DE69937147D1 - Mehrspitzenfühler - Google Patents

Mehrspitzenfühler

Info

Publication number
DE69937147D1
DE69937147D1 DE69937147T DE69937147T DE69937147D1 DE 69937147 D1 DE69937147 D1 DE 69937147D1 DE 69937147 T DE69937147 T DE 69937147T DE 69937147 T DE69937147 T DE 69937147T DE 69937147 D1 DE69937147 D1 DE 69937147D1
Authority
DE
Germany
Prior art keywords
probe
probe arms
arms
wafer
conducting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69937147T
Other languages
English (en)
Other versions
DE69937147T2 (de
Inventor
Christian Leth Petersen
Francois Grey
Peter Boggild
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Capres AS
Original Assignee
Capres AS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26063886&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69937147(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from EP98610023A external-priority patent/EP0974845A1/de
Application filed by Capres AS filed Critical Capres AS
Publication of DE69937147D1 publication Critical patent/DE69937147D1/de
Application granted granted Critical
Publication of DE69937147T2 publication Critical patent/DE69937147T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
    • G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
    • G01R27/14—Measuring resistance by measuring current or voltage obtained from a reference source
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
    • G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
    • G01R27/04—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant in circuits having distributed constants, e.g. having very long conductors or involving high frequencies
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2648—Characterising semiconductor materials
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
DE69937147T 1998-07-08 1999-07-08 Mehrspitzenfühler Expired - Lifetime DE69937147T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
EP98610023 1998-07-08
EP98610023A EP0974845A1 (de) 1998-07-08 1998-07-08 Vorrichtung zum Testen elektrischer Eigenschaften mittels eines Mehrspitzenfühlers
DKPA199900378 1999-03-17
DK37899 1999-03-17
PCT/DK1999/000391 WO2000003252A2 (en) 1998-07-08 1999-07-08 Multi-point probe

Publications (2)

Publication Number Publication Date
DE69937147D1 true DE69937147D1 (de) 2007-10-31
DE69937147T2 DE69937147T2 (de) 2008-06-19

Family

ID=26063886

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69937147T Expired - Lifetime DE69937147T2 (de) 1998-07-08 1999-07-08 Mehrspitzenfühler

Country Status (8)

Country Link
US (2) US20010050565A1 (de)
EP (1) EP1095282B1 (de)
JP (1) JP4685240B2 (de)
AT (1) ATE373830T1 (de)
AU (1) AU4897399A (de)
CA (1) CA2336531A1 (de)
DE (1) DE69937147T2 (de)
WO (1) WO2000003252A2 (de)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6955078B2 (en) * 2001-03-30 2005-10-18 Xidex Corporation Caliper method, system, and apparatus
WO2003058260A1 (en) 2002-01-07 2003-07-17 Capres A/S Electrical feedback detection system for multi-point probes
DE10201491C1 (de) * 2002-01-16 2003-08-28 Gfd Ges Fuer Diamantprodukte M Meßspitzensystem und Verfahren zu dessen Herstellung
KR101170287B1 (ko) 2004-06-21 2012-07-31 카프레스 에이/에스 프로브의 정렬을 제공하기 위한 장치 및 방법과, 테스트 샘플의 특정 위치 상의 전기적 특성을 테스트하기 위한 테스트 장치
EP2463668A2 (de) 2004-06-21 2012-06-13 Capres A/S Verfahren und Vorrichtung zum Testen elektrischer Eigenschaften
US9423693B1 (en) 2005-05-10 2016-08-23 Victor B. Kley In-plane scanning probe microscopy tips and tools for wafers and substrates with diverse designs on one wafer or substrate
US7571638B1 (en) * 2005-05-10 2009-08-11 Kley Victor B Tool tips with scanning probe microscopy and/or atomic force microscopy applications
ES2265277B1 (es) * 2005-06-01 2008-01-01 Consejo Superior Investig. Cientificas Dispositivo sensor y equipo para la medicion de resistividad con el metodo de las cuatro puntas, asi como un metodo para la fabricacion del dispositivo.
US7511510B2 (en) * 2005-11-30 2009-03-31 International Business Machines Corporation Nanoscale fault isolation and measurement system
WO2007121752A1 (en) 2006-04-24 2007-11-01 Capres A/S Method for sheet resistance and leakage current density measurements on shallow semiconductor implants
US8245318B2 (en) * 2006-07-27 2012-08-14 The Regents Of The University Of California Sidewall tracing nanoprobes, method for making the same, and method for use
JP4837747B2 (ja) * 2006-11-30 2011-12-14 独立行政法人科学技術振興機構 金属プローブ、その金属プローブの形成方法及びその形成装置
EP1970714A1 (de) * 2007-03-12 2008-09-17 Capres Aps Vorrichtung mit Kontaktdetektor
KR101106971B1 (ko) 2007-07-03 2012-01-20 가부시키가이샤 아드반테스트 프로브 및 프로브 카드
JP5100750B2 (ja) * 2007-07-03 2012-12-19 株式会社アドバンテスト プローブ、プローブカード及びプローブの製造方法
US20090201038A1 (en) * 2008-02-11 2009-08-13 Knickerbocker John U Test head for functional wafer level testing, system and method therefor
EP2101181A1 (de) 2008-03-12 2009-09-16 Capres A/S Vorrichtung mit Kontaktdetektor
EP2141503A1 (de) * 2008-06-30 2010-01-06 Capres A/S Mehrpunktsonde zum Testen elektrischer Eigenschaften und Verfahren zur Herstellung einer Mehrpunktsonde
US20110285416A1 (en) * 2008-06-30 2011-11-24 Petersen Dirch H Multi-point probe for testing electrical properties and a method of producing a multi-point probe
US7940067B2 (en) * 2008-09-08 2011-05-10 Tektronix, Inc. Probe with printed tip
EP2237052A1 (de) 2009-03-31 2010-10-06 Capres A/S Automatisierte Mehrpunktsondenmanipulation
JP6013361B2 (ja) 2010-12-21 2016-10-25 カプレス・アクティーゼルスカブＣａｐｒｅｓ Ａ／Ｓ 単一位置ホール効果測定
EP2498081A1 (de) 2011-03-08 2012-09-12 Capres A/S Messung des Hall-Effekts in einer einzigen Position
EP2469271A1 (de) 2010-12-21 2012-06-27 Capres A/S Messung des Hall-Effekts in einer einzigen Position
US8633720B2 (en) 2011-06-21 2014-01-21 Avalanche Technology Inc. Method and apparatus for measuring magnetic parameters of magnetic thin film structures
WO2013148204A1 (en) * 2012-03-27 2013-10-03 Syed Amanulla Syed Asif Microscope objective mechanical testing instrument
US8806284B2 (en) 2012-05-02 2014-08-12 Avalanche Technology Inc. Method for bit-error rate testing of resistance-based RAM cells using a reflected signal
EP2677324A1 (de) * 2012-06-20 2013-12-25 Capres A/S Tiefgeätzte Mehrpunktsonde
US9252187B2 (en) 2013-03-08 2016-02-02 Avalanche Technology, Inc. Devices and methods for measurement of magnetic characteristics of MRAM wafers using magnetoresistive test strips
US9778572B1 (en) 2013-03-15 2017-10-03 Victor B. Kley In-plane scanning probe microscopy tips and tools for wafers and substrates with diverse designs on one wafer or substrate
US9844139B2 (en) 2013-03-16 2017-12-12 Indiana Integrated Circuits, LLC Method of interconnecting microchips
KR102080661B1 (ko) * 2013-08-06 2020-02-24 삼성전기주식회사 두께 측정 장치 및 두께 측정 방법
EP2871487A1 (de) 2013-11-11 2015-05-13 Capres A/S Miniaturisierte Messungen von anisotropen Flächenleitfähigkeiten
US9201112B2 (en) 2013-12-09 2015-12-01 International Business Machines Corporation Atom probe tomography sample preparation for three-dimensional (3D) semiconductor devices
US9170273B2 (en) * 2013-12-09 2015-10-27 Globalfoundries U.S. 2 Llc High frequency capacitance-voltage nanoprobing characterization
US10302677B2 (en) * 2015-04-29 2019-05-28 Kla-Tencor Corporation Multiple pin probes with support for performing parallel measurements
TWI567846B (zh) * 2015-08-19 2017-01-21 創意電子股份有限公司 測試單元與使用其的測試裝置
US10896803B2 (en) * 2016-08-19 2021-01-19 The Regents Of The University Of California Ion beam mill etch depth monitoring with nanometer-scale resolution
US10514391B2 (en) 2016-08-22 2019-12-24 Kla-Tencor Corporation Resistivity probe having movable needle bodies
US11215638B2 (en) 2017-03-07 2022-01-04 Capres A/S Probe for testing an electrical property of a test sample
TWI645194B (zh) * 2017-07-12 2018-12-21 萬潤科技股份有限公司 探針模組、探針裝置及使用該探針裝置之電子元件檢測方法及設備
CN111316110B (zh) * 2017-11-15 2023-07-14 卡普雷斯股份有限公司 用于测试测试样品电气性能的探针和相关的接近探测器
US10411185B1 (en) 2018-05-30 2019-09-10 Spin Memory, Inc. Process for creating a high density magnetic tunnel junction array test platform
US11125779B2 (en) 2018-11-15 2021-09-21 Rohde & Schwarz Gmbh & Co. Kg Probe with radio frequency power detector, test system and test method
KR102137442B1 (ko) * 2018-12-05 2020-07-27 전북대학교산학협력단 원자력 현미경용 프로브 및 이의 제조 방법
CN110190106B (zh) * 2019-06-13 2022-01-28 京东方科技集团股份有限公司 一种显示面板及其制备方法、检测方法、显示装置
JP2022179066A (ja) * 2021-05-21 2022-12-02 富士フイルムビジネスイノベーション株式会社 シート電気抵抗測定器
CN114814314B (zh) * 2022-04-18 2024-02-13 苏州伊欧陆系统集成有限公司 一种多触点高电流高电压测试探针

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3984620A (en) * 1975-06-04 1976-10-05 Raytheon Company Integrated circuit chip test and assembly package
US4329642A (en) * 1979-03-09 1982-05-11 Siliconix, Incorporated Carrier and test socket for leadless integrated circuit
EP0078339B1 (de) * 1981-10-30 1986-07-30 Ibm Deutschland Gmbh Tastkopfanordnung für Leiterzugüberprüfung mit mindestens einem, eine Vielzahl von federnden Kontakten aufweisenden Tastkopf
US5917707A (en) * 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
US4989154A (en) 1987-07-13 1991-01-29 Mitsubishi Petrochemical Company Ltd. Method of measuring resistivity, and apparatus therefor
JPH01147374A (ja) * 1987-12-04 1989-06-09 Hitachi Ltd マイクロプローバ
EP0466274B1 (de) * 1990-07-09 1996-10-16 Interuniversitair Micro-Elektronica Centrum vzw Verfahren und Apparat zur Wiederstandsmessung in Halbleiterelementen
JPH081382B2 (ja) * 1990-10-31 1996-01-10 インターナショナル・ビジネス・マシーンズ・コーポレイション ナノメートル・スケールのプローブ及びその製造方法
US5171992A (en) * 1990-10-31 1992-12-15 International Business Machines Corporation Nanometer scale probe for an atomic force microscope, and method for making same
WO1994011745A1 (en) 1992-11-10 1994-05-26 David Cheng Method and apparatus for measuring film thickness
US5347226A (en) * 1992-11-16 1994-09-13 National Semiconductor Corporation Array spreading resistance probe (ASRP) method for profile extraction from semiconductor chips of cellular construction
DE4301420C2 (de) * 1993-01-20 2002-04-25 Advantest Corp Kontaktierungsvorrichtung
US5475318A (en) * 1993-10-29 1995-12-12 Robert B. Marcus Microprobe
US6482013B2 (en) * 1993-11-16 2002-11-19 Formfactor, Inc. Microelectronic spring contact element and electronic component having a plurality of spring contact elements
US5383354A (en) * 1993-12-27 1995-01-24 Motorola, Inc. Process for measuring surface topography using atomic force microscopy
JPH07199219A (ja) * 1993-12-28 1995-08-04 Mitsui Eng & Shipbuild Co Ltd 液晶表示装置検査用プローブカード
JP2599895B2 (ja) * 1994-06-23 1997-04-16 山一電機株式会社 プローブユニットとその製法
US5565788A (en) * 1994-07-20 1996-10-15 Cascade Microtech, Inc. Coaxial wafer probe with tip shielding
US5540958A (en) * 1994-12-14 1996-07-30 Vlsi Technology, Inc. Method of making microscope probe tips
US5557214A (en) * 1995-02-06 1996-09-17 Barnett; C. Kenneth Micro beam probe semiconductor test interface
JPH08330369A (ja) * 1995-05-31 1996-12-13 Hewlett Packard Japan Ltd プローバ用インターフェースカード
US5613861A (en) * 1995-06-07 1997-03-25 Xerox Corporation Photolithographically patterned spring contact
JP3838381B2 (ja) * 1995-11-22 2006-10-25 株式会社アドバンテスト プローブカード
US5734176A (en) * 1996-02-26 1998-03-31 Wiltron Company Impedance controlled test fixture for multi-lead surface mounted integrated circuits
EP0899538B1 (de) * 1997-08-27 2003-05-14 IMEC vzw Taststift-Konfiguration sowie Herstellungsverfahren und Verwendung von Taststiften
DE19945178C2 (de) * 1999-09-21 2003-05-28 Rosenberger Hochfrequenztech Meßspitze zur Hochfrequenzmessung und Verfahren zu deren Herstellung
US6496026B1 (en) * 2000-02-25 2002-12-17 Microconnect, Inc. Method of manufacturing and testing an electronic device using a contact device having fingers and a mechanical ground

Also Published As

Publication number Publication date
WO2000003252A3 (en) 2000-04-13
CA2336531A1 (en) 2000-01-20
JP4685240B2 (ja) 2011-05-18
WO2000003252A2 (en) 2000-01-20
US20040056674A1 (en) 2004-03-25
US20010050565A1 (en) 2001-12-13
EP1095282B1 (de) 2007-09-19
JP2002520596A (ja) 2002-07-09
EP1095282A2 (de) 2001-05-02
AU4897399A (en) 2000-02-01
DE69937147T2 (de) 2008-06-19
US7323890B2 (en) 2008-01-29
ATE373830T1 (de) 2007-10-15

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Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: CAPRES A/S, LYNGBY, DK

8363 Opposition against the patent