EP0184877A1 - Matrix of electroluminescent elements and production method thereof - Google Patents

Matrix of electroluminescent elements and production method thereof Download PDF

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Publication number
EP0184877A1
EP0184877A1 EP85201902A EP85201902A EP0184877A1 EP 0184877 A1 EP0184877 A1 EP 0184877A1 EP 85201902 A EP85201902 A EP 85201902A EP 85201902 A EP85201902 A EP 85201902A EP 0184877 A1 EP0184877 A1 EP 0184877A1
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EP
European Patent Office
Prior art keywords
substrate
conductive
face
insulating
matrix
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Granted
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EP85201902A
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German (de)
French (fr)
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EP0184877B1 (en
Inventor
Jacques Thillays
André Talpied
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Photonis SAS
Koninklijke Philips NV
Original Assignee
Rtc La Radiotechnique-Compelec SA
Radiotechnique Compelec RTC SA
Photonis SAS
Philips Gloeilampenfabrieken NV
Koninklijke Philips Electronics NV
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Publication of EP0184877A1 publication Critical patent/EP0184877A1/en
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Publication of EP0184877B1 publication Critical patent/EP0184877B1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base

Definitions

  • the subject of the present invention is a matrix of electroluminescent elements mounted on an insulating substrate having conductive paths for their electrical interconnection and each disposed at the focus of an optical collimating element, at least several of said elements being arranged in at least a plate whose lower face covers the upper face of the substrate, and extending by cylindrical openings opening to the lower face of the plate.
  • This matrix has the drawback of a high number of elements and of a relatively complicated assembly, since it requires operations of precise alignment of the printed circuit and of the plate forming the substrate, of prior orientation of the anode and of the cathode of the electroluminescent elements and of insertion of these, each in two aligned holes of the plate forming the substrate and of the printed circuit, so that their electrical outputs deviate towards the outside, from the soldering of the electrical outputs of the diodes on the printed circuit, and positioning of the plate carrying the parabolic cavities so that the diodes are held in abutment thereon thanks to the elasticity of their electrical outlets spread outwards.
  • the matrix is simpler than that of the aforementioned prior art, since it has neither a special plate forming a printed circuit, nor a panel for resiliently holding the plate carrying the optical collimation elements.
  • each element comprises on the one hand a support consisting of an electrically conductive rod having an upper face and a lower face, an insulating washer surrounding an upper lateral part of the conductive rod, and of a conductive washer surrounding the insulating washer, and on the other hand an electroluminescent component mounted on the upper face of the conductive rod so as to form an electrical contact therewith, in that the conductive rod passes through a hole in the substrate so that its underside is in electrical contact with conductive paths on the underside of the substrate, in that the conductive washer is electrically connected on the one hand to the electroluminescent component and on the other hand to conductive paths of the upper face of the substrate, and in that at least the lower face and the cylindrical openings of the plate are insulating, said openings cy lindrics engaging with small play in the conductive washers.
  • the substrate directly carries on its two faces the conductive paths which also have the function of holding in place the electroluminescent elements, and the plate comes into contact with the substrate and is held in place by cooperation with low clearance between the cylindrical openings extending the collimating optical elements and the corresponding conductive washers.
  • optical collimating elements can be chosen from reflective parabolic cavities such as those described in the aforementioned US Pat. No. 4,254,453, or else light pipes of the type described for example in the German patent application DE A 2 201 574 (SIEMENS AG), or in European application EP 117 606 (XEROX Corp.).
  • the conductive paths of at least one face of the substrate are screen printed. It is then advantageous for the underside of the conductive rods to protrude slightly from the corresponding hole in the substrate.
  • the electrical connection of the elements of the matrix is generally such that the conductive paths of the substrate connect the electroluminescent elements according to lines on one face of the substrate and according to columns on the other face of the latter.
  • the electro-luminescent components can be coated in a protective dome made of transparent material adapting the optical indices between said components and the air.
  • the substrate can advantageously be made of a material which is a good thermal conductor, for example aluminum coated with an anodic oxidation layer.
  • the method according to the invention is also easier to implement than that of the above-mentioned prior art.
  • the insertion step consists simply of introducing the conductive rods into the corresponding holes of the substrate without the need to orient them angularly and the elements are held in place by joining with the conductive paths of the substrate.
  • the positioning of the plate carrying the optical collimating elements is also simplified by the fact that it is positioned by the cooperation with small clearance between the cylindrical parts of the plate and the conducting rings, and by its abutment on the substrate.
  • the conductive paths of at least one face of the substrate are produced by screen printing, said joining being obtained by baking the screen-printed paths.
  • the structure of the matrix makes it possible to mount the electroluminescent components on the upper face of the conductive rods either before the insertion of the supports in the holes of the insulating substrate, that is to say that electro-elements are inserted. complete luminescent, or after said insertion of the supports, that is to say that the elements are collectively completed on the matrix itself after any one of steps c to f.
  • the electro-luminescent component can be coated with a protective dome made of transparent material which also acts as an index adapter.
  • a support 10 consists of a cylindrical conductive rod 13, generally of metal, having an upper face 15 and a lower face 16, an insulating washer 12, made of glass or thermoplastic material whose internal diameter corresponds to that of the rod and of a conductive washer 11 whose internal diameter corresponds to the external diameter of the insulating washer 12.
  • the mounting of these three elements is carried out such that the washer 12 is mounted on the upper lateral part 19 of the rod 13 and that the washers 11 and 12 are located in the same plane and that the upper face 15 of the conductive rod 13 protrudes slightly.
  • the attachment of the rod and the two washers is easy, either by glass-metal welding when the washer 12 is made of glass, or by simple heating in case it is made of thermoplastic material.
  • an electro-luminescent component 17 for example a diode
  • a conductive adhesive to the upper face 15 of the conductive rod 13.
  • the optical coupling can be improved by means of a transparent resin dome 14 allowing adaptation of index between component 17 and air.
  • This dome 14 also covers the rings 12 and 11 which improves the mechanical strength of the support 10.
  • the anode of the diode 17 is electrically connected to the conductive ring 11 by a welded wire 18.
  • the matrix comprises an insulating substrate 30 having holes 21 arranged in rows and columns to form the array of the matrix.
  • the substrate 30 is here made of aluminum 31 covered with an anodizing layer covering at 32 its upper 35 and lower 36 faces and at 34 the edges of the holes 33.
  • the conductive rods 13 are arranged with little play in the holes 33, and the washers 11 and 12 abut on metallizations 22 (axis X) located on the upper face 35 of the substrate 30
  • the lower faces 16 of the rods 13 come into contact with metallizations 24 of the lower face 36 of the substrate 30.
  • the metallizations 22, preferably obtained by screen printing are arranged in lines and the metallizations 24 (axis Y), preferably obtained by screen printing, according to columns so as to obtain the conventional interconnection in the matrices.
  • the lower part 16 of the rods 13 advantageously protrudes from the lower face 36 of the substrate 30 and is covered by the screen-printed metallization 24 which improves the mechanical and electrical connection.
  • the metallization axis 22 crosses that of the corresponding holes 33. At these, the metallizations 22 are interrupted on a circle 25 of diameter approximately equal to the inside diameter of the rings 11.
  • a plate 20 has parabolic cavities 21 extending towards the lower face 23 of said plate by circular openings 41, the outside diameter of which corresponds to a small clearance close to the outside diameter of the conductive rings 11.
  • the openings 41 are arranged in the same network as the elements 1.
  • the plate 20 is arranged so as to abut on the upper face 35 of the substrate 30.
  • each cavity 21 is constituted by a half-shell 40 with relatively thin walls, the shells being integral together others at their periphery in the regions 43.
  • the lower face 23 of the half-shells 40 has a central region 26 surrounding the openings 41 and which abuts on the upper face 35 of the substrate 30.
  • Said plate 20 can be of molded plastic material and metallized on the inner face 27 of the half-shells.
  • the plate 20 includes at least one light pipe as described in the applications DE A 2 201 574 or EP A 117 606 mentioned above.
  • a conduit has a hemispherical cavity which suffices to be extended by a cylindrical part cooperating with little play with the corresponding conductive ring 11.
  • Metallizations 24 are then produced on the underside 36 of the substrate 30. It is preferable to carry out ser this operation by inverting the substrate 30.
  • the preferred solution is screen printing, which allows, by a subsequent cooking step to complete the electrical and mechanical placement of the supports. It is advantageous to allow the lower face 16 of the rods 13 to protrude from the lower face 36 of the substrate 30.
  • components 17 and the possible coating in domes 14 can be carried out at any time, but it will advantageously take place after the stages of cooking the screen prints.
  • series connections between diodes of the matrix can be obtained by means of suitable links to a connector in which the substrate is inserted or even using at least one fully conductive part and of the same shape as the supports 10 and arranged in an appropriately chosen hole 33.

Abstract

L'invention concerne une matrice d'éléments électro-luminescents présentant chacun une tige conductrice (13), une rondelle isolante (12) et une rondelle conductrice (11), un composant (17) étant monté sur la face supérieure de la tige (13). Les éléments sont disposés dans des trous d'un substrat isolant (30) et sont reliés électriquement selon des lignes par des métallisations (22) de la face supérieure du substrat (30) et selon des colonnes par des métallisations (24) de la face inférieure (36) du substrat (30). Selon le procédé, les éléments sont introduits dans les trous (33) du substrat et sont solidarisés d'une part aux métallisations (22) et d'autre part aux métallisations (24). Une plaque 20 portant des cavités paraboliques réfléchissantes (21) est montée en butée sur le substrat 30 et est maintenu par coopération entre des ouvertures 41 prolongeant les cavités 21 et les rondelles conductrices 11.The invention relates to a matrix of electroluminescent elements each having a conductive rod (13), an insulating washer (12) and a conductive washer (11), a component (17) being mounted on the upper face of the rod ( 13). The elements are arranged in holes of an insulating substrate (30) and are electrically connected in lines by metallizations (22) of the upper face of the substrate (30) and in columns by metallizations (24) of the face bottom (36) of the substrate (30). According to the method, the elements are introduced into the holes (33) of the substrate and are joined on the one hand to the metallizations (22) and on the other hand to the metallizations (24). A plate 20 carrying reflective parabolic cavities (21) is mounted in abutment on the substrate 30 and is held by cooperation between openings 41 extending the cavities 21 and the conductive washers 11.

Description

La présente invention a pour objet une matrice d'éléments électro-luminescents montés sur un substrat isolant présentant des trajets conducteurs pour leur interconnexion électrique et disposés chacun au foyer d'un élément optique de collimation, au moins plusieurs desdits éléments étant ménagés dans au moins une plaque dont la face inférieure recouvre la face supérieure du substrat, et se prolongeant par des ouvertures cylindriques débouchant à la face inférieure de la plaque.The subject of the present invention is a matrix of electroluminescent elements mounted on an insulating substrate having conductive paths for their electrical interconnection and each disposed at the focus of an optical collimating element, at least several of said elements being arranged in at least a plate whose lower face covers the upper face of the substrate, and extending by cylindrical openings opening to the lower face of the plate.

Une telle matrice est connue du brevet US 4 254 453 (MOUYARD et al.) déposé par la Société Général Instruments Corp., dans lequel les éléments électro-luminescents sont des diodes sous boîtier d'un type classique, et présentant des éléments de collimation constitués par des cavités paraboliques réfléchissantes. Les diodes sont maintenues mécaniquement par une plaque d'insertion formant substrat. Une carte de circuit imprimé simple ou double face est utilisée pour réaliser les connexions électriques.Such a matrix is known from US Pat. No. 4,254,453 (MOUYARD et al.) Filed by the Société Général Instruments Corp., in which the electroluminescent elements are diodes in a housing of a conventional type, and having collimation elements. formed by reflective parabolic cavities. The diodes are held mechanically by an insertion plate forming a substrate. A single or double sided printed circuit board is used to make the electrical connections.

Cette matrice présente l'inconvénient d'un nombre élevé d'éléments et d'un montage relativement compliqué, car nécessitant des opérations d'alignement précis du circuit imprimé et de la plaque formant substrat, d'orientation préalable de l'anode et de la cathode des éléments électroluminescents et d'insertion de celles-ci, chacune dans deux trous alignés de la plaque formant substrat et du circuit imprimé, de telle sorte que leurs sorties électriques s'écartent vers l'extérieur, de soudure des sorties électriques des diodes sur le circuit imprimé, et de mise en place de la plaque portant les cavités paraboliques de telle manière que les diodes soient maintenues en butée sur celle-ci grâce à l'élasticité de leurs sorties électriques écartées vers l'extérieur.This matrix has the drawback of a high number of elements and of a relatively complicated assembly, since it requires operations of precise alignment of the printed circuit and of the plate forming the substrate, of prior orientation of the anode and of the cathode of the electroluminescent elements and of insertion of these, each in two aligned holes of the plate forming the substrate and of the printed circuit, so that their electrical outputs deviate towards the outside, from the soldering of the electrical outputs of the diodes on the printed circuit, and positioning of the plate carrying the parabolic cavities so that the diodes are held in abutment thereon thanks to the elasticity of their electrical outlets spread outwards.

Selon l'invention, la matrice est plus simple que celle de l'art antérieur précité, car elle ne présente ni plaque spéciale formant circuit imprimé, ni panneau pour maintenir élastiquement la plaque portant les éléments optiques de collimation.According to the invention, the matrix is simpler than that of the aforementioned prior art, since it has neither a special plate forming a printed circuit, nor a panel for resiliently holding the plate carrying the optical collimation elements.

Dans ce but, elle est caractérisée en ce que chaque élément comporte d'une part un support constitué d'une tige électriquement conductrice présentant une face supérieure et une face inférieure, d'une rondelle isolante entourant une partie latérale supérieure de la tige conductrice, et d'une rondelle conductrice entourant la rondelle isolante, et d'autre part un composant électro-luminescent monté à la face supérieure de la tige conductrice de manière à former un contact électrique avec celle-ci, en ce que la tige conductrice traverse un trou du substrat de celle sorte que sa face inférieure se trouve en contact électrique avec des trajets conducteurs de la face inférieure du substrat, en ce que la rondelle conductrice est raccordée électriquement d'une part au composant électro-luminescent et d'autre part à des trajets conducteurs de la face supérieure du substrat, et en ce qu'au moins la face inférieure et les ouvertures cylindriques de la plaque sont isolantes, lesdites ouvertures cylindriques s'engageant à faible jeu dans les rondelles conductrices.For this purpose, it is characterized in that each element comprises on the one hand a support consisting of an electrically conductive rod having an upper face and a lower face, an insulating washer surrounding an upper lateral part of the conductive rod, and of a conductive washer surrounding the insulating washer, and on the other hand an electroluminescent component mounted on the upper face of the conductive rod so as to form an electrical contact therewith, in that the conductive rod passes through a hole in the substrate so that its underside is in electrical contact with conductive paths on the underside of the substrate, in that the conductive washer is electrically connected on the one hand to the electroluminescent component and on the other hand to conductive paths of the upper face of the substrate, and in that at least the lower face and the cylindrical openings of the plate are insulating, said openings cy lindrics engaging with small play in the conductive washers.

De la sorte, le substrat porte directement sur ses deux faces les trajets conducteurs qui ont également pour fonction de maintenir en place les éléments électro-luminescents, et la plaque vient en contact avec le substrat et est maintenue en place par coopération à faible jeu entre les ouvertures cylindriques prolongeant les éléments optiques de collimation et les rondelles conductrices correspondantes.In this way, the substrate directly carries on its two faces the conductive paths which also have the function of holding in place the electroluminescent elements, and the plate comes into contact with the substrate and is held in place by cooperation with low clearance between the cylindrical openings extending the collimating optical elements and the corresponding conductive washers.

Les éléments optiques de collimation peuvent être choisis parmi les cavités paraboliques réfléchissantes telles que celles décrites dans le brevet US 4 254 453 précité, ou bien les conduits de lumière du type de ceux décrits par exemple dans la demande de brevet allemand DE A 2 201 574 (SIEMENS AG), ou dans la demande européenne EP 117 606 (XEROX Corp.).The optical collimating elements can be chosen from reflective parabolic cavities such as those described in the aforementioned US Pat. No. 4,254,453, or else light pipes of the type described for example in the German patent application DE A 2 201 574 (SIEMENS AG), or in European application EP 117 606 (XEROX Corp.).

Selon un mode de réalisation préféré, les trajets conducteurs d'au moins une face du substrat sont sérigraphiés. Il est alors avantageux que la face inférieure des tiges conductrices dépasse légèrement du trou correspondant du substrat. Le raccordement électrique des éléments de la matrice est en général tel que les trajets conducteurs du substrat connectent les éléments électro-luminescents selon des lignes sur une face du substrat et selon des colonnes sur l'autre face de celui-ci.According to a preferred embodiment, the conductive paths of at least one face of the substrate are screen printed. It is then advantageous for the underside of the conductive rods to protrude slightly from the corresponding hole in the substrate. The electrical connection of the elements of the matrix is generally such that the conductive paths of the substrate connect the electroluminescent elements according to lines on one face of the substrate and according to columns on the other face of the latter.

Les composants électro-luminescents peuvent être enrobés dans un dôme de protection en matériau transparent adaptant les indices optiques entre lesdits composants et l'air.The electro-luminescent components can be coated in a protective dome made of transparent material adapting the optical indices between said components and the air.

Le substrat peut être avantageusement en matériau bon conducteur thermique, par exemple de l'aluminium revêtu d'une couche d'oxydation anodique. Les calories dissipées par les diodes étant véhiculées vers le substrat principalement par l'intermédiaire des tiges conductrices, on obtient une bonne évacuation thermique.The substrate can advantageously be made of a material which is a good thermal conductor, for example aluminum coated with an anodic oxidation layer. The calories dissipated by the diodes being conveyed towards the substrate mainly via the conductive rods, good thermal evacuation is obtained.

Le procédé selon l'invention est également plus facile à mettre en oeuvre que celui de l'art antérieur précité.The method according to the invention is also easier to implement than that of the above-mentioned prior art.

L'étape d'insertion consiste simplement à introduire les tiges conductrices dans les trous correspondants du substrat sans qu'il soit besoin de les orienter angulairement et les éléments sont maintenus en place par solidarisation avec les trajets conducteurs du substrat. La mise en place de la plaque portant les éléments optiques de collimation est également simplifiée du fait que celle-ci est positionnée par la coopération à faible jeu entre les parties cylindriques de la plaque et les anneaux conducteurs, et par sa venue en butée sur le substrat.The insertion step consists simply of introducing the conductive rods into the corresponding holes of the substrate without the need to orient them angularly and the elements are held in place by joining with the conductive paths of the substrate. The positioning of the plate carrying the optical collimating elements is also simplified by the fact that it is positioned by the cooperation with small clearance between the cylindrical parts of the plate and the conducting rings, and by its abutment on the substrate.

Le procédé selon l'invention vise à fabriquer une matrice telle qu'elle a été définie ci-dessus et comporte à cet effet les étapes suivantes :

  • a) réaliser selon une géométrie désirée des trajets conducteurs au moins sur une face supérieure d'un substrat isolant pourvu de trous destinés à recevoir lesdits éléments.
  • b) insérer dans les trous au moins les supports des éléments, ceux-ci comportant une tige électriquement conductrice présentant une face supérieure et une face inférieure, une rondelle isolante entourant une partie latérale supérieure de la tige conductrice,' et une rondelle conductrice entourant la rondelle isolante, la géométrie désirée des trajets conducteurs étant telle que ceux-ci viennent en contact électrique avec les anneaux conducteurs correspondants.
  • c) solidariser les anneaux conducteurs et les trajets conducteurs correspondants de la face supérieure du substrat.
  • d) réaliser selon une géométrie désirée des trajets conducteurs sur la face inférieure du substrat de telle manière que ceux-ci viennent en contact électrique avec la face inférieure de la tige conductrice.
  • e) solidariser la tige conductrice et les trajets conducteurs correspondants de la face inférieure du substrat.
  • f) disposer sur le substrat au moins une plaque présentant une pluralité d'éléments optiques de collimation, se prolongeant par des ouvertures cylindriques isolantes venant s'engager à faible jeu dans les rondelles conductrices, jusqu'à ce que la face inférieure isolante de la plaque vienne en butée sur le substrat.
The method according to the invention aims to manufacture a matrix as defined above and for this purpose comprises the following steps:
  • a) producing, according to a desired geometry, conductive paths at least on an upper face of an insulating substrate provided with holes intended to receive said elements.
  • b) insert in the holes at least the supports of the elements, these comprising an electrically conductive rod having an upper face and a lower face, an insulating washer surrounding an upper lateral part of the conductive rod, and a conductive washer surrounding the insulating washer, the desired geometry of the conductive paths being such that they come into electrical contact with the corresponding conductive rings.
  • c) securing the conductive rings and the corresponding conductive paths of the upper face of the substrate.
  • d) producing, according to a desired geometry, conductive paths on the underside of the substrate so that they come into electrical contact with the underside of the conductive rod.
  • e) securing the conductive rod and the corresponding conductive paths of the underside of the substrate.
  • f) placing on the substrate at least one plate having a plurality of optical collimating elements, extended by insulating cylindrical openings which engage with small clearance in the conductive washers, until the insulating underside of the plate comes into abutment on the substrate.

Selon un mode de réalisation préféré, les trajets conducteurs d'au moins une face du substrat sont réalisés par sérigraphie, ladite solidarisation étant obtenue par cuisson des trajets sérigraphiés.According to a preferred embodiment, the conductive paths of at least one face of the substrate are produced by screen printing, said joining being obtained by baking the screen-printed paths.

La structure de la matrice permet de monter les composants électro-luminescents sur la face supérieure des tiges conductrices soit avant l'insertion des supports dans les trous du substrat isolant, c'est-à-dire que l'on insère des éléments électro-luminescents complets, soit après ladite insertion des supports, c'est-à-dire que les éléments sont com- plètés collectivement sur la matrice elle-même après l'une quelconque des étapes c à f. Le composant électro-luminescent peut être enrobé d'un dôme de protection en matériau transparent faisant également fonction d'adaptateur d'indice.The structure of the matrix makes it possible to mount the electroluminescent components on the upper face of the conductive rods either before the insertion of the supports in the holes of the insulating substrate, that is to say that electro-elements are inserted. complete luminescent, or after said insertion of the supports, that is to say that the elements are collectively completed on the matrix itself after any one of steps c to f. The electro-luminescent component can be coated with a protective dome made of transparent material which also acts as an index adapter.

L'invention sera mieux comprise à la lecture de la description qui va suivre, donnée à titre d'exemple non limitatif en liaison avec les figures qui représentent :

  • - les figures la à lc, respectivement un support avant montage, un support après montage, et un élément électro-luminescent pré-assemblé ;
  • - la figure 2, une vue de dessus d'une plaque portant les cavités paraboliques ;
  • - la figure 3a, une vue en coupe d'un substrat isolant selon l'invention, la figure 3b, un détail d'une métallisation de la face supérieure dudit substrat ;
  • - et la figure 4 un détail en coupe d'une matrice selon l'invention.
The invention will be better understood on reading the description which follows, given by way of nonlimiting example in conjunction with the figures which represent:
  • - Figures la to lc, respectively a support before mounting, a support after mounting, and a pre-assembled electro-luminescent element;
  • - Figure 2, a top view of a plate carrying the parabolic cavities;
  • - Figure 3a, a sectional view of an insulating substrate according to the invention, Figure 3b, a detail of a metallization of the upper face of said substrate;
  • - And Figure 4 a detail in section of a matrix according to the invention.

Selon la figure la, un support 10 est constitué d'une tige conductrice cylindrique 13, généralement en métal, présentant une face supérieure 15 et une face inférieure 16, d'une rondelle isolante 12, en verre ou en matériau thermoplastique dont le diamètre intérieur correspond à celui de la tige et d'une rondelle conductrice 11 dont le diamètre intérieur correspond au diamètre extérieur de la rondelle isolante 12.According to Figure la, a support 10 consists of a cylindrical conductive rod 13, generally of metal, having an upper face 15 and a lower face 16, an insulating washer 12, made of glass or thermoplastic material whose internal diameter corresponds to that of the rod and of a conductive washer 11 whose internal diameter corresponds to the external diameter of the insulating washer 12.

Selon la figure lb, le montage de ces trois éléments est réalisé de telle sorte que la rondelle 12 est montée sur la partie latérale supérieure 19 de la tige 13 et que les rondelles 11 et 12 soient situées dans le même plan et que la face supérieure 15 de la tige conductrice 13 dépasse légèrement. La solidarisation de la tige et des deux rondelles est aisée, soit par soudure verre-métal lorsque la rondelle 12 est en verre, soit par simple chauffage au cas où elle est en matériau thermoplastique.According to FIG. 1b, the mounting of these three elements is carried out such that the washer 12 is mounted on the upper lateral part 19 of the rod 13 and that the washers 11 and 12 are located in the same plane and that the upper face 15 of the conductive rod 13 protrudes slightly. The attachment of the rod and the two washers is easy, either by glass-metal welding when the washer 12 is made of glass, or by simple heating in case it is made of thermoplastic material.

Selon la figure lc, un composant électro-luminescent 17 par exemple une diode est collé par une colle conductrice sur la face supérieure 15 de la tige conductrice 13. Le couplage optique peut être amélioré grâce à un dôme en résine transparente 14 permettant une adaptation d'indice entre le composant 17 et l'air. Ce dôme 14 recouvre également les anneaux 12 et 11 ce qui améliore la tenue mécanique du support 10. L'anode de la diode 17 est reliée électriquement à l'anneau conducteur 11 par un fil soudé 18.According to FIG. 1c, an electro-luminescent component 17, for example a diode, is bonded by a conductive adhesive to the upper face 15 of the conductive rod 13. The optical coupling can be improved by means of a transparent resin dome 14 allowing adaptation of index between component 17 and air. This dome 14 also covers the rings 12 and 11 which improves the mechanical strength of the support 10. The anode of the diode 17 is electrically connected to the conductive ring 11 by a welded wire 18.

Selon les figures 2 à 4, la matrice comporte un substrat isolant 30 présentant des trous 21 disposés selon des lignes et des colonnes pour former le réseau de la matrice. Le substrat 30 est ici en aluminium 31 recouvert d'une couche d'anodisation recouvrant en 32 ses faces supérieure 35 et inférieure 36 et en 34 les bords des trous 33.According to Figures 2 to 4, the matrix comprises an insulating substrate 30 having holes 21 arranged in rows and columns to form the array of the matrix. The substrate 30 is here made of aluminum 31 covered with an anodizing layer covering at 32 its upper 35 and lower 36 faces and at 34 the edges of the holes 33.

Dans la matrice terminée (fig. 4), les tiges conductrices 13 sont disposées à faible jeu dans les trous 33, et les rondelles 11 et 12 viennent en butée sur des métallisations 22 (axe X) situées sur la face supérieure 35 du substrat 30. Les faces inférieures 16 des tiges 13 viennent en contact avec des métallisations 24 de la face inférieure 36 du substrat 30. Les métallisations 22, de préférence obtenues par sérigraphie, sont disposées selon des lignes et les métallisations 24 (axe Y), de préférence obtenues par sérigraphie, selon des colonnes de manière à obtenir l'interconnexion classique dans les matrices. La partie inférieure 16 des tiges 13 dépasse avantageusement de la face inférieure 36 du substrat 30 et est recouverte par la métallisation sérigraphiée 24 ce qui en améliore la liaison mécanique et électrique. L'axe des métallisations 22 croise celui des trous 33 correspondant. Au niveau de ceux-ci, les métallisations 22 s'interrompent sur un cercle 25 de diamètre approximativement égal au diamètre intérieur des anneaux 11.In the finished matrix (fig. 4), the conductive rods 13 are arranged with little play in the holes 33, and the washers 11 and 12 abut on metallizations 22 (axis X) located on the upper face 35 of the substrate 30 The lower faces 16 of the rods 13 come into contact with metallizations 24 of the lower face 36 of the substrate 30. The metallizations 22, preferably obtained by screen printing, are arranged in lines and the metallizations 24 (axis Y), preferably obtained by screen printing, according to columns so as to obtain the conventional interconnection in the matrices. The lower part 16 of the rods 13 advantageously protrudes from the lower face 36 of the substrate 30 and is covered by the screen-printed metallization 24 which improves the mechanical and electrical connection. The metallization axis 22 crosses that of the corresponding holes 33. At these, the metallizations 22 are interrupted on a circle 25 of diameter approximately equal to the inside diameter of the rings 11.

Une plaque 20 présente des cavités paraboliques 21 se prolongeant vers la face inférieure 23 de ladite plaque par des ouvertures circulaires 41 dont le diamètre extérieur correspond à un faible jeu près au diamètre extérieur des anneaux conducteurs 11. Les ouvertures 41 sont disposées selon le même réseau que les éléments 1. La plaque 20 est disposée de manière à venir en butée sur la face supérieure 35 du substrat 30. Plus particulièrement, chaque cavité 21 est constituée par une demi-coquille 40 à parois relativement minces, les coquilles étant solidaires les unes des autres à leur périphérie dans les régions 43. La face inférieure 23 des demi-coquilles 40 présente une région centrale 26 entourant les ouvertures 41 et qui vient en butée sur la face supérieure 35 du substrat 30.A plate 20 has parabolic cavities 21 extending towards the lower face 23 of said plate by circular openings 41, the outside diameter of which corresponds to a small clearance close to the outside diameter of the conductive rings 11. The openings 41 are arranged in the same network as the elements 1. The plate 20 is arranged so as to abut on the upper face 35 of the substrate 30. More particularly, each cavity 21 is constituted by a half-shell 40 with relatively thin walls, the shells being integral together others at their periphery in the regions 43. The lower face 23 of the half-shells 40 has a central region 26 surrounding the openings 41 and which abuts on the upper face 35 of the substrate 30.

Ladite plaque 20 peut être en matière plastique moulée et métallisée sur la face intérieure 27 des demi-coquilles.Said plate 20 can be of molded plastic material and metallized on the inner face 27 of the half-shells.

En tout état de cause, les régions centrales 26 et les ouvertures 41 se doivent de rester isolantes.In any event, the central regions 26 and the openings 41 must remain insulating.

A titre de variante, la plaque 20 comporte au moins un conduit de lumière tel que décrit dans les demandes DE A 2 201 574 ou EP A 117 606 précitées. Un tel conduit, présente une cavité hémisphérique qu'il suffit de prolonger par une partie cylindrique coopérant à faible jeu avec l'anneau conducteur 11 correspondant.As a variant, the plate 20 includes at least one light pipe as described in the applications DE A 2 201 574 or EP A 117 606 mentioned above. Such a conduit has a hemispherical cavity which suffices to be extended by a cylindrical part cooperating with little play with the corresponding conductive ring 11.

Le montage de la matrice est réalisé de la manière suivante :

  • les supports 10, sur lesquels ont été ou non montés les composants 17 sont introduits dans les trous 33 du substrat 30. Ensuite, on solidarise les métallisations 22 et les anneaux conducteurs 11. Si les métallisations 22 sont sérigraphiées, il suffit de réaliser la cuisson des trajets sérigraphiés. Pour des métallisations du type circuit imprimé, il suffit de réaliser des soudures sur un poste automatique.
The assembly of the matrix is carried out as follows:
  • the supports 10, on which the components 17 have or have not been mounted, are introduced into the holes 33 of the substrate 30. Next, the metallizations 22 and the conductive rings 11 are joined together. If the metallizations 22 are screen printed, it suffices to bake them screen-printed routes. For metallizations of the printed circuit type, it is sufficient to perform soldering on an automatic station.

On réalise alors les métallisations 24 sur la face inférieure 36 du substrat 30. Il est préférable de réaliser cette opération en retournant le substrat 30. La solution préférée est la sérigraphie, ce qui permet, par une étape ultérieure de cuisson de terminer la mise en place électrique et mécanique des supports. Il est avantageux de laisser dépasser la face inférieure 16 des tiges 13 de la face inférieure 36 du substrat 30.Metallizations 24 are then produced on the underside 36 of the substrate 30. It is preferable to carry out ser this operation by inverting the substrate 30. The preferred solution is screen printing, which allows, by a subsequent cooking step to complete the electrical and mechanical placement of the supports. It is advantageous to allow the lower face 16 of the rods 13 to protrude from the lower face 36 of the substrate 30.

La mise en place éventuelle de composants 17 et l'enrobage éventuel dans des dômes 14 peuvent être effectué à tout moment, mais elle interviendra avantageusement après les étapes de cuisson des sérigraphies.The possible installation of components 17 and the possible coating in domes 14 can be carried out at any time, but it will advantageously take place after the stages of cooking the screen prints.

Le montage de la matrice se termine par la pose de la ou des plaques 20 portant les cavités paraboliques 21. On remarquera que la forme de demi-coquilles 40 à parois min- ces de celles-ci, qui, du fait de la légère élasticité qu'elle présente, facilite dans une certaine mesure l'introduction des ouvertures 41 dans les anneaux 11.The assembly of the matrix ends with the laying of the plate or plates 20 carrying the parabolic cavities 21. It will be noted that the shape of half-shells 40 with thin walls - these of these, which, due to the slight elasticity that it presents, facilitates to a certain extent the introduction of the openings 41 in the rings 11.

L'invention ne se limite pas aux modes de réalisation décrits et représentés. Ainsi, des connexions en série entre des diodes de la matrice peuvent être obtenues au moyen de liaisons convenables vers un connecteur dans lequel le substrat est enfiché ou bien encore à l'aide d'au moins une pièce entièrement conductrice et de même forme que les supports 10 et disposée dans un trou 33 choisi de manière appropriée.The invention is not limited to the embodiments described and shown. Thus, series connections between diodes of the matrix can be obtained by means of suitable links to a connector in which the substrate is inserted or even using at least one fully conductive part and of the same shape as the supports 10 and arranged in an appropriately chosen hole 33.

Claims (14)

1. Matrice d'éléments électro-luminescents montés sur un substrat isolant présentant des trajets conducteurs pour leur interconnexion électrique et disposés chacun au foyer d'un élément optique de collimation, au moins plusieurs desdits éléments étant ménagés à la face supérieure d'au moins une plaque dont la face inférieure recouvre la face supérieure du substrat, et se prolongeant par des ouvertures cylindriques débouchant à la face inférieure de la plaque, caractérisée en ce que chaque élément (1) comporte d'une part un support (10) constitué d'une tige électriquement conductrice (13) présentant une face supérieure (15) et une face inférieure (16), d'une rondelle isolante (12) entourant une partie latérale supérieure (19) de la tige conductrice (13) et d'une rondelle conductrice (11) entourant la rondelle isolante (12) et d'autre part un composant électro-luminescent (17) monté à la face supérieure (15) de la tige conductrice (13) de manière à former un contact électrique avec celle-ci, en ce que la tige conductrice (13) traverse un trou (33) du substrat (30) de telle sorte que sa face inférieure (16) se trouve en contact électrique avec des trajets conducteurs (24) de la face inférieure (36) du substrat (30), en ce que la rondelle conductrice (11) est raccordée électriquement d'une part au composant électro-luminescent (17) et d'autre part à des trajets conducteurs (22) de la face supérieure (35) du substrat (30) et en ce qu'au moins la face inférieure (26) et les ouvertures cylindriques (32) de la plaque (20) sont isolantes, lesdies ouvertures cylindriques (33) s'engageant à faible jeu dans les rondelles conductrices (11).1. Matrix of electroluminescent elements mounted on an insulating substrate having conductive paths for their electrical interconnection and each disposed at the focal point of an optical collimation element, at least several of said elements being provided on the upper face of at least a plate, the lower face of which covers the upper face of the substrate, and which is extended by cylindrical openings opening onto the lower face of the plate, characterized in that each element (1) comprises on the one hand a support (10) consisting of an electrically conductive rod (13) having an upper face (15) and a lower face (16), an insulating washer (12) surrounding an upper lateral part (19) of the conductive rod (13) and a conductive washer (11) surrounding the insulating washer (12) and on the other hand an electroluminescent component (17) mounted on the upper face (15) of the conductive rod (13) so as to form an electrical contact with that here, in that the conductive rod (13) passes through a hole (33) in the substrate (30) so that its lower face (16) is in electrical contact with conductive paths (24) of the lower face ( 36) of the substrate (30), in that the conductive washer (11) is electrically connected on the one hand to the electroluminescent component (17) and on the other hand to conductive paths (22) of the upper face (35 ) of the substrate (30) and in that at least the lower face (26) and the cylindrical openings (32) of the plate (20) are insulating, the said cylindrical openings (33) engaging with small play in the washers conductive (11). 2. Matrice selon la revendication 1, caractérisée en ce qu'au moins un élément optique de collimation est constitué par une cavité parabolique réfléchissante (21) à parois minces (27).2. Matrix according to claim 1, characterized in that at least one optical collimating element is constituted by a reflective parabolic cavity (21) with thin walls (27). 3. Matrice selon une des revendications 1 ou 2, caractérisée en ce que les trajets conducteurs (22, 24) d'au moins une face (35, 36) du substrat (30) sont sérigraphiés.3. Matrix according to one of claims 1 or 2, characterized in that the conductive paths (22, 24) of at least one face (35, 36) of the substrate (30) are screen printed. 4. Matrice selon une des revendications 1 à 3 caractérisée en ce que la face inférieure (16) de la tige conductrice (13) dépasse légèrement du trou correspondant (33) du substrat (30).4. Matrix according to one of claims 1 to 3 characterized in that the lower face (16) of the conductive rod (13) slightly protrudes from the corresponding hole (33) of the substrate (30). 5. Matrice selon une des revendications précédentes caractérisée en ce que les trajets conducteurs (22, 24) du substrat sont agencés pour raccorder électriquement les éléments électro-luminescents selon des lignes sur une face (35) du substrat (30) et selon des colonnes sur l'autre face (36) de celui-ci.5. Matrix according to one of the preceding claims, characterized in that the conductive paths (22, 24) of the substrate are arranged to electrically connect the electroluminescent elements along lines on one face (35) of the substrate (30) and according to columns on the other face (36) thereof. 6. Matrice selon une des revendications précédentes caractérisée en ce qu'au moins un composant électro-luminescent (17) est enrobé dans un dôme de protection (14) en matériau transparent adaptant les indices optiques desdits composants (17) et l'air.6. Matrix according to one of the preceding claims, characterized in that at least one electro-luminescent component (17) is coated in a protective dome (14) made of transparent material adapting the optical indices of said components (17) and the air. 7. Matrice selon une des revendications précédentes caractérisée en ce que le substrat (30) est constitué d'un matériau bon conducteur thermique.7. Matrix according to one of the preceding claims, characterized in that the substrate (30) consists of a material which is a good thermal conductor. 8. Matrice selon la revendication 7 caractérisée en ce que ledit matériau est de l'aluminium (31) revêtu d'une couche d'oxydation anodique (32).8. Matrix according to claim 7 characterized in that said material is aluminum (31) coated with an anodic oxidation layer (32). 9. Matrice selon une des revendications 7 ou 8 caractérisée en ce qu'elle comporte au moins une pièce conductrice de même forme que les supports (10) disposée dans un trou (33) du substrat (30) et réalisant des connexions en série de certaines au moins des diodes de la matrice.9. Matrix according to one of claims 7 or 8 characterized in that it comprises at least one conductive part of the same shape as the supports (10) disposed in a hole (33) of the substrate (30) and making series connections of some at least of the diodes of the matrix. 10. Procédé de fabrication d'une matrice d'éléments électro-luminescents selon une des revendications précédentes caractérisé en ce qu'il comporte les étapes suivantes : a) réaliser selon une géométrie désirée des trajets conducteurs (22) sur une face supérieure (35) d'un substrat isolant (30) pourvu de trous destinés (33) à recevoir lesdits éléments (1) b)insérer dans les trous (33) au moins les supports (10) des éléments (1) ceux-ci comportant une tige (13) électriquement conductrice présentant une face supérieure (15) et une face inférieure (16), une rondelle isolante (12) entourant une partie latérale supérieure (19) de la tige conductrice (13), et une rondelle conductrice (11) entourant la rondelle isolante (12), la géométrie désirée des trajets conducteurs (22) étant telle que ceux-ci viennent en contact électrique avec les anneaux conducteurs (11) correspondants. c) solidariser les anneaux conducteurs (11) et les trajets conducteurs correspondants (22) de la face supérieure (35) du substrat (30). d) réaliser selon une géométrie désirée des trajets conducteurs (24) sur la face inférieure (36) du substrat (30) de telle manière que ceux--ci viennent en contact électrique avec la face inférieure (36) de la tige conductrice (13). e) solidariser la tige conductrice (13) et les trajets conducteurs correspondants (24) de la face inférieure (36) du substrat (30). f) disposer sur le substrat au moins une plaque (20) présentant une pluralité de cavités paraboliques réfléchissantes (21) se prolongeant par des ouvertures cylindriques isolantes (41) venant s'engager à faible jeu dans les rondelles conductrices (11) jusqu'à ce que la face inférieure isolante de la plaque vienne en butée sur le substrat (30). 10. Method for manufacturing a matrix of electro-luminescent elements according to one of the preceding claims, characterized in that it comprises the following steps: a) making, according to a desired geometry, conductive paths (22) on an upper face (35) of an insulating substrate (30) provided with holes intended (33) to receive said elements (1) b) insert into the holes (33) at least the supports (10) of the elements (1) these comprising an electrically conductive rod (13) present both an upper face (15) and a lower face (16), an insulating washer (12) surrounding an upper lateral part (19) of the conductive rod (13), and a conductive washer (11) surrounding the insulating washer (12 ), the desired geometry of the conductive paths (22) being such that they come into electrical contact with the corresponding conductive rings (11). c) securing the conducting rings (11) and the corresponding conducting paths (22) of the upper face (35) of the substrate (30). d) making, according to a desired geometry, conductive paths (24) on the lower face (36) of the substrate (30) so that these come into electrical contact with the lower face (36) of the conductive rod (13 ). e) securing the conductive rod (13) and the corresponding conductive paths (24) of the underside (36) of the substrate (30). f) placing on the substrate at least one plate (20) having a plurality of reflective parabolic cavities (21) extending by insulating cylindrical openings (41) which engage with small play in the conductive washers (11) up to that the insulating underside of the plate abuts on the substrate (30). 11. Procédé selon la revendication 10 caractérisé en ce que les trajets conducteurs (22, 24) d'au moins une des faces (35, 36) du substrat (30) sont réalisés par sérigraphie ladite solidarisation étant obtenu par cuisson des trajets sérigraphiés (22, 24).11. Method according to claim 10 characterized in that the conductive paths (22, 24) of at least one of the faces (35, 36) of the substrate (30) are produced by screen printing, said joining being obtained by baking the screen printed paths ( 22, 24). 12. Procédé selon une des revendications 10 ou 11 caractérisé en ce que des composants électro-luminescents (17) sont montés sur la face supérieure (15) des tiges conductrices (13) avant l'insertion des supports (10) dans les trous (33) du substrat isolant (30).12. Method according to one of claims 10 or 11 characterized in that electroluminescent components (17) are mounted on the upper face (15) of the conductive rods (13) before inserting the supports (10) in the holes (33) of the insulating substrate (30). 13. Procédé selon une des revendications 10 ou 11 caractérisé en ce que des composants électro-luminescents (17) sont montés sur la face supérieure (15) des tiges conductrices (18) après une quelconque des étapes c) à f).13. Method according to one of claims 10 or 11 characterized in that electroluminescent components (17) are mounted on the upper face (15) of the conductive rods (18) after any of steps c) to f). 14. Procédé selon une des revendications 12 ou 13 caractérisé en ce qu'il comporte une étape d'enrober les composants électro-luminescents (17) d'un dôme de protection (14) en matériau transparent.14. Method according to one of claims 12 or 13 characterized in that it comprises a step of coating the electroluminescent components (17) with a protective dome (14) in transparent material.
EP85201902A 1984-12-07 1985-11-19 Matrix of electroluminescent elements and production method thereof Expired - Lifetime EP0184877B1 (en)

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FR8418731 1984-12-07
FR8418731A FR2574616B1 (en) 1984-12-07 1984-12-07 MATRIX OF ELECTRO-LUMINESCENT ELEMENT AND MANUFACTURING METHOD THEREOF

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EP0184877A1 true EP0184877A1 (en) 1986-06-18
EP0184877B1 EP0184877B1 (en) 1990-10-31

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EP (1) EP0184877B1 (en)
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EP0184877B1 (en) 1990-10-31
DE3580342D1 (en) 1990-12-06
JPH0638519B2 (en) 1994-05-18
FR2574616A1 (en) 1986-06-13
US4742432A (en) 1988-05-03
FR2574616B1 (en) 1987-01-23
JPS61137376A (en) 1986-06-25

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