EP0841167A3 - Method of producing a through-hole, silicon substrate having a through-hole, device using such a substrate, method of producing an ink-jet print head, and ink-jet print head - Google Patents

Method of producing a through-hole, silicon substrate having a through-hole, device using such a substrate, method of producing an ink-jet print head, and ink-jet print head Download PDF

Info

Publication number
EP0841167A3
EP0841167A3 EP97119648A EP97119648A EP0841167A3 EP 0841167 A3 EP0841167 A3 EP 0841167A3 EP 97119648 A EP97119648 A EP 97119648A EP 97119648 A EP97119648 A EP 97119648A EP 0841167 A3 EP0841167 A3 EP 0841167A3
Authority
EP
European Patent Office
Prior art keywords
hole
substrate
etching
layer
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP97119648A
Other languages
German (de)
French (fr)
Other versions
EP0841167A2 (en
EP0841167B1 (en
Inventor
Takayuki Yagi
Junichi Kobayashi
Yasushi Kawasumi
Genzo Momma
Kenji Makino
Kei Fujita
Yasushi Matsuno
Yukihiro Hayakawa
Masahiro Takizawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of EP0841167A2 publication Critical patent/EP0841167A2/en
Publication of EP0841167A3 publication Critical patent/EP0841167A3/en
Application granted granted Critical
Publication of EP0841167B1 publication Critical patent/EP0841167B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B41J2/1603—Production of bubble jet print heads of the front shooter type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1628—Manufacturing processes etching dry etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1629—Manufacturing processes etching wet etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1637—Manufacturing processes molding
    • B41J2/1639—Manufacturing processes molding sacrificial molding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/13—Heads having an integrated circuit

Abstract

The invention provides a method of producing a through-hole, a substrate used to produce a through-hole, a substrate having a through-hole, and a device using such a through-hole or a substrate having such a through-hole, which are characterized in that: a through-hole can be produced only by etching a silicon substrate from its back side; the opening length d can be precisely controlled to a desired value regardless of the variations in the silicon wafer thickness, and the orientation flat angle, and also regardless of the type of a silicon crystal orientation-dependent anisotropic etchant employed; high productivity, high production reproducibility, and ease of production can be achieved; a high-liberality can be achieved in the shape of the opening end even if temperature treatment is performed at a high temperature for a long time; and a high-precision through-hole can be produced regardless of the shape of a device formed on the surface of a substrate. The method of producing a through-hole comprises the steps of: (a) forming a dummy layer on the principal surface of the substrate at a location where the through-hole will be formed, the dummy layer being capable of being selectively etched without etching the material of the substrate; (b) forming a passivation layer having resistance to an etching process on the substrate in such a manner that the dummy layer is covered with the passivation layer; (c) forming an etching mask layer on the back surface of the substrate, the etching mask layer having an opening corresponding to the dummy layer; (d) etching the substrate by means of a crystal orientation-dependent anisotropic etching process until the dummy layer is exposed via the opening; (e) removing the dummy layer by etching the dummy layer from the part which has been exposed in the step of etching the substrate; and (f) partially removing the passivation layer so as to form a through-hole.
EP19970119648 1996-11-11 1997-11-10 Method of producing a through-hole and the use of said method to produce a silicon substrate having a through-hole or a device using such a substrate, method of producing an ink jet print head and use of said method for producing an ink jet print head Expired - Lifetime EP0841167B1 (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP29864296 1996-11-11
JP298643/96 1996-11-11
JP298642/96 1996-11-11
JP29864396 1996-11-11
JP29864296 1996-11-11
JP29864396 1996-11-11

Publications (3)

Publication Number Publication Date
EP0841167A2 EP0841167A2 (en) 1998-05-13
EP0841167A3 true EP0841167A3 (en) 2000-03-08
EP0841167B1 EP0841167B1 (en) 2004-09-15

Family

ID=26561605

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19970119648 Expired - Lifetime EP0841167B1 (en) 1996-11-11 1997-11-10 Method of producing a through-hole and the use of said method to produce a silicon substrate having a through-hole or a device using such a substrate, method of producing an ink jet print head and use of said method for producing an ink jet print head

Country Status (3)

Country Link
EP (1) EP0841167B1 (en)
DE (1) DE69730667T2 (en)
DK (1) DK0841167T3 (en)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6336714B1 (en) 1996-02-07 2002-01-08 Hewlett-Packard Company Fully integrated thermal inkjet printhead having thin film layer shelf
US6273557B1 (en) 1998-03-02 2001-08-14 Hewlett-Packard Company Micromachined ink feed channels for an inkjet printhead
US6379571B1 (en) 1998-06-11 2002-04-30 Canon Kabushiki Kaisha Etching method for processing substrate, dry etching method for polyetheramide resin layer, production method of ink-jet printing head, ink-jet head and ink-jet printing apparatus
JP4690556B2 (en) * 2000-07-21 2011-06-01 大日本印刷株式会社 Fine pattern forming apparatus and fine nozzle manufacturing method
IT1320599B1 (en) 2000-08-23 2003-12-10 Olivetti Lexikon Spa MONOLITHIC PRINT HEAD WITH SELF-ALIGNED GROOVING AND RELATIVE MANUFACTURING PROCESS.
US6675476B2 (en) 2000-12-05 2004-01-13 Hewlett-Packard Development Company, L.P. Slotted substrates and techniques for forming same
US6419346B1 (en) 2001-01-25 2002-07-16 Hewlett-Packard Company Two-step trench etch for a fully integrated thermal inkjet printhead
US6481832B2 (en) 2001-01-29 2002-11-19 Hewlett-Packard Company Fluid-jet ejection device
US6517735B2 (en) 2001-03-15 2003-02-11 Hewlett-Packard Company Ink feed trench etch technique for a fully integrated thermal inkjet printhead
US6818138B2 (en) * 2001-06-22 2004-11-16 Hewlett-Packard Development Company, L.P. Slotted substrate and slotting process
ATE375865T1 (en) 2001-08-10 2007-11-15 Canon Kk METHOD FOR PRODUCING A LIQUID DISCHARGE HEAD, SUBSTRATE FOR A LIQUID DISCHARGE HEAD AND ASSOCIATED PRODUCTION METHOD
ITTO20011019A1 (en) * 2001-10-25 2003-04-28 Olivetti I Jet PERFECT PROCEDURE FOR THE CONSTRUCTION OF A SUPPLY DUCT FOR AN INK JET PRINT HEAD.
US7105097B2 (en) 2002-01-31 2006-09-12 Hewlett-Packard Development Company, L.P. Substrate and method of forming substrate for fluid ejection device
US6648454B1 (en) 2002-10-30 2003-11-18 Hewlett-Packard Development Company, L.P. Slotted substrate and method of making
US6880926B2 (en) 2002-10-31 2005-04-19 Hewlett-Packard Development Company, L.P. Circulation through compound slots
CN100355573C (en) 2002-12-27 2007-12-19 佳能株式会社 Ink-jet recording head and mfg. method, and substrate for mfg. ink-jet recording head
US6821450B2 (en) 2003-01-21 2004-11-23 Hewlett-Packard Development Company, L.P. Substrate and method of forming substrate for fluid ejection device
US6883903B2 (en) 2003-01-21 2005-04-26 Martha A. Truninger Flextensional transducer and method of forming flextensional transducer
KR100480791B1 (en) 2003-06-05 2005-04-06 삼성전자주식회사 Monolithic ink jet printhead and method of manufacturing thereof
JP2005035281A (en) * 2003-06-23 2005-02-10 Canon Inc Manufacturing method of liquid ejection head
US7429335B2 (en) 2004-04-29 2008-09-30 Shen Buswell Substrate passage formation
DE102005046156B3 (en) * 2005-09-27 2007-05-31 Siemens Ag Device with functional element and method for manufacturing the device
JP4144640B2 (en) * 2006-10-13 2008-09-03 オムロン株式会社 Method for manufacturing vibration sensor
DE102007031549B4 (en) 2007-07-06 2021-07-08 Robert Bosch Gmbh Single crystal silicon device and method of making a single crystal silicon device
EP2212115A4 (en) * 2007-11-24 2011-03-02 Hewlett Packard Development Co Inkjet-printing device printhead die having edge protection layer for heating resistor
US9136160B2 (en) 2012-06-29 2015-09-15 Institute of Microelectronics, Chinese Academy of Sciences Solid hole array and method for forming the same
CN103510088B (en) * 2012-06-29 2015-11-11 中国科学院微电子研究所 Solid-state hole array and preparation method thereof
CN103281661B (en) * 2013-05-09 2019-02-05 上海集成电路研发中心有限公司 A kind of MEMS microphone structure and its manufacturing method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4784721A (en) * 1988-02-22 1988-11-15 Honeywell Inc. Integrated thin-film diaphragm; backside etch
US5308442A (en) * 1993-01-25 1994-05-03 Hewlett-Packard Company Anisotropically etched ink fill slots in silicon
EP0609012A2 (en) * 1993-01-25 1994-08-03 Hewlett-Packard Company Method for manufacturing a thermal ink-jet print head
EP0750992A2 (en) * 1995-06-30 1997-01-02 Canon Kabushiki Kaisha Manufacturing method of ink jet head

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4784721A (en) * 1988-02-22 1988-11-15 Honeywell Inc. Integrated thin-film diaphragm; backside etch
US5308442A (en) * 1993-01-25 1994-05-03 Hewlett-Packard Company Anisotropically etched ink fill slots in silicon
EP0609012A2 (en) * 1993-01-25 1994-08-03 Hewlett-Packard Company Method for manufacturing a thermal ink-jet print head
EP0750992A2 (en) * 1995-06-30 1997-01-02 Canon Kabushiki Kaisha Manufacturing method of ink jet head

Also Published As

Publication number Publication date
EP0841167A2 (en) 1998-05-13
EP0841167B1 (en) 2004-09-15
DE69730667D1 (en) 2004-10-21
DK0841167T3 (en) 2005-01-24
DE69730667T2 (en) 2005-09-22

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