DE69943072D1 - Verfahren zur wärmebehandlung von halbleitersubstraten - Google Patents
Verfahren zur wärmebehandlung von halbleitersubstratenInfo
- Publication number
- DE69943072D1 DE69943072D1 DE69943072T DE69943072T DE69943072D1 DE 69943072 D1 DE69943072 D1 DE 69943072D1 DE 69943072 T DE69943072 T DE 69943072T DE 69943072 T DE69943072 T DE 69943072T DE 69943072 D1 DE69943072 D1 DE 69943072D1
- Authority
- DE
- Germany
- Prior art keywords
- heat treatment
- semiconductor substrates
- substrates
- semiconductor
- treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/322—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections
- H01L21/3221—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections of silicon bodies, e.g. for gettering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
- H01L21/76254—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9804299A FR2777115B1 (fr) | 1998-04-07 | 1998-04-07 | Procede de traitement de substrats semi-conducteurs et structures obtenues par ce procede |
PCT/FR1999/000786 WO1999052145A1 (fr) | 1998-04-07 | 1999-04-06 | Procede de traitement thermique de substrats semi-conducteurs |
Publications (1)
Publication Number | Publication Date |
---|---|
DE69943072D1 true DE69943072D1 (de) | 2011-02-10 |
Family
ID=9524936
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69943072T Expired - Lifetime DE69943072D1 (de) | 1998-04-07 | 1999-04-06 | Verfahren zur wärmebehandlung von halbleitersubstraten |
Country Status (9)
Country | Link |
---|---|
US (1) | US6403450B1 (de) |
EP (1) | EP0986826B1 (de) |
JP (1) | JP4479010B2 (de) |
KR (1) | KR100637364B1 (de) |
DE (1) | DE69943072D1 (de) |
FR (1) | FR2777115B1 (de) |
MY (1) | MY122412A (de) |
TW (1) | TW429481B (de) |
WO (1) | WO1999052145A1 (de) |
Families Citing this family (50)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3911901B2 (ja) * | 1999-04-09 | 2007-05-09 | 信越半導体株式会社 | Soiウエーハおよびsoiウエーハの製造方法 |
FR2797713B1 (fr) * | 1999-08-20 | 2002-08-02 | Soitec Silicon On Insulator | Procede de traitement de substrats pour la microelectronique et substrats obtenus par ce procede |
FR2797714B1 (fr) * | 1999-08-20 | 2001-10-26 | Soitec Silicon On Insulator | Procede de traitement de substrats pour la microelectronique et substrats obtenus par ce procede |
FR2810793B1 (fr) * | 2000-06-23 | 2003-09-05 | St Microelectronics Sa | Procede de fabrication d'un substrat semi-conducteur du type silicium sur isolant a couche active semi-conductrice mince |
US6717213B2 (en) * | 2001-06-29 | 2004-04-06 | Intel Corporation | Creation of high mobility channels in thin-body SOI devices |
US7749910B2 (en) * | 2001-07-04 | 2010-07-06 | S.O.I.Tec Silicon On Insulator Technologies | Method of reducing the surface roughness of a semiconductor wafer |
US7883628B2 (en) * | 2001-07-04 | 2011-02-08 | S.O.I.Tec Silicon On Insulator Technologies | Method of reducing the surface roughness of a semiconductor wafer |
FR2827078B1 (fr) * | 2001-07-04 | 2005-02-04 | Soitec Silicon On Insulator | Procede de diminution de rugosite de surface |
FR2827423B1 (fr) * | 2001-07-16 | 2005-05-20 | Soitec Silicon On Insulator | Procede d'amelioration d'etat de surface |
AU2002339592A1 (en) * | 2001-10-29 | 2003-05-12 | Analog Devices Inc. | A method for bonding a pair of silicon wafers together and a semiconductor wafer |
US7084046B2 (en) * | 2001-11-29 | 2006-08-01 | Shin-Etsu Handotai Co., Ltd. | Method of fabricating SOI wafer |
JP2003205336A (ja) * | 2002-01-08 | 2003-07-22 | Tori Techno:Kk | 高力ステンレスボルト及びその製造法 |
US7018910B2 (en) | 2002-07-09 | 2006-03-28 | S.O.I.Tec Silicon On Insulator Technologies S.A. | Transfer of a thin layer from a wafer comprising a buffer layer |
US6953736B2 (en) | 2002-07-09 | 2005-10-11 | S.O.I.Tec Silicon On Insulator Technologies S.A. | Process for transferring a layer of strained semiconductor material |
FR2842349B1 (fr) * | 2002-07-09 | 2005-02-18 | Transfert d'une couche mince a partir d'une plaquette comprenant une couche tampon | |
FR2842648B1 (fr) * | 2002-07-18 | 2005-01-14 | Commissariat Energie Atomique | Procede de transfert d'une couche mince electriquement active |
WO2004015759A2 (en) | 2002-08-12 | 2004-02-19 | S.O.I.Tec Silicon On Insulator Technologies | A method of preparing a thin layer, the method including a step of correcting thickness by sacrificial oxidation, and an associated machine |
FR2845202B1 (fr) * | 2002-10-01 | 2004-11-05 | Soitec Silicon On Insulator | Procede de recuit rapide de tranches de materiau semiconducteur. |
JP4407127B2 (ja) * | 2003-01-10 | 2010-02-03 | 信越半導体株式会社 | Soiウエーハの製造方法 |
FR2855909B1 (fr) * | 2003-06-06 | 2005-08-26 | Soitec Silicon On Insulator | Procede d'obtention concomitante d'au moins une paire de structures comprenant au moins une couche utile reportee sur un substrat |
US7098148B2 (en) * | 2003-06-10 | 2006-08-29 | S.O.I.Tec Silicon On Insulator Technologies S.A. | Method for heat treating a semiconductor wafer |
FR2856194B1 (fr) * | 2003-06-10 | 2005-08-26 | Soitec Silicon On Insulator | Procede perfectionne de recuit de stabilisation |
DE10326578B4 (de) * | 2003-06-12 | 2006-01-19 | Siltronic Ag | Verfahren zur Herstellung einer SOI-Scheibe |
EP1542275A1 (de) * | 2003-12-10 | 2005-06-15 | S.O.I.TEC. Silicon on Insulator Technologies S.A. | Verfahren zur Verbesserung der Qualität einer Heterostruktur |
FR2867310B1 (fr) * | 2004-03-05 | 2006-05-26 | Soitec Silicon On Insulator | Technique d'amelioration de la qualite d'une couche mince prelevee |
DE602004011353T2 (de) | 2004-10-19 | 2008-05-15 | S.O.I. Tec Silicon On Insulator Technologies S.A. | Verfahren zur Herstellung einer verspannten Silizium-Schicht auf einem Substrat und Zwischenprodukt |
EP1831922B9 (de) * | 2004-12-28 | 2010-02-24 | S.O.I.Tec Silicon on Insulator Technologies | Verfahren zum erhalten einer dünnen schicht mit einer geringen dichte von löchern |
JP4934966B2 (ja) * | 2005-02-04 | 2012-05-23 | 株式会社Sumco | Soi基板の製造方法 |
JP2006216826A (ja) * | 2005-02-04 | 2006-08-17 | Sumco Corp | Soiウェーハの製造方法 |
JP4958797B2 (ja) * | 2005-02-24 | 2012-06-20 | ソイテック | SiGe層の表面領域を酸化させる方法、SGOI構造体内の少なくとも1つの接合境界面を安定化させる方法、及びSiGe層を半導体材料製の基板層と接合する方法 |
FR2883659B1 (fr) * | 2005-03-24 | 2007-06-22 | Soitec Silicon On Insulator | Procede de fabrication d'une hetero-structure comportant au moins une couche epaisse de materiau semi-conducteur |
JP5292810B2 (ja) * | 2005-12-19 | 2013-09-18 | 信越半導体株式会社 | Soi基板の製造方法 |
FR2895563B1 (fr) * | 2005-12-22 | 2008-04-04 | Soitec Silicon On Insulator | Procede de simplification d'une sequence de finition et structure obtenue par le procede |
FR2903809B1 (fr) * | 2006-07-13 | 2008-10-17 | Soitec Silicon On Insulator | Traitement thermique de stabilisation d'interface e collage. |
JP2008028070A (ja) | 2006-07-20 | 2008-02-07 | Sumco Corp | 貼り合わせウェーハの製造方法 |
JP5280015B2 (ja) * | 2007-05-07 | 2013-09-04 | 信越半導体株式会社 | Soi基板の製造方法 |
JP2009260313A (ja) * | 2008-03-26 | 2009-11-05 | Semiconductor Energy Lab Co Ltd | Soi基板の作製方法及び半導体装置の作製方法 |
EP2161741B1 (de) * | 2008-09-03 | 2014-06-11 | Soitec | Verfahren zur Herstellung eines Halbleiters auf einem Isoliersubstrat mit verringerter SECCO-Fehlerdichte |
EP2368264A1 (de) * | 2008-11-26 | 2011-09-28 | MEMC Electronic Materials, Inc. | Verfahren zum verarbeiten einer silizium-auf-isolator-struktur |
US7927975B2 (en) | 2009-02-04 | 2011-04-19 | Micron Technology, Inc. | Semiconductor material manufacture |
JP5912368B2 (ja) * | 2011-03-22 | 2016-04-27 | グローバルウェーハズ・ジャパン株式会社 | シリコンウェーハの熱処理方法及びシリコンウェーハ |
FR2978604B1 (fr) | 2011-07-28 | 2018-09-14 | Soitec | Procede de guerison de defauts dans une couche semi-conductrice |
FR2984007B1 (fr) * | 2011-12-13 | 2015-05-08 | Soitec Silicon On Insulator | Procede de stabilisation d'une interface de collage situee au sein d'une structure comprenant une couche d'oxyde enterree et structure obtenue |
KR102055933B1 (ko) * | 2012-01-12 | 2019-12-13 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 열산화 이종 복합 기판 및 그 제조 방법 |
CN104106128B (zh) * | 2012-02-13 | 2016-11-09 | 应用材料公司 | 用于基板的选择性氧化的方法和设备 |
FR2987166B1 (fr) | 2012-02-16 | 2017-05-12 | Soitec Silicon On Insulator | Procede de transfert d'une couche |
FR2991099B1 (fr) * | 2012-05-25 | 2014-05-23 | Soitec Silicon On Insulator | Procede de traitement d'une structure semi-conducteur sur isolant en vue d'uniformiser l'epaisseur de la couche semi-conductrice |
US9202711B2 (en) | 2013-03-14 | 2015-12-01 | Sunedison Semiconductor Limited (Uen201334164H) | Semiconductor-on-insulator wafer manufacturing method for reducing light point defects and surface roughness |
FR3076069B1 (fr) | 2017-12-22 | 2021-11-26 | Commissariat Energie Atomique | Procede de transfert d'une couche utile |
FR3091620B1 (fr) * | 2019-01-07 | 2021-01-29 | Commissariat Energie Atomique | Procédé de transfert de couche avec réduction localisée d’une capacité à initier une fracture |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5297666A (en) * | 1976-02-12 | 1977-08-16 | Hitachi Ltd | Production of semiconductor device containing pn junctions |
US4824698A (en) * | 1987-12-23 | 1989-04-25 | General Electric Company | High temperature annealing to improve SIMOX characteristics |
US4804633A (en) * | 1988-02-18 | 1989-02-14 | Northern Telecom Limited | Silicon-on-insulator substrates annealed in polysilicon tube |
DE69126153T2 (de) * | 1990-02-28 | 1998-01-08 | Shinetsu Handotai Kk | Verfahren zur Herstellung von verbundenen Halbleiterplättchen |
JP2721265B2 (ja) * | 1990-07-05 | 1998-03-04 | 株式会社東芝 | 半導体基板の製造方法 |
JPH06275525A (ja) * | 1993-03-18 | 1994-09-30 | Shin Etsu Handotai Co Ltd | Soi基板及びその製造方法 |
JP3036619B2 (ja) * | 1994-03-23 | 2000-04-24 | コマツ電子金属株式会社 | Soi基板の製造方法およびsoi基板 |
US6008110A (en) * | 1994-07-21 | 1999-12-28 | Kabushiki Kaisha Toshiba | Semiconductor substrate and method of manufacturing same |
JPH0837286A (ja) * | 1994-07-21 | 1996-02-06 | Toshiba Microelectron Corp | 半導体基板および半導体基板の製造方法 |
JP3528880B2 (ja) * | 1995-05-24 | 2004-05-24 | 三菱住友シリコン株式会社 | Soi基板の製造方法 |
JP3105770B2 (ja) * | 1995-09-29 | 2000-11-06 | 日本電気株式会社 | 半導体装置の製造方法 |
US5646053A (en) * | 1995-12-20 | 1997-07-08 | International Business Machines Corporation | Method and structure for front-side gettering of silicon-on-insulator substrates |
US5930643A (en) * | 1997-12-22 | 1999-07-27 | International Business Machines Corporation | Defect induced buried oxide (DIBOX) for throughput SOI |
-
1998
- 1998-04-07 FR FR9804299A patent/FR2777115B1/fr not_active Expired - Fee Related
-
1999
- 1999-04-06 WO PCT/FR1999/000786 patent/WO1999052145A1/fr active IP Right Grant
- 1999-04-06 JP JP55014499A patent/JP4479010B2/ja not_active Expired - Lifetime
- 1999-04-06 US US09/445,314 patent/US6403450B1/en not_active Expired - Lifetime
- 1999-04-06 EP EP99911878A patent/EP0986826B1/de not_active Expired - Lifetime
- 1999-04-06 DE DE69943072T patent/DE69943072D1/de not_active Expired - Lifetime
- 1999-04-06 KR KR1019997011506A patent/KR100637364B1/ko not_active IP Right Cessation
- 1999-04-06 MY MYPI99001311A patent/MY122412A/en unknown
- 1999-04-07 TW TW088105475A patent/TW429481B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO1999052145A1 (fr) | 1999-10-14 |
TW429481B (en) | 2001-04-11 |
EP0986826B1 (de) | 2010-12-29 |
KR100637364B1 (ko) | 2006-10-23 |
JP4479010B2 (ja) | 2010-06-09 |
KR20010013500A (ko) | 2001-02-26 |
JP2002503400A (ja) | 2002-01-29 |
EP0986826A1 (de) | 2000-03-22 |
FR2777115A1 (fr) | 1999-10-08 |
MY122412A (en) | 2006-04-29 |
US6403450B1 (en) | 2002-06-11 |
FR2777115B1 (fr) | 2001-07-13 |
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