DE69909205D1 - Verfahren zur Herstellung vertikaler Transistoren - Google Patents
Verfahren zur Herstellung vertikaler TransistorenInfo
- Publication number
- DE69909205D1 DE69909205D1 DE69909205T DE69909205T DE69909205D1 DE 69909205 D1 DE69909205 D1 DE 69909205D1 DE 69909205 T DE69909205 T DE 69909205T DE 69909205 T DE69909205 T DE 69909205T DE 69909205 D1 DE69909205 D1 DE 69909205D1
- Authority
- DE
- Germany
- Prior art keywords
- vertical transistors
- manufacturing vertical
- manufacturing
- transistors
- vertical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66666—Vertical transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System
- H01L29/161—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System including two or more of the elements provided for in group H01L29/16, e.g. alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7827—Vertical transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78642—Vertical transistors
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/143,274 US6027975A (en) | 1998-08-28 | 1998-08-28 | Process for fabricating vertical transistors |
US143274 | 1998-08-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69909205D1 true DE69909205D1 (de) | 2003-08-07 |
DE69909205T2 DE69909205T2 (de) | 2004-04-15 |
Family
ID=22503349
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69909205T Expired - Lifetime DE69909205T2 (de) | 1998-08-28 | 1999-08-17 | Verfahren zur Herstellung vertikaler Transistoren |
Country Status (5)
Country | Link |
---|---|
US (1) | US6027975A (de) |
EP (1) | EP0989599B1 (de) |
JP (1) | JP3506965B2 (de) |
KR (1) | KR100572647B1 (de) |
DE (1) | DE69909205T2 (de) |
Families Citing this family (65)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6328794B1 (en) * | 1993-06-26 | 2001-12-11 | International Business Machines Corporation | Method of controlling stress in a film |
US6027975A (en) * | 1998-08-28 | 2000-02-22 | Lucent Technologies Inc. | Process for fabricating vertical transistors |
US6245623B1 (en) * | 1998-11-06 | 2001-06-12 | Advanced Micro Devices, Inc. | CMOS semiconductor device containing N-channel transistor having shallow LDD junctions |
KR100281124B1 (ko) * | 1999-01-20 | 2001-01-15 | 김영환 | 반도체소자 및 그의 제조방법 |
TW410382B (en) * | 1999-06-11 | 2000-11-01 | United Microelectronics Corp | Method of manufacturing forming metal oxide semiconductor transistor with raised source/drain |
EP1063697B1 (de) * | 1999-06-18 | 2003-03-12 | Lucent Technologies Inc. | Fertigungsverfahren zur Herstellung eines CMOS integrieten Schaltkreises mit vertikalen Transistoren |
US6551946B1 (en) | 1999-06-24 | 2003-04-22 | Agere Systems Inc. | Two-step oxidation process for oxidizing a silicon substrate wherein the first step is carried out at a temperature below the viscoelastic temperature of silicon dioxide and the second step is carried out at a temperature above the viscoelastic temperature |
US6670242B1 (en) | 1999-06-24 | 2003-12-30 | Agere Systems Inc. | Method for making an integrated circuit device including a graded, grown, high quality gate oxide layer and a nitride layer |
US20030235957A1 (en) * | 2002-06-25 | 2003-12-25 | Samir Chaudhry | Method and structure for graded gate oxides on vertical and non-planar surfaces |
US6506653B1 (en) * | 2000-03-13 | 2003-01-14 | International Business Machines Corporation | Method using disposable and permanent films for diffusion and implant doping |
US6518622B1 (en) * | 2000-03-20 | 2003-02-11 | Agere Systems Inc. | Vertical replacement gate (VRG) MOSFET with a conductive layer adjacent a source/drain region and method of manufacture therefor |
US6603168B1 (en) * | 2000-04-20 | 2003-08-05 | Agere Systems Inc. | Vertical DRAM device with channel access transistor and stacked storage capacitor and associated method |
US6300199B1 (en) | 2000-05-24 | 2001-10-09 | Micron Technology, Inc. | Method of defining at least two different field effect transistor channel lengths using differently angled sidewall segments of a channel defining layer |
KR100594218B1 (ko) * | 2000-05-30 | 2006-07-03 | 삼성전자주식회사 | 수직채널형 mos 트랜지스터의 채널형성 방법 |
FR2810792B1 (fr) * | 2000-06-22 | 2003-07-04 | Commissariat Energie Atomique | Transistor mos vertical a grille enterree et procede de fabrication de celui-ci |
US6903411B1 (en) * | 2000-08-25 | 2005-06-07 | Agere Systems Inc. | Architecture for circuit connection of a vertical transistor |
US6617173B1 (en) * | 2000-10-11 | 2003-09-09 | Genus, Inc. | Integration of ferromagnetic films with ultrathin insulating film using atomic layer deposition |
US6506638B1 (en) * | 2000-10-12 | 2003-01-14 | Advanced Micro Devices, Inc. | Vertical double gate transistor structure |
US6599789B1 (en) * | 2000-11-15 | 2003-07-29 | Micron Technology, Inc. | Method of forming a field effect transistor |
US6664143B2 (en) * | 2000-11-22 | 2003-12-16 | North Carolina State University | Methods of fabricating vertical field effect transistors by conformal channel layer deposition on sidewalls |
KR100393208B1 (ko) | 2001-01-15 | 2003-07-31 | 삼성전자주식회사 | 도핑된 다결정 실리콘-저매니움막을 이용한 반도체 소자및 그 제조방법 |
US6455377B1 (en) * | 2001-01-19 | 2002-09-24 | Chartered Semiconductor Manufacturing Ltd. | Method to form very high mobility vertical channel transistor by selective deposition of SiGe or multi-quantum wells (MQWs) |
JP4866534B2 (ja) | 2001-02-12 | 2012-02-01 | エーエスエム アメリカ インコーポレイテッド | 半導体膜の改良された堆積方法 |
US7026219B2 (en) * | 2001-02-12 | 2006-04-11 | Asm America, Inc. | Integration of high k gate dielectric |
US6706603B2 (en) * | 2001-02-23 | 2004-03-16 | Agere Systems Inc. | Method of forming a semiconductor device |
US6518616B2 (en) | 2001-04-18 | 2003-02-11 | International Business Machines Corporation | Vertical gate top engineering for improved GC and CB process windows |
US6780735B2 (en) * | 2001-04-30 | 2004-08-24 | International Business Machines Corporation | Method to increase carbon and boron doping concentrations in Si and SiGe films |
US6551942B2 (en) | 2001-06-15 | 2003-04-22 | International Business Machines Corporation | Methods for etching tungsten stack structures |
US6690040B2 (en) * | 2001-09-10 | 2004-02-10 | Agere Systems Inc. | Vertical replacement-gate junction field-effect transistor |
US20030052365A1 (en) * | 2001-09-18 | 2003-03-20 | Samir Chaudhry | Structure and fabrication method for capacitors integratible with vertical replacement gate transistors |
US6759730B2 (en) * | 2001-09-18 | 2004-07-06 | Agere Systems Inc. | Bipolar junction transistor compatible with vertical replacement gate transistor |
US6686604B2 (en) * | 2001-09-21 | 2004-02-03 | Agere Systems Inc. | Multiple operating voltage vertical replacement-gate (VRG) transistor |
US6709904B2 (en) * | 2001-09-28 | 2004-03-23 | Agere Systems Inc. | Vertical replacement-gate silicon-on-insulator transistor |
US6429109B1 (en) | 2001-12-14 | 2002-08-06 | Chartered Semiconductor Manufacturing Ltd | Method to form high k dielectric and silicide to reduce poly depletion by using a sacrificial metal between oxide and gate |
US6773994B2 (en) | 2001-12-26 | 2004-08-10 | Agere Systems Inc. | CMOS vertical replacement gate (VRG) transistors |
US7186630B2 (en) * | 2002-08-14 | 2007-03-06 | Asm America, Inc. | Deposition of amorphous silicon-containing films |
US7071043B2 (en) * | 2002-08-15 | 2006-07-04 | Micron Technology, Inc. | Methods of forming a field effect transistor having source/drain material over insulative material |
US6806126B1 (en) | 2002-09-06 | 2004-10-19 | Advanced Micro Devices, Inc. | Method of manufacturing a semiconductor component |
US7372091B2 (en) * | 2004-01-27 | 2008-05-13 | Micron Technology, Inc. | Selective epitaxy vertical integrated circuit components |
US7667250B2 (en) * | 2004-07-16 | 2010-02-23 | Aptina Imaging Corporation | Vertical gate device for an image sensor and method of forming the same |
US7241655B2 (en) * | 2004-08-30 | 2007-07-10 | Micron Technology, Inc. | Method of fabricating a vertical wrap-around-gate field-effect-transistor for high density, low voltage logic and memory array |
JP2006310651A (ja) * | 2005-04-28 | 2006-11-09 | Toshiba Corp | 半導体装置の製造方法 |
US20060255412A1 (en) * | 2005-05-13 | 2006-11-16 | Nirmal Ramaswamy | Enhanced access devices using selective epitaxial silicon over the channel region during the formation of a semiconductor device and systems including same |
US7504685B2 (en) | 2005-06-28 | 2009-03-17 | Micron Technology, Inc. | Oxide epitaxial isolation |
KR100675285B1 (ko) * | 2005-10-10 | 2007-01-29 | 삼성전자주식회사 | 수직 트랜지스터를 갖는 반도체소자 및 그 제조방법 |
US7491995B2 (en) | 2006-04-04 | 2009-02-17 | Micron Technology, Inc. | DRAM with nanofin transistors |
US7923373B2 (en) | 2007-06-04 | 2011-04-12 | Micron Technology, Inc. | Pitch multiplication using self-assembling materials |
KR20080110366A (ko) * | 2007-06-15 | 2008-12-18 | 주식회사 동부하이텍 | 반도체 소자의 게이트 형성 방법 |
KR101202158B1 (ko) * | 2007-12-05 | 2012-11-15 | 유니산티스 일렉트로닉스 싱가포르 프라이빗 리미티드 | 반도체 장치 |
US8896056B2 (en) * | 2007-12-05 | 2014-11-25 | Unisantis Electronics Singapore Pte Ltd. | Surrounding gate transistor semiconductor device |
US8078063B2 (en) * | 2008-02-05 | 2011-12-13 | Finisar Corporation | Monolithic power monitor and wavelength detector |
KR101559868B1 (ko) | 2008-02-29 | 2015-10-14 | 삼성전자주식회사 | 수직형 반도체 소자 및 이의 제조 방법. |
KR101031476B1 (ko) | 2008-07-25 | 2011-04-26 | 주식회사 하이닉스반도체 | 올 어라운드 게이트형 반도체 장치 및 그 제조 방법 |
JP4530098B1 (ja) * | 2009-05-29 | 2010-08-25 | 日本ユニサンティスエレクトロニクス株式会社 | 半導体装置 |
CN102931237B (zh) * | 2012-10-10 | 2015-07-22 | 哈尔滨工程大学 | 垂直非对称环栅mosfet器件的结构及其制造方法 |
CN102983171B (zh) * | 2012-12-11 | 2015-10-28 | 哈尔滨工程大学 | 垂直无结环栅mosfet器件的结构及其制造方法 |
US9012278B2 (en) * | 2013-10-03 | 2015-04-21 | Asm Ip Holding B.V. | Method of making a wire-based semiconductor device |
WO2015147866A1 (en) | 2014-03-28 | 2015-10-01 | Intel Corporation | Selectively regrown top contact for vertical semiconductor devices |
US20150380258A1 (en) * | 2014-06-25 | 2015-12-31 | Stmicroelectronics, Inc. | Method for controlling height of a fin structure |
WO2016031014A1 (ja) | 2014-08-28 | 2016-03-03 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッド | 半導体装置、及び、半導体装置の製造方法 |
US9882047B2 (en) | 2016-02-01 | 2018-01-30 | International Business Machines Corporation | Self-aligned replacement metal gate spacerless vertical field effect transistor |
US9711618B1 (en) | 2016-03-31 | 2017-07-18 | International Business Machines Corporation | Fabrication of vertical field effect transistor structure with controlled gate length |
US9954109B2 (en) | 2016-05-05 | 2018-04-24 | International Business Machines Corporation | Vertical transistor including controlled gate length and a self-aligned junction |
JP6310500B2 (ja) * | 2016-05-25 | 2018-04-11 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッドUnisantis Electronics Singapore Pte Ltd. | 半導体装置、及び、半導体装置の製造方法 |
US11239342B2 (en) | 2018-06-28 | 2022-02-01 | International Business Machines Corporation | Vertical transistors having improved control of top source or drain junctions |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60128654A (ja) * | 1983-12-16 | 1985-07-09 | Hitachi Ltd | 半導体集積回路 |
US5140388A (en) * | 1991-03-22 | 1992-08-18 | Hewlett-Packard Company | Vertical metal-oxide semiconductor devices |
JPH05183158A (ja) * | 1991-10-18 | 1993-07-23 | Nec Corp | 半導体装置およびその製造方法 |
US5612563A (en) * | 1992-03-02 | 1997-03-18 | Motorola Inc. | Vertically stacked vertical transistors used to form vertical logic gate structures |
JPH05267678A (ja) * | 1992-03-17 | 1993-10-15 | Rohm Co Ltd | 半導体装置およびその製造方法 |
JPH06169089A (ja) * | 1992-05-07 | 1994-06-14 | Nec Corp | 縦型mosfetの製造方法 |
JP3229012B2 (ja) * | 1992-05-21 | 2001-11-12 | 株式会社東芝 | 半導体装置の製造方法 |
US5324673A (en) * | 1992-11-19 | 1994-06-28 | Motorola, Inc. | Method of formation of vertical transistor |
US5918155A (en) * | 1995-03-13 | 1999-06-29 | Hitachi, Ltd. | Satellite communication system and method thereof |
JPH098290A (ja) * | 1995-06-20 | 1997-01-10 | Mitsubishi Electric Corp | 半導体装置及びその製造方法 |
US5943574A (en) * | 1998-02-23 | 1999-08-24 | Motorola, Inc. | Method of fabricating 3D multilayer semiconductor circuits |
US6027975A (en) * | 1998-08-28 | 2000-02-22 | Lucent Technologies Inc. | Process for fabricating vertical transistors |
-
1998
- 1998-08-28 US US09/143,274 patent/US6027975A/en not_active Expired - Lifetime
-
1999
- 1999-08-17 EP EP99306446A patent/EP0989599B1/de not_active Expired - Lifetime
- 1999-08-17 DE DE69909205T patent/DE69909205T2/de not_active Expired - Lifetime
- 1999-08-27 JP JP24066399A patent/JP3506965B2/ja not_active Expired - Fee Related
- 1999-08-27 KR KR1019990035816A patent/KR100572647B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2000091578A (ja) | 2000-03-31 |
EP0989599A1 (de) | 2000-03-29 |
DE69909205T2 (de) | 2004-04-15 |
US6027975A (en) | 2000-02-22 |
KR100572647B1 (ko) | 2006-04-24 |
EP0989599B1 (de) | 2003-07-02 |
JP3506965B2 (ja) | 2004-03-15 |
KR20000017583A (ko) | 2000-03-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |