EP0873789A2 - Device with reception means encapsulating materials - Google Patents
Device with reception means encapsulating materials Download PDFInfo
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- EP0873789A2 EP0873789A2 EP98107137A EP98107137A EP0873789A2 EP 0873789 A2 EP0873789 A2 EP 0873789A2 EP 98107137 A EP98107137 A EP 98107137A EP 98107137 A EP98107137 A EP 98107137A EP 0873789 A2 EP0873789 A2 EP 0873789A2
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- Prior art keywords
- membrane
- gaseous
- cavities
- liquid
- technology
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
- B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
- B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
- B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
- B01L3/502738—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by integrated valves
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F33/00—Other mixers; Mixing plants; Combinations of mixers
- B01F33/30—Micromixers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F33/00—Other mixers; Mixing plants; Combinations of mixers
- B01F33/50—Movable or transportable mixing devices or plants
- B01F33/501—Movable mixing devices, i.e. readily shifted or displaced from one place to another, e.g. portable during use
- B01F33/5011—Movable mixing devices, i.e. readily shifted or displaced from one place to another, e.g. portable during use portable during use, e.g. hand-held
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
- B01F35/71—Feed mechanisms
- B01F35/713—Feed mechanisms comprising breaking packages or parts thereof, e.g. piercing or opening sealing elements between compartments or cartridges
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
- B01F35/71—Feed mechanisms
- B01F35/713—Feed mechanisms comprising breaking packages or parts thereof, e.g. piercing or opening sealing elements between compartments or cartridges
- B01F35/7135—Opening the seal between the compartments by application of heat
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
- B01F35/71—Feed mechanisms
- B01F35/713—Feed mechanisms comprising breaking packages or parts thereof, e.g. piercing or opening sealing elements between compartments or cartridges
- B01F35/7137—Piercing, perforating or melting membranes or closures which seal the compartments
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2400/00—Moving or stopping fluids
- B01L2400/06—Valves, specific forms thereof
- B01L2400/0677—Valves, specific forms thereof phase change valves; Meltable, freezing, dissolvable plugs; Destructible barriers
Definitions
- the present invention relates to a device for encapsulated recording of a material using a such device.
- Sensitive means the lifespan, i.e. H. the Availability for a specific purpose, is available on contact reduced with a certain substance or mixture of substances. Because of this limited life it is desirable to use this Materials just before they are used in the harmful Release the measuring medium and take it up to this point Keep protective gas or protective liquid or vacuum.
- the harmful measuring medium can with the substance to be measured be identical.
- the usual methods are to encapsulate the substance in one Glass flasks, plastic foils or similar packaging.
- the disadvantage of these methods is manifold: the encapsulation methods can only be miniaturized to a limited extent and / or the closure is not automatic or only consuming to open.
- Such sensitive substances are also in a vessel included, which via a valve and / or Hose system is connected to the outside world. This device can be opened automatically, but here the speed can the mechanical opening for some applications not be sufficient. Responding to fast processes is not possible. Furthermore limits the necessary Mechanics the minimum achievable size and the Cost reduction.
- the direct coating of the substance to be protected with e.g. electrically vaporizable materials is very limited can be used because in many cases this method becomes a irreversible contamination of the coated material leads.
- DE 3919042 A1 discloses a system for the analysis of solid Substances on mercury. With this known system a solid substance to be analyzed is introduced into a vessel, which is subsequently closed by a membrane being, when, over the membrane, a lid on the edge of the vessel is set by heating the membrane solid substance and a resulting overpressure in the Vessel is destroyed. Those disclosed in DE 3919042 A1 However, the system used is for a device Large series production not suitable.
- DE 3520416 C2 describes a device for controllable Opening a partition, the partition consisting of an in a clamping ring used membrane with adjacent heating wires there is an opening of the membrane when supply effect with electrical energy.
- This device too is not for mass production, for example suitable micromechanical method.
- DE 3818614 A1 and DE3915920 A1 disclose micromechanical Structures with a plurality of recesses for receiving of small amounts of material, especially in the field of biotechnology.
- the wells are by means of a lid, preferably with the wells has corresponding surveys, closed.
- membrane structures for example Si 3 N 4 on Si carrier material and other combinations.
- these membrane structures are used due to their very low thermal heat capacity and / or thermal conductivity. They serve as a carrier material for temperature-sensitive resistors, for example in the implementation of thermal flow meters and / or for the thermal insulation of a heating element from its surroundings.
- the invention is based on the cited prior art the task of a miniaturizable device to create the event or timed, allows automatic mixing of two substances.
- Another object of the present invention is a miniaturizable device for automatic Release of a gaseous, liquid or solid substance to create in the environment.
- the present invention provides an apparatus for separate, encapsulated recording of a plurality of the same or different substances in a plurality of closed Cavities in a micromechanically manufactured structure, where at least two of the cavities by one in microsystem technology or membrane implemented in thin film technology are separated, the device being an electrical actuatable heater to destroy the membrane in order which has to connect at least two cavities.
- the micromechanically manufactured structure can preferably be formed by a plurality of semiconductor wafers which are connected such that at least two recesses in the semiconductor wafers by the in microsystem technology or Thin film technology implemented membrane are separated.
- Such a micromechanically manufactured structure can also be used have a plurality of membranes, each membrane in each case at least two cavities in the micromechanically manufactured Structure separates.
- a suitable driver device for driving the electrically operated heating devices the majority of the membranes can then essentially destroyed at the same time or with a time delay.
- the present invention further provides the use of a Encapsulated device for a gaseous, liquid or solid substance, the device a a recess for receiving the gaseous, liquid or solid substance formed in microsystem technology Base body, a spanning the base body, in microsystem technology or membrane implemented in thin film technology for encapsulating the material in the recess of the base body and an electrically actuated heating device for Destroy the membrane to the gaseous, liquid or expose solid substance, has to release the gaseous, liquid or solid into the environment.
- the membrane used in the present invention can preferably be provided with a protective layer which Enabling aggressive media to be housed.
- a protective layer which Enabling aggressive media to be housed.
- the membrane for example made of silicon nitride, can be resistant Protective layer, for example silicon carbide be used.
- An advantage of the use according to the invention for example compared to a pump, it consists of mechanical and electronic much simpler structure of the invention Systems. Up to a certain number of releases this method is therefore cheaper per system than for example the use of a pump. Another advantage is the higher functional reliability due to the simple structure of the system. The release of the substance happens without using flaps, valves and channels. In contrast to a pump, for example, no clogging of channels possible, as these are required Function according to the present invention is not required will.
- the present invention takes advantage of the fact that in thin membranes, which in thin film technology or microsystem technology are implemented, often higher tension forces occur in other areas of technology are considered a problem of such membrane structures. These tension forces which are present in the membrane, cause application of thermal forces on the membrane an explosive Bursting of the same.
- the membrane evaporates not, but shatters into individual pieces.
- the according heater used in the present invention preferably as a heater integrated on the membrane executed, in which a short heating pulse a thermal Tensioning the membrane caused by this membrane to Burst is brought.
- the structures used in accordance with the present invention offer a simple, contamination-proof and fast way and way to a gaseous, liquid or solid substance into the environment, or to release a plurality of in to mix substances located in different cavities, the structure being simple in a mass production technique is accessible.
- the proper destruction of the Membrane can each have a suitable electrode geometry be signaled.
- the present invention operates thus a structure that is compatible with common large-scale production Methods can be implemented.
- the membrane body structure advantageously in microsystem technology executed.
- the membrane can also be made using thin film technology.
- FIG. 1 The only figure of the present application shows one schematic cross-sectional representation of an embodiment the device according to the invention for separate, encapsulated Inclusion of a plurality of the same or different Fabrics.
- the device has that is designated in its entirety with the reference number 10 is, a carrier 1, for example, from Quartz exists.
- a layer 2 is optionally on the carrier 1 applied, for example, to support a connection of the carrier 1 with a semiconductor wafer, which in the preferred embodiment consists of silicon, serve can, in which a recess 8 by conventional, photolithographic and etching methods are incorporated. over a recess 5 is formed in the recess 8.
- a semiconductor wafer which in the preferred embodiment consists of silicon
- a heater structure 7 which has connection lines with connection pads or bond pads stands, arranged.
- the membrane 5 On the surface opposite the support structure 4. the membrane 5 is another wafer 9, which in the preferred Embodiment consists of silicon, attached.
- the wafer 9 has a recess 10 and is so over the membrane 5 connected to the wafer 4 that the cavities 8 and 10 are opposite, the same through Membrane 5 are separated.
- the present invention thus enables separation a certain number of substances in two or more chambers or recesses separated by "membrane technology".
- a structure can be achieved by the encapsulation either in the manufacture of several chambers and contains membrane, or alternatively in which the elements at wafer or individual part level, for example Wafer bonding or gluing can be combined accordingly.
- Dependent of the structure and the desired reaction can now certain number of chambers quasi-simultaneously (in the millisecond range) or open at any time be by the individual heater devices accordingly can be controlled.
- With a multi-chamber technology it can the number of possible within a membrane system, for example chemical reactions, for example detection reactions, be greatly increased.
- the present invention provides further developed use of a device for encapsulated receptacle of a material that has a recess to hold the material in microsystem technology formed basic body, a spanning the basic body, in microsystem technology or thin film technology implemented membrane to encapsulate the material in the Recess of the base body and an electrically operated Has heater for destroying the membrane to the Material that is a gaseous, liquid or solid substance may be to release into the environment.
- the membrane can be made with a resistant Protective layer. Does it exist Membrane made of silicon nitride, can in a suitable form a silicon carbide layer can be used as a protective layer. Thereby the membrane is also in aggressive media, for example strong acids, can be used. With appropriate choice of material and thickness affects this protective layer Function of the system, d. H. destroying the membrane, Not. In contrast, mechanically moving parts are like they contain pumps, generally more difficult with protective layers to cover.
- the release of a single substance can be taken on its own have a purpose, for example, in the release of fragrances in the room air or in the release of Additives in liquids etc. Furthermore, by the release is also a reaction with surrounding substances and thereby triggered a desired effect with the environment will.
Abstract
Description
Die vorliegende Erfindung betrifft eine Vorrichtung zur gekapselten Aufnahme eines Materials die Verwendung einer solchen Vorrichtung.The present invention relates to a device for encapsulated recording of a material using a such device.
Auf vielen Gebieten werden empfindliche Materialien, z. B. chemische Indikatormaterialien, Katalysatoren, Medikamente, eingesetzt. Empfindlich heißt, die Lebensdauer, d. h. die Verwendbarkeit für einen bestimmten Zweck, wird bei Kontakt mit einem bestimmten Stoff oder Stoffgemisch reduziert. Aufgrund dieser begrenzten Lebensdauer ist es erwünscht, diese Materialien erst kurz vor ihrem Einsatz in dem schädlichen Meßmedium freizugeben und sie bis zu diesem Zeitpunkt unter Schutzgas oder Schutzflüssigkeit oder Vakuum zu verwahren. Das schädliche Meßmedium kann mit der zu messenden Substanz identisch sein.In many areas, sensitive materials, e.g. B. chemical indicator materials, catalysts, medicines, used. Sensitive means the lifespan, i.e. H. the Availability for a specific purpose, is available on contact reduced with a certain substance or mixture of substances. Because of this limited life it is desirable to use this Materials just before they are used in the harmful Release the measuring medium and take it up to this point Keep protective gas or protective liquid or vacuum. The harmful measuring medium can with the substance to be measured be identical.
Übliche Methoden sind hierzu das Kapseln der Substanz in einem Glaskolben, Kunststoff-Folien oder ähnlichen Verpackungen. Der Nachteil dieser Methoden ist vielfältig: Die Kapselungsmethoden sind nur begrenzt miniaturisierbar und/oder der Verschluß ist nicht oder nur aufwending automatisch zu öffnen. Solche empfindlichen Stoffe werden auch in einem Gefäß eingeschlossen, welches über ein Ventil und/oder Schlauchsystem mit der Außenwelt verbunden ist. Diese Vorrichtung ist automatisch zu öffnen, doch kann hier die Geschwindigkeit der mechanischen Öffnung für manche Anwendungen nicht ausreichend sein. Ein Reagieren auf schnelle Vorgänge ist somit nicht möglich. Weiterhin begrenzt die notwendige Mechanik die minimal erreichbare Baugröße und die Kostenreduzierung.The usual methods are to encapsulate the substance in one Glass flasks, plastic foils or similar packaging. The disadvantage of these methods is manifold: the encapsulation methods can only be miniaturized to a limited extent and / or the closure is not automatic or only consuming to open. Such sensitive substances are also in a vessel included, which via a valve and / or Hose system is connected to the outside world. This device can be opened automatically, but here the speed can the mechanical opening for some applications not be sufficient. Responding to fast processes is not possible. Furthermore limits the necessary Mechanics the minimum achievable size and the Cost reduction.
Die direkte Beschichtung der zu schützenden Substanz mit z.B. elektrisch abdampfbaren Materialien ist nur sehr begrenzt einsetzbar, da diese Methode in vielen Fällen zu einer irreversiblen Kontamination des beschichteten Materials führt.The direct coating of the substance to be protected with e.g. electrically vaporizable materials is very limited can be used because in many cases this method becomes a irreversible contamination of the coated material leads.
Die DE 3919042 A1 offenbart ein System zur Analyse von festen Substanzen auf Quecksilber. Bei diesem bekannten System wird eine zu analysierende feste Substanz in ein Gefäß eingebracht, das nachfolgend durch eine Membran verschlossen wird, wobei, wenn über der Membran ein Deckel auf den Rand des Gefäßes gesetzt ist, die Membran durch das Erhitzen der festen Substanz und einen dadurch bedingten Überdruck in dem Gefäß zerstört wird. Die bei dem in der DE 3919042 A1 offenbarten System verwendete Vorrichtung ist jedoch für eine Großserienfertigung nicht geeignet.DE 3919042 A1 discloses a system for the analysis of solid Substances on mercury. With this known system a solid substance to be analyzed is introduced into a vessel, which is subsequently closed by a membrane being, when, over the membrane, a lid on the edge of the vessel is set by heating the membrane solid substance and a resulting overpressure in the Vessel is destroyed. Those disclosed in DE 3919042 A1 However, the system used is for a device Large series production not suitable.
Die DE 3520416 C2 beschreibt eine Vorrichtung zum steuerbaren Öffnen einer Trennwand, wobei die Trennwand aus einer in einen Spannring eingesetzten Membran mit anliegenden Heizdrähten besteht, welche ein Öffnen der Membran bei Versorgung mit elektrischer Energie bewirken. Auch diese Vorrichtung ist nicht für eine Massenproduktion beispielsweise mittels mikromechanischer Verfahren geeignet.DE 3520416 C2 describes a device for controllable Opening a partition, the partition consisting of an in a clamping ring used membrane with adjacent heating wires there is an opening of the membrane when supply effect with electrical energy. This device too is not for mass production, for example suitable micromechanical method.
Die DE 3818614 A1 und DE3915920 A1 offenbaren mikromechanische Strukturen mit einer Mehrzahl von Vertiefungen zur Aufnahme von kleinen Materialmengen, insbesondere auf dem Gebiet der Biotechnologie. Die Vertiefungen werden dabei mittels eines Deckels, der vorzugsweise mit den Vertiefungen korrespondierende Erhebungen aufweist, verschlossen.DE 3818614 A1 and DE3915920 A1 disclose micromechanical Structures with a plurality of recesses for receiving of small amounts of material, especially in the field of biotechnology. The wells are by means of a lid, preferably with the wells has corresponding surveys, closed.
Für den Nachweis von Stoffen in Gasen oder Flüssigkeiten existiert z.B. eine Vielzahl von Transducerbauformen. Viele funktionieren nach dem Prinzip der Widerstands- oder Kapazitätsmessung des Indikatormaterials. Bezüglich derartiger Transducerbauformen wird verwiesen auf H.-E. Endres, S. rost, H. Sandmaier "A PHYSICAL SYSTEM FOR CHEMICAL SENSORS", Proc. Microsystem Technologies, Berlin, 29.10.-01.11.91, 70-75. Eine Änderung dieser Größe(n) wird mit einem Ereignis in dem zu untersuchenden Medium korreliert. Die für die z. B. Widerstandsmessung notwendigen Strukturen, z.B. Interdigitalstrukturen, werden oft in einer Dünnfilmtechnik auf ein Substrat, z.B. Silizium, Quarz, aufgebracht. Der Träger dieser Sensoren kann auch selbst wieder eine Membranstruktur sein.For the detection of substances in gases or liquids e.g. exists a variety of transducer designs. Lots operate on the principle of resistance or capacitance measurement of the indicator material. Regarding such Transducer designs are referred to H.-E. Endres, S. Rost, H. Sandmaier "A PHYSICAL SYSTEM FOR CHEMICAL SENSORS", Proc. Microsystem Technologies, Berlin, October 29th - November 1st, 1991, 70-75. A change in this size (s) will result in an event correlated in the medium to be examined. The for the z. B. Resistance measurement necessary structures, e.g. Interdigital structures, are often based on a thin film technique a substrate, e.g. Silicon, quartz, applied. The carrier These sensors can also have a membrane structure be.
Aus der Mikrosystemtechnik ist seit Jahren die Herstellung von dünnen Membranstrukturen, z.B. Si3N4 auf Si-Trägermaterial und andere Kombinationen, bekannt. Im allgemeinen werden diese Membranstrukturen aufgrund ihrer sehr niedrigen thermischen Wärmekapazität und/oder Wärmeleitfähigkeit eingesetzt. Sie dienen als Trägermaterial für temperaturempfindliche Widerstände, z.B. bei der Realisierung thermischen Durchflußmessers und/oder zur thermischen Isolierung eines Heizelements von seiner Umgebung.The production of thin membrane structures, for example Si 3 N 4 on Si carrier material and other combinations, has been known from microsystem technology for years. In general, these membrane structures are used due to their very low thermal heat capacity and / or thermal conductivity. They serve as a carrier material for temperature-sensitive resistors, for example in the implementation of thermal flow meters and / or for the thermal insulation of a heating element from its surroundings.
Ausgehend von dem genannten Stand der Technik liegt der Erfindung die Aufgabe zugrunde, eine miniaturisierbare Vorrichtung zu schaffen, die die Ereignis- oder zeitlich gesteuerte, automatische Vermengung zweier Stoffe ermöglicht.The invention is based on the cited prior art the task of a miniaturizable device to create the event or timed, allows automatic mixing of two substances.
Diese Aufgabe wird durch eine Vorrichtung gemaß Patentanspruch
1 gelöst.This object is achieved by a device according to
Eine weitere Aufgabe der vorliegenden Erfindung besteht darin, eine miniaturisierbare Vorrichtung zur automatischen Freisetzung eines gasförmigen, flüssigen oder festen Stoffes in die Umgebung zu schaffen.Another object of the present invention is a miniaturizable device for automatic Release of a gaseous, liquid or solid substance to create in the environment.
Diese Aufgabe wird durch den Gegenstand des Anspruchs 7 gelöst.This object is achieved by the subject matter of
Die vorliegende Erfindung schafft eine Vorrichtung zur getrennten, gekapselten Aufnahme einer Mehrzahl gleicher oder unterschiedlicher Stoffe in einer Mehrzahl von abgeschlossenen Hohlräumen in einer mikromechanisch gefertigten Struktur, wobei zumindest zwei der Hohlräume durch eine in Mikrosystemtechnik oder Dünnfilmtechnologie implementierte Membran getrennt sind, wobei die Vorrichtung eine elektrisch betätigbare Heizeinrichtung zum Zerstören der Membran, um die zumindest zwei Hohlräume zu verbinden, aufweist.The present invention provides an apparatus for separate, encapsulated recording of a plurality of the same or different substances in a plurality of closed Cavities in a micromechanically manufactured structure, where at least two of the cavities by one in microsystem technology or membrane implemented in thin film technology are separated, the device being an electrical actuatable heater to destroy the membrane in order which has to connect at least two cavities.
Die mikromechanisch gefertigte Struktur kann vorzugsweise durch eine Mehrzahl von Halbleiterwafern gebildet sein, die derart verbunden sind, daß zumindest zwei Ausnehmungen in den Halbleiterwafern durch die in Mikrosystemtechnik oder Dünnfilmtechnologie implementierte Membran getrennt sind. Ferner kann eine solche mikromechanisch gefertigte Struktur eine Mehrzahl von Membranen aufweisen, wobei jede Membran jeweils zumindest zwei Hohlräume in der mikromechanisch gefertigten Struktur trennt. Mittels einer geeigneten Treibereinrichtung zum Treiben der elektrisch betätigbaren Heizeinrichtungen kann die Mehrzahl der Membranen dann im wesentlichen gleichzeitig oder zeitversetzt zerstört werden.The micromechanically manufactured structure can preferably be formed by a plurality of semiconductor wafers which are connected such that at least two recesses in the semiconductor wafers by the in microsystem technology or Thin film technology implemented membrane are separated. Such a micromechanically manufactured structure can also be used have a plurality of membranes, each membrane in each case at least two cavities in the micromechanically manufactured Structure separates. Using a suitable driver device for driving the electrically operated heating devices the majority of the membranes can then essentially destroyed at the same time or with a time delay.
Die vorliegende Erfindung liefert ferner die Verwendung einer Vorrichtung zur gekapselten Aufnahme eines gasförmigen, flüssigen oder festen Stoffes, wobei die Vorrichtung einen eine Ausnehmung zur Aufnahme des gasförmigen, flüssigen oder festen Stoffes aufweisenden in Mikrosystemtechnik gebildeten Grundkörper, eine den Grundkörper überspannende, in Mikrosystemtechnik oder Dünnfilmtechnologie implementierte Membran zur Kapselung des Material in der Ausnehmung des Grundkörpers und eine elektrisch betätigbare Heizeinrichtung zum Zerstören der Membran, um den gasförmigen, flüssigen oder festen Stoff freizulegen, aufweist, zur Freisetzung der gasförmigen, flüssigen oder festen Stoffes in die Umgebung.The present invention further provides the use of a Encapsulated device for a gaseous, liquid or solid substance, the device a a recess for receiving the gaseous, liquid or solid substance formed in microsystem technology Base body, a spanning the base body, in microsystem technology or membrane implemented in thin film technology for encapsulating the material in the recess of the base body and an electrically actuated heating device for Destroy the membrane to the gaseous, liquid or expose solid substance, has to release the gaseous, liquid or solid into the environment.
Die gemäß der vorliegenden Erfindung verwendete Membran kann vorzugsweise mit einer Schutzschicht versehen sein, die die Häusung von aggressiven Medien ermöglicht. Besteht die Membran beispielsweise aus Siliziumnitrid, kann als widerstandsfähige Schutzschicht beispielsweise Siliziumcarbid verwendet werden. The membrane used in the present invention can preferably be provided with a protective layer which Enabling aggressive media to be housed. There is the membrane for example made of silicon nitride, can be resistant Protective layer, for example silicon carbide be used.
Ein Vorteil der erfindungsgemäßen Verwendung beispielsweise gegenüber einer Pumpe besteht in dem mechanisch und elektronisch wesentlich einfacheren Aufbau des erfindungsgemäßen Systems. Bis zu einer bestimmten Anzahl von Freisetzungen pro System ist dieses Verfahren somit kostengünstiger als zum Beispiel der Einsatz einer Pumpe. Ein weiterer Vorteil ist die durch den einfachen Aufbau bedingte höhere Funktionszuverlässigkeit des Systems. Die Freisetzung des Stoffes geschieht ohne Benutzung von Klappen, Ventilen und Kanälen. Somit ist beispielsweise, im Gegensatz zu einer Pumpe, kein Verstopfen von Kanälen möglich, da solche zur gewünschten Funktion gemäß der vorliegenden Erfindung nicht benötigt werden.An advantage of the use according to the invention, for example compared to a pump, it consists of mechanical and electronic much simpler structure of the invention Systems. Up to a certain number of releases this method is therefore cheaper per system than for example the use of a pump. Another advantage is the higher functional reliability due to the simple structure of the system. The release of the substance happens without using flaps, valves and channels. In contrast to a pump, for example, no clogging of channels possible, as these are required Function according to the present invention is not required will.
Die vorliegende Erfindung bedient sich der Tatsache, daß in dünnen Membranen, welche in Dünnfilmtechnologie oder Mikrosystemtechnik implementiert sind, häufig höhere Spannungskräfte auftreten, welche in anderen Bereichen der Technik als Problem derartiger Membranstrukturen gelten. Diese Spannungskräfte, die in der Membran vorliegen, bewirken bei Anwendung von thermischen Kräften auf die Membran ein explosionsartiges Zerplatzen derselben. Dabei verdampft die Membran nicht, sondern zerspringt in einzelne Stücke. Die gemäß der vorliegenden Erfindung verwendete Heizeinrichtung ist vorzugsweise als ein auf der Membran integrierter Heizer ausgeführt, bei dem ein kurzer Heizimpuls eine thermische Verspannung der Membran bewirkt, durch die diese Membran zum Platzen gebracht wird.The present invention takes advantage of the fact that in thin membranes, which in thin film technology or microsystem technology are implemented, often higher tension forces occur in other areas of technology are considered a problem of such membrane structures. These tension forces which are present in the membrane, cause application of thermal forces on the membrane an explosive Bursting of the same. The membrane evaporates not, but shatters into individual pieces. The according heater used in the present invention preferably as a heater integrated on the membrane executed, in which a short heating pulse a thermal Tensioning the membrane caused by this membrane to Burst is brought.
Die gemäß der vorliegenden Erfindung verwendeten Strukturen bieten eine einfache, kontaminationssichere und schnelle Art und Weise, um einen gasförmigen, flüssigen oder festen Stoff in die Umgebung freizusetzen, oder um eine Mehrzahl von in unterschiedlichen Hohlräumen befindliche Stoffen zu vermengen, wobei die Struktur in einfacher Weise einer Großserientechnik zugänglich ist. Das ordnungsgemäße Zerstören der Membran kann jeweils durch eine geeignete Elektrodengeometrie signalisiert werden. Die vorliegende Erfindung bedient sich somit einer Struktur, die mit gängigen großserientechnischen Methoden implementierbar ist. Hierbei ist die Membran-Grundkörper-Struktur vorteilhafterweise in Mikrosystemtechnik ausgeführt. Für die Zwecke der Erfindung kann die Membran jedoch auch in Dünnfilmtechnik ausgeführt sein.The structures used in accordance with the present invention offer a simple, contamination-proof and fast way and way to a gaseous, liquid or solid substance into the environment, or to release a plurality of in to mix substances located in different cavities, the structure being simple in a mass production technique is accessible. The proper destruction of the Membrane can each have a suitable electrode geometry be signaled. The present invention operates thus a structure that is compatible with common large-scale production Methods can be implemented. Here is the membrane body structure advantageously in microsystem technology executed. For the purposes of the invention, the However, the membrane can also be made using thin film technology.
Die einzige Figur der vorliegenden Anmeldung zeigt eine schematische Querschnittdarstellung eines Ausführungsbeispiels der erfindungsgemäßen Vorrichtung zur getrennten, gekapselten Aufnahme einer Mehrzahl gleicher oder unterschiedlicher Stoffe.The only figure of the present application shows one schematic cross-sectional representation of an embodiment the device according to the invention for separate, encapsulated Inclusion of a plurality of the same or different Fabrics.
Die Vorrichtung weist bei dem dargestellten Ausführungsbeispiel,
das in seiner Gesamtheit mit den Bezugszeichen 10 bezeichnet
ist, einen Träger 1 auf, der beispielsweise aus
Quarz besteht. Auf den Träger 1 ist optional eine Schicht 2
aufgebracht, die beispielsweise zur Unterstützung einer Verbindung
des Trägers 1 mit einem Halbleiterwafer, der bei dem
bevorzugten Ausführungsbeispiel aus Silizium besteht, dienen
kann, in dem eine Ausnehmung 8 durch übliche, photolithographische
und ätztechnische Methoden eingearbeitet ist. Über
der Ausnehmung 8 ist eine Membran 5 gebildet. Für einen
Fachmann auf dem Gebiet der Mikrosystemtechnik bedarf es
keiner Erläuterung, daß Methoden zur Herstellung einer eine
Halbleiterstruktur überspannenden Membran in der Mikrosystemtechnik
üblich sind und daß hierbei üblicherweise die
Membran 5 zunächst auf die Halbleiterstruktur 4 aufgebracht
wird, bevor die Ausnehmung 8 durch photolithographische und
ätztechnische Maßnahmen in der Halbleiterstruktur 4 gebildet
wird.In the exemplary embodiment shown, the device has
that is designated in its entirety with the
Auf der Membran 5 ist eine Heizerstruktur 7, die über Anschlußleitungen
mit Anschlußflächen oder Bondpads in Verbindung
steht, angeordnet.On the
Auf der der Trägerstruktur 4 gegenüberliegenden Oberfläche.
der Membran 5 ist ein weiterer Wafer 9, der bei dem bevorzugten
Ausführungsbeispiel aus Silizium besteht, angebracht. On the surface opposite the
Der Wafer 9 weißt eine Ausnehmung 10 auf und ist derart über
der Membran 5 mit dem Wafer 4 verbunden, daß sich die Hohlräume
8 und 10 gegenüberliegen, wobei dieselben durch die
Membran 5 getrennt sind.The
Wird nun während der Herstellung der Vorrichtung in den
Hohlraum 8 beispielsweise ein Stoff A eingebracht, während
in den Hohlraum 10 ein Stoff B eingebracht wird, kann durch
eine Betätigung der elektrischen Heizeinrichtung 7 automatisch
eine Vermischung der beiden Stoffe und somit beispielsweise
eine bestimmte Reaktion erreicht werden.Will now in the manufacture of the device in the
Für Fachleute ist offensichtlich, daß das in der Figur dargestellte
Ausführungsbeispiel rein veranschaulichend ist.
Beispielsweise könnte die in dem Wafer 9 angeordnete Ausnehmung
10 denselben vollständig durchdringen, wobei dieselbe
auf der Oberseite durch eine weitere Membran abgeschlossen
ist, an die wiederum eine Ausnehmung eines weiteren Wafers
angrenzt. Somit kann beispielsweise eine Struktur erstellt
werden, die mehr als zwei jeweils durch eine Membran voneinander
getrennte Hohlräume aufweist.It will be apparent to those skilled in the art that this is shown in the figure
Embodiment is purely illustrative.
For example, the recess arranged in the
Die vorliegende Erfindung ermöglicht somit die Abtrennung einer bestimmten Anzahl von Stoffen in zwei oder mehreren durch die "Membrantechnik" getrennten Kammern oder Ausnehmungen. Ein derartiger Aufbau kann erreicht werden, indem die Kapselung entweder schon in der Fertigung mehrere Kammern und Membrane enthält, oder in dem alternativ die Elemente auf Wafer- oder Einzelteil-Level beispielsweise durch Waferbonding oder Kleben entsprechend kombiniert werden. Abhängig vom Aufbau und der gewünschten Reaktion kann nun eine bestimmte Anzahl von Kammern quasi-gleichzeitig (im Millisekundenbereich) oder auch zeitlich beliebig versetzt geöffnet werden, indem die einzelnen Heizereinrichtungen entsprechend angesteuert werden. Durch eine Mehrkammertechnik kann somit die Anzahl von innerhalb eines Membransystems möglichen, beispielsweise chemischen, Reaktionen, beispielsweise Nachweisreaktionen, stark erhöht sein. The present invention thus enables separation a certain number of substances in two or more chambers or recesses separated by "membrane technology". Such a structure can be achieved by the encapsulation either in the manufacture of several chambers and contains membrane, or alternatively in which the elements at wafer or individual part level, for example Wafer bonding or gluing can be combined accordingly. Dependent of the structure and the desired reaction can now certain number of chambers quasi-simultaneously (in the millisecond range) or open at any time be by the individual heater devices accordingly can be controlled. With a multi-chamber technology, it can the number of possible within a membrane system, for example chemical reactions, for example detection reactions, be greatly increased.
Gemäß einem weiteren Aspekt schafft die vorliegende Erfindung eine weiterentwickelte Verwendung einer Vorrichtung zur gekapselten Aufnahme eines Materials, die einem eine Ausnehmung zur Aufnahme des Materials aufweisenden in Mikrosystemtechnik gebildeten Grundkörper, eine den Grundkörper überspannende, in Mikrosystemtechnik oder Dünnfilmtechnologie implementierte Membran zur Kapselung des Materials in der Ausnehmung des Grundkörpers und eine elektrisch betätigbare Heizeinrichtung zum Zerstören der Membran aufweist, um das Material, daß ein gasförmiger, flüssiger oder fester Stoff sein kann, in die Umgebung freizusetzen.In another aspect, the present invention provides further developed use of a device for encapsulated receptacle of a material that has a recess to hold the material in microsystem technology formed basic body, a spanning the basic body, in microsystem technology or thin film technology implemented membrane to encapsulate the material in the Recess of the base body and an electrically operated Has heater for destroying the membrane to the Material that is a gaseous, liquid or solid substance may be to release into the environment.
Bei der nachfolgend beschriebenen Verwendung dieser Vorrichtung wird nun der von der Membran und dem Träger gebildete Hohlraum als ein "kleines Gefäß" betrachtet, das beispielsweise eine bestimmte Flüssigkeits- oder Gas-Menge enthalten kann. Durch ein Zerstören der Membran wird dieser in dem "kleinen Gefäß" enthaltene Stoff dann in die Umgebung, die durch die Umwelt oder einen weiteren Teil des Systems, beispielsweise Reaktionskammern oder Stoffreservoirs gebildet ist, freigesetzt. Vorteilhaft dabei ist der einfache Aufbau des Systems und die damit verbundene höhere Funktionszuverlässigkeit.When using this device as described below is now that formed by the membrane and the support Cavity viewed as a "small vessel", for example contain a certain amount of liquid or gas can. By destroying the membrane, it becomes in the "Small vessel" then contained substance in the environment that through the environment or another part of the system, for example Reaction chambers or fabric reservoirs are formed is released. The simple structure is advantageous here of the system and the associated higher functional reliability.
Abhängig von der Verwendung kann die Membran mit einer widerstandsfähigen Schutzschicht versehen werden. Besteht die Membran aus Siliziumnitrid, kann in geeigneter Form eine Siliziumcarbidschicht als Schutzschicht verwendet werden. Dadurch ist die Membran auch in aggressiven Medien, beispielsweise starken Säuren, einsetzbar. Bei entsprechender Material-Wahl und -Dicke beeinträchtigt diese Schutzschicht die Funktion des Systems, d. h. das Zerstören der Membran, nicht. Im Gegensatz dazu sind mechanisch bewegte Teile, wie sie Pumpen enthalten, im allgemeinen schwieriger mit Schutzschichten zu überziehen.Depending on the use, the membrane can be made with a resistant Protective layer. Does it exist Membrane made of silicon nitride, can in a suitable form a silicon carbide layer can be used as a protective layer. Thereby the membrane is also in aggressive media, for example strong acids, can be used. With appropriate choice of material and thickness affects this protective layer Function of the system, d. H. destroying the membrane, Not. In contrast, mechanically moving parts are like they contain pumps, generally more difficult with protective layers to cover.
Die Freisetzung eines einzelnen Stoffes kann für sich genommen einen Zweck haben, der beispielsweise in der Freisetzung von Duftstoffen in die Raumluft oder in der Freisetzung von Zusatzstoffen in Flüssigkeiten usw. liegt. Ferner kann durch die Freisetzung auch eine Reaktion mit Stoffen der Umgebung und dadurch ein gewünschter Effekt mit der Umgebung ausgelöst werden.The release of a single substance can be taken on its own have a purpose, for example, in the release of fragrances in the room air or in the release of Additives in liquids etc. Furthermore, by the release is also a reaction with surrounding substances and thereby triggered a desired effect with the environment will.
Claims (9)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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DE19716683 | 1997-04-21 | ||
DE19716683A DE19716683C1 (en) | 1997-04-21 | 1997-04-21 | Miniature encapsulation device for sensitive materials |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0873789A2 true EP0873789A2 (en) | 1998-10-28 |
EP0873789A3 EP0873789A3 (en) | 1999-09-15 |
Family
ID=7827208
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP98107137A Withdrawn EP0873789A3 (en) | 1997-04-21 | 1998-04-20 | Device with reception means encapsulating materials |
Country Status (2)
Country | Link |
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EP (1) | EP0873789A3 (en) |
DE (1) | DE19716683C1 (en) |
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Also Published As
Publication number | Publication date |
---|---|
DE19716683C1 (en) | 1998-06-04 |
EP0873789A3 (en) | 1999-09-15 |
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