EP0118841A2 - Method of sealing a relay - Google Patents

Method of sealing a relay Download PDF

Info

Publication number
EP0118841A2
EP0118841A2 EP84102158A EP84102158A EP0118841A2 EP 0118841 A2 EP0118841 A2 EP 0118841A2 EP 84102158 A EP84102158 A EP 84102158A EP 84102158 A EP84102158 A EP 84102158A EP 0118841 A2 EP0118841 A2 EP 0118841A2
Authority
EP
European Patent Office
Prior art keywords
relay
ventilation hole
interior
compound
closed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP84102158A
Other languages
German (de)
French (fr)
Other versions
EP0118841A3 (en
EP0118841B1 (en
Inventor
Werner Minks
Bernhard Franz Nitschke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alcatel Lucent NV
Original Assignee
Alcatel NV
International Standard Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel NV, International Standard Electric Corp filed Critical Alcatel NV
Priority to AT84102158T priority Critical patent/ATE32151T1/en
Publication of EP0118841A2 publication Critical patent/EP0118841A2/en
Publication of EP0118841A3 publication Critical patent/EP0118841A3/en
Application granted granted Critical
Publication of EP0118841B1 publication Critical patent/EP0118841B1/en
Expired legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H01H50/02—Bases; Casings; Covers
    • H01H50/023—Details concerning sealing, e.g. sealing casing with resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor

Definitions

  • the present invention relates to a method for sealing a relay according to the preamble of patent claim 1.
  • Such a method is known from DE-OS 26 18 492.
  • the base plate which is overlapped by the edge of the ceiling, has an outward-pointing bump.
  • the latter is provided with a central ventilation opening. Sealing takes place by means of a layer placed on the floor slab and the lower ceiling edge; fleece soaked with hardenable potting compound, through which the hump protrudes through a recess in the fleece.
  • the ventilation hole ensures pressure equalization in the component during curing. After curing, the ventilation hole can be closed with viscous resin or glue.
  • the object of the present invention is to be achieved with a sealing method of the type mentioned prevent potting compound or too much potting compound from flowing inwards when sealing. Nevertheless, the atmosphere in the interior should be as free as possible of harmful gases, particularly those that occur inside when potting.
  • Fig. 1 designates a cup-shaped cover L, in the top 2 of which an inwardly projecting funnel-shaped, outwardly widening filling opening 3 is provided.
  • the bottom 4 of the filling opening 3 is initially closed.
  • the lid 1 is expediently an injection molded or pressed part, in particular made of plastic.
  • the side walls 5 extend downwards and extend with their end edge 6 to the underside 7 of a housing base 8 or even protrude slightly above them.
  • the housing base 8 is part of an inner housing lower part which contains the magnet system 9 and the contact system 10 (FIG. 5) and the connection elements 11 (FIG. 5).
  • a plurality of ribs 12 are provided on the inner sides of the ceiling, the ends 13 of which, when assembled, rest on the upper edge of the lower housing part or its side walls etc.
  • the bottom 4 of the filling opening 3 can be pierced so that potting compound 15 can be filled through the resulting ventilation hole 14 (FIG. 3).
  • the ventilation hole 14 is only made so large that the casting compound, for example, by capillary action and / or Surface tension and / or viscosity of the potting compound 15 can not drip down.
  • the ventilation hole is preferably 0.1 to 0.8 mm in diameter or a slot with a slot width of 0.1 to 0.6 mm.
  • the inner edge of the lower end edges 6 of the ceiling L side walls 5 can expediently be chamfered (FIG. 4), so that potting compound applied from below can run better into the separating slot 16 between the ceiling L side walls 5 and the housing base 8.
  • a dense relay which works perfectly even with a very large number of switching cycles, is obtained by first assembling the relay and pushing on the cover 1 (FIG. 5, method section I). The relay is then set up or held so that the top 2 of the cover 1 points downward (FIG. 5, process section II). In this position, a self-curing or, for example, energy-curable potting compound 15 is applied to the underside 7 of the housing base 8 (method section III) and then the potting compound is cured or fully cured by energy supply, in particular by a heating device 17 or hot air etc. The bottom 4 of the filling opening 3 of the cover 1 is then pierced or pierced, for example by means of a fine needle, and the ventilation hole 14 is thereby formed.
  • the ventilation hole 14 can also be provided at other parts of the housing, for example in one of the side walls 5 of the ceiling 1 or in a part of the housing part.
  • the interior of the relay can be degassed through the ventilation hole 14, after which the ventilation hole 14 may be closed or the interior is flushed with dry air, hydrogen and / or inert gas in a special process section (process section V) or, for example, at a negative pressure of up to 10 Degassed -5 bar in a vacuum chamber 18 and if necessary only then closed.
  • the latter is preferably carried out at an elevated temperature, for example between 120 and 200 ° C., in particular between 140 and 160 ° C., and possibly in the normal position of the relay. Harmful components escape from the plastics used for later operation.
  • the interior is then expediently filled with an inert gas, such as helium, argon or nitrogen, or with hydrogen or dried air, preferably after cooling to normal temperature, and then placed in the filling opening 3 in the normal position of the ReLais potting compound 15 and then cured.
  • an inert gas such as helium, argon or nitrogen
  • hydrogen or dried air preferably after cooling to normal temperature
  • a heated needle can be used to pierce the relay wall, in particular the bottom 4 of the filling opening 3.
  • the wall material as provided and usually used, consists of a thermoplastic.

Abstract

Erfindungsgemäß wird ein Relais mit sehr guten Schalteigenschaften auch bei langer Benutzungsdauer und hoher Schalthäufigkeit dadurch erreicht, daß das Relais durch Vergießen mit Vergußmasse (15) im geschlossenen Zustand vergossen wird, wodurch sich innen ein Luftpolster bildet und ein Nachfließen von Vergußmasse verhindert wird. Nach dem Angelieren oder Aushärten der Vergußmasse wird in das Gehäuse (Deckel 1) ein Lüftungsloch (14) gestoßen, das nach Entgasen des Innenraums ggfs. wieder verschlossen wird.

Figure imgaf001
According to the invention, a relay with very good switching properties is achieved even with a long period of use and high switching frequency in that the relay is cast in the closed state by casting with casting compound (15), as a result of which an air cushion is formed on the inside and the casting compound is prevented from flowing in. After gelling or hardening of the potting compound, a ventilation hole (14) is pushed into the housing (cover 1), which may be closed again after degassing the interior.
Figure imgaf001

Description

Die vorliegende Erfindung bezieht sich auf ein Verfahren zum Abdichten eines ReLais gemäß dem Oberbegriff des Patentanspruchs 1.The present invention relates to a method for sealing a relay according to the preamble of patent claim 1.

Ein derartiges Verfahren ist bekannt aus der DE-OS 26 18 492. Dort besitzt die Bodenplatte, die vom DeckeLrand übergriffen wird, einennach außen weisenden Höcker. Letzterer ist mit einer zentralen Lüftungsöffnung versehen. Die Abdichtung erfolgt durch ein auf die BodenpLatte und den unteren DeckeLrand aufgelegtes; mit aushärtbarer Vergußmasse getränktes Vlies, durch das der Höcker durch eine Aussparung im VLies hindurchragt. Das LüftungsLoch sorgt während des Aushärtens für einen Druckausgleich im Bauelement. Nach dem Aushärten kann das LüftungsLoch mit dickflüssigem Harz oder KLeber verschlossen werden.Such a method is known from DE-OS 26 18 492. There, the base plate, which is overlapped by the edge of the ceiling, has an outward-pointing bump. The latter is provided with a central ventilation opening. Sealing takes place by means of a layer placed on the floor slab and the lower ceiling edge; fleece soaked with hardenable potting compound, through which the hump protrudes through a recess in the fleece. The ventilation hole ensures pressure equalization in the component during curing. After curing, the ventilation hole can be closed with viscous resin or glue.

Ein ähnliches Verfahren ohne Verwendung eines VLieses ist aus der EP-AnmeLdung 0053 870 bekannt. In beiden FäLLen ist das dünne LüftungsLoch außen von einem erweiterten Einfüllbereich umgeben.A similar method without using a nonwoven is known from EP application 0053 870. In both cases, the thin ventilation hole is surrounded on the outside by an extended filling area.

Mit der vorliegenden Erfindung soll die Aufgabe gelöst werden, bei einem Abdichtverfahren der genannten Art zu verhindern, daß Vergußmasse oder zuviel Vergußmasse beim Abdichten nach innen fließt. Trotzdem soll die Atmosphäre des Innenraumes möglichst von schädlichen, besonders beim Vergießen innen auftretenden Gasen frei sein.The object of the present invention is to be achieved with a sealing method of the type mentioned prevent potting compound or too much potting compound from flowing inwards when sealing. Nevertheless, the atmosphere in the interior should be as free as possible of harmful gases, particularly those that occur inside when potting.

Diese Aufgabe wird erfindungsgemäß durch die im Kennzeichen des Anspruchs 1 angegebenen MerkmaLe gelöst. Durch das Vergießen im geschlossenen Zustand verhindert der Innendruck im ReLais, daß Vergußmasse nach innen Läuft und mit BauteiLen in Berührung kommen kann, die die Gebrauchsfähigkeit des ReLais beeinträchtigen oder es funktionsunfähig machen. Durch die nach dem Angelierenoder Aushärten der Vergußmasse vorgenommene öffnung des ReLaisgehäuses können die schädlichen Gase entweichen. ZusätzLich kann der Innenraum dann entgast und mit inertem Gas gespült oder gefüllt werden und dann das LüftungsLoch verschlossen werden. Hierdurch erhält man ein ReLais mit optimalem SchaLtverhaLten.This object is achieved by the features specified in the characterizing part of claim 1. By potting in the closed state, the internal pressure in the relay prevents the potting compound from running inwards and coming into contact with components that impair the usability of the relay or render it inoperable. The harmful gases can escape through the opening of the relay housing after gelling or hardening of the potting compound. In addition, the interior can then be degassed and flushed or filled with inert gas and then the ventilation hole closed. This gives you a relay with optimal switching behavior.

Weitere vorteilhafte Einzelheiten der Erfindung sind in den Unteransprüchen angegeben und nachfolgend anhand eines in der Zeichnung veranschaulichten Ausführungsbeispieles beschrieben. Dabei zeigen:

  • Fig. 1 eine Seitenansicht eines DeckeLs eines ReLais mit dem angedeuteten, das Magnetsystem und das Kontaktsystem enthaltenden GehäuseteiL,
  • Fig. 2 den DeckeL von oben gemäß dem Schnitt A-B-C der Fig. 1,
  • Fig. 3 eine Seitenansicht des Deckels gemäß dem Schnitt D-E der Fig. 2,
  • Fig. 4 den Ausschnitt X der Fig. 3 in vergrößertem Maßstab und
  • Fig. 5 einen Verfahrensableufplan.
Further advantageous details of the invention are specified in the subclaims and described below with reference to an exemplary embodiment illustrated in the drawing. Show:
  • 1 shows a side view of a cover of a relay with the indicated housing part containing the magnet system and the contact system,
  • Fig. 2 shows the lid ig from above according to the section F of ABC. 1 ,
  • 3 is a side view of the lid according to section DE of FIG. 2,
  • Fig. 4 shows the detail X of FIG. 3 on an enlarged scale and
  • Fig. 5 shows a procedural schedule.

In Fig. 1 ist mit 1 ein becherförmiger DeckeL bezeichnet, in dessen Oberseite 2 eine nach innen ragende trichterförmige, nach außen sich erweiternde EinfüLLöffnung 3 vorgesehen ist. Der Boden 4 der EinfüLLöffnung 3 ist zunächst verschlossen. Der Deckel 1 ist zweckmäßig ein Spritzguß- oder PreßteiL, insbesondere aus Kunststoff. Die Seitenwände 5 erstrecken sich nach unten und reichen mit ihrer Endkante 6 bis zur Unterseite 7 eines Gehäusebodens 8 oder stehen sogar geringfügig über diese über. Der Gehäuseboden 8 ist TeiL eines inneren Gehäuseunterteils, das das andeutungsweise gezeigte Magnetsystem 9 und das Kontaktsystem 10 (Fig. 5) sowie die AnschLußelemente 11 (Fig. 5) enthält.In Fig. 1, 1 designates a cup-shaped cover L, in the top 2 of which an inwardly projecting funnel-shaped, outwardly widening filling opening 3 is provided. The bottom 4 of the filling opening 3 is initially closed. The lid 1 is expediently an injection molded or pressed part, in particular made of plastic. The side walls 5 extend downwards and extend with their end edge 6 to the underside 7 of a housing base 8 or even protrude slightly above them. The housing base 8 is part of an inner housing lower part which contains the magnet system 9 and the contact system 10 (FIG. 5) and the connection elements 11 (FIG. 5).

An den DeckeLinnenseiten sind mehrere Rippen 12 vorgesehen, deren Enden 13 in zusammengebautem Zustand auf der Oberkante des GehäuseunterteiLs oder dessen Seitenwänden etc. aufliegen. Der Boden 4 der EinfüLLöffnung 3 kann durchstoßen werden, so daß durch das entstandene LüftungsLoch 14 Vergußmasse 15 eingefüLLt werden kann (Fig. 3). Das Lüftungsloch 14 wird nur so groß gemacht, daß die Vergußmasse beispielsweise durch KapiLLarwirkung und/oder Oberflächenspannung und/oder Viskosität der Vergußmasse 15 nicht nach unten heruntertropfen kann. Vorzugsweise ist das LüftungsLoch 0,1 bis 0,8 mm im Durchmesser oder als SchLitz mit einer SchLitzbreite von 0,1 bis 0,6 mm ausgebildet.A plurality of ribs 12 are provided on the inner sides of the ceiling, the ends 13 of which, when assembled, rest on the upper edge of the lower housing part or its side walls etc. The bottom 4 of the filling opening 3 can be pierced so that potting compound 15 can be filled through the resulting ventilation hole 14 (FIG. 3). The ventilation hole 14 is only made so large that the casting compound, for example, by capillary action and / or Surface tension and / or viscosity of the potting compound 15 can not drip down. The ventilation hole is preferably 0.1 to 0.8 mm in diameter or a slot with a slot width of 0.1 to 0.6 mm.

Zweckmäßig kann die innere Kante der unteren Endkanten 6 der DeckeL-Seitenwände 5 angefast sein (Fig. 4), damit von unten aufgebrachte Vergußmasse besser in den Trennschlitz 16 zwischen den DeckeL-Seitenwänden 5 und dem Gehäuseboden 8 verlaufen kann.The inner edge of the lower end edges 6 of the ceiling L side walls 5 can expediently be chamfered (FIG. 4), so that potting compound applied from below can run better into the separating slot 16 between the ceiling L side walls 5 and the housing base 8.

Erfindungsgemäß wird ein dichtes und auch bei sehr hoher Anzahl von SchaLtzykLen noch einwandfrei arbeitendes ReLais dadurch erhalten, daß zunächst das ReLais zusammengebaut und der Deckel 1 aufgeschoben wird (Fig. 5 Verfahrensabschnitt I). Hierauf wird das ReLais so aufgestellt oder gehalten, daß die Oberseite 2 des DeckeLs 1 nach unten zeigt (Fig. 5, Verfahrensabschnitt II). In dieser Lage wird auf die Unterseite 7 des Gehäusebodens 8 eine selbsthärtende oder z.B. durch Energiezufuhr härtbare Vergußmasse 15 aufgebracht (Verfahrensabschnitt III) und dann die Vergußmasse durch Energiezufuhg insbesondere durch eine Wärmevorrichtung 17 oder HeißLuft etc., angeLiert oder ganz ausgehärtet. Darauf wird der Boden 4 der Einfülloffnung 3 des DeckeLs 1 beispielsweise mittels einer feinen Nadel durchstoßen oder durchstochen und dadurch das LüftungsLoch 14 gebiLdet. Ggfs. kann das Lüftungsloch 14 auch an anderen SteLLen des Gehäuses, beispielsweise in einer der Seitenwände 5 des DeckeLs 1 oder in einem Teil des GehäuseunterteiLs vorgesehen sein. Durch das LüftungsLoch 14 kann der Innenraum des ReLais entgasen, wonach das LüftungsLoch 14 ggfs. verschlossen wird oder der Innenraum wird in einem besonderen Verfahrensabschnitt (Verfahrensabschnitt V) mit trockner Luft, Wasserstoff und/oder Inertgas durchgespült oder beispielsweise bei einem Unterdruck von bis zu 10-5 bar in einer Unterdruckkammer 18 entgast und ggfs. dann erst verschlossen. Letzteres erfolgt vorzugsweise bei erhöhter Temperatur, z.B. zwischen 120 und 200 °C, insbesondere zwischen 140 und 160 °C,und ggfs. in NormaLLage des ReLais. Hierbei entweichen aus den verwendeten Kunststoffen für den späteren Betrieb schädliche BestandteiLe. Hierauf wird zweckmäßig der Innenraum vorzugsweise nach AbkühLung auf NormaLtemperatur mit einem inerten Gas, wie z.B. Helium, Argon oder Stickstoff,oder mit Wasserstoff oder getrockneter Luft gefüllt und anschließend in Normallage des ReLais Vergußmasse 15 in die EinfüLLöffnung 3 gebracht und diese danach ausgehärtet.According to the invention, a dense relay, which works perfectly even with a very large number of switching cycles, is obtained by first assembling the relay and pushing on the cover 1 (FIG. 5, method section I). The relay is then set up or held so that the top 2 of the cover 1 points downward (FIG. 5, process section II). In this position, a self-curing or, for example, energy-curable potting compound 15 is applied to the underside 7 of the housing base 8 (method section III) and then the potting compound is cured or fully cured by energy supply, in particular by a heating device 17 or hot air etc. The bottom 4 of the filling opening 3 of the cover 1 is then pierced or pierced, for example by means of a fine needle, and the ventilation hole 14 is thereby formed. If necessary. The ventilation hole 14 can also be provided at other parts of the housing, for example in one of the side walls 5 of the ceiling 1 or in a part of the housing part. The interior of the relay can be degassed through the ventilation hole 14, after which the ventilation hole 14 may be closed or the interior is flushed with dry air, hydrogen and / or inert gas in a special process section (process section V) or, for example, at a negative pressure of up to 10 Degassed -5 bar in a vacuum chamber 18 and if necessary only then closed. The latter is preferably carried out at an elevated temperature, for example between 120 and 200 ° C., in particular between 140 and 160 ° C., and possibly in the normal position of the relay. Harmful components escape from the plastics used for later operation. The interior is then expediently filled with an inert gas, such as helium, argon or nitrogen, or with hydrogen or dried air, preferably after cooling to normal temperature, and then placed in the filling opening 3 in the normal position of the ReLais potting compound 15 and then cured.

Hierdurch erhält man ein vollkommen dichtes ReLais mit sehr reinen Kontaktoberflächen und reiner, unschädLicher Innenatmosphäre, wodurch eine Lange Lebensdauer auch bei hoher SchaLthäufigkeit und sehr vielen, z.B. 106, SchaLtzyklen erreicht wird.This results in a completely tight relay with very clean contact surfaces and a clean, harmless interior atmosphere, which ensures a long service life even with high switching frequency and a large number of switching cycles, e.g. 10 6 .

Gemäß einer vorteilhaften Ausgestaltung der Erfindung kann zum Durchstoßen der ReLaiswandung, also insbesondere des Bodens 4 der EinfüLLöffnung 3, eine erhitzte NadeL verwendet werden. Hierdurch muß kein großer Druck auf die Wanduna ausgeübt werden, wenn das Wandungsmaterial, wie vorgesehen und üblicherweise verwendet, aus einem thermoplastischen Kunststoff besteht.According to an advantageous embodiment of the invention, a heated needle can be used to pierce the relay wall, in particular the bottom 4 of the filling opening 3. As a result, no great pressure has to be exerted on the wall if the wall material, as provided and usually used, consists of a thermoplastic.

Claims (10)

1. Verfahren zum Abdichten eines elektromagnetischen ReLais mit Lüftbarem Innenraum und mit einem bis zum Boden eines GehäuseunterteiLs reichenden becherartigen DekkeL durch Aufbringen einer aushärtenden oder härtbaren Vergußmasse auf die Unterseite des ReLaisbodens und anschließendes Härten der Vergußmasse in nach unten weisender Lage der DeckeLoberseite des ReLais, dadurch gekennzeichnet, daß ein zum Lüften und/oder Entgasen und/oder Füllen des Innenraums dienendes LüftungsLoch (14) erst nach dem AngeLieren oder Aushärten der Vergußmasse (15) in einer ReLaiswandung gebildet wird.1. A method for sealing an electromagnetic relay with a ventilated interior and with a cup-like cover reaching to the bottom of a housing lower part by applying a hardening or hardenable sealing compound to the underside of the relay bottom and subsequent hardening of the sealing compound in the downward-facing position of the top cover side of the relay, thereby characterized in that a ventilation hole (14) serving for ventilation and / or degassing and / or filling the interior is formed in a relay wall only after the casting compound (15) has been gelled or hardened. 2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß das LüftungsLoch (14) nach dem öffnen wieder verschlossen wird.2. The method according to claim 1, characterized in that the ventilation hole (14) is closed again after opening. 3. Verfahren nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß der Innenraum des ReLais nach dem öffnen bzw. nach BiLdung des LüftungsLoches (14) mit trockener Luft und/ oder Wasserstoff und/oder Inertgas gespült wird.3. The method according to claim 1 or 2, characterized in that the interior of the relay after opening or after formation of the ventilation hole (14) is flushed with dry air and / or hydrogen and / or inert gas. 4. Verfahren nach Anspruch 4, dadurch gekennzeichnet, daß die DurchspüLung bei erhöhter Temperatur vorgenommen wird.4. The method according to claim 4, characterized in that the flushing is carried out at elevated temperature. 5. Verfahren nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, daß der Innenraum des ReLais bei Unterdruck bis herunter zu 10-5 bar entgast und anschließend mit einem Inertgas und/oder getrockneter Luft und/oder Wasserstoff gefüllt und anschließend das LüftungsLoch (14) geschlossen wird.5. The method according to any one of claims 1 to 4, characterized in that the interior of the ReLais degasses down to 10 -5 bar and then filled with an inert gas and / or dried air and / or hydrogen and then the ventilation hole (14 ) is closed. 6. Verfahren nach Anspruch 5, dadurch gekennzeichnet, daß die Entgasung bei einer Temperatur zwischen 130 und 180 C vorgenommen wird.6. The method according to claim 5, characterized in that the degassing is carried out at a temperature between 130 and 180 C. 7. Verfahren nach einem der Ansprüche 1 bis 6, dadurch gekennzeichnet, daß ein becherartiger DeckeL (1) mit einer trichterartigen EinfüLLöffnung (3), deren Boden (4) geschlossen ist, nach dem Zusammenbau des ReLais auf dieses aufgeschoben wird, daß anschließend der Gehäuseboden (8) des GehäuseunterteiLs vergossen und die Vergußmasse (15) angeliert oder ausgehärtet wird, daß danach das ReLais um 180 0 in die NormaLLage gedreht wird und hierauf oder vor dem Umdrehen der Boden (4) des LüfungsLoches (14) durchstoßen und dann der Innenraum des ReLais bei erhöhter Temperatur und Unterdruck entgast und danach auf Raumtemperatur abgekühlt und mit inertem Gas und/oder getrockneter Luft und/oder Wasserstoff gefüllt und hierauf oder nach dem Umdrehen des ReLais das LüftungsLoch (14) verschlossen wird.7. The method according to any one of claims 1 to 6, characterized in that a cup-like cover (1) with a funnel-like filler opening (3), the bottom (4) of which is closed, is pushed onto the relay after assembly, that subsequently the is the housing bottom (8) shed the lower housing part and gelled the sealing compound (15) or hardened, that thereafter the relay is turned 180 0 in the normal position and thereafter or before the time at the bottom (4) pierce the LüfungsLoches (14) and then the The interior of the ReLais is degassed at elevated temperature and negative pressure and then cooled to room temperature and filled with inert gas and / or dried air and / or hydrogen and the ventilation hole (14) is then closed or after the ReLais has been turned over. 8. Verfahren nach einem der Ansprüche 1 bis 7, dadurch gekennzeichnet, daß das LüftungsLoch (14) durch Eingießen und anschließendes Aushärten einer Vergußmasse (15) verschlossen wird.8. The method according to any one of claims 1 to 7, characterized in that the ventilation hole (14) is sealed by pouring and then curing a potting compound (15). 9. Verfahren nach einem der Ansprüche 1 bis 8, dadurch gekennzeichnet, daß das LüftungsLoch (14) nur so groß gemacht wird, daß die eingefüllte Vergußmasse (15) infolge KapiLLarwirkung und/oder der Oberflächenspannung der Vergußmasse (15) nicht nach innen tropft.9. The method according to any one of claims 1 to 8, characterized in that the ventilation hole (14) is only made so large that the filled potting compound (15) does not drip inwards as a result of capillary action and / or the surface tension of the potting compound (15). 10. Verfahren nach Anspruch 1 bis 9, dadurch gekennzeichnet, daß das LüftungsLoch (14) dadurch gebildet wird, daß eine Relaiswandung mittels einer erhitzten NadeL durchstochen wird.10. The method according to claim 1 to 9, characterized in that the ventilation hole (14) is formed in that a relay wall is pierced by means of a heated needle.
EP84102158A 1983-03-12 1984-03-01 Method of sealing a relay Expired EP0118841B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AT84102158T ATE32151T1 (en) 1983-03-12 1984-03-01 PROCEDURE FOR SEALING A RELAY.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3308791 1983-03-12
DE3308791A DE3308791C2 (en) 1983-03-12 1983-03-12 Method of manufacturing a sealed electromagnetic relay

Publications (3)

Publication Number Publication Date
EP0118841A2 true EP0118841A2 (en) 1984-09-19
EP0118841A3 EP0118841A3 (en) 1985-01-23
EP0118841B1 EP0118841B1 (en) 1988-01-20

Family

ID=6193247

Family Applications (1)

Application Number Title Priority Date Filing Date
EP84102158A Expired EP0118841B1 (en) 1983-03-12 1984-03-01 Method of sealing a relay

Country Status (7)

Country Link
US (1) US4675987A (en)
EP (1) EP0118841B1 (en)
JP (1) JPS59175528A (en)
AT (1) ATE32151T1 (en)
CA (1) CA1234462A (en)
DE (1) DE3308791C2 (en)
ES (1) ES8504406A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0308898A2 (en) * 1987-09-21 1989-03-29 OMRON Corporation Electrical contact
EP0434463A2 (en) * 1989-12-22 1991-06-26 Eev Limited High voltage relay
US5554963A (en) * 1992-06-11 1996-09-10 Alcatel Str Ag Gas-filled plastic enclosed relay
EP0836208A2 (en) * 1996-10-14 1998-04-15 Cherry Mikroschalter GmbH Switching device encapsulated in a potting compound and method for making it

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8900466U1 (en) * 1989-01-17 1989-03-02 Siemens Ag, 1000 Berlin Und 8000 Muenchen, De
JPH05290703A (en) * 1992-04-08 1993-11-05 Nec Tohoku Ltd Electromagnetic relay
US5477008A (en) * 1993-03-19 1995-12-19 Olin Corporation Polymer plug for electronic packages
US5759668A (en) * 1994-02-04 1998-06-02 Omron Corporation Heat seal structure
GB2333646B (en) * 1998-05-29 2000-01-12 Electronic Tech Transformer bobbin
CN101609773B (en) * 2008-06-18 2012-05-16 清华大学 Method for sealing vacuum device
US8330062B2 (en) * 2009-09-18 2012-12-11 Leviton Manufacturing Co., Inc. Electrical switching component
US8281951B2 (en) * 2009-10-15 2012-10-09 Leviton Manufacturing Co., Inc. Electrical component enclosure
US8463453B2 (en) 2009-11-13 2013-06-11 Leviton Manufacturing Co., Inc. Intelligent metering demand response
US8755944B2 (en) * 2009-11-13 2014-06-17 Leviton Manufacturing Co., Inc. Electrical switching module
US8324761B2 (en) * 2009-11-13 2012-12-04 Leviton Manufacturing Co., Inc. Electrical switching module
US8736193B2 (en) 2011-12-22 2014-05-27 Leviton Manufacturing Company, Inc. Threshold-based zero-crossing detection in an electrical dimmer
US8664886B2 (en) 2011-12-22 2014-03-04 Leviton Manufacturing Company, Inc. Timer-based switching circuit synchronization in an electrical dimmer
US9681526B2 (en) 2014-06-11 2017-06-13 Leviton Manufacturing Co., Inc. Power efficient line synchronized dimmer
CN108281326A (en) * 2018-02-12 2018-07-13 裴喜乐 Pedestal and shell automatic assembly equipment in relay
CN112385093B (en) * 2018-05-08 2022-07-08 博泽沃尔兹堡汽车零部件欧洲两合公司 Electronic unit and electric fluid pump and closure element
JP7204365B2 (en) * 2018-07-31 2023-01-16 富士通コンポーネント株式会社 electromagnetic relay

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2461427A1 (en) * 1974-12-24 1976-07-08 Lothar Sachsse Electromagnetic switching relay with protective atmosphere - has moving system of permanent magnet supported by lead-in wires
DE2618492A1 (en) * 1976-04-27 1977-11-10 Siemens Ag Electromechanical relay protective device - has case sealed by porous mass saturated with sealing compound also used for gluing additional components
DE2732517A1 (en) * 1976-12-23 1978-06-29 Zettler Elektrotechn Alois AIR-TIGHTLY SEALED CASE MADE OF PLASTIC FOR ELECTROMAGNETIC RELAY
EP0053870A1 (en) * 1980-12-05 1982-06-16 Izumi Denki Corporation Compact design relay
DE3111311A1 (en) * 1981-03-23 1982-09-30 Siemens AG, 1000 Berlin und 8000 München Method for sealing electromechanical components

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2092445A (en) * 1934-03-09 1937-09-07 Doulgheridis Alcibiad Michael Method of sealing containers
BE457265A (en) * 1943-08-18
DE843350C (en) * 1948-10-02 1952-07-07 Ernst Augsten Canning container lid and tools for opening the same
US2810889A (en) * 1956-07-30 1957-10-22 Rca Corp Electromechanical filter assembly
NL113667C (en) * 1958-07-04
US4035909A (en) * 1972-12-12 1977-07-19 P. R. Mallory & Co., Inc. Method of making a miniature concentric battery
JPS6021878Y2 (en) * 1979-10-23 1985-06-29 富士通株式会社 Relay for printed board
JPS5539154A (en) * 1978-09-12 1980-03-18 Matsushita Electric Works Ltd Method of fabricating gassfilled electric switch
DE3045719A1 (en) * 1980-12-04 1982-07-08 Basf Ag, 6700 Ludwigshafen METHOD FOR PRODUCING CYCLOALIPHATIC AND / OR AROMATIC AMINES
JPH017959Y2 (en) * 1981-05-06 1989-03-02

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2461427A1 (en) * 1974-12-24 1976-07-08 Lothar Sachsse Electromagnetic switching relay with protective atmosphere - has moving system of permanent magnet supported by lead-in wires
DE2618492A1 (en) * 1976-04-27 1977-11-10 Siemens Ag Electromechanical relay protective device - has case sealed by porous mass saturated with sealing compound also used for gluing additional components
DE2732517A1 (en) * 1976-12-23 1978-06-29 Zettler Elektrotechn Alois AIR-TIGHTLY SEALED CASE MADE OF PLASTIC FOR ELECTROMAGNETIC RELAY
EP0053870A1 (en) * 1980-12-05 1982-06-16 Izumi Denki Corporation Compact design relay
DE3111311A1 (en) * 1981-03-23 1982-09-30 Siemens AG, 1000 Berlin und 8000 München Method for sealing electromechanical components

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0308898A2 (en) * 1987-09-21 1989-03-29 OMRON Corporation Electrical contact
EP0308898A3 (en) * 1987-09-21 1989-07-26 OMRON Corporation Electrical contact
US4933520A (en) * 1987-09-21 1990-06-12 Omron Tateisi Electronics Company Electrical contact for use in electromagnetic relay
EP0434463A2 (en) * 1989-12-22 1991-06-26 Eev Limited High voltage relay
EP0434463A3 (en) * 1989-12-22 1992-07-01 Eev Limited Relay arrangements
US5554963A (en) * 1992-06-11 1996-09-10 Alcatel Str Ag Gas-filled plastic enclosed relay
EP0836208A2 (en) * 1996-10-14 1998-04-15 Cherry Mikroschalter GmbH Switching device encapsulated in a potting compound and method for making it
EP0836208A3 (en) * 1996-10-14 1999-01-27 Cherry Mikroschalter GmbH Switching device encapsulated in a potting compound and method for making it

Also Published As

Publication number Publication date
EP0118841A3 (en) 1985-01-23
DE3308791A1 (en) 1984-09-20
JPH0572049B2 (en) 1993-10-08
JPS59175528A (en) 1984-10-04
ATE32151T1 (en) 1988-02-15
CA1234462A (en) 1988-03-29
US4675987A (en) 1987-06-30
ES530501A0 (en) 1985-04-01
ES8504406A1 (en) 1985-04-01
EP0118841B1 (en) 1988-01-20
DE3308791C2 (en) 1986-08-21

Similar Documents

Publication Publication Date Title
EP0118841A2 (en) Method of sealing a relay
EP1720637B1 (en) Method for the production of a membrane filter unit
WO1998008365A1 (en) Process for shielding an electric or electronic circuit and shielding cap
WO2000023241A1 (en) Thermoplastic part with an injected elastomer seal
DE2535923B2 (en) METHOD AND FORM FOR ENCAPSULATING ELECTRICAL COMPONENTS
DE19703269C2 (en) Bracket for a cooktop
DE2616299C2 (en) Wash-proof protective device for an electromechanical component and method for its sealing
DE19818036A1 (en) Production of electro-technical components with plastic-passivated surfaces
EP0130500A2 (en) Water-proof electromagnetic relay
DE2830472B2 (en) Process for the serial encasing of electrical components, in particular capacitors
DE4326564C2 (en) Nozzle cover for an ink printhead and method for applying the same
EP0578017B1 (en) Injection valve for a vacuum-wax-injection molding apparatus
DE3012449A1 (en) LIQUID-COOLED TRANSFORMER FOR HIGH PERFORMANCE
EP0593986B1 (en) Process of soldering a semiconductor body to a supportelement
CH657475A5 (en) ELECTROMAGNETIC RELAY.
DE4212068C1 (en)
DE2713167C2 (en) Process for applying plastic sealing strips to positive tube plates of lead-acid batteries
DE3805562A1 (en) Holding magnet release, and a method for its production
DE102008026997A1 (en) Method and template for applying an adhesive layer to a sensor device
DE19750348A1 (en) Housing and method for its manufacture
DE4444812C1 (en) Method for capping a chip card module and device for carrying out the method
WO2005011040A2 (en) Method for producing a fuel cell stack
EP0773358A1 (en) Method for making a cylinder head cover seal
DE2331294B2 (en) Die casting mold for molding resin under pressure with a vent of the mold cavity
EP1409796B1 (en) Method for producing a damped manhole

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Designated state(s): AT BE FR GB

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Designated state(s): AT BE FR GB

17P Request for examination filed

Effective date: 19850529

17Q First examination report despatched

Effective date: 19860120

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: ALCATEL N.V.

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT BE FR GB

REF Corresponds to:

Ref document number: 32151

Country of ref document: AT

Date of ref document: 19880215

Kind code of ref document: T

GBT Gb: translation of ep patent filed (gb section 77(6)(a)/1977)
RAP4 Party data changed (patent owner data changed or rights of a patent transferred)

Owner name: ALCATEL N.V.

ET Fr: translation filed
PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed
PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 19921230

Year of fee payment: 10

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 19930225

Year of fee payment: 10

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: AT

Payment date: 19930325

Year of fee payment: 10

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: BE

Payment date: 19930414

Year of fee payment: 10

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AT

Effective date: 19940301

Ref country code: GB

Effective date: 19940301

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Effective date: 19940331

BERE Be: lapsed

Owner name: ALCATEL N.V.

Effective date: 19940331

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 19940301

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Effective date: 19941130

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST