DE69913610D1 - Herstellung von Durchkontaktierungen für mehrlagige, induktive oder andere Bauteile - Google Patents

Herstellung von Durchkontaktierungen für mehrlagige, induktive oder andere Bauteile

Info

Publication number
DE69913610D1
DE69913610D1 DE69913610T DE69913610T DE69913610D1 DE 69913610 D1 DE69913610 D1 DE 69913610D1 DE 69913610 T DE69913610 T DE 69913610T DE 69913610 T DE69913610 T DE 69913610T DE 69913610 D1 DE69913610 D1 DE 69913610D1
Authority
DE
Germany
Prior art keywords
inductive
plated
multilayer
manufacture
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69913610T
Other languages
English (en)
Other versions
DE69913610T2 (de
Inventor
John JIANG
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vishay Vitramon Inc
Original Assignee
Vishay Vitramon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vishay Vitramon Inc filed Critical Vishay Vitramon Inc
Publication of DE69913610D1 publication Critical patent/DE69913610D1/de
Application granted granted Critical
Publication of DE69913610T2 publication Critical patent/DE69913610T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H01F41/043—Printed circuit coils by thick film techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4647—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer around previously made via studs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H05K3/4667—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders characterized by using an inorganic intermediate insulating layer
DE69913610T 1998-06-24 1999-06-23 Herstellung von Durchkontaktierungen für mehrlagige, induktive oder andere Bauteile Expired - Fee Related DE69913610T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/103,962 US6207234B1 (en) 1998-06-24 1998-06-24 Via formation for multilayer inductive devices and other devices
US103962 1998-06-24

Publications (2)

Publication Number Publication Date
DE69913610D1 true DE69913610D1 (de) 2004-01-29
DE69913610T2 DE69913610T2 (de) 2004-09-30

Family

ID=22297941

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69913610T Expired - Fee Related DE69913610T2 (de) 1998-06-24 1999-06-23 Herstellung von Durchkontaktierungen für mehrlagige, induktive oder andere Bauteile

Country Status (5)

Country Link
US (1) US6207234B1 (de)
EP (1) EP0967624B1 (de)
JP (1) JP3500567B2 (de)
DE (1) DE69913610T2 (de)
HK (1) HK1024332A1 (de)

Families Citing this family (87)

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KR100328710B1 (ko) 1999-08-23 2002-03-20 박종섭 인덕터 및 그의 제조방법
US6689976B1 (en) * 2002-10-08 2004-02-10 Agilent Technologies, Inc. Electrically isolated liquid metal micro-switches for integrally shielded microcircuits
JP4039035B2 (ja) * 2001-10-31 2008-01-30 セイコーエプソン株式会社 線パターンの形成方法、線パターン、電気光学装置、電子機器、非接触型カード媒体
US7078849B2 (en) * 2001-10-31 2006-07-18 Agilent Technologies, Inc. Longitudinal piezoelectric optical latching relay
US20030178388A1 (en) * 2002-03-22 2003-09-25 Phillips Kenneth L. Inverted micro-vias
US6741767B2 (en) * 2002-03-28 2004-05-25 Agilent Technologies, Inc. Piezoelectric optical relay
US20030194170A1 (en) * 2002-04-10 2003-10-16 Wong Marvin Glenn Piezoelectric optical demultiplexing switch
US6750594B2 (en) 2002-05-02 2004-06-15 Agilent Technologies, Inc. Piezoelectrically actuated liquid metal switch
US6927529B2 (en) 2002-05-02 2005-08-09 Agilent Technologies, Inc. Solid slug longitudinal piezoelectric latching relay
US6756551B2 (en) 2002-05-09 2004-06-29 Agilent Technologies, Inc. Piezoelectrically actuated liquid metal switch
US6787719B2 (en) * 2002-12-12 2004-09-07 Agilent Technologies, Inc. Switch and method for producing the same
US6774324B2 (en) * 2002-12-12 2004-08-10 Agilent Technologies, Inc. Switch and production thereof
US20040112727A1 (en) * 2002-12-12 2004-06-17 Wong Marvin Glenn Laser cut channel plate for a switch
US7022926B2 (en) * 2002-12-12 2006-04-04 Agilent Technologies, Inc. Ultrasonically milled channel plate for a switch
US6743990B1 (en) 2002-12-12 2004-06-01 Agilent Technologies, Inc. Volume adjustment apparatus and method for use
US6855898B2 (en) * 2002-12-12 2005-02-15 Agilent Technologies, Inc. Ceramic channel plate for a switch
US6806793B2 (en) * 2002-12-13 2004-10-19 International Business Machines Corporation MLC frequency selective circuit structures
US7019235B2 (en) * 2003-01-13 2006-03-28 Agilent Technologies, Inc. Photoimaged channel plate for a switch
US6809277B2 (en) * 2003-01-22 2004-10-26 Agilent Technologies, Inc. Method for registering a deposited material with channel plate channels, and switch produced using same
US6747222B1 (en) * 2003-02-04 2004-06-08 Agilent Technologies, Inc. Feature formation in a nonphotoimagable material and switch incorporating same
US6825429B2 (en) * 2003-03-31 2004-11-30 Agilent Technologies, Inc. Hermetic seal and controlled impedance RF connections for a liquid metal micro switch
US6876132B2 (en) * 2003-04-14 2005-04-05 Agilent Technologies, Inc. Method and structure for a solid slug caterpillar piezoelectric relay
US7071432B2 (en) * 2003-04-14 2006-07-04 Agilent Technologies, Inc. Reduction of oxides in a fluid-based switch
US6818844B2 (en) * 2003-04-14 2004-11-16 Agilent Technologies, Inc. Method and structure for a slug assisted pusher-mode piezoelectrically actuated liquid metal optical switch
US6946776B2 (en) * 2003-04-14 2005-09-20 Agilent Technologies, Inc. Method and apparatus for maintaining a liquid metal switch in a ready-to-switch condition
US6894237B2 (en) * 2003-04-14 2005-05-17 Agilent Technologies, Inc. Formation of signal paths to increase maximum signal-carrying frequency of a fluid-based switch
US7070908B2 (en) * 2003-04-14 2006-07-04 Agilent Technologies, Inc. Feature formation in thick-film inks
US6831532B2 (en) * 2003-04-14 2004-12-14 Agilent Technologies, Inc. Push-mode latching relay
US6903493B2 (en) * 2003-04-14 2005-06-07 Agilent Technologies, Inc. Inserting-finger liquid metal relay
US6841746B2 (en) * 2003-04-14 2005-01-11 Agilent Technologies, Inc. Bent switching fluid cavity
US6903287B2 (en) * 2003-04-14 2005-06-07 Agilent Technologies, Inc. Liquid metal optical relay
US6838959B2 (en) * 2003-04-14 2005-01-04 Agilent Technologies, Inc. Longitudinal electromagnetic latching relay
US7012354B2 (en) * 2003-04-14 2006-03-14 Agilent Technologies, Inc. Method and structure for a pusher-mode piezoelectrically actuated liquid metal switch
US7048519B2 (en) * 2003-04-14 2006-05-23 Agilent Technologies, Inc. Closed-loop piezoelectric pump
US6770827B1 (en) 2003-04-14 2004-08-03 Agilent Technologies, Inc. Electrical isolation of fluid-based switches
US6768068B1 (en) 2003-04-14 2004-07-27 Agilent Technologies, Inc. Method and structure for a slug pusher-mode piezoelectrically actuated liquid metal switch
US20040201447A1 (en) * 2003-04-14 2004-10-14 Wong Marvin Glenn Thin-film resistor device
US6879088B2 (en) * 2003-04-14 2005-04-12 Agilent Technologies, Inc. Insertion-type liquid metal latching relay array
US6894424B2 (en) * 2003-04-14 2005-05-17 Agilent Technologies, Inc. High frequency push-mode latching relay
US6891116B2 (en) * 2003-04-14 2005-05-10 Agilent Technologies, Inc. Substrate with liquid electrode
US6876130B2 (en) * 2003-04-14 2005-04-05 Agilent Technologies, Inc. Damped longitudinal mode latching relay
US6794591B1 (en) 2003-04-14 2004-09-21 Agilent Technologies, Inc. Fluid-based switches
US6882088B2 (en) * 2003-04-14 2005-04-19 Agilent Technologies, Inc. Bending-mode latching relay
US6765161B1 (en) 2003-04-14 2004-07-20 Agilent Technologies, Inc. Method and structure for a slug caterpillar piezoelectric latching reflective optical relay
US6876133B2 (en) * 2003-04-14 2005-04-05 Agilent Technologies, Inc. Latching relay with switch bar
US6762378B1 (en) 2003-04-14 2004-07-13 Agilent Technologies, Inc. Liquid metal, latching relay with face contact
US6870111B2 (en) * 2003-04-14 2005-03-22 Agilent Technologies, Inc. Bending mode liquid metal switch
US6740829B1 (en) 2003-04-14 2004-05-25 Agilent Technologies, Inc. Insertion-type liquid metal latching relay
US6925223B2 (en) * 2003-04-14 2005-08-02 Agilent Technologies, Inc. Pressure actuated optical latching relay
US6961487B2 (en) * 2003-04-14 2005-11-01 Agilent Technologies, Inc. Method and structure for a pusher-mode piezoelectrically actuated liquid metal optical switch
US6803842B1 (en) 2003-04-14 2004-10-12 Agilent Technologies, Inc. Longitudinal mode solid slug optical latching relay
US6903490B2 (en) * 2003-04-14 2005-06-07 Agilent Technologies, Inc. Longitudinal mode optical latching relay
US6876131B2 (en) * 2003-04-14 2005-04-05 Agilent Technologies, Inc. High-frequency, liquid metal, latching relay with face contact
US6774325B1 (en) 2003-04-14 2004-08-10 Agilent Technologies, Inc. Reducing oxides on a switching fluid in a fluid-based switch
US6891315B2 (en) * 2003-04-14 2005-05-10 Agilent Technologies, Inc. Shear mode liquid metal switch
US6903492B2 (en) * 2003-04-14 2005-06-07 Agilent Technologies, Inc. Wetting finger latching piezoelectric relay
US6906271B2 (en) * 2003-04-14 2005-06-14 Agilent Technologies, Inc. Fluid-based switch
US6798937B1 (en) 2003-04-14 2004-09-28 Agilent Technologies, Inc. Pressure actuated solid slug optical latching relay
US6730866B1 (en) 2003-04-14 2004-05-04 Agilent Technologies, Inc. High-frequency, liquid metal, latching relay array
US6816641B2 (en) * 2003-04-14 2004-11-09 Agilent Technologies, Inc. Method and structure for a solid slug caterpillar piezoelectric optical relay
US6900578B2 (en) * 2003-04-14 2005-05-31 Agilent Technologies, Inc. High frequency latching relay with bending switch bar
US6946775B2 (en) * 2003-04-14 2005-09-20 Agilent Technologies, Inc. Method and structure for a slug assisted longitudinal piezoelectrically actuated liquid metal optical switch
US6885133B2 (en) * 2003-04-14 2005-04-26 Agilent Technologies, Inc. High frequency bending-mode latching relay
US6888977B2 (en) * 2003-04-14 2005-05-03 Agilent Technologies, Inc. Polymeric liquid metal optical switch
US6879089B2 (en) * 2003-04-14 2005-04-12 Agilent Technologies, Inc. Damped longitudinal mode optical latching relay
US6920259B2 (en) * 2003-04-14 2005-07-19 Agilent Technologies, Inc. Longitudinal electromagnetic latching optical relay
US6956990B2 (en) * 2003-04-14 2005-10-18 Agilent Technologies, Inc. Reflecting wedge optical wavelength multiplexer/demultiplexer
US6924443B2 (en) * 2003-04-14 2005-08-02 Agilent Technologies, Inc. Reducing oxides on a switching fluid in a fluid-based switch
US6750413B1 (en) 2003-04-25 2004-06-15 Agilent Technologies, Inc. Liquid metal micro switches using patterned thick film dielectric as channels and a thin ceramic or glass cover plate
US6777630B1 (en) 2003-04-30 2004-08-17 Agilent Technologies, Inc. Liquid metal micro switches using as channels and heater cavities matching patterned thick film dielectric layers on opposing thin ceramic plates
US6759610B1 (en) 2003-06-05 2004-07-06 Agilent Technologies, Inc. Multi-layer assembly of stacked LIMMS devices with liquid metal vias
US6759611B1 (en) 2003-06-16 2004-07-06 Agilent Technologies, Inc. Fluid-based switches and methods for producing the same
US6833520B1 (en) * 2003-06-16 2004-12-21 Agilent Technologies, Inc. Suspended thin-film resistor
US6781074B1 (en) 2003-07-30 2004-08-24 Agilent Technologies, Inc. Preventing corrosion degradation in a fluid-based switch
US6787720B1 (en) 2003-07-31 2004-09-07 Agilent Technologies, Inc. Gettering agent and method to prevent corrosion in a fluid switch
KR100665114B1 (ko) * 2005-01-07 2007-01-09 삼성전기주식회사 평면형 자성 인덕터의 제조 방법
JP4844045B2 (ja) * 2005-08-18 2011-12-21 Ｔｄｋ株式会社 電子部品及びその製造方法
FR2925222B1 (fr) * 2007-12-17 2010-04-16 Commissariat Energie Atomique Procede de realisation d'une interconnexion electrique entre deux couches conductrices
JP5382225B2 (ja) * 2010-07-29 2014-01-08 株式会社村田製作所 セラミック多層基板およびその製造方法
JP5280500B2 (ja) * 2011-08-25 2013-09-04 太陽誘電株式会社 巻線型インダクタ
KR20130051614A (ko) * 2011-11-10 2013-05-21 삼성전기주식회사 적층 세라믹 전자 부품 및 그 제조 방법
KR102052596B1 (ko) * 2014-06-25 2019-12-06 삼성전기주식회사 칩형 코일 부품 및 그 제조방법
KR101693749B1 (ko) * 2015-04-06 2017-01-06 삼성전기주식회사 인덕터 소자 및 그 제조방법
DE102015206173A1 (de) * 2015-04-07 2016-10-13 Würth Elektronik eiSos Gmbh & Co. KG Elektronisches Bauteil und Verfahren zum Herstellen eines elektronischen Bauteils
WO2017003789A1 (en) * 2015-06-30 2017-01-05 3M Innovative Properties Company Electronic devices comprising a via and methods of forming such electronic devices
WO2017124200A2 (en) * 2016-01-20 2017-07-27 Jaquet Technology Group Ag Manufacturing method for a sensing element and sensor device
US20200105453A1 (en) * 2018-10-01 2020-04-02 Texas Instruments Incorporated Inkjet printed electronic components

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US5302932A (en) * 1992-05-12 1994-04-12 Dale Electronics, Inc. Monolythic multilayer chip inductor and method for making same
JPH07167747A (ja) 1993-12-14 1995-07-04 Hitachi Ltd 内燃機関の二次空気供給システムの故障診断装置
US5650199A (en) * 1995-11-22 1997-07-22 Aem, Inc. Method of making a multilayer electronic component with inter-layer conductor connection utilizing a conductive via forming ink

Also Published As

Publication number Publication date
HK1024332A1 (en) 2000-10-05
DE69913610T2 (de) 2004-09-30
EP0967624A2 (de) 1999-12-29
JP2000114085A (ja) 2000-04-21
US6207234B1 (en) 2001-03-27
EP0967624B1 (de) 2003-12-17
EP0967624A3 (de) 2001-03-28
JP3500567B2 (ja) 2004-02-23

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Legal Events

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8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee