DE69914834D1 - Polierkissen - Google Patents
PolierkissenInfo
- Publication number
- DE69914834D1 DE69914834D1 DE69914834T DE69914834T DE69914834D1 DE 69914834 D1 DE69914834 D1 DE 69914834D1 DE 69914834 T DE69914834 T DE 69914834T DE 69914834 T DE69914834 T DE 69914834T DE 69914834 D1 DE69914834 D1 DE 69914834D1
- Authority
- DE
- Germany
- Prior art keywords
- polishing pad
- polishing
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
- B24D13/14—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
- B24D13/02—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery
- B24D13/12—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery comprising assemblies of felted or spongy material, e.g. felt, steel wool, foamed latex
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20001398A JP2918883B1 (ja) | 1998-07-15 | 1998-07-15 | 研磨パッド |
JP20001398 | 1998-07-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69914834D1 true DE69914834D1 (de) | 2004-03-25 |
DE69914834T2 DE69914834T2 (de) | 2005-01-13 |
Family
ID=16417356
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69914834T Expired - Fee Related DE69914834T2 (de) | 1998-07-15 | 1999-07-09 | Heizelemente und Herstellungsverfahren dafür |
Country Status (7)
Country | Link |
---|---|
US (1) | US6089965A (de) |
EP (1) | EP0972612B1 (de) |
JP (1) | JP2918883B1 (de) |
KR (1) | KR100307330B1 (de) |
CN (1) | CN1145201C (de) |
DE (1) | DE69914834T2 (de) |
TW (1) | TW402545B (de) |
Families Citing this family (57)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6569004B1 (en) * | 1999-12-30 | 2003-05-27 | Lam Research | Polishing pad and method of manufacture |
KR20010093677A (ko) * | 2000-03-29 | 2001-10-29 | 추후기재 | 향상된 슬러리 분배를 위하여 특수 설계된 연마 패드 |
US6530829B1 (en) * | 2001-08-30 | 2003-03-11 | Micron Technology, Inc. | CMP pad having isolated pockets of continuous porosity and a method for using such pad |
JP3731522B2 (ja) * | 2001-10-09 | 2006-01-05 | 日本ミクロコーティング株式会社 | クリーニングシート |
WO2003082524A1 (en) * | 2002-03-25 | 2003-10-09 | Thomas West, Inc | Smooth pads for cmp and polishing substrates |
US20040171339A1 (en) * | 2002-10-28 | 2004-09-02 | Cabot Microelectronics Corporation | Microporous polishing pads |
US6913517B2 (en) * | 2002-05-23 | 2005-07-05 | Cabot Microelectronics Corporation | Microporous polishing pads |
US20050276967A1 (en) * | 2002-05-23 | 2005-12-15 | Cabot Microelectronics Corporation | Surface textured microporous polishing pads |
US7311862B2 (en) * | 2002-10-28 | 2007-12-25 | Cabot Microelectronics Corporation | Method for manufacturing microporous CMP materials having controlled pore size |
US7435165B2 (en) | 2002-10-28 | 2008-10-14 | Cabot Microelectronics Corporation | Transparent microporous materials for CMP |
US7267607B2 (en) * | 2002-10-28 | 2007-09-11 | Cabot Microelectronics Corporation | Transparent microporous materials for CMP |
TW200521167A (en) * | 2003-12-31 | 2005-07-01 | San Fang Chemical Industry Co | Polymer sheet material and method for making the same |
US20070207687A1 (en) * | 2004-05-03 | 2007-09-06 | San Fang Chemical Industry Co., Ltd. | Method for producing artificial leather |
US8075372B2 (en) * | 2004-09-01 | 2011-12-13 | Cabot Microelectronics Corporation | Polishing pad with microporous regions |
TWI275679B (en) * | 2004-09-16 | 2007-03-11 | San Fang Chemical Industry Co | Artificial leather materials having elongational elasticity |
US20080149264A1 (en) * | 2004-11-09 | 2008-06-26 | Chung-Chih Feng | Method for Making Flameproof Environmentally Friendly Artificial Leather |
US20080318505A1 (en) * | 2004-11-29 | 2008-12-25 | Rajeev Bajaj | Chemical mechanical planarization pad and method of use thereof |
US7815778B2 (en) * | 2005-11-23 | 2010-10-19 | Semiquest Inc. | Electro-chemical mechanical planarization pad with uniform polish performance |
US7530880B2 (en) * | 2004-11-29 | 2009-05-12 | Semiquest Inc. | Method and apparatus for improved chemical mechanical planarization pad with pressure control and process monitor |
WO2006057714A2 (en) * | 2004-11-29 | 2006-06-01 | Rajeev Bajaj | Method and apparatus for improved chemical mechanical planarization pad with uniform polish performance |
US20090061744A1 (en) * | 2007-08-28 | 2009-03-05 | Rajeev Bajaj | Polishing pad and method of use |
US7846008B2 (en) * | 2004-11-29 | 2010-12-07 | Semiquest Inc. | Method and apparatus for improved chemical mechanical planarization and CMP pad |
US20070224925A1 (en) * | 2006-03-21 | 2007-09-27 | Rajeev Bajaj | Chemical Mechanical Polishing Pad |
WO2006057713A2 (en) * | 2004-11-29 | 2006-06-01 | Rajeev Bajaj | Electro-method and apparatus for improved chemical mechanical planarization pad with uniform polish performance |
US20080095945A1 (en) * | 2004-12-30 | 2008-04-24 | Ching-Tang Wang | Method for Making Macromolecular Laminate |
US7762871B2 (en) * | 2005-03-07 | 2010-07-27 | Rajeev Bajaj | Pad conditioner design and method of use |
US8398463B2 (en) * | 2005-03-07 | 2013-03-19 | Rajeev Bajaj | Pad conditioner and method |
TWI297049B (en) * | 2005-05-17 | 2008-05-21 | San Fang Chemical Industry Co | Artificial leather having ultramicro fiber in conjugate fiber of substrate |
TW200641193A (en) * | 2005-05-27 | 2006-12-01 | San Fang Chemical Industry Co | A polishing panel of micro fibers and its manufacturing method |
US20070010175A1 (en) | 2005-07-07 | 2007-01-11 | San Fang Chemical Industry Co., Ltd. | Polishing pad and method of producing same |
US20080187715A1 (en) * | 2005-08-08 | 2008-08-07 | Ko-Feng Wang | Elastic Laminate and Method for Making The Same |
US20070155268A1 (en) * | 2005-12-30 | 2007-07-05 | San Fang Chemical Industry Co., Ltd. | Polishing pad and method for manufacturing the polishing pad |
US20080220701A1 (en) * | 2005-12-30 | 2008-09-11 | Chung-Ching Feng | Polishing Pad and Method for Making the Same |
US7789738B2 (en) * | 2006-07-03 | 2010-09-07 | San Fang Chemical Industry Co., Ltd. | Sheet for mounting polishing workpiece and method for making the same |
US7316605B1 (en) * | 2006-07-03 | 2008-01-08 | San Fang Chemical Industry Co., Ltd. | Sheet for mounting polishing workpiece and method for making the same |
US20080064310A1 (en) * | 2006-09-08 | 2008-03-13 | Chung-Chih Feng | Polishing pad having hollow fibers and the method for making the same |
KR100842486B1 (ko) | 2006-10-30 | 2008-07-01 | 동부일렉트로닉스 주식회사 | Cmp 장비의 폴리싱패드와 이의 제조장치 |
TWI302575B (en) * | 2006-12-07 | 2008-11-01 | San Fang Chemical Industry Co | Manufacturing method for ultrafine carbon fiber by using core and sheath conjugate melt spinning |
TW200825244A (en) | 2006-12-13 | 2008-06-16 | San Fang Chemical Industry Co | Flexible artificial leather and its manufacturing method |
US20090011679A1 (en) * | 2007-04-06 | 2009-01-08 | Rajeev Bajaj | Method of removal profile modulation in cmp pads |
US20090252876A1 (en) * | 2007-05-07 | 2009-10-08 | San Fang Chemical Industry Co., Ltd. | Sheet for mounting polishing workpiece and method for making the same |
US7828634B2 (en) | 2007-08-16 | 2010-11-09 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Interconnected-multi-element-lattice polishing pad |
US8357286B1 (en) | 2007-10-29 | 2013-01-22 | Semcon Tech, Llc | Versatile workpiece refining |
JP5514806B2 (ja) * | 2008-04-29 | 2014-06-04 | セミクエスト・インコーポレーテッド | 研磨パッド組成物およびその製造方法ならびに使用 |
US20090266002A1 (en) * | 2008-04-29 | 2009-10-29 | Rajeev Bajaj | Polishing pad and method of use |
US20090313905A1 (en) * | 2008-06-18 | 2009-12-24 | Stephen Fisher | Method and apparatus for assembly of cmp polishing pads |
US8292692B2 (en) * | 2008-11-26 | 2012-10-23 | Semiquest, Inc. | Polishing pad with endpoint window and systems and method using the same |
JP5461133B2 (ja) * | 2009-09-25 | 2014-04-02 | 富士紡ホールディングス株式会社 | 研磨布 |
US8162728B2 (en) * | 2009-09-28 | 2012-04-24 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Dual-pore structure polishing pad |
US20120302148A1 (en) | 2011-05-23 | 2012-11-29 | Rajeev Bajaj | Polishing pad with homogeneous body having discrete protrusions thereon |
US9067298B2 (en) | 2011-11-29 | 2015-06-30 | Nexplanar Corporation | Polishing pad with grooved foundation layer and polishing surface layer |
US9067297B2 (en) | 2011-11-29 | 2015-06-30 | Nexplanar Corporation | Polishing pad with foundation layer and polishing surface layer |
US9597769B2 (en) | 2012-06-04 | 2017-03-21 | Nexplanar Corporation | Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer |
US10226853B2 (en) | 2013-01-18 | 2019-03-12 | Applied Materials, Inc. | Methods and apparatus for conditioning of chemical mechanical polishing pads |
JP7061029B2 (ja) * | 2018-06-25 | 2022-04-27 | 芝浦メカトロニクス株式会社 | 洗浄ブラシ、基板処理装置及び基板処理方法 |
CN113165141A (zh) * | 2018-11-29 | 2021-07-23 | 株式会社大辉 | 抛光垫及其制造方法 |
CN114589620B (zh) * | 2020-12-03 | 2023-05-23 | 中国科学院微电子研究所 | 半导体研磨垫及制备方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2188365A (en) * | 1937-12-07 | 1940-01-30 | Leon B Lent | Grinding tool |
US3623276A (en) * | 1970-03-05 | 1971-11-30 | Willard C Twigg | Multicellular lapping head |
DE69322491T2 (de) * | 1992-02-12 | 1999-08-26 | Sumitomo Metal Ind | Schleifvorrichtung und verfahren zur verwendung desselben |
JP3024417B2 (ja) * | 1992-02-12 | 2000-03-21 | 住友金属工業株式会社 | 研磨装置 |
DE4240476A1 (de) * | 1992-12-02 | 1994-06-16 | Winter & Sohn Ernst | Schleifscheibe zum spangebenden Bearbeiten von Werkstückflächen |
US5533923A (en) * | 1995-04-10 | 1996-07-09 | Applied Materials, Inc. | Chemical-mechanical polishing pad providing polishing unformity |
US5609517A (en) * | 1995-11-20 | 1997-03-11 | International Business Machines Corporation | Composite polishing pad |
US5795218A (en) * | 1996-09-30 | 1998-08-18 | Micron Technology, Inc. | Polishing pad with elongated microcolumns |
-
1998
- 1998-07-15 JP JP20001398A patent/JP2918883B1/ja not_active Expired - Fee Related
-
1999
- 1999-06-10 TW TW088109718A patent/TW402545B/zh not_active IP Right Cessation
- 1999-07-09 DE DE69914834T patent/DE69914834T2/de not_active Expired - Fee Related
- 1999-07-09 EP EP99305476A patent/EP0972612B1/de not_active Expired - Fee Related
- 1999-07-12 US US09/351,161 patent/US6089965A/en not_active Expired - Fee Related
- 1999-07-15 KR KR1019990028627A patent/KR100307330B1/ko not_active IP Right Cessation
- 1999-07-15 CN CNB991103807A patent/CN1145201C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1145201C (zh) | 2004-04-07 |
EP0972612A2 (de) | 2000-01-19 |
US6089965A (en) | 2000-07-18 |
EP0972612B1 (de) | 2004-02-18 |
JP2000024911A (ja) | 2000-01-25 |
KR100307330B1 (ko) | 2001-11-01 |
EP0972612A3 (de) | 2003-01-15 |
TW402545B (en) | 2000-08-21 |
KR20000011734A (ko) | 2000-02-25 |
JP2918883B1 (ja) | 1999-07-12 |
CN1247380A (zh) | 2000-03-15 |
DE69914834T2 (de) | 2005-01-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |