EP0367303A1 - Thermal ink jet printhead - Google Patents

Thermal ink jet printhead Download PDF

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Publication number
EP0367303A1
EP0367303A1 EP89123606A EP89123606A EP0367303A1 EP 0367303 A1 EP0367303 A1 EP 0367303A1 EP 89123606 A EP89123606 A EP 89123606A EP 89123606 A EP89123606 A EP 89123606A EP 0367303 A1 EP0367303 A1 EP 0367303A1
Authority
EP
European Patent Office
Prior art keywords
opening
layer
nozzle
barrier layer
orifice
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP89123606A
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German (de)
French (fr)
Inventor
Alfred I. Tsung Pan
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HP Inc
Original Assignee
Hewlett Packard Co
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Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of EP0367303A1 publication Critical patent/EP0367303A1/en
Withdrawn legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/164Manufacturing processes thin film formation
    • B41J2/1642Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2/14016Structure of bubble jet print heads
    • B41J2/14088Structure of heating means
    • B41J2/14112Resistive element
    • B41J2/1412Shape
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2/14016Structure of bubble jet print heads
    • B41J2/14088Structure of heating means
    • B41J2/14112Resistive element
    • B41J2/14129Layer structure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2/14016Structure of bubble jet print heads
    • B41J2/14145Structure of the manifold
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1601Production of bubble jet print heads
    • B41J2/1603Production of bubble jet print heads of the front shooter type
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1626Manufacturing processes etching
    • B41J2/1629Manufacturing processes etching wet etching
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1631Manufacturing processes photolithography
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1632Manufacturing processes machining
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1637Manufacturing processes molding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/164Manufacturing processes thin film formation
    • B41J2/1643Manufacturing processes thin film formation thin film formation by plating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/164Manufacturing processes thin film formation
    • B41J2/1646Manufacturing processes thin film formation thin film formation by sputtering
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01Embodiments of or processes related to ink-jet heads
    • B41J2202/03Specific materials used
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01Embodiments of or processes related to ink-jet heads
    • B41J2202/11Embodiments of or processes related to ink-jet heads characterised by specific geometrical characteristics

Definitions

  • This invention concerns thermal ink jet (TIJ) printheads, and to methods for their manufacture.
  • TIJ thermal ink jet
  • TIJ printheads employ a liquid ink in a reservoir or well, the ink being fed via passages to a series of nozzles defined by a nozzle plate. Within each nozzle is a resistive heater which is independently energizable to evaporate the ink which emerges from the nozzle under pressure.
  • Difficulties which arise with known printheads include detachment or misalignment of the nozzle plate which has been glued in place after formation of the heater and the structure of the well and passages; restricted ink flow through the passages, thus slowing the rate of printing; and unrealiability due to destruction of the resistive heater by the flow of ink and the cavitation forces of the expelled vapour.
  • US Patent No. 4438191 proposes a new form of TIJ printhead which is an improvement on previous printheads.
  • the fabrication of this device presents additional problems: formation of ink holes, removal of dry film residue from the firing chambers and other locations, proper alignment of the nozzle, and various manufacturing problems.
  • the nozzles of the monolithic printhead do not diverge.
  • the present invention aims to reduce or avoid some or all the disadvantages mentioned above.
  • a monolithic ink jet printhead for ejecting a substance comprising a nozzle enclosing a heating chamber, means for storing the substance contiguous with the heating chamber, and a heating element for propelling the substance through the nozzle, characterised in that means is provided for flexibly supporting the heating element within the flow of the substance.
  • a monolithic printhead has the advantages of lower cost and increased precision.
  • An advantage of placing the heating element within the flow of the substance is that the substance (e.g. ink) buffers the heating element from cavitation forces that result from collapsing bubbles. These cavitation forces could otherwise destroy the heating element. Additionally, the supporting means can flex and absorb energy from the collapsing bubbles that would otherwise be absorbed by the heating element.
  • the storing means is brought directly adjacent the nozzle, and there is then no restriction on the rate of ink flow which permits an increased printing speed.
  • the nozzle and heating element are formed integrally on a substrate by deposition techniques. This ensures automatic alignment of the nozzle, and means the nozzle plate cannot be detached.
  • a method of producing a monolithic ink jet printhead comprising the steps of: using integrated circuit techniques to construct in a first part of a substrate a means for supporting a heating element, using integrated circuit techniques to form in a second part of the substrate a means for storing ink that is contiguous with the supporting means, using integrated circuit techniques to form a heating element on the supporting means, and using integrated circuit techniques to form nozzle on the substrate and over the heating element.
  • FIG. 1 A prior-art thermal ink jet printhead 2 is shown in Figure 1.
  • the advancement of thermal ink jet technology falls upon an assembly problem: detachment of the nozzle plate 1.
  • each nozzle plate 1 is individually attached with epoxy to the resistor structure 3 as shown in Figure 2A.
  • This costly procedure is problem-prone. For example, this procedure often misaligns the nozzle plate 1.
  • Figure 2A a simplified representation of the prior art, omits many of the details.
  • the differences in thermal expansion coefficients among different components of the printhead 2 tend to debond the nozzle plate 1 during the curing process of the glue. This adhesion problem limits the number of nozzles in the printhead 2.
  • prior-art TIJ print head 2 presents another problem. It limits the printing speed.
  • ink reaches the nozzle 6 after travelling through high friction channels 7 which restrict the ink flow.
  • a monolithic thermal ink jet printhead is proposed.
  • This monolithic structure makes page-width array thermal ink jet printheads possible.
  • the monolithic structure can be manufactured by standard integrated circuit and printed circuit processing techniques.
  • a nickel-plating process constructs a nozzle on top of resistors, thereby eliminating adhesion and alignment problems.
  • a rigid substrate supports a flexible cantilever beam upon which the resistors are constructed.
  • the monolithic printhead allows a smoother ink supply since the ink is fed directly from the backside past the resistor from a well in the thickness of the rigid substrate.
  • the orifice structure is constructed by a self-aligned, two-step plating process which results in compound bore shape nozzles.
  • Figure 3 shows a cross-section of the preferred embodiment of the invention, a monolithic thermal ink jet printhead with integrated nozzle 19 and ink well 11.
  • Figure 4 shows a top view of the monolithic printhead 20.
  • a well 11 Within the thickness of the substrate 10 a well 11 resides to hold ink.
  • the gaseous ink (water vapour, glycol, and ink pigment particles) migrates to the nozzle area 17.
  • the compound bore nozzle 19 directs the gaseous ink as it is expelled from the nozzle area 17 by pressure from the accumulated gaseous ink.
  • a thermal barrier, layer 21, prevents heat from flowing to nickel cantilever beams 12 which form part of the nickel deposit 40.
  • the beams 12 are formed by apertures which communicate between wall 11 and nozzle 17. Because of layer 21 heat from the resistive layer 15 heats the ink and is not wasted on the printhead 20.
  • a patterned conducting layer 23 shorts out the resistive layer 15 except on the cantilever beams 12.
  • a protective layer 25 prevents electrical shorts during the nickel plating process to form the nozzle 19. The protective layer 25 also protects layers from chemical and mechanical wear.
  • a conducting layer 27 is deposited during the manufacturing process to provide a surface upon which the nozzle 19 can be constructed.
  • Advantages of the present invention include the automatically-aligned nozzle 19, shown in Figure 3.
  • Prior-art processes misalign the nozzle plate 1 shown in Figure 1. This misalignment causes dot spread and slanted printing.
  • the new monolithic TIJ printhead 20 reduces resistor failure.
  • prior-art TIJ printheads shown in Figure 1 the collapsing bubble and refilling ink impact the resistor surface. The cavitation force eventually destroys the resistor.
  • the collapsing bubble collides with the refilling ink. The ink absorbs most of the cavitation forces.
  • the cantilever beams constructed from ductile nickel, lie in a reservoir of ink. The mechanical forces on resistors will be buffered by the flexibility of the cantilever beams as well as the ink itself.
  • printing speed is not limited by the ink refilling rate.
  • the ink well 11 is directly connected to the heating elements 15 as shown in Figure 3. This direct connection reduces resistance to ink flow.
  • printing speed is not limited by the ink refilling rate.
  • Figures 5 to 7 illustrate the process to manufacture monolithic thermal ink jet printheads 20 and involves several steps.
  • a conducting, layer 30 approximately 1000 A is deposited using a sputter deposition technique. By conducting electricity through the conducting layer 30, a surface is formed to which nickel plating can be attached.
  • a dry film mask 32 is laminated on the conducting layer 30 as shown in Figure 5B.
  • This mask 32 having a diameter of 50.8 to 76.2 ⁇ m (2 to 3 mils), defines the location of the cantilever beams 12 in Figure 3 as well as 13 in Figure 8.
  • Figure 5C shows the various shapes a mask 32 can have.
  • Mask 38 corresponds to the printhead 20 shown in Figure 4.
  • Mask 34 corresponds to printhead 60 shown in Figure 9.
  • an electroplating process deposits a nickel layer 40 from 25.4 to 38.1 um (1 to 1.5 mils) thick onto the exposed substrate 10.
  • cantilever beams 12 are formed.
  • removal of the dry film mask 38 exposes the cantilever beams 12 shown in Figure 6B.
  • the well 11 is formed through a multi-­step process.
  • a sputtering process deposits a protective metal layer 42. This layer is made of gold and has a thickness of 1000 ⁇ .
  • a mask 44 defines the well 11.
  • a wet chemical etching process such as KOH for silicon or HF for glass, forms the well 11.
  • the protective layer 42 and the mask layer 44 are removed, the device appears as shown in Figure 6C.
  • the thermal insulation layer 21 encourages the efficient operation of the resistor layer 15.
  • a resistive layer 15 made of a material such as tantalum-aluminium is deposited to a thickness of 1000 ⁇ to 3000 ⁇ , as shown in Figure 3.
  • a conducting layer 23 made of gold or aluminium to a thickness of 5000 ⁇ is selectively patterned on resistive layer 15 to short out portions of the resistive layer 15.
  • the conducting layer 23 is not present on the cantilever beam 12 so that the resistive layer 15 is operative there.
  • a protective layer 25 made of Si Carbide (SiC) and Si3N4 or other dielectric material is deposited using an LPCVD process. This layer protects the device from chemical and mechanical wear.
  • the conducting layer 27 provides a surface upon which the nozzle 19 can be formed with an electroplating process.
  • portions of the conducting layer 27 are etched away through a wet-­etching process, so that the only conducting layer 27 remaining is located where the nozzle will be constructed.
  • donut-shaped dry film blocks 52 are laminated onto the conducting layer 27. These blocks 52 form a frame for the construction of the nozzle 19.
  • the nozzle 19 is constructed in a two-step plating process. The results of the first step are shown in Figure 7A.
  • the base of nozzle 19 is formed by electroplating nickel onto the conducting layer 27 to a thickness of 38.1 to 5.08 ⁇ m (1.5 mil to 2.0 mil), which equals the height of the nozzle 19.
  • a glass slab or any other flat dielectric material 56 is pressed on the nozzle 19 as shown in Figure 7B. This slab 56 acts as a nozzle 19 mould for the second part of the nickel plating process.
  • Figure 7C the electroplating process is continued to form the nozzle 19. Now that the nozzle is completed, the slab 56 is removed.
  • the resulting product is the printhead 20 shown in Figure 3.
  • the nozzle 19 could be constructed by a one-­step plating process without the use of the slab 56.
  • Figures 8 and 9 show an alternative embodiment of the printhead 20.
  • a nozzle 19 having this shape is called a compound-bore nozzle 19. It controls the stream of ink ejected from the nozzle 19.
  • the ink stream ejected from a compound-bore nozzle has a narrow diameter and minimum spread.
  • the cantilever beams 13 protrude inward and the heating element 15 rests on top of the cantilever beam 13.
  • This embodiment of the printhead 20 would be formed in the same way as the printhead 20 shown in Figure 3.
  • the primary difference in the process would be in the type of mask 32 used when layer 40 is plated onto substrate 10.
  • a mask similar to mask 34 or 36 is used.
  • the printhead ejects ink.
  • This ink contains water, glycol, and pigment particles. However, it can be used to eject other substances.
  • the present invention a monolithic thermal ink jet printhead with integrated nozzle and ink well and a process for making it, solves the nozzle attachment and ink flow problems of prior-art printheads mentioned above. Also, the present invention reduces manufacturing costs and improves reliability. The reduced manufacturing costs are partially achieved through an automated manufacturing procedure. The increased reliability is partially achieved through longer resistor life and smoother ink flow in the printhead. With these improvements, page-width TIJ print arrays are possible.

Abstract

A thermal ink jet printer has a nozzle (17,19), a heating element (15) within the nozzle and an ink well (11) within the thickness of a rigid substrate (10) carrying the nozzle and heating element. The latter are produced by deposition on the substrate. Thus the well (11) is directly adjacent to the nozzle (17), avoiding cavitation problems, destruction of the element (15) by ink turbulence. The method of production is described.

Description

  • This invention concerns thermal ink jet (TIJ) printheads, and to methods for their manufacture.
  • TIJ printheads employ a liquid ink in a reservoir or well, the ink being fed via passages to a series of nozzles defined by a nozzle plate. Within each nozzle is a resistive heater which is independently energizable to evaporate the ink which emerges from the nozzle under pressure.
  • Difficulties which arise with known printheads include detachment or misalignment of the nozzle plate which has been glued in place after formation of the heater and the structure of the well and passages; restricted ink flow through the passages, thus slowing the rate of printing; and unrealiability due to destruction of the resistive heater by the flow of ink and the cavitation forces of the expelled vapour.
  • US Patent No. 4438191 proposes a new form of TIJ printhead which is an improvement on previous printheads. However, the fabrication of this device presents additional problems: formation of ink holes, removal of dry film residue from the firing chambers and other locations, proper alignment of the nozzle, and various manufacturing problems. Also, the nozzles of the monolithic printhead do not diverge. The present invention aims to reduce or avoid some or all the disadvantages mentioned above.
  • According to a first aspect ofthe present invention there is provided a monolithic ink jet printhead for ejecting a substance comprising a nozzle enclosing a heating chamber, means for storing the substance contiguous with the heating chamber, and a heating element for propelling the substance through the nozzle, characterised in that means is provided for flexibly supporting the heating element within the flow of the substance.
  • A monolithic printhead has the advantages of lower cost and increased precision. An advantage of placing the heating element within the flow of the substance is that the substance (e.g. ink) buffers the heating element from cavitation forces that result from collapsing bubbles. These cavitation forces could otherwise destroy the heating element. Additionally, the supporting means can flex and absorb energy from the collapsing bubbles that would otherwise be absorbed by the heating element.
  • In a preferred printhead the storing means is brought directly adjacent the nozzle, and there is then no restriction on the rate of ink flow which permits an increased printing speed. Preferably, the nozzle and heating element are formed integrally on a substrate by deposition techniques. This ensures automatic alignment of the nozzle, and means the nozzle plate cannot be detached.
  • According to a second aspect of the present invention there is provided a method of producing a monolithic ink jet printhead comprising the steps of: using integrated circuit techniques to construct in a first part of a substrate a means for supporting a heating element, using integrated circuit techniques to form in a second part of the substrate a means for storing ink that is contiguous with the supporting means, using integrated circuit techniques to form a heating element on the supporting means, and using integrated circuit techniques to form nozzle on the substrate and over the heating element.
  • By constructing the entire printhead, including the nozzles, using integrated circuit techniques, precise nozzle alignment with the rest of the printhead is obtained. This precise alignment increases the allowable nozzle density and permits the construction of a page width array of nozzles, Also, by using integrated circuit techniques, batches of printheads can be made at one time.
  • In order that the invention shall be clearly understood, exemplary embodiments thereof will now be described with reference to the accompanying drawings, in which:
    • Figure 1 shows a prior-art thermal ink jet printhead;
    • Figure 2A shows a cross section of a prior-art nozzle on line A-A in Fig 2B;
    • Figure 2B shows a top view of a prior-art nozzle, the line A-A corresponds to the cross section of Figure 2A;
    • Figure 3 shows a cross-section on line A-A in Fig.4 of a preferred embodiment of the invention with cantilever beams;
    • Figure 4 shows a top view of the preferred embodiment of the invention with the nozzle removed; the line A-A corresponds to the cross-section of Figure 3;
    • Figures 5A-5C shows steps in preparing the substrate for masking;
    • Figures 6A-6C shows the formation of the cantilever beams and the well;
    • Figures 7A, 7B, and 7C show the steps taken to construct the nozzle shown in Figure 3;
    • Figure 8 shows an alternative embodiment of the invention without cantilever beams.
    • Figure 9 shows a top view of the alternative embodiment shown in Figure 8.
  • A prior-art thermal ink jet printhead 2 is shown in Figure 1. The advancement of thermal ink jet technology stumbles upon an assembly problem: detachment of the nozzle plate 1. Presently, each nozzle plate 1 is individually attached with epoxy to the resistor structure 3 as shown in Figure 2A. This costly procedure is problem-prone. For example, this procedure often misaligns the nozzle plate 1. Figure 2A, a simplified representation of the prior art, omits many of the details. The differences in thermal expansion coefficients among different components of the printhead 2 tend to debond the nozzle plate 1 during the curing process of the glue. This adhesion problem limits the number of nozzles in the printhead 2.
  • The ink refilling rate of prior-art TIJ print head 2 presents another problem. It limits the printing speed. In prior-art TIJ printheads 2 shown in Figure 2B, ink reaches the nozzle 6 after travelling through high friction channels 7 which restrict the ink flow.
  • A monolithic thermal ink jet printhead is proposed. This monolithic structure makes page-width array thermal ink jet printheads possible. The monolithic structure can be manufactured by standard integrated circuit and printed circuit processing techniques. A nickel-plating process constructs a nozzle on top of resistors, thereby eliminating adhesion and alignment problems. A rigid substrate supports a flexible cantilever beam upon which the resistors are constructed. The cantilever beams, together with the ink itself, buffers the impact of cavitation forces during bubble collapsing and results in a better resistor reliability. The monolithic printhead allows a smoother ink supply since the ink is fed directly from the backside past the resistor from a well in the thickness of the rigid substrate. The orifice structure is constructed by a self-aligned, two-step plating process which results in compound bore shape nozzles.
  • Figure 3 shows a cross-section of the preferred embodiment of the invention, a monolithic thermal ink jet printhead with integrated nozzle 19 and ink well 11. Figure 4 shows a top view of the monolithic printhead 20. Within the thickness of the substrate 10 a well 11 resides to hold ink. The heating element, a resistor layer 15, evaporates the ink. The gaseous ink (water vapour, glycol, and ink pigment particles) migrates to the nozzle area 17. The compound bore nozzle 19 directs the gaseous ink as it is expelled from the nozzle area 17 by pressure from the accumulated gaseous ink.
  • A thermal barrier, layer 21, prevents heat from flowing to nickel cantilever beams 12 which form part of the nickel deposit 40. The beams 12 are formed by apertures which communicate between wall 11 and nozzle 17. Because of layer 21 heat from the resistive layer 15 heats the ink and is not wasted on the printhead 20. A patterned conducting layer 23 shorts out the resistive layer 15 except on the cantilever beams 12. A protective layer 25 prevents electrical shorts during the nickel plating process to form the nozzle 19. The protective layer 25 also protects layers from chemical and mechanical wear. A conducting layer 27 is deposited during the manufacturing process to provide a surface upon which the nozzle 19 can be constructed.
  • Advantages of the present invention include the automatically-aligned nozzle 19, shown in Figure 3. Prior-art processes misalign the nozzle plate 1 shown in Figure 1. This misalignment causes dot spread and slanted printing. The new monolithic TIJ printhead 20 reduces resistor failure. In prior-art TIJ printheads shown in Figure 1, the collapsing bubble and refilling ink impact the resistor surface. The cavitation force eventually destroys the resistor. In the new monolithic TIJ printhead 20 shown in Figure 3, the collapsing bubble collides with the refilling ink. The ink absorbs most of the cavitation forces. The cantilever beams 12, upon which the heating element, such as a resistor, is built, absorb the remaining cavitation force. The cantilever beams, constructed from ductile nickel, lie in a reservoir of ink. The mechanical forces on resistors will be buffered by the flexibility of the cantilever beams as well as the ink itself.
  • Also, in the present invention printing speed is not limited by the ink refilling rate. The ink well 11 is directly connected to the heating elements 15 as shown in Figure 3. This direct connection reduces resistance to ink flow. Thus, printing speed is not limited by the ink refilling rate.
  • Figures 5 to 7 illustrate the process to manufacture monolithic thermal ink jet printheads 20 and involves several steps. On a substrate 10 of glass or silicon shown in Figure 5A, a conducting, layer 30 approximately 1000 A is deposited using a sputter deposition technique. By conducting electricity through the conducting layer 30, a surface is formed to which nickel plating can be attached. Next, a dry film mask 32 is laminated on the conducting layer 30 as shown in Figure 5B. This mask 32, having a diameter of 50.8 to 76.2 µm (2 to 3 mils), defines the location of the cantilever beams 12 in Figure 3 as well as 13 in Figure 8. Figure 5C shows the various shapes a mask 32 can have. Mask 38 corresponds to the printhead 20 shown in Figure 4. Mask 34 corresponds to printhead 60 shown in Figure 9.
  • Next, an electroplating process deposits a nickel layer 40 from 25.4 to 38.1 um (1 to 1.5 mils) thick onto the exposed substrate 10. Thus, cantilever beams 12 are formed. After completion of, the plating, removal of the dry film mask 38 exposes the cantilever beams 12 shown in Figure 6B. The well 11 is formed through a multi-­step process. First, a sputtering process deposits a protective metal layer 42. This layer is made of gold and has a thickness of 1000 Å. Next, a mask 44 defines the well 11. Then, a wet chemical etching process, such as KOH for silicon or HF for glass, forms the well 11. When the protective layer 42 and the mask layer 44 are removed, the device appears as shown in Figure 6C.
  • Next, a thermal insulating layer 21, made of LPCVD Sio₂ or another dielectric, is deposited. It is deposited to a thickness of 1.5 µm on the inside of the well 11, on top of the plated nickel layer 40, and around the cantilever beams 12 as shown in Figure 3. The thermal insulation layer 21 encourages the efficient operation of the resistor layer 15. On top of the thermal insulating layer 21, a resistive layer 15 made of a material such as tantalum-aluminium is deposited to a thickness of 1000Å to 3000 Å, as shown in Figure 3. Next, a conducting layer 23 made of gold or aluminium to a thickness of 5000 Å is selectively patterned on resistive layer 15 to short out portions of the resistive layer 15. The conducting layer 23 is not present on the cantilever beam 12 so that the resistive layer 15 is operative there. On top of the conducting layer 23, a protective layer 25 made of Si Carbide (SiC) and Si³N⁴ or other dielectric material is deposited using an LPCVD process. This layer protects the device from chemical and mechanical wear.
  • A conducting layer 27, 1000 to 5000 Å thick, is deposited on the protective layer 25. It is formed by sputtering. The conducting layer 27 provides a surface upon which the nozzle 19 can be formed with an electroplating process. Next, portions of the conducting layer 27 are etched away through a wet-­etching process, so that the only conducting layer 27 remaining is located where the nozzle will be constructed.
  • Next, donut-shaped dry film blocks 52 are laminated onto the conducting layer 27. These blocks 52 form a frame for the construction of the nozzle 19. In the preferred embodiment of the invention, the nozzle 19 is constructed in a two-step plating process. The results of the first step are shown in Figure 7A. The base of nozzle 19 is formed by electroplating nickel onto the conducting layer 27 to a thickness of 38.1 to 5.08 µm (1.5 mil to 2.0 mil), which equals the height of the nozzle 19. Next, a glass slab or any other flat dielectric material 56 is pressed on the nozzle 19 as shown in Figure 7B. This slab 56 acts as a nozzle 19 mould for the second part of the nickel plating process. Figure 7C, the electroplating process is continued to form the nozzle 19. Now that the nozzle is completed, the slab 56 is removed. The resulting product is the printhead 20 shown in Figure 3.
  • Other methods can be used to form the nozzle 19. For example, the nozzle 19 could be constructed by a one-­step plating process without the use of the slab 56.
  • Figures 8 and 9 show an alternative embodiment of the printhead 20. A nozzle 19 having this shape is called a compound-bore nozzle 19. It controls the stream of ink ejected from the nozzle 19. The ink stream ejected from a compound-bore nozzle has a narrow diameter and minimum spread. The cantilever beams 13 protrude inward and the heating element 15 rests on top of the cantilever beam 13. This embodiment of the printhead 20 would be formed in the same way as the printhead 20 shown in Figure 3. The primary difference in the process would be in the type of mask 32 used when layer 40 is plated onto substrate 10. Instead of mask 38 for the cantilever beams 12, a mask similar to mask 34 or 36 is used.
  • In the preferred embodiment of the invention, the printhead ejects ink. This ink contains water, glycol, and pigment particles. However, it can be used to eject other substances.
  • The present invention, a monolithic thermal ink jet printhead with integrated nozzle and ink well and a process for making it, solves the nozzle attachment and ink flow problems of prior-art printheads mentioned above. Also, the present invention reduces manufacturing costs and improves reliability. The reduced manufacturing costs are partially achieved through an automated manufacturing procedure. The increased reliability is partially achieved through longer resistor life and smoother ink flow in the printhead. With these improvements, page-width TIJ print arrays are possible.

Claims (4)

1. A method for accurately aligning an orifice opening (17) in an orifice plate of an ink jet printhead with a transducer element (15) on a thin film substrate member (15,21,23,25,40) of said printhead, comprising the steps of: providing a metal seed layer (27) having an opening therein on said thin film substrate, providing a barrier layer (52) on said thin film substrate and adjacent said opening in said seed layer, providing an opening in said barrier layer and aligning said opening in said barrier layer with said transducer element in said thin film substrate, and plating a metal orifice layer (19) on said metal seed layer and over said barrier layer to form an orifice opening extending within said opening in said barrier layer and aligned thereto, whereby said orifice opening is aligned to both said opening in said barrier layer and to said transducer element in said thin film substrate.
2. A method according to claim 1, wherein the plating of said metal orifice layer includes plating a first orifice plate section (19) over a portion of said barrier layer (27) and then plating a second orifice plate section (19) as an extension of said first orifice plate section to form a convergent nozzle opening (17) within said opening in said barrier layer and aligned with said transducer element (15).
3. An ink jet printhead comprising: a transducer element (15) located within a thin film substrate (15,21,23,25,40) for providing energizing pulses to said transducer element during an ink jet printing operation, a seed layer (27) having an opening therein disposed on said substrate, a barrier layer (52) disposed on said thin film substrate and located adjacent to said opening in said seed layer, said barrier layer having an opening therein aligned with said transducer element, and a metal orifice layer (19) plated up from said seed layer and over said barrier layer and having an orifice opening (17) therein, located within and aligned to said opening in said barrier layer, whereby said opening in said orifice plate is also aligned to said transducer element in said thin film substrate.
4. An ink jet printer incorporating one or more printheads, each comprising one or more orifice openings (17), each aligned with a transducer (15); wherein the orifice openings and transducers are aligned by a method according to claim 1 or 2.
EP89123606A 1986-04-28 1987-04-28 Thermal ink jet printhead Withdrawn EP0367303A1 (en)

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US85674086A 1986-04-28 1986-04-28
US856740 1986-04-28

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Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991017891A1 (en) * 1990-05-21 1991-11-28 Mannesmann Ag Ink-jet printing head for a liquid-jet printing device operating on the heat converter principle and process for making it
GB2267254A (en) * 1992-04-28 1993-12-01 Inkjet Systems Gmbh Co Kg Structure of single-integrated-chip ink-jet print head.
EP0594310A2 (en) * 1992-10-23 1994-04-27 Hewlett-Packard Company Ink jet printhead and method of manufacture thereof
EP0742102A2 (en) * 1995-05-12 1996-11-13 Lexmark International, Inc. Print head and method of making a print head by one-shot injection molding
US6508546B2 (en) 1998-10-16 2003-01-21 Silverbrook Research Pty Ltd Ink supply arrangement for a portable ink jet printer
WO2004048109A1 (en) * 2002-11-23 2004-06-10 Silverbrook Research Pty Ltd Thermal ink jet printhead with symmetric bubble formation
US6805435B2 (en) 1998-10-16 2004-10-19 Silverbrook Research Pty Ltd Printhead assembly with an ink distribution arrangement
EP1567353A1 (en) * 2002-11-23 2005-08-31 Silverbrook Research Pty. Limited Thermal ink jet printhead with cavitation gap
EP1567350A1 (en) * 2002-11-23 2005-08-31 Silverbrook Research Pty. Limited Thermal ink jet with chemical vapor deposited nozzle plate
US7281782B2 (en) 2002-11-23 2007-10-16 Silverbrook Research Pty Ltd Thermal ink jet with thin nozzle plate
US7306326B2 (en) 2002-11-23 2007-12-11 Silverbrook Research Pty Ltd Thermal ink jet printhead with low heater mass
US7328978B2 (en) 2002-11-23 2008-02-12 Silverbrook Research Pty Ltd Printhead heaters with short pulse time
US7407271B2 (en) 2002-11-23 2008-08-05 Silverbrook Research Pty Ltd Self-cooling thermal ink jet printhead
US7431427B2 (en) 2002-06-13 2008-10-07 Silverbrook Research Pty Ltd Ink supply arrangement with improved ink flows
US7669980B2 (en) 2002-11-23 2010-03-02 Silverbrook Research Pty Ltd Printhead having low energy heater elements

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE156066T1 (en) * 1989-05-30 1997-08-15 Canon Kk INKJET HEAD
EP0498291B1 (en) * 1991-01-30 1996-04-10 Canon Information Systems Research Australia Pty Ltd. Nozzle structures for bubblejet print devices
DE69214853T2 (en) * 1991-01-30 1997-05-28 Canon Kk Jet printer with bubbles for imaging device
US5815173A (en) * 1991-01-30 1998-09-29 Canon Kabushiki Kaisha Nozzle structures for bubblejet print devices
US6019457A (en) * 1991-01-30 2000-02-01 Canon Information Systems Research Australia Pty Ltd. Ink jet print device and print head or print apparatus using the same
AU657720B2 (en) * 1991-01-30 1995-03-23 Canon Kabushiki Kaisha A bubblejet image reproducing apparatus
US5198834A (en) * 1991-04-02 1993-03-30 Hewlett-Packard Company Ink jet print head having two cured photoimaged barrier layers
EP0638424A3 (en) * 1993-08-09 1996-07-31 Hewlett Packard Co Thermal ink jet printhead and method of manufacture.
AUPN234695A0 (en) * 1995-04-12 1995-05-04 Eastman Kodak Company Heater structure for monolithic lift print heads
EP0771272A1 (en) * 1995-04-12 1997-05-07 Eastman Kodak Company Monolithic printing heads and manufacturing processes therefor
US5905517A (en) * 1995-04-12 1999-05-18 Eastman Kodak Company Heater structure and fabrication process for monolithic print heads
JPH10501766A (en) * 1995-04-12 1998-02-17 イーストマン コダック カンパニー Assembly and manufacturing process of thermally actuated print head
AUPN623895A0 (en) * 1995-10-30 1995-11-23 Eastman Kodak Company A manufacturing process for lift print heads with nozzle rim heaters
US6336714B1 (en) * 1996-02-07 2002-01-08 Hewlett-Packard Company Fully integrated thermal inkjet printhead having thin film layer shelf
US6305790B1 (en) 1996-02-07 2001-10-23 Hewlett-Packard Company Fully integrated thermal inkjet printhead having multiple ink feed holes per nozzle
US6543884B1 (en) 1996-02-07 2003-04-08 Hewlett-Packard Company Fully integrated thermal inkjet printhead having etched back PSG layer
US6162589A (en) * 1998-03-02 2000-12-19 Hewlett-Packard Company Direct imaging polymer fluid jet orifice
US6019907A (en) * 1997-08-08 2000-02-01 Hewlett-Packard Company Forming refill for monolithic inkjet printhead
US6322201B1 (en) 1997-10-22 2001-11-27 Hewlett-Packard Company Printhead with a fluid channel therethrough
US6482574B1 (en) 2000-04-20 2002-11-19 Hewlett-Packard Co. Droplet plate architecture in ink-jet printheads
KR100374788B1 (en) 2000-04-26 2003-03-04 삼성전자주식회사 Bubble-jet type ink-jet printhead, manufacturing method thereof and ejection method of the ink
US6520627B2 (en) 2000-06-26 2003-02-18 Hewlett-Packard Company Direct imaging polymer fluid jet orifice
FR2811588B1 (en) * 2000-07-13 2002-10-11 Centre Nat Rech Scient THERMAL INJECTION AND DOSING HEAD, MANUFACTURING METHOD THEREOF, AND FUNCTIONALIZATION OR ADDRESSING SYSTEM COMPRISING THE SAME
KR100397604B1 (en) 2000-07-18 2003-09-13 삼성전자주식회사 Bubble-jet type ink-jet printhead and manufacturing method thereof
US6364466B1 (en) 2000-11-30 2002-04-02 Hewlett-Packard Company Particle tolerant ink-feed channel structure for fully integrated inkjet printhead
KR20020043669A (en) * 2000-12-02 2002-06-12 윤종용 Both side bubble type ink-jet print head
KR100506079B1 (en) 2000-12-05 2005-08-04 삼성전자주식회사 Bubble-jet type inkjet print head
US6419346B1 (en) 2001-01-25 2002-07-16 Hewlett-Packard Company Two-step trench etch for a fully integrated thermal inkjet printhead
US6481832B2 (en) 2001-01-29 2002-11-19 Hewlett-Packard Company Fluid-jet ejection device
US6517735B2 (en) 2001-03-15 2003-02-11 Hewlett-Packard Company Ink feed trench etch technique for a fully integrated thermal inkjet printhead
GB2406309B (en) * 2001-09-29 2006-02-08 Hewlett Packard Co Fluid ejection device with drive circuitry proximate to heating element
KR100429844B1 (en) * 2001-10-25 2004-05-03 삼성전자주식회사 Monolithic ink-jet printhead and manufacturing method thereof
KR100395529B1 (en) * 2001-10-30 2003-08-25 삼성전자주식회사 Ink-jet print head and method for manufacturing the same
US7125731B2 (en) 2001-10-31 2006-10-24 Hewlett-Packard Development Company, L.P. Drop generator for ultra-small droplets
US6698868B2 (en) 2001-10-31 2004-03-02 Hewlett-Packard Development Company, L.P. Thermal drop generator for ultra-small droplets
US6627467B2 (en) 2001-10-31 2003-09-30 Hewlett-Packard Development Company, Lp. Fluid ejection device fabrication
DE10217990B4 (en) * 2002-03-09 2006-06-01 Rheinmetall Landsysteme Gmbh Load lifting gear for armored vehicle has load-lifting unit with crane jib fastened to suitable flange surface on vehicle and with linear or rotational drives to enable load lifting to be carried out on all reachable points of vehicle
KR100421027B1 (en) * 2002-04-29 2004-03-04 삼성전자주식회사 Inkjet printhead and manufacturing method thereof
US6672712B1 (en) * 2002-10-31 2004-01-06 Hewlett-Packard Development Company, L.P. Slotted substrates and methods and systems for forming same
US6755509B2 (en) 2002-11-23 2004-06-29 Silverbrook Research Pty Ltd Thermal ink jet printhead with suspended beam heater
US7581822B2 (en) 2002-11-23 2009-09-01 Silverbrook Research Pty Ltd Inkjet printhead with low voltage ink vaporizing heaters
JP4455282B2 (en) 2003-11-28 2010-04-21 キヤノン株式会社 Inkjet head manufacturing method, inkjet head, and inkjet cartridge
JP4455287B2 (en) 2003-12-26 2010-04-21 キヤノン株式会社 Method for manufacturing ink jet recording head
KR100641359B1 (en) 2004-10-26 2006-11-01 삼성전자주식회사 Ink-jet print head with high efficiency heater and the fabricating method for the same
KR100773983B1 (en) * 2006-06-26 2007-11-08 삼성전기주식회사 Inkjet head and manufacturing method thereof
JP2013500880A (en) * 2009-07-31 2013-01-10 ヒューレット−パッカード デベロップメント カンパニー エル.ピー. Inkjet printhead and method using a central ink supply path

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4438191A (en) * 1982-11-23 1984-03-20 Hewlett-Packard Company Monolithic ink jet print head
EP0140611A2 (en) * 1983-10-31 1985-05-08 Hewlett-Packard Company Thermal ink jet printhead assemblies

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5559977A (en) * 1978-10-31 1980-05-06 Canon Inc Liquid injection recorder
JPS565979A (en) * 1979-06-27 1981-01-22 Ricoh Co Ltd Manufacture of nozzle plate for liquid jetting
US4558333A (en) * 1981-07-09 1985-12-10 Canon Kabushiki Kaisha Liquid jet recording head
GB2106039A (en) * 1981-08-14 1983-04-07 Hewlett Packard Co Thermal ink jet printer
US4528574A (en) * 1983-03-28 1985-07-09 Hewlett-Packard Company Apparatus for reducing erosion due to cavitation in ink jet printers
US4580149A (en) * 1985-02-19 1986-04-01 Xerox Corporation Cavitational liquid impact printer

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4438191A (en) * 1982-11-23 1984-03-20 Hewlett-Packard Company Monolithic ink jet print head
EP0140611A2 (en) * 1983-10-31 1985-05-08 Hewlett-Packard Company Thermal ink jet printhead assemblies

Cited By (95)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5760804A (en) * 1990-05-21 1998-06-02 Eastman Kodak Company Ink-jet printing head for a liquid-jet printing device operating on the heat converter principle and process for making it
WO1991017891A1 (en) * 1990-05-21 1991-11-28 Mannesmann Ag Ink-jet printing head for a liquid-jet printing device operating on the heat converter principle and process for making it
GB2267254A (en) * 1992-04-28 1993-12-01 Inkjet Systems Gmbh Co Kg Structure of single-integrated-chip ink-jet print head.
GB2267254B (en) * 1992-04-28 1996-03-20 Inkjet Systems Gmbh Co Kg Electrothermal ink jet print head
EP0594310A2 (en) * 1992-10-23 1994-04-27 Hewlett-Packard Company Ink jet printhead and method of manufacture thereof
EP0594310A3 (en) * 1992-10-23 1994-08-17 Hewlett Packard Co Ink jet printhead and method of manufacture thereof
US6142611A (en) * 1992-10-23 2000-11-07 Pan; Alfred I-Tsung Oxide island structure for flexible inkjet printhead and method of manufacture thereof
EP0742102A2 (en) * 1995-05-12 1996-11-13 Lexmark International, Inc. Print head and method of making a print head by one-shot injection molding
EP0742102A3 (en) * 1995-05-12 1998-10-07 Lexmark International, Inc. Print head and method of making a print head by one-shot injection molding
US6988785B2 (en) 1997-09-27 2006-01-24 Silverbrook Research Pty Ltd Print head for a pagewidth printer incorporating a replicated nozzle arrangement pattern
US6974206B2 (en) 1998-10-16 2005-12-13 Silverbrook Research Pty Ltd Method for producing a nozzle rim for a printer
US7004577B2 (en) 1998-10-16 2006-02-28 Silverbrook Research Pty Ltd Baffle unit for an ink supply system in a portable printer
US6652082B2 (en) * 1998-10-16 2003-11-25 Silverbrook Research Pty Ltd Printhead assembly for an ink jet printer
US7467850B2 (en) 1998-10-16 2008-12-23 Silverbrook Research Pty Ltd Nozzle arrangement for a printhead
US6805435B2 (en) 1998-10-16 2004-10-19 Silverbrook Research Pty Ltd Printhead assembly with an ink distribution arrangement
US6824257B2 (en) 1998-10-16 2004-11-30 Silverbrook Research Pty Ltd Ink supply system for a portable printer
US7537325B2 (en) 1998-10-16 2009-05-26 Silverbrook Research Pty Ltd Inkjet printer incorporating a print mediul cartridge storing a roll of print medium
US6883906B2 (en) 1998-10-16 2005-04-26 Silverbrook Research Pty Ltd Compact inkjet printer for portable electronic devices
US6899416B2 (en) 1998-10-16 2005-05-31 Silverbrook Research Pty Ltd Inkjet printhead substrate with crosstalk damping
US6905195B2 (en) 1998-10-16 2005-06-14 Silverbrook Research Pty Ltd Inkjet nozzle arrangement within small printhead substrate area
US6916091B2 (en) 1998-10-16 2005-07-12 Silverbrook Research Pty Ltd Ink chamber suitable for an ink supply system in a portable printer
US6916087B2 (en) 1998-10-16 2005-07-12 Silverbrook Research Pty Ltd Thermal bend actuated inkjet with pre-heat mode
US8251495B2 (en) 1998-10-16 2012-08-28 Zamtec Limited Pagewidth inkjet printhead incorporating power and data transmission film positioning protuberances
US8079688B2 (en) * 1998-10-16 2011-12-20 Silverbrook Research Pty Ltd Inkjet printer with a cartridge storing ink and a roll of media
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US7585066B2 (en) 1998-10-16 2009-09-08 Silverbrook Research Pty Ltd Ink supply unit with a baffle arrangement
US6988790B2 (en) 1998-10-16 2006-01-24 Silverbrook Research Pty Ltd Compact inkjet nozzle arrangement
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US7070256B2 (en) 2001-08-31 2006-07-04 Silverbrook Research Pty Ltd Ink supply arrangement for a portable ink jet printer
WO2003018315A1 (en) * 2001-08-31 2003-03-06 Silverbrook Research Pty. Ltd. Ink supply arrangement for a portable ink jet printer
AU2002304986B2 (en) * 2001-08-31 2005-04-14 Memjet Technology Limited Ink supply arrangement for a portable ink jet printer
US7431427B2 (en) 2002-06-13 2008-10-07 Silverbrook Research Pty Ltd Ink supply arrangement with improved ink flows
US8282181B2 (en) 2002-06-13 2012-10-09 Zamtec Limited Method of controlling a control circuit for a micro-electromechanical inkjet nozzle arrangement
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US7429097B2 (en) 2002-11-23 2008-09-30 Silverbrook Research Pty Ltd Thermal ink jet printhead with symmetric bubble formation
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US7438390B2 (en) 2002-11-23 2008-10-21 Silverbrook Research Pty Ltd Printhead module assembly with A flexible PCB
US7465034B2 (en) 2002-11-23 2008-12-16 Silverbrook Research Pty Ltd Thermal ink jet printhead with cavitation gap
CN100386206C (en) * 2002-11-23 2008-05-07 西尔弗布鲁克研究有限公司 Thermal ink jet printhead with small surface area heaters
US7469995B2 (en) 2002-11-23 2008-12-30 Kia Silverbrook Printhead integrated circuit having suspended heater elements
US7533963B2 (en) 2002-11-23 2009-05-19 Silverbrook Research Pty Ltd High nozzle density printhead
CN100386205C (en) * 2002-11-23 2008-05-07 西尔弗布鲁克研究有限公司 Ink jet printhead with thin nozzle plate
US7562966B2 (en) 2002-11-23 2009-07-21 Silverbrook Research Pty Ltd Ink jet printhead with suspended heater element
CN100386203C (en) * 2002-11-23 2008-05-07 西尔弗布鲁克研究有限公司 Inkjet printhead heater with high surface area
US7587822B2 (en) 2002-11-23 2009-09-15 Silverbrook Research Pty Ltd Method of producing high nozzle density printhead in-situ
US7587823B2 (en) 2002-11-23 2009-09-15 Silverbrook Research Pty Ltd Method of producing pagewidth printhead structures in-situ
EP1567353A4 (en) * 2002-11-23 2008-03-12 Silverbrook Res Pty Ltd Thermal ink jet printhead with cavitation gap
US7631427B2 (en) 2002-11-23 2009-12-15 Silverbrook Research Pty Ltd Method of producing energy efficient printhead in-situ
US7645029B2 (en) 2002-11-23 2010-01-12 Silverbrook Research Pty Ltd Inkjet printhead nozzle arrangement having non-coincident electrodes
US7658472B2 (en) 2002-11-23 2010-02-09 Silverbrook Research Pty Ltd Printhead system with substrate channel supporting printhead and ink hose
US7669972B2 (en) 2002-11-23 2010-03-02 Silverbrook Research Pty Ltd Printhead having suspended heater elements
US7669980B2 (en) 2002-11-23 2010-03-02 Silverbrook Research Pty Ltd Printhead having low energy heater elements
US7695106B2 (en) 2002-11-23 2010-04-13 Silverbrook Research Pty Ltd Thin nozzle layer printhead
US7726781B2 (en) 2002-11-23 2010-06-01 Silverbrook Research Pty Ltd Micro-electromechanical nozzles having low weight heater elements
US7328978B2 (en) 2002-11-23 2008-02-12 Silverbrook Research Pty Ltd Printhead heaters with short pulse time
US7744191B2 (en) 2002-11-23 2010-06-29 Silverbrook Research Pty Ltd Flexible printhead module incorporating staggered rows of ink ejection nozzles
US7306326B2 (en) 2002-11-23 2007-12-11 Silverbrook Research Pty Ltd Thermal ink jet printhead with low heater mass
AU2003275799B2 (en) * 2002-11-23 2006-05-25 Memjet Technology Limited Thermal ink jet printhead with symmetric bubble formation
US7922294B2 (en) 2002-11-23 2011-04-12 Silverbrook Research Pty Ltd Ink jet printhead with inner and outer heating loops
US7946026B2 (en) 2002-11-23 2011-05-24 Silverbrook Research Pty Ltd Inkjet printhead production method
US7950776B2 (en) 2002-11-23 2011-05-31 Silverbrook Research Pty Ltd Nozzle chambers having suspended heater elements
US7967420B2 (en) 2002-11-23 2011-06-28 Silverbrook Research Pty Ltd Inkjet printhead nozzle arrangement having non-coincident low mass electrode and heater element
US7976125B2 (en) 2002-11-23 2011-07-12 Silverbrook Research Pty Ltd Printhead with low drag nozzles apertures
US7980665B2 (en) 2002-11-23 2011-07-19 Silverbrook Research Pty Ltd Printhead assembly with an extrusion for housing bus bars
US7984971B2 (en) 2002-11-23 2011-07-26 Silverbrook Research Pty Ltd Printhead system with substrate channel supporting printhead and ink hose
US8006384B2 (en) 2002-11-23 2011-08-30 Silverbrook Research Pty Ltd Method of producing pagewidth inkjet printhead
EP1567350A1 (en) * 2002-11-23 2005-08-31 Silverbrook Research Pty. Limited Thermal ink jet with chemical vapor deposited nozzle plate
EP1567353A1 (en) * 2002-11-23 2005-08-31 Silverbrook Research Pty. Limited Thermal ink jet printhead with cavitation gap
WO2004048109A1 (en) * 2002-11-23 2004-06-10 Silverbrook Research Pty Ltd Thermal ink jet printhead with symmetric bubble formation
US8287096B2 (en) 2002-11-23 2012-10-16 Zamtec Limited Printhead nozzles having low mass heater elements
US8376514B2 (en) 2002-11-23 2013-02-19 Zamtec Ltd Flexible printhead module incorporating staggered rows of ink ejection nozzles

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DE3771269D1 (en) 1991-08-14
EP0244214B1 (en) 1991-07-10
EP0244214A1 (en) 1987-11-04
JPS62259864A (en) 1987-11-12
JP2635043B2 (en) 1997-07-30
JP2716418B2 (en) 1998-02-18
JPH08230192A (en) 1996-09-10

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