EP0714123A3 - A semiconductor device, a semiconductor device-mounted apparatus, and a method for replacing the semiconductor device - Google Patents

A semiconductor device, a semiconductor device-mounted apparatus, and a method for replacing the semiconductor device Download PDF

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Publication number
EP0714123A3
EP0714123A3 EP95303846A EP95303846A EP0714123A3 EP 0714123 A3 EP0714123 A3 EP 0714123A3 EP 95303846 A EP95303846 A EP 95303846A EP 95303846 A EP95303846 A EP 95303846A EP 0714123 A3 EP0714123 A3 EP 0714123A3
Authority
EP
European Patent Office
Prior art keywords
semiconductor device
solder
connection electrode
drawing layer
replacing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP95303846A
Other languages
German (de)
French (fr)
Other versions
EP0714123B1 (en
EP0714123A2 (en
Inventor
Hiroshi Matsubara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Publication of EP0714123A2 publication Critical patent/EP0714123A2/en
Publication of EP0714123A3 publication Critical patent/EP0714123A3/en
Application granted granted Critical
Publication of EP0714123B1 publication Critical patent/EP0714123B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
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Abstract

A semiconductor device according to the present invention to be mounted on a mounting substrate includes: a connection electrode (22) formed on a surface of the semiconductor device; a solder bump (31) formed on the connection electrode the solder bump electrically and mechanically connecting the connection electrode (22) with a substrate electrode formed on the mounting substrate; and a solder drawing layer (23) provided on the surface of the semiconductor device in a periphery of the solder bump and having a surface portion (42b) composed of a solder-agreeable metal, the solder drawing layer retracting melted solder of the solder bump onto a surface of the solder drawing layer by contact with the melted solder.
EP95303846A 1994-11-22 1995-06-06 A semiconductor device, a semiconductor device-mounted apparatus, and a method for replacing the semiconductor device Expired - Lifetime EP0714123B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP28813394 1994-11-22
JP288133/94 1994-11-22
JP06288133A JP3138159B2 (en) 1994-11-22 1994-11-22 Semiconductor device, semiconductor device package, and semiconductor device replacement method

Publications (3)

Publication Number Publication Date
EP0714123A2 EP0714123A2 (en) 1996-05-29
EP0714123A3 true EP0714123A3 (en) 1998-06-10
EP0714123B1 EP0714123B1 (en) 2005-10-26

Family

ID=17726244

Family Applications (1)

Application Number Title Priority Date Filing Date
EP95303846A Expired - Lifetime EP0714123B1 (en) 1994-11-22 1995-06-06 A semiconductor device, a semiconductor device-mounted apparatus, and a method for replacing the semiconductor device

Country Status (4)

Country Link
US (1) US5726501A (en)
EP (1) EP0714123B1 (en)
JP (1) JP3138159B2 (en)
DE (1) DE69534543T2 (en)

Families Citing this family (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5956605A (en) * 1996-09-20 1999-09-21 Micron Technology, Inc. Use of nitrides for flip-chip encapsulation
US5877560A (en) * 1997-02-21 1999-03-02 Raytheon Company Flip chip microwave module and fabrication method
US5942448A (en) * 1997-02-24 1999-08-24 Sarnoff Corporation Method of making contacts on an integrated circuit
US5929521A (en) * 1997-03-26 1999-07-27 Micron Technology, Inc. Projected contact structure for bumped semiconductor device and resulting articles and assemblies
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US5726501A (en) 1998-03-10
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DE69534543T2 (en) 2006-07-13
EP0714123A2 (en) 1996-05-29
DE69534543D1 (en) 2005-12-01

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