EP1195805A3 - Heat radiation substrate and semiconductor module - Google Patents
Heat radiation substrate and semiconductor module Download PDFInfo
- Publication number
- EP1195805A3 EP1195805A3 EP20010302583 EP01302583A EP1195805A3 EP 1195805 A3 EP1195805 A3 EP 1195805A3 EP 20010302583 EP20010302583 EP 20010302583 EP 01302583 A EP01302583 A EP 01302583A EP 1195805 A3 EP1195805 A3 EP 1195805A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- heat radiation
- semiconductor module
- radiation substrate
- adhered
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- G11B33/1406—Reducing the influence of the temperature
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- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
- H01L2924/143—Digital devices
- H01L2924/1433—Application-specific integrated circuit [ASIC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
- H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
- H01L2924/18165—Exposing the passive side of the semiconductor or solid-state body of a wire bonded chip
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
Abstract
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000306666A JP2002118202A (en) | 2000-10-05 | 2000-10-05 | Heat dissipation substrate and semiconductor module |
JP2000306666 | 2000-10-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1195805A2 EP1195805A2 (en) | 2002-04-10 |
EP1195805A3 true EP1195805A3 (en) | 2006-06-14 |
Family
ID=18787315
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP20010302583 Withdrawn EP1195805A3 (en) | 2000-10-05 | 2001-03-20 | Heat radiation substrate and semiconductor module |
Country Status (6)
Country | Link |
---|---|
US (1) | US20020041022A1 (en) |
EP (1) | EP1195805A3 (en) |
JP (1) | JP2002118202A (en) |
KR (1) | KR100400628B1 (en) |
CN (1) | CN1348215A (en) |
TW (1) | TWI228947B (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI225826B (en) * | 2001-07-25 | 2005-01-01 | Kobe Steel Ltd | Coated body, coating compound for electronic instrument member, and electronic instrument part |
US6900525B2 (en) * | 2003-05-21 | 2005-05-31 | Kyocera America, Inc. | Semiconductor package having filler metal of gold/silver/copper alloy |
KR100532461B1 (en) | 2003-08-21 | 2005-12-01 | 삼성전자주식회사 | Disk drive having heat sinking apparatus |
WO2006009030A1 (en) * | 2004-07-15 | 2006-01-26 | Dai Nippon Printing Co., Ltd. | Semiconductor device and semiconductor device producing substrate and production methods therefor |
JP4817418B2 (en) * | 2005-01-31 | 2011-11-16 | オンセミコンダクター・トレーディング・リミテッド | Circuit device manufacturing method |
JP5056429B2 (en) * | 2008-01-16 | 2012-10-24 | 株式会社デンソー | Manufacturing method of semiconductor device |
DE112010001702B4 (en) * | 2009-04-21 | 2013-03-21 | Alps Electric Co., Ltd. | MAGNETIC SENSOR PACKAGE |
CN102595767B (en) * | 2011-01-13 | 2015-07-22 | 钰桥半导体股份有限公司 | Circuit board structure of mobile electronic product and manufacturing method thereof |
US9312194B2 (en) | 2012-03-20 | 2016-04-12 | Stats Chippac Ltd. | Integrated circuit packaging system with terminals and method of manufacture thereof |
US8569112B2 (en) * | 2012-03-20 | 2013-10-29 | Stats Chippac Ltd. | Integrated circuit packaging system with encapsulation and leadframe etching and method of manufacture thereof |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1149606A (en) * | 1967-02-27 | 1969-04-23 | Motorola Inc | Mounting for a semiconductor wafer which is resistant to fatigue caused by thermal stresses |
US5144412A (en) * | 1987-02-19 | 1992-09-01 | Olin Corporation | Process for manufacturing plastic pin grid arrays and the product produced thereby |
US5650663A (en) * | 1995-07-03 | 1997-07-22 | Olin Corporation | Electronic package with improved thermal properties |
US6001671A (en) * | 1996-04-18 | 1999-12-14 | Tessera, Inc. | Methods for manufacturing a semiconductor package having a sacrificial layer |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5715446A (en) * | 1980-07-02 | 1982-01-26 | Hitachi Ltd | Semiconductor device |
US4821051A (en) * | 1988-09-01 | 1989-04-11 | Eastman Kodak Company | Optical printhead having thermal expansion stress relief |
US5151777A (en) * | 1989-03-03 | 1992-09-29 | Delco Electronics Corporation | Interface device for thermally coupling an integrated circuit to a heat sink |
JPH04164384A (en) * | 1990-10-29 | 1992-06-10 | Nec Corp | Hybrid integrated circuit for electric power |
KR0127160Y1 (en) * | 1995-09-16 | 1998-12-15 | 김광호 | Heat sink for heating circuit parts |
JP3171234B2 (en) * | 1997-03-26 | 2001-05-28 | 三菱マテリアル株式会社 | Ceramic circuit board with heat sink |
JP3571905B2 (en) * | 1998-01-14 | 2004-09-29 | 古河電気工業株式会社 | Heat radiating device and manufacturing method thereof |
JP3734359B2 (en) * | 1998-03-03 | 2006-01-11 | 電気化学工業株式会社 | Circuit board |
JP2001159931A (en) * | 1999-09-24 | 2001-06-12 | Cybernetics Technology Co Ltd | Computer |
-
2000
- 2000-10-05 JP JP2000306666A patent/JP2002118202A/en active Pending
-
2001
- 2001-02-08 TW TW90102803A patent/TWI228947B/en not_active IP Right Cessation
- 2001-02-10 CN CN01117384A patent/CN1348215A/en active Pending
- 2001-02-23 KR KR10-2001-0009171A patent/KR100400628B1/en not_active IP Right Cessation
- 2001-03-16 US US09/810,101 patent/US20020041022A1/en not_active Abandoned
- 2001-03-20 EP EP20010302583 patent/EP1195805A3/en not_active Withdrawn
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1149606A (en) * | 1967-02-27 | 1969-04-23 | Motorola Inc | Mounting for a semiconductor wafer which is resistant to fatigue caused by thermal stresses |
US5144412A (en) * | 1987-02-19 | 1992-09-01 | Olin Corporation | Process for manufacturing plastic pin grid arrays and the product produced thereby |
US5650663A (en) * | 1995-07-03 | 1997-07-22 | Olin Corporation | Electronic package with improved thermal properties |
US6001671A (en) * | 1996-04-18 | 1999-12-14 | Tessera, Inc. | Methods for manufacturing a semiconductor package having a sacrificial layer |
Also Published As
Publication number | Publication date |
---|---|
JP2002118202A (en) | 2002-04-19 |
CN1348215A (en) | 2002-05-08 |
KR100400628B1 (en) | 2003-10-04 |
US20020041022A1 (en) | 2002-04-11 |
TWI228947B (en) | 2005-03-01 |
EP1195805A2 (en) | 2002-04-10 |
KR20020027149A (en) | 2002-04-13 |
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