric Manufacturing Company | Ceramic heater and method of securing a thermocouple thereto |
JP4762208B2 (ja) | 2006-07-19 | 2011-08-31 | 日本碍子株式会社 | 静電チャックヒータ |
US7848075B2 (en) | 2006-07-19 | 2010-12-07 | Ngk Insulators, Ltd. | Electrostatic chuck with heater |
JP4394667B2 (ja) | 2006-08-22 | 2010-01-06 | 日本碍子株式会社 | ヒータ付き静電チャックの製造方法 |
WO2008087983A1 (ja) * | 2007-01-17 | 2008-07-24 | Tokyo Electron Limited | 載置台構造及び処理装置 |
JP5029257B2 (ja) * | 2007-01-17 | 2012-09-19 | 東京エレクトロン株式会社 | 載置台構造及び処理装置 |
JP4858319B2 (ja) * | 2007-06-07 | 2012-01-18 | 住友電気工業株式会社 | ウェハ保持体の電極接続構造 |
JP5174582B2 (ja) * | 2007-08-30 | 2013-04-03 | 日本碍子株式会社 | 接合構造体 |
KR100932233B1 (ko) * | 2007-11-06 | 2009-12-16 | 주식회사 메카로닉스 | 히터 제조방법 |
US8480806B2 (en) * | 2008-01-08 | 2013-07-09 | Ngk Insulators, Ltd. | Bonding structure and semiconductor device manufacturing apparatus |
US8414704B2 (en) * | 2008-01-08 | 2013-04-09 | Ngk Insulators, Ltd. | Bonding structure and semiconductor device manufacturing apparatus |
TWI450353B (zh) * | 2008-01-08 | 2014-08-21 | Ngk Insulators Ltd | A bonding structure and a semiconductor manufacturing apparatus |
JP5143029B2 (ja) * | 2008-01-08 | 2013-02-13 | 日本碍子株式会社 | 接合構造及び半導体製造装置 |
JP5214414B2 (ja) * | 2008-11-21 | 2013-06-19 | 日本特殊陶業株式会社 | 半導体製造装置用接続部及び半導体製造装置用接続部の形成方法 |
JP5717248B2 (ja) * | 2011-03-30 | 2015-05-13 | 黒崎播磨株式会社 | 静電チャックの給電部及びその製造方法 |
JP5968651B2 (ja) * | 2011-03-31 | 2016-08-10 | 日本碍子株式会社 | 半導体製造装置用部材 |
KR101339981B1 (ko) * | 2011-11-29 | 2013-12-11 | (주)티티에스 | 기판 지지 모듈 |
JP5642722B2 (ja) * | 2012-02-06 | 2014-12-17 | 日本特殊陶業株式会社 | 半導体製造装置用接続部及び半導体製造装置用接続部の形成方法 |
KR102037920B1 (ko) * | 2012-12-05 | 2019-10-29 | 세메스 주식회사 | 가열유닛 |
JP6235226B2 (ja) * | 2013-04-09 | 2017-11-22 | 日本特殊陶業株式会社 | 接合構造体及び半導体素子収納用パッケージ |
KR101727255B1 (ko) * | 2015-02-23 | 2017-04-14 | 주식회사 케이에스엠컴포넌트 | 세라믹 히터 결합구조 |
JP6666717B2 (ja) * | 2015-12-28 | 2020-03-18 | 日本特殊陶業株式会社 | セラミックス部材 |
US20170211185A1 (en) * | 2016-01-22 | 2017-07-27 | Applied Materials, Inc. | Ceramic showerhead with embedded conductive layers |
JP6693832B2 (ja) * | 2016-07-29 | 2020-05-13 | 日本特殊陶業株式会社 | セラミックス部材 |
KR102583758B1 (ko) * | 2016-08-19 | 2023-10-04 | 엘지이노텍 주식회사 | 세라믹 히터 및 이를 이용한 전기 자동차의 난방 장치 |
JP2018203581A (ja) * | 2017-06-07 | 2018-12-27 | 日本特殊陶業株式会社 | セラミックス構造体 |
JP7025268B2 (ja) | 2018-04-04 | 2022-02-24 | 日本特殊陶業株式会社 | セラミックス構造体 |
JP7010750B2 (ja) * | 2018-04-04 | 2022-01-26 | 日本特殊陶業株式会社 | セラミックス部材および緩衝部材の製造方法 |
KR102054732B1 (ko) | 2018-04-09 | 2019-12-11 | (주)티티에스 | 히터의 로드 접속 구조 |
KR102054733B1 (ko) | 2018-04-09 | 2019-12-11 | (주)티티에스 | 히터의 단자접합 구조 |
KR102331072B1 (ko) * | 2018-04-27 | 2021-11-29 | 엔지케이 인슐레이터 엘티디 | 웨이퍼 지지대 |
JP7227806B2 (ja) * | 2019-03-18 | 2023-02-22 | 日本特殊陶業株式会社 | 保持装置 |
KR102527439B1 (ko) | 2019-03-26 | 2023-04-28 | 니뽄 도쿠슈 도교 가부시키가이샤 | 전극 매설 부재 및 그 제조 방법, 정전 척, 세라믹스제 히터 |
JP7143256B2 (ja) * | 2019-07-01 | 2022-09-28 | 日本碍子株式会社 | ウエハ載置台及びその製法 |
KR102254204B1 (ko) * | 2020-10-12 | 2021-05-21 | 주식회사 미코세라믹스 | 세라믹 히터 |
KR20220147395A (ko) | 2021-04-27 | 2022-11-03 | 주성엔지니어링(주) | 단자대, 히터블록 및 히터블록 제조방법 |
KR102597592B1 (ko) * | 2021-10-08 | 2023-11-02 | (주)엘오티씨이에스 | 전력 공급 유닛, 그리고 이를 포함하는 기판 지지 척 |
CN115464302A (zh) * | 2022-10-14 | 2022-12-13 | 中国航发北京航空材料研究院 | 一种多活性组元钎料及原位生成高熵陶瓷相接头的方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02302381A (ja) | 1989-05-13 | 1990-12-14 | Shinko Electric Ind Co Ltd | セラミック体とモリブデン線の接合方法 |
US4996116A (en) | 1989-12-21 | 1991-02-26 | General Electric Company | Enhanced direct bond structure |
MX9302780A (es) | 1992-05-12 | 1993-11-01 | Carborundum Co | Metalizacion de pelicula fina y latonado de nitruro de aluminio. |
JP3866320B2 (ja) | 1995-02-09 | 2007-01-10 | 日本碍子株式会社 | 接合体、および接合体の製造方法 |
JP3813654B2 (ja) | 1995-02-09 | 2006-08-23 | 日本碍子株式会社 | セラミックスの接合構造およびその製造方法 |
JP3368725B2 (ja) | 1995-06-30 | 2003-01-20 | 株式会社豊田中央研究所 | 粘土複合材料及びその製造方法,並びにブレンド材料 |
US5794838A (en) | 1995-07-14 | 1998-08-18 | Ngk Insulators, Ltd. | Ceramics joined body and method of joining ceramics |
JP3790000B2 (ja) | 1997-01-27 | 2006-06-28 | 日本碍子株式会社 | セラミックス部材と電力供給用コネクターとの接合構造 |
JP3954177B2 (ja) | 1997-01-29 | 2007-08-08 | 日本碍子株式会社 | 金属部材とセラミックス部材との接合構造およびその製造方法 |
-
1997
- 1997-06-20 JP JP16458297A patent/JP3746594B2/ja not_active Expired - Lifetime
-
1998
- 1998-06-02 TW TW087108665A patent/TW407298B/zh not_active IP Right Cessation
- 1998-06-10 US US09/095,157 patent/US6617514B1/en not_active Expired - Lifetime
- 1998-06-11 KR KR1019980021650A patent/KR100283600B1/ko not_active IP Right Cessation
- 1998-06-15 DE DE69834771T patent/DE69834771T2/de not_active Expired - Lifetime
- 1998-06-15 EP EP98304719A patent/EP0886312B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0886312A2 (de) | 1998-12-23 |
EP0886312B1 (de) | 2006-06-07 |
KR100283600B1 (ko) | 2001-03-02 |
JPH1112053A (ja) | 1999-01-19 |
TW407298B (en) | 2000-10-01 |
KR19990006874A (ko) | 1999-01-25 |
DE69834771T2 (de) | 2007-05-16 |
EP0886312A3 (de) | 1999-11-03 |
US6617514B1 (en) | 2003-09-09 |
JP3746594B2 (ja) | 2006-02-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |