EP0802419A3 - Probe card and method of forming the same - Google Patents
Probe card and method of forming the same Download PDFInfo
- Publication number
- EP0802419A3 EP0802419A3 EP97302543A EP97302543A EP0802419A3 EP 0802419 A3 EP0802419 A3 EP 0802419A3 EP 97302543 A EP97302543 A EP 97302543A EP 97302543 A EP97302543 A EP 97302543A EP 0802419 A3 EP0802419 A3 EP 0802419A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- insulation film
- probe card
- forming
- same
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000523 sample Substances 0.000 title abstract 3
- 238000009413 insulation Methods 0.000 abstract 5
- 239000000758 substrate Substances 0.000 abstract 3
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06744—Microprobes, i.e. having dimensions as IC details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
Abstract
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8092079A JP3022312B2 (en) | 1996-04-15 | 1996-04-15 | Method of manufacturing probe card |
JP92079/96 | 1996-04-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0802419A2 EP0802419A2 (en) | 1997-10-22 |
EP0802419A3 true EP0802419A3 (en) | 1998-08-12 |
Family
ID=14044451
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP97302543A Withdrawn EP0802419A3 (en) | 1996-04-15 | 1997-04-15 | Probe card and method of forming the same |
Country Status (6)
Country | Link |
---|---|
US (1) | US6114864A (en) |
EP (1) | EP0802419A3 (en) |
JP (1) | JP3022312B2 (en) |
KR (1) | KR100266759B1 (en) |
SG (1) | SG55303A1 (en) |
TW (1) | TW357265B (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6815961B2 (en) | 1999-07-28 | 2004-11-09 | Nanonexus, Inc. | Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies |
US7772860B2 (en) | 1999-05-27 | 2010-08-10 | Nanonexus, Inc. | Massively parallel interface for electronic circuit |
US7872482B2 (en) | 2000-05-23 | 2011-01-18 | Verigy (Singapore) Pte. Ltd | High density interconnect system having rapid fabrication cycle |
US8373428B2 (en) | 1993-11-16 | 2013-02-12 | Formfactor, Inc. | Probe card assembly and kit, and methods of making same |
US8427183B2 (en) | 2000-03-17 | 2013-04-23 | Formfactor, Inc. | Probe card assembly having an actuator for bending the probe substrate |
Families Citing this family (80)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5729150A (en) | 1995-12-01 | 1998-03-17 | Cascade Microtech, Inc. | Low-current probe card with reduced triboelectric current generating cables |
US8033838B2 (en) | 1996-02-21 | 2011-10-11 | Formfactor, Inc. | Microelectronic contact structure |
US6310484B1 (en) * | 1996-04-01 | 2001-10-30 | Micron Technology, Inc. | Semiconductor test interconnect with variable flexure contacts |
US5914613A (en) * | 1996-08-08 | 1999-06-22 | Cascade Microtech, Inc. | Membrane probing system with local contact scrub |
US7714235B1 (en) | 1997-05-06 | 2010-05-11 | Formfactor, Inc. | Lithographically defined microelectronic contact structures |
JP4006081B2 (en) * | 1998-03-19 | 2007-11-14 | 株式会社ルネサステクノロジ | Manufacturing method of semiconductor device |
JP3553791B2 (en) * | 1998-04-03 | 2004-08-11 | 株式会社ルネサステクノロジ | CONNECTION DEVICE AND ITS MANUFACTURING METHOD, INSPECTION DEVICE, AND SEMICONDUCTOR ELEMENT MANUFACTURING METHOD |
JPH11326371A (en) * | 1998-05-15 | 1999-11-26 | Toppan Printing Co Ltd | Inspection jig |
JPH11354561A (en) * | 1998-06-09 | 1999-12-24 | Advantest Corp | Bump and method for forming the same |
US6256882B1 (en) | 1998-07-14 | 2001-07-10 | Cascade Microtech, Inc. | Membrane probing system |
JP4160665B2 (en) * | 1998-07-22 | 2008-10-01 | Hoya株式会社 | Contact board and its components |
JP3958875B2 (en) * | 1998-07-24 | 2007-08-15 | 株式会社日本マイクロニクス | Prober and probe needle contact method |
JP2000055936A (en) * | 1998-08-12 | 2000-02-25 | Tokyo Electron Ltd | Contactor |
US6344752B1 (en) * | 1998-08-12 | 2002-02-05 | Tokyo Electron Limited | Contactor and production method for contractor |
US6441315B1 (en) | 1998-11-10 | 2002-08-27 | Formfactor, Inc. | Contact structures with blades having a wiping motion |
JP2000227446A (en) * | 1998-11-30 | 2000-08-15 | Japan Electronic Materials Corp | Probe card |
US6980017B1 (en) * | 1999-03-10 | 2005-12-27 | Micron Technology, Inc. | Test interconnect for bumped semiconductor components and method of fabrication |
JPH11337581A (en) * | 1999-04-27 | 1999-12-10 | Nec Corp | Probe card |
US6218203B1 (en) * | 1999-06-28 | 2001-04-17 | Advantest Corp. | Method of producing a contact structure |
JP2003506686A (en) * | 1999-07-28 | 2003-02-18 | ナノネクサス インコーポレイテッド | Structure and manufacturing method of integrated circuit wafer probe card assembly |
JP2003506873A (en) * | 1999-07-30 | 2003-02-18 | フォームファクター,インコーポレイテッド | Interconnect assembly and method |
US6713374B2 (en) | 1999-07-30 | 2004-03-30 | Formfactor, Inc. | Interconnect assemblies and methods |
US7435108B1 (en) | 1999-07-30 | 2008-10-14 | Formfactor, Inc. | Variable width resilient conductive contact structures |
ATE329272T1 (en) * | 1999-09-15 | 2006-06-15 | Capres As | MULTIPOINT PROBE |
JP2001094227A (en) * | 1999-09-20 | 2001-04-06 | Shinko Electric Ind Co Ltd | Semiconductor chip mounting wiring board and semiconductor chip mounting method using the board |
KR100621760B1 (en) * | 1999-10-18 | 2006-09-07 | 삼성전자주식회사 | probe card for testing semiconductor chip |
JP2003203954A (en) * | 1999-11-18 | 2003-07-18 | Ibiden Co Ltd | Inspection apparatus and probe card |
JP3696486B2 (en) * | 1999-11-18 | 2005-09-21 | イビデン株式会社 | Inspection device |
US6657448B2 (en) * | 2000-02-21 | 2003-12-02 | Kabushiki Kaisha Nihon Micronics | Electrical connection apparatus |
US6838890B2 (en) * | 2000-02-25 | 2005-01-04 | Cascade Microtech, Inc. | Membrane probing system |
JP3650722B2 (en) * | 2000-05-18 | 2005-05-25 | 株式会社アドバンテスト | Probe card and manufacturing method thereof |
US7952373B2 (en) | 2000-05-23 | 2011-05-31 | Verigy (Singapore) Pte. Ltd. | Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies |
WO2002009169A1 (en) * | 2000-07-25 | 2002-01-31 | Ibiden Co., Ltd. | Inspection apparatus and probe card |
KR20000064001A (en) * | 2000-08-16 | 2000-11-06 | 홍영희 | Probe and probe card |
US6462568B1 (en) * | 2000-08-31 | 2002-10-08 | Micron Technology, Inc. | Conductive polymer contact system and test method for semiconductor components |
JP2002082130A (en) * | 2000-09-06 | 2002-03-22 | Hitachi Ltd | Apparatus and method for inspecting semiconductor device |
JP4527267B2 (en) * | 2000-11-13 | 2010-08-18 | 東京エレクトロン株式会社 | Contactor manufacturing method |
DE20114544U1 (en) | 2000-12-04 | 2002-02-21 | Cascade Microtech Inc | wafer probe |
JP3651405B2 (en) * | 2001-03-28 | 2005-05-25 | ヤマハ株式会社 | Probe and manufacturing method thereof |
CN1288450C (en) | 2001-07-11 | 2006-12-06 | 佛姆法克特股份有限公司 | Method of manufacturing a probe card |
US6729019B2 (en) | 2001-07-11 | 2004-05-04 | Formfactor, Inc. | Method of manufacturing a probe card |
US7355420B2 (en) | 2001-08-21 | 2008-04-08 | Cascade Microtech, Inc. | Membrane probing system |
AU2003233659A1 (en) * | 2002-05-23 | 2003-12-12 | Cascade Microtech, Inc. | Probe for testing a device under test |
TWI236723B (en) * | 2002-10-02 | 2005-07-21 | Renesas Tech Corp | Probe sheet, probe card, semiconductor inspection device, and manufacturing method for semiconductor device |
US6724205B1 (en) | 2002-11-13 | 2004-04-20 | Cascade Microtech, Inc. | Probe for combined signals |
JP2004213923A (en) * | 2002-12-27 | 2004-07-29 | Anritsu Corp | Contact member and micro contact device using the same |
US6982565B2 (en) * | 2003-03-06 | 2006-01-03 | Micron Technology, Inc. | Test system and test method with interconnect having semiconductor spring contacts |
KR100523745B1 (en) * | 2003-03-24 | 2005-10-25 | 주식회사 유니테스트 | Microprobe and Method for Manufacturing the Same Using MEMS and Electroplating Technology |
KR20040089244A (en) * | 2003-04-11 | 2004-10-21 | 주식회사 유림하이테크산업 | Needle assembly of probe card |
US7057404B2 (en) | 2003-05-23 | 2006-06-06 | Sharp Laboratories Of America, Inc. | Shielded probe for testing a device under test |
JP2005156365A (en) * | 2003-11-26 | 2005-06-16 | Shinko Electric Ind Co Ltd | Probe for measuring electrical characteristics, and manufacturing method therefor |
WO2005065258A2 (en) | 2003-12-24 | 2005-07-21 | Cascade Microtech, Inc. | Active wafer probe |
TWI286606B (en) | 2004-03-16 | 2007-09-11 | Gunsei Kimoto | Electric signal connecting device, and probe assembly and prober device using it |
JP2008512680A (en) | 2004-09-13 | 2008-04-24 | カスケード マイクロテック インコーポレイテッド | Double-sided probing structure |
JP4535494B2 (en) * | 2004-10-20 | 2010-09-01 | ルネサスエレクトロニクス株式会社 | Thin film probe sheet manufacturing method and semiconductor chip inspection method |
KR100633456B1 (en) * | 2004-11-24 | 2006-10-16 | 주식회사 유니테스트 | Probe card with deeply recessed trench and method manufacturing thereof |
US7656172B2 (en) | 2005-01-31 | 2010-02-02 | Cascade Microtech, Inc. | System for testing semiconductors |
US7535247B2 (en) | 2005-01-31 | 2009-05-19 | Cascade Microtech, Inc. | Interface for testing semiconductors |
CN101258416A (en) | 2005-09-07 | 2008-09-03 | 日本电气株式会社 | Semiconductor device inspecting apparatus and power supply unit |
DE602005016423D1 (en) * | 2005-09-14 | 2009-10-15 | Gunsei Kimoto | Electrical signal connection device and its use in a test probe device |
JP4884749B2 (en) * | 2005-10-31 | 2012-02-29 | 日本発條株式会社 | Manufacturing method of conductive contact holder and manufacturing method of conductive contact unit |
CN100594759C (en) * | 2005-12-01 | 2010-03-17 | 夏普株式会社 | Circuit member, electrode connecting structure and display device provided with such electrode connecting structure |
TWI397696B (en) | 2006-02-19 | 2013-06-01 | Gunsei Kimoto | Probe assembly |
US7528618B2 (en) | 2006-05-02 | 2009-05-05 | Formfactor, Inc. | Extended probe tips |
US7723999B2 (en) | 2006-06-12 | 2010-05-25 | Cascade Microtech, Inc. | Calibration structures for differential signal probing |
US7764072B2 (en) | 2006-06-12 | 2010-07-27 | Cascade Microtech, Inc. | Differential signal probing system |
US7403028B2 (en) | 2006-06-12 | 2008-07-22 | Cascade Microtech, Inc. | Test structure and probe for differential signals |
JP2006258826A (en) * | 2006-06-20 | 2006-09-28 | Advantest Corp | Bump forming method and bump |
US8130005B2 (en) * | 2006-12-14 | 2012-03-06 | Formfactor, Inc. | Electrical guard structures for protecting a signal trace from electrical interference |
JP5030060B2 (en) * | 2007-08-01 | 2012-09-19 | 軍生 木本 | Electrical signal connection device |
US7876114B2 (en) | 2007-08-08 | 2011-01-25 | Cascade Microtech, Inc. | Differential waveguide probe |
US7888957B2 (en) | 2008-10-06 | 2011-02-15 | Cascade Microtech, Inc. | Probing apparatus with impedance optimized interface |
WO2010059247A2 (en) | 2008-11-21 | 2010-05-27 | Cascade Microtech, Inc. | Replaceable coupon for a probing apparatus |
JP2012198194A (en) * | 2011-03-09 | 2012-10-18 | Shinko Electric Ind Co Ltd | Probe card and manufacturing method for the same |
TWI439698B (en) * | 2011-09-30 | 2014-06-01 | Hermes Testing Solutions Inc | Probe card for circuit-testing and structure of probe substrate thereof |
US9899236B2 (en) * | 2014-12-24 | 2018-02-20 | Stmicroelectronics, Inc. | Semiconductor package with cantilever pads |
US9768126B2 (en) * | 2014-12-24 | 2017-09-19 | Stmicroelectronics, Inc. | Stacked semiconductor packages with cantilever pads |
DE102015004150A1 (en) * | 2015-03-31 | 2016-10-06 | Feinmetall Gmbh | Process for the preparation of a contact gap converter and contact gap converter |
CN106206516B (en) * | 2015-05-26 | 2019-08-06 | 意法半导体公司 | Laminated semiconductor packaging body with cantilevered pad |
JP6770798B2 (en) * | 2015-11-20 | 2020-10-21 | 日本電子材料株式会社 | Contact probe |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3826984A (en) * | 1969-02-28 | 1974-07-30 | Licentia Gmbh | Measuring device for the dynamic measurement of semiconductor parameters and method of making such a device |
US4968589A (en) * | 1988-10-26 | 1990-11-06 | General Signal Corporation | Probe card for integrated circuit chip and method of making probe card |
US5191708A (en) * | 1990-06-20 | 1993-03-09 | Hitachi, Ltd. | Manufacturing method of a probe head for semiconductor LSI inspection apparatus |
EP0646800A1 (en) * | 1993-09-30 | 1995-04-05 | International Business Machines Corporation | Probe for testing semi-conductor chips |
WO1996041506A1 (en) * | 1995-06-07 | 1996-12-19 | Xerox Corporation | Photolithographically patterned spring contact |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS612338A (en) * | 1984-06-15 | 1986-01-08 | Hitachi Ltd | Inspection device |
JPH07114227B2 (en) * | 1989-01-07 | 1995-12-06 | 三菱電機株式会社 | Wafer test probe |
US5134365A (en) * | 1989-07-11 | 1992-07-28 | Nihon Denshizairyo Kabushiki Kaisha | Probe card in which contact pressure and relative position of each probe end are correctly maintained |
US5172050A (en) * | 1991-02-15 | 1992-12-15 | Motorola, Inc. | Micromachined semiconductor probe card |
JPH04297050A (en) * | 1991-03-12 | 1992-10-21 | Mitsubishi Electric Corp | Semiconductor inspection apparatus and preparation of its plane substrate |
JP2606554Y2 (en) * | 1992-01-17 | 2000-11-27 | 株式会社東京精密 | Probing equipment |
JPH0618555A (en) * | 1992-06-30 | 1994-01-25 | Meisei Denshi Kogyo Kk | Microspring contact, its aggregate, terminal for electric connection composed of the aggregate and production of microspring contact |
JPH0650990A (en) * | 1992-07-30 | 1994-02-25 | Nec Corp | Probe card |
JPH06349907A (en) * | 1993-06-08 | 1994-12-22 | Toshiba Corp | Probe card |
JPH06347481A (en) * | 1993-06-11 | 1994-12-22 | Nitto Denko Corp | Probe structure |
JPH0721598A (en) * | 1993-07-02 | 1995-01-24 | Canon Inc | Probe unit and information processor using the same |
JPH0774219A (en) * | 1993-08-31 | 1995-03-17 | Kurisutaru Device:Kk | Probe substrate, its manufacture and probe device |
JPH0783955A (en) * | 1993-09-14 | 1995-03-31 | Fujitsu Ltd | Probe card |
JPH07135240A (en) * | 1993-11-10 | 1995-05-23 | Tokyo Electron Ltd | Probe device |
JPH07142541A (en) * | 1993-11-12 | 1995-06-02 | Toshiba Corp | Probe |
JP3502874B2 (en) * | 1994-06-03 | 2004-03-02 | 株式会社ルネサステクノロジ | CONNECTION DEVICE AND ITS MANUFACTURING METHOD |
-
1996
- 1996-04-15 JP JP8092079A patent/JP3022312B2/en not_active Expired - Fee Related
-
1997
- 1997-04-14 US US08/833,221 patent/US6114864A/en not_active Expired - Fee Related
- 1997-04-15 SG SG1997001205A patent/SG55303A1/en unknown
- 1997-04-15 TW TW086104848A patent/TW357265B/en not_active IP Right Cessation
- 1997-04-15 EP EP97302543A patent/EP0802419A3/en not_active Withdrawn
- 1997-04-15 KR KR1019970013789A patent/KR100266759B1/en not_active IP Right Cessation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3826984A (en) * | 1969-02-28 | 1974-07-30 | Licentia Gmbh | Measuring device for the dynamic measurement of semiconductor parameters and method of making such a device |
US4968589A (en) * | 1988-10-26 | 1990-11-06 | General Signal Corporation | Probe card for integrated circuit chip and method of making probe card |
US5191708A (en) * | 1990-06-20 | 1993-03-09 | Hitachi, Ltd. | Manufacturing method of a probe head for semiconductor LSI inspection apparatus |
EP0646800A1 (en) * | 1993-09-30 | 1995-04-05 | International Business Machines Corporation | Probe for testing semi-conductor chips |
WO1996041506A1 (en) * | 1995-06-07 | 1996-12-19 | Xerox Corporation | Photolithographically patterned spring contact |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8373428B2 (en) | 1993-11-16 | 2013-02-12 | Formfactor, Inc. | Probe card assembly and kit, and methods of making same |
US7772860B2 (en) | 1999-05-27 | 2010-08-10 | Nanonexus, Inc. | Massively parallel interface for electronic circuit |
US7884634B2 (en) | 1999-05-27 | 2011-02-08 | Verigy (Singapore) Pte, Ltd | High density interconnect system having rapid fabrication cycle |
US6815961B2 (en) | 1999-07-28 | 2004-11-09 | Nanonexus, Inc. | Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies |
US8427183B2 (en) | 2000-03-17 | 2013-04-23 | Formfactor, Inc. | Probe card assembly having an actuator for bending the probe substrate |
US7872482B2 (en) | 2000-05-23 | 2011-01-18 | Verigy (Singapore) Pte. Ltd | High density interconnect system having rapid fabrication cycle |
Also Published As
Publication number | Publication date |
---|---|
KR100266759B1 (en) | 2000-09-15 |
KR970072105A (en) | 1997-11-07 |
TW357265B (en) | 1999-05-01 |
JP3022312B2 (en) | 2000-03-21 |
SG55303A1 (en) | 1998-12-21 |
US6114864A (en) | 2000-09-05 |
EP0802419A2 (en) | 1997-10-22 |
JPH09281144A (en) | 1997-10-31 |
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