DE69922491D1 - Berührungsfreies system zur messung von filmdicken - Google Patents

Berührungsfreies system zur messung von filmdicken

Info

Publication number
DE69922491D1
DE69922491D1 DE1999622491 DE69922491T DE69922491D1 DE 69922491 D1 DE69922491 D1 DE 69922491D1 DE 1999622491 DE1999622491 DE 1999622491 DE 69922491 T DE69922491 T DE 69922491T DE 69922491 D1 DE69922491 D1 DE 69922491D1
Authority
DE
Germany
Prior art keywords
touch
film thickness
free system
measuring film
measuring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE1999622491
Other languages
English (en)
Inventor
Mehrdad Nikoonahad
Shing Lee
Haiming Wang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KLA Corp
Original Assignee
KLA Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KLA Tencor Corp filed Critical KLA Tencor Corp
Application granted granted Critical
Publication of DE69922491D1 publication Critical patent/DE69922491D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B17/00—Measuring arrangements characterised by the use of infrasonic, sonic or ultrasonic vibrations
    • G01B17/02—Measuring arrangements characterised by the use of infrasonic, sonic or ultrasonic vibrations for measuring thickness
    • G01B17/025—Measuring arrangements characterised by the use of infrasonic, sonic or ultrasonic vibrations for measuring thickness for measuring thickness of coating
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/24—Probes
    • G01N29/2418—Probes using optoacoustic interaction with the material, e.g. laser radiation, photoacoustics
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/34—Generating the ultrasonic, sonic or infrasonic waves, e.g. electronic circuits specially adapted therefor
    • G01N29/348—Generating the ultrasonic, sonic or infrasonic waves, e.g. electronic circuits specially adapted therefor with frequency characteristics, e.g. single frequency signals, chirp signals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/01—Indexing codes associated with the measuring variable
    • G01N2291/014—Resonance or resonant frequency
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/028—Material parameters
    • G01N2291/02854—Length, thickness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/04—Wave modes and trajectories
    • G01N2291/042—Wave modes
    • G01N2291/0427—Flexural waves, plate waves, e.g. Lamb waves, tuning fork, cantilever
DE1999622491 1998-02-24 1999-02-08 Berührungsfreies system zur messung von filmdicken Expired - Lifetime DE69922491D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/028,417 US6108087A (en) 1998-02-24 1998-02-24 Non-contact system for measuring film thickness
PCT/US1999/002650 WO1999044052A1 (en) 1998-02-24 1999-02-08 Non-contact system for measuring film thickness

Publications (1)

Publication Number Publication Date
DE69922491D1 true DE69922491D1 (de) 2005-01-13

Family

ID=21843342

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1999622491 Expired - Lifetime DE69922491D1 (de) 1998-02-24 1999-02-08 Berührungsfreies system zur messung von filmdicken

Country Status (6)

Country Link
US (1) US6108087A (de)
EP (1) EP1058843B1 (de)
JP (1) JP2002505427A (de)
AU (1) AU2591799A (de)
DE (1) DE69922491D1 (de)
WO (1) WO1999044052A1 (de)

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WO1998048252A1 (en) * 1997-04-22 1998-10-29 The Regents Of The University Of California Laser detection of material thickness
US6552803B1 (en) * 1998-02-24 2003-04-22 Kla-Tencor Corporation Detection of film thickness through induced acoustic pulse-echos
US7545509B2 (en) * 1998-06-30 2009-06-09 Lockheed Martin Corporation System and method for online control of paper elasticity and thickness
US7342665B2 (en) * 1998-06-30 2008-03-11 Drake Jr Thomas E System and method for control of paint thickness
US6633384B1 (en) * 1998-06-30 2003-10-14 Lockheed Martin Corporation Method and apparatus for ultrasonic laser testing
WO2000020841A1 (en) * 1998-10-05 2000-04-13 Kla-Tencor Corporation Interferometric system for measurement disturbance of a sample
DE19963052A1 (de) * 1999-12-24 2001-06-28 Bayer Ag Verwendung von Azolen zur Prävention von Hautkrebs
US6546820B1 (en) * 2000-02-11 2003-04-15 Ann F. Koo Method and apparatus for multifunction vacuum/nonvacuum annealing system
US6408048B2 (en) 2000-03-14 2002-06-18 Therma-Wave, Inc. Apparatus for analyzing samples using combined thermal wave and X-ray reflectance measurements
DE10021379A1 (de) * 2000-05-02 2001-11-08 Leica Microsystems Optische Messanordnung insbesondere zur Schichtdickenmessung
US6891627B1 (en) 2000-09-20 2005-05-10 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension and overlay of a specimen
US6782337B2 (en) 2000-09-20 2004-08-24 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension an a presence of defects on a specimen
US6812045B1 (en) 2000-09-20 2004-11-02 Kla-Tencor, Inc. Methods and systems for determining a characteristic of a specimen prior to, during, or subsequent to ion implantation
US7139083B2 (en) 2000-09-20 2006-11-21 Kla-Tencor Technologies Corp. Methods and systems for determining a composition and a thickness of a specimen
US6673637B2 (en) 2000-09-20 2004-01-06 Kla-Tencor Technologies Methods and systems for determining a presence of macro defects and overlay of a specimen
US6694284B1 (en) 2000-09-20 2004-02-17 Kla-Tencor Technologies Corp. Methods and systems for determining at least four properties of a specimen
US6831742B1 (en) 2000-10-23 2004-12-14 Applied Materials, Inc Monitoring substrate processing using reflected radiation
AU2002341544A1 (en) 2001-07-13 2003-01-29 Rudolph Technologies Inc. Method and apparatus for increasing signal to noise ratio in a photoacoustic film thickness measurement system
US6472237B1 (en) * 2001-10-26 2002-10-29 Motorola, Inc. Method and system for determining a thickness of a layer
US7295325B2 (en) * 2002-10-08 2007-11-13 Kla-Tencor Technologies Corporation Time-resolved measurement technique using radiation pulses
WO2006023406A2 (en) * 2004-08-16 2006-03-02 Zetetic Institute Apparatus and method for joint and time delayed measurements of components of conjugated quadratures of fields of reflected/scattered and transmitted/scattered beams by an object in interferometry
FR2887334B1 (fr) * 2005-06-20 2007-08-24 Centre Nat Rech Scient Dispositif et procede de caracterisation de structure par effet de longueur d'onde dans un systeme photo-acoustique
US7589843B2 (en) * 2005-09-27 2009-09-15 Verity Instruments, Inc. Self referencing heterodyne reflectometer and method for implementing
US7684047B2 (en) * 2006-10-27 2010-03-23 Lockheed Martin Corporation Apparatus and method for two wave mixing (TWM) based ultrasonic laser testing
US7889355B2 (en) 2007-01-31 2011-02-15 Zygo Corporation Interferometry for lateral metrology
US8312772B2 (en) 2007-02-28 2012-11-20 Rudolph Technologies, Inc. Characterization with picosecond ultrasonics of metal portions of samples potentially subject to erosion
US8264693B2 (en) 2007-12-06 2012-09-11 The Regents Of The University Of Michigan Method and system for measuring at least one property including a magnetic property of a material using pulsed laser sources
US20120144642A1 (en) * 2010-12-10 2012-06-14 Robert Steinkraus Generating and Detecting Acoustic Resonance in Thin Films
KR102069500B1 (ko) * 2013-12-10 2020-01-23 한국전자통신연구원 파장선택형 도막 두께 측정 장치
US20200359903A1 (en) 2018-01-26 2020-11-19 Illumisonics Inc. Coherence gated photoacoustic remote sensing (cg-pars)
WO2020223584A1 (en) * 2019-05-01 2020-11-05 Trustees Of Boston University Systems and methods for bond-selective transient phase imaging
JP6956930B1 (ja) * 2021-03-23 2021-11-02 三菱電機株式会社 生体成分測定装置および生体成分測定方法

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US3978713A (en) * 1975-05-27 1976-09-07 General Electric Company Laser generation of ultrasonic waves for nondestructive testing
DE3029716C2 (de) * 1980-08-06 1985-05-15 Krautkrämer GmbH, 5000 Köln Verfahren und Vorrichtung zur automatischen Aufrechterhaltung einer Justage der Deckung und der relativen Phasenlage von Lichtstrahlen in einem für den Ultraschallempfang benutzten optischen Interferometer
JPS58131557A (ja) * 1982-01-12 1983-08-05 Nippon Steel Corp 超音波の非接触測定法
US4522510A (en) * 1982-07-26 1985-06-11 Therma-Wave, Inc. Thin film thickness measurement with thermal waves
US4541280A (en) * 1982-12-28 1985-09-17 Canadian Patents & Development Ltd. Efficient laser generation of surface acoustic waves
US4752140A (en) * 1983-12-02 1988-06-21 Canadian Patents And Development Limited/Societe Canadienne Des Brevets Et D'exploitation Limitee Pulsed dilatometric method and device for the detection of delaminations
US4579463A (en) * 1984-05-21 1986-04-01 Therma-Wave Partners Detecting thermal waves to evaluate thermal parameters
US4636088A (en) * 1984-05-21 1987-01-13 Therma-Wave, Inc. Method and apparatus for evaluating surface conditions of a sample
US4679946A (en) * 1984-05-21 1987-07-14 Therma-Wave, Inc. Evaluating both thickness and compositional variables in a thin film sample
US4710030A (en) * 1985-05-17 1987-12-01 Bw Brown University Research Foundation Optical generator and detector of stress pulses
JPH0816607B2 (ja) * 1990-10-30 1996-02-21 インターナショナル・ビジネス・マシーンズ・コーポレイション 薄膜処理制御方法
US5479259A (en) * 1991-05-20 1995-12-26 Hitachi, Ltd. Method and apparatus for detecting photoacoustic signal
US5286313A (en) * 1991-10-31 1994-02-15 Surface Combustion, Inc. Process control system using polarizing interferometer
JPH07311182A (ja) * 1994-03-25 1995-11-28 Kobe Steel Ltd 光熱変位計測による試料評価方法
US5638396A (en) * 1994-09-19 1997-06-10 Textron Systems Corporation Laser ultrasonics-based material analysis system and method
US5672830A (en) * 1994-10-04 1997-09-30 Massachusetts Institute Of Technology Measuring anisotropic mechanical properties of thin films
US5585921A (en) * 1995-03-15 1996-12-17 Hughes Aircraft Company Laser-ultrasonic non-destructive, non-contacting inspection system

Also Published As

Publication number Publication date
US6108087A (en) 2000-08-22
EP1058843A1 (de) 2000-12-13
AU2591799A (en) 1999-09-15
WO1999044052A1 (en) 1999-09-02
JP2002505427A (ja) 2002-02-19
EP1058843B1 (de) 2004-12-08

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