DE9406227U1 - Temperature change test device - Google Patents
Temperature change test deviceInfo
- Publication number
- DE9406227U1 DE9406227U1 DE9406227U DE9406227U DE9406227U1 DE 9406227 U1 DE9406227 U1 DE 9406227U1 DE 9406227 U DE9406227 U DE 9406227U DE 9406227 U DE9406227 U DE 9406227U DE 9406227 U1 DE9406227 U1 DE 9406227U1
- Authority
- DE
- Germany
- Prior art keywords
- temperature change
- test device
- change test
- temperature
- test
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/60—Investigating resistance of materials, e.g. refractory materials, to rapid heat changes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
- G01R31/2817—Environmental-, stress-, or burn-in tests
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE9406227U DE9406227U1 (en) | 1994-04-14 | 1994-04-14 | Temperature change test device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE9406227U DE9406227U1 (en) | 1994-04-14 | 1994-04-14 | Temperature change test device |
Publications (1)
Publication Number | Publication Date |
---|---|
DE9406227U1 true DE9406227U1 (en) | 1995-08-31 |
Family
ID=6907338
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE9406227U Expired - Lifetime DE9406227U1 (en) | 1994-04-14 | 1994-04-14 | Temperature change test device |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE9406227U1 (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19616212A1 (en) * | 1995-04-28 | 1996-10-31 | Cascade Microtech Inc | Test probe station appts. for low noise measurement of wafer formed electronic device |
DE19747399A1 (en) * | 1997-10-27 | 1999-05-06 | Siemens Ag | Plug-in errors detection method e.g. for component-equipped circuit boards |
DE19908745A1 (en) * | 1999-02-22 | 2000-08-24 | Univ Schiller Jena | Tempering increased temperatures caused by light or convection in analysis in multiwell analysis plates, especially microtitration plates, and apparatus for the method |
US7656172B2 (en) | 2005-01-31 | 2010-02-02 | Cascade Microtech, Inc. | System for testing semiconductors |
US7688062B2 (en) | 2000-09-05 | 2010-03-30 | Cascade Microtech, Inc. | Probe station |
US7688091B2 (en) | 2003-12-24 | 2010-03-30 | Cascade Microtech, Inc. | Chuck with integrated wafer support |
US7876115B2 (en) | 2003-05-23 | 2011-01-25 | Cascade Microtech, Inc. | Chuck for holding a device under test |
US7898281B2 (en) | 2005-01-31 | 2011-03-01 | Cascade Mircotech, Inc. | Interface for testing semiconductors |
US7969173B2 (en) | 2000-09-05 | 2011-06-28 | Cascade Microtech, Inc. | Chuck for holding a device under test |
US8069491B2 (en) | 2003-10-22 | 2011-11-29 | Cascade Microtech, Inc. | Probe testing structure |
US8319503B2 (en) | 2008-11-24 | 2012-11-27 | Cascade Microtech, Inc. | Test apparatus for measuring a characteristic of a device under test |
-
1994
- 1994-04-14 DE DE9406227U patent/DE9406227U1/en not_active Expired - Lifetime
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19616212C2 (en) * | 1995-04-28 | 2002-03-14 | Cascade Microtech Inc | Test probe station with conductor layer applied in addition to the thermal clamping insulator |
DE19616212A1 (en) * | 1995-04-28 | 1996-10-31 | Cascade Microtech Inc | Test probe station appts. for low noise measurement of wafer formed electronic device |
DE19747399A1 (en) * | 1997-10-27 | 1999-05-06 | Siemens Ag | Plug-in errors detection method e.g. for component-equipped circuit boards |
DE19908745A1 (en) * | 1999-02-22 | 2000-08-24 | Univ Schiller Jena | Tempering increased temperatures caused by light or convection in analysis in multiwell analysis plates, especially microtitration plates, and apparatus for the method |
US7969173B2 (en) | 2000-09-05 | 2011-06-28 | Cascade Microtech, Inc. | Chuck for holding a device under test |
US7688062B2 (en) | 2000-09-05 | 2010-03-30 | Cascade Microtech, Inc. | Probe station |
US7876115B2 (en) | 2003-05-23 | 2011-01-25 | Cascade Microtech, Inc. | Chuck for holding a device under test |
US8069491B2 (en) | 2003-10-22 | 2011-11-29 | Cascade Microtech, Inc. | Probe testing structure |
US7688091B2 (en) | 2003-12-24 | 2010-03-30 | Cascade Microtech, Inc. | Chuck with integrated wafer support |
US7940069B2 (en) | 2005-01-31 | 2011-05-10 | Cascade Microtech, Inc. | System for testing semiconductors |
US7898281B2 (en) | 2005-01-31 | 2011-03-01 | Cascade Mircotech, Inc. | Interface for testing semiconductors |
US7656172B2 (en) | 2005-01-31 | 2010-02-02 | Cascade Microtech, Inc. | System for testing semiconductors |
US8319503B2 (en) | 2008-11-24 | 2012-11-27 | Cascade Microtech, Inc. | Test apparatus for measuring a characteristic of a device under test |
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