EP0654672A3 - Integrated circuit test apparatus. - Google Patents

Integrated circuit test apparatus. Download PDF

Info

Publication number: EP0654672A3
Authority: EP; European Patent Office
Prior art keywords: integrated circuit; test apparatus; circuit test; integrated; test
Prior art date: 1993-11-23
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

EP94117937A

Other languages

German (de)

French (fr)

Other versions

EP0654672A2 (en

EP0654672B1 (en

Inventor

Mohi Sobhani

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Raytheon Co

Original Assignee

Hughes Aircraft Co

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1993-11-23

Filing date

1994-11-14

Publication date

1996-02-14

1994-11-14 Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co

1995-05-24 Publication of EP0654672A2 publication Critical patent/EP0654672A2/en

1996-02-14 Publication of EP0654672A3 publication Critical patent/EP0654672A3/en

2002-03-06 Application granted granted Critical

2002-03-06 Publication of EP0654672B1 publication Critical patent/EP0654672B1/en

2014-11-14 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Links

Classifications

- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

Physics & Mathematics (AREA)
General Physics & Mathematics (AREA)
Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Testing Of Individual Semiconductor Devices (AREA)
Testing Or Measuring Of Semiconductors Or The Like (AREA)
Tests Of Electronic Circuits (AREA)
Measuring Leads Or Probes (AREA)

EP94117937A 1993-11-23 1994-11-14 Integrated circuit test apparatus Expired - Lifetime EP0654672B1 (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US08/157,556 US5455518A (en)	1993-11-23	1993-11-23	Test apparatus for integrated circuit die
US157556		1993-11-23

Publications (3)

Publication Number	Publication Date
EP0654672A2 EP0654672A2 (en)	1995-05-24
EP0654672A3 true EP0654672A3 (en)	1996-02-14
EP0654672B1 EP0654672B1 (en)	2002-03-06

Family

ID=22564254

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP94117937A Expired - Lifetime EP0654672B1 (en)	1993-11-23	1994-11-14	Integrated circuit test apparatus

Country Status (6)

Country	Link
US (1)	US5455518A (en)
EP (1)	EP0654672B1 (en)
JP (1)	JP3316095B2 (en)
KR (1)	KR0135214B1 (en)
DE (1)	DE69430036T2 (en)
IL (1)	IL111589A (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5642054A (en) *	1995-08-08	1997-06-24	Hughes Aircraft Company	Active circuit multi-port membrane probe for full wafer testing
US6303988B1 (en)	1998-04-22	2001-10-16	Packard Hughes Interconnect Company	Wafer scale burn-in socket
US7132841B1 (en) *	2000-06-06	2006-11-07	International Business Machines Corporation	Carrier for test, burn-in, and first level packaging
JP2005086044A (en) *	2003-09-09	2005-03-31	Citizen Electronics Co Ltd	Highly reliable package
US8884640B2 (en) *	2011-04-28	2014-11-11	Mpi Corporation	Integrated high-speed probe system
US20120324305A1 (en) *	2011-06-20	2012-12-20	Texas Instruments Incorporated	Testing interposer method and apparatus

Citations (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4554505A (en) *	1983-06-10	1985-11-19	Rockwell International Corporation	Test socket for a leadless chip carrier
EP0259162A2 (en) *	1986-09-05	1988-03-09	Tektronix, Inc.	Integrated circuit probe system
EP0343021A1 (en) *	1988-05-19	1989-11-23	Augat Inc.	Flex dot wafer probe
US5089772A (en) *	1989-03-10	1992-02-18	Matsushita Electric Industrial Co. Ltd.	Device for testing semiconductor integrated circuits and method of testing the same
EP0484141A2 (en) *	1990-10-31	1992-05-06	Hughes Aircraft Company	Method and apparatus for testing integrated circuits

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4783719A (en) *	1987-01-20	1988-11-08	Hughes Aircraft Company	Test connector for electrical devices
US4956605A (en) *	1989-07-18	1990-09-11	International Business Machines Corporation	Tab mounted chip burn-in apparatus
US5156983A (en) *	1989-10-26	1992-10-20	Digtial Equipment Corporation	Method of manufacturing tape automated bonding semiconductor package

1993
- 1993-11-23 US US08/157,556 patent/US5455518A/en not_active Expired - Lifetime
1994
- 1994-11-10 IL IL11158994A patent/IL111589A/en not_active IP Right Cessation
- 1994-11-14 DE DE69430036T patent/DE69430036T2/en not_active Expired - Fee Related
- 1994-11-14 EP EP94117937A patent/EP0654672B1/en not_active Expired - Lifetime
- 1994-11-22 JP JP28808994A patent/JP3316095B2/en not_active Expired - Fee Related
- 1994-11-22 KR KR1019940030735A patent/KR0135214B1/en not_active IP Right Cessation

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4554505A (en) *	1983-06-10	1985-11-19	Rockwell International Corporation	Test socket for a leadless chip carrier
EP0259162A2 (en) *	1986-09-05	1988-03-09	Tektronix, Inc.	Integrated circuit probe system
EP0343021A1 (en) *	1988-05-19	1989-11-23	Augat Inc.	Flex dot wafer probe
US5089772A (en) *	1989-03-10	1992-02-18	Matsushita Electric Industrial Co. Ltd.	Device for testing semiconductor integrated circuits and method of testing the same
EP0484141A2 (en) *	1990-10-31	1992-05-06	Hughes Aircraft Company	Method and apparatus for testing integrated circuits

Also Published As

Publication number	Publication date
IL111589A0 (en)	1995-01-24
DE69430036D1 (en)	2002-04-11
US5455518A (en)	1995-10-03
IL111589A (en)	1997-11-20
JPH07302821A (en)	1995-11-14
JP3316095B2 (en)	2002-08-19
DE69430036T2 (en)	2002-10-24
EP0654672A2 (en)	1995-05-24
KR0135214B1 (en)	1998-05-15
EP0654672B1 (en)	2002-03-06
KR950014898A (en)	1995-06-16

Legal Events

Date	Code	Title	Description
1995-04-07	PUAI	Public reference made under article 153(3) epc to a published international application that has entered the european phase	Free format text: ORIGINAL CODE: 0009012
1995-05-24	AK	Designated contracting states	Kind code of ref document: A2 Designated state(s): DE FR GB IT
1996-01-08	PUAL	Search report despatched	Free format text: ORIGINAL CODE: 0009013
1996-02-14	AK	Designated contracting states	Kind code of ref document: A3 Designated state(s): DE FR GB IT
1996-10-09	17P	Request for examination filed	Effective date: 19960813
1999-01-27	RAP1	Party data changed (applicant data changed or rights of an application transferred)	Owner name: RAYTHEON COMPANY
2000-03-22	17Q	First examination report despatched	Effective date: 20000203
2001-07-09	GRAG	Despatch of communication of intention to grant	Free format text: ORIGINAL CODE: EPIDOS AGRA
2001-08-30	GRAG	Despatch of communication of intention to grant	Free format text: ORIGINAL CODE: EPIDOS AGRA
2001-08-30	GRAH	Despatch of communication of intention to grant a patent	Free format text: ORIGINAL CODE: EPIDOS IGRA
2001-12-21	GRAH	Despatch of communication of intention to grant a patent	Free format text: ORIGINAL CODE: EPIDOS IGRA
2002-01-01	REG	Reference to a national code	Ref country code: GB Ref legal event code: IF02
2002-01-18	GRAA	(expected) grant	Free format text: ORIGINAL CODE: 0009210
2002-03-06	AK	Designated contracting states	Kind code of ref document: B1 Designated state(s): DE FR GB IT
2002-04-11	REF	Corresponds to:	Ref document number: 69430036 Country of ref document: DE Date of ref document: 20020411
2002-05-31	ET	Fr: translation filed
2003-01-11	PLBE	No opposition filed within time limit	Free format text: ORIGINAL CODE: 0009261
2003-01-11	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT
2003-02-26	26N	No opposition filed	Effective date: 20021209
2006-10-16	PGFP	Annual fee paid to national office [announced via postgrant information from national office to epo]	Ref country code: GB Payment date: 20061016 Year of fee payment: 13
2006-10-25	PGFP	Annual fee paid to national office [announced via postgrant information from national office to epo]	Ref country code: DE Payment date: 20061025 Year of fee payment: 13
2006-11-30	PGFP	Annual fee paid to national office [announced via postgrant information from national office to epo]	Ref country code: IT Payment date: 20061130 Year of fee payment: 13
2008-07-23	GBPC	Gb: european patent ceased through non-payment of renewal fee	Effective date: 20071114
2008-10-31	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: DE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20080603
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