EP1620738A1 - Platinentestvorrichtung mit schr gstehend angetriebenen kont aktiernadeln - Google Patents
Platinentestvorrichtung mit schr gstehend angetriebenen kont aktiernadelnInfo
- Publication number
- EP1620738A1 EP1620738A1 EP04730866A EP04730866A EP1620738A1 EP 1620738 A1 EP1620738 A1 EP 1620738A1 EP 04730866 A EP04730866 A EP 04730866A EP 04730866 A EP04730866 A EP 04730866A EP 1620738 A1 EP1620738 A1 EP 1620738A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- needle
- circuit board
- distance
- board
- drive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 23
- 238000000034 method Methods 0.000 claims abstract description 4
- 238000005259 measurement Methods 0.000 claims description 27
- 238000005452 bending Methods 0.000 claims description 11
- 238000010276 construction Methods 0.000 description 5
- 239000000523 sample Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000007665 sagging Methods 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
- G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06705—Apparatus for holding or moving single probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07392—Multiple probes manipulating each probe element or tip individually
Definitions
- the invention relates to a device of the type mentioned in the preamble of claim 1.
- Such board test devices serve to contact assembled or bare boards with needles on contact surfaces.
- the needles are connected to an electrical measuring device which can carry out electrical measurements, such as resistance measurements, capacitance measurements, induction measurements and the like, between contacted surfaces of the circuit board. This allows the conductor tracks to be checked for continuity on unassembled boards and the assembled components can be checked for correct soldering, function and the like on assembled boards.
- Board test devices are indispensable for the production control of electronic devices.
- the needles can be moved parallel to the board so that any contact surfaces can be approached for contacting. Any number of needles can be used at the same time. Areas on the conductor tracks or on the components can be used as contact areas to be contacted, e.g. on the connecting legs of IC's.
- the needles are arranged in an inclined position, which offers the advantage of being able to contact not only from above onto the board, for example onto a conductor track, but also from the side, eg against an inclined or perpendicular surface to the board, e.g. a surface on one leg of an IC.
- the contact surfaces to be approached are calculated from the circuit board layout and given to the drive control, which can control the surfaces with these coordinates, ie with X, Y coordinates in the plane of the circuit board. If surfaces are to be controlled on components, that is to say surfaces that lie above the surface of the circuit board, the Z coordinate is added, so that the surfaces are to be controlled as three-dimensional spatial coordinates.
- the needle moves obliquely onto the calculated If the spatial coordinate of a contact surface is too close, the needle moves over the contact surface into the void. The result is incorrect contacting, which considerably disrupts or makes the test procedure impossible. The flatter the angle of the needle, the more annoying this effect becomes.
- the object of the present invention is to design a generic board test device with contact accuracy independent of bending of the boards. This object is achieved with the features of claim 1.
- the distance from the circuit board to the positioning level is measured before the contacting process. If the board sags, this is determined and the spatial coordinate of the contact surface to be approached is corrected accordingly. This means that even very small contact areas can be precisely hit. Since the sagging depth of the board is measured, the accuracy is independent of any bending of the board.
- any distance measuring devices can be used, e.g. mechanical sensing devices, optical or acoustic distance measuring devices.
- the laser triangulation measuring devices customary in this field can be used.
- the features of claim 2 are preferably provided.
- the needle drives can be used as a distance measuring device after changing over to the vertical position of the needle.
- the height of the board can be determined from the travel of the needle from a known zero position to the contact which can be determined via the measuring device.
- a separate distance measuring device can be omitted, so that the construction is simplified.
- the distance can be measured at several points on the board and the distance profile of the board for all points can be determined therefrom by interpolation. This can also cause irregular bending (Corrugated) boards can be measured precisely.
- the distance measurement of the board must be carried out before contacting, since the measured distance value is a prerequisite for accurate contacting.
- the features of claim 5 are preferably provided. Before the electrical measurement begins, the distance is determined and the bending shape of the board is determined. With this result, all electrical measurements, ie all contacting of contact surfaces, can subsequently be carried out correctly.
- FIG. 1 the invention is shown in a single FIG. 1, for example and schematically in a side view of a circuit board test device according to the invention.
- Figure 1 shows a side view of a circuit board test device 1, which is set up with two vertical columns 2 on a surface, for example, the table top 3 shown.
- the board test device 1 With two receptacles 4, the board test device 1 carries, in precise positioning, a board 5 which can be exchanged for the next board to be tested after the test run has ended.
- the circuit board 5 is held on the receptacles 4 at opposite edges so that its surface areas are freely accessible for testing. In the illustrated embodiment, the board is only tested from above. However, in a manner not shown, the circuit board test device 1 can also be designed such that it also tests from below.
- Parallel to the board 5 or the area predetermined by the receptacles 4, a positioning plate 6 is held by the columns 2 at a distance above the board 5.
- a holder drive 8 is provided, which can be moved in the direction of the arrow, that is in the direction of the level 7 and thus parallel to the circuit board 5, and is controlled by a drive control 10 via a line 9.
- the mounting drive 8 can preferably be moved in the X and Y directions in the setting plane 7 in order to be able to approach all surface points.
- the bracket drive 8 carries an angular drive 11, which can be controlled via a line 12 by the drive control 10 for angular adjustment of a needle drive 13, which in turn can be controlled by the drive control 10 via a line 14.
- the needle drive 13 is designed to feed a needle 15 in the needle direction.
- the needle 15 is connected via a line 16 to a measuring device 17 which can carry out electrical measurements at points on the circuit board 5 contacted by the needle tip 18.
- the drive control 10 and the measuring device 17 can be part of a computer system 19.
- the circuit board 5 is equipped with only one component 20, which has an inclined contact surface 21. This contact surface 21 is to be contacted with the needle tip 18 in order to carry out an electrical measurement.
- the circuit board 5 is also contacted at another point, for example from the receptacles 4 at ground points on the underside of the circuit board 5.
- the second contact is made just like the contact tion on another, not shown contact surface on the top of the circuit board 5 with a further needle, which can be moved and positioned with appropriate devices 8, 11, 13 independently of the needle shown in FIG.
- the exact position of the contact surface 21 is known from the design data of the circuit board 5, that is to say the circuit board layout. Their angular position is also known from this. These data are available to the drive control 10 and this can control the holder drive 8, the angle drive 11 and the needle drive 13 in such a way that the spatial coordinate of the center of the contact surface 21 is approached when the needle 15 is being advanced in the needle direction. In the embodiment shown with an angle drive 11, the oblique angle of the needle can be set up so that the contact surface 21 is contacted as vertically as possible.
- the circuit board 5 shown in solid lines in FIG. 1 sags between the receptacles 4 under its own weight. This is shown exaggerated in Figure 1 for clarity. If the circuit board did not sag, for example because it would be made of considerably stiffer material or equipped with lighter components, it would ideally be completely flat, as can be seen from the circuit board 5 'shown in dashed lines. If the needle is advanced in the position of the needle drive 13 shown in solid lines, it does not hit the contact surface 21 'on the flat board 5', as the figure clearly shows. The spatial coordinates of the contact surface 21 'are completely different. The needle drive would have to be brought into the position shown by deleting by adjusting the holder drive 8. The angle drive 11 could also be adjusted accordingly.
- Circuit boards can sag differently. As shown in FIG. 1, there is a greater height deviation in the middle than at the edges. Under certain circumstances, circuit boards can also be corrugated.
- the invention provides a distance measuring device 25 which, in the exemplary embodiment, is arranged to be movable in the level 7 and, for example, uses an optical or acoustic beam 26 to determine the distance of the board 5 from the level 7.
- the distance measuring device 25 can be moved over the entire surface of the circuit board 5 and can carry out distance measurements at many points. These are reported to the drive controller 10 via the line 27 and enable the exact height of all points of the circuit board 5 to be calculated by interpolating the measured values.
- the exact height of the contact surface 21 or the contact surface 21 ' can also be determined, so that depending on Deflection this contact surface can be approached correctly either in position 21 or in position 21 '. This also applies to all further contact surfaces, not shown, to be approached on the circuit board 5.
- the deflection of the plate 5 can also be measured in a manner not shown with a fixed distance measuring device in the middle of the plate with a beam 26 '. With the deflection curve of a plate known from structural engineering, the height deviation can then be calculated for each point of the plate 5.
- the needle drive 13 can be used as a distance measuring device, with the distance measuring device 25 being omitted. For this purpose, it is brought into the vertical position 13 ′ with the angular drive 11, specifically over a contactable point on the circuit board 5, for example over the contact surface 21, 21 ′. Now the needle is moved downwards from a rest position with a known altitude until the measuring device 17 detects contact.
- the travel path and thus the height of the contact surface 21 or 21 ' can be determined in the drive control 10 from the travel speed and the travel time of the needle.
- the steps can be counted in a simple manner, for example.
- any number of distance measurements can be carried out at different points on the board 5, so that the exact height profile can be measured, for example, even in the event of irregular deformation.
- the described distance measurement of the circuit board 5, to determine its exact altitude can preferably be carried out at the beginning of a test process after the circuit board has been placed on it.
- the height profile of the board is determined and the drive control 10 can determine the exact spatial coordinates for all contact areas from the known locations of the contact surfaces to be approached, which result from the board layout and from the measured height profile of the board To be able to approach contact surfaces exactly with the inclined needle 15.
- the electrical measurement that is to say the contacting of the contact surfaces in order to determine the proper functioning of the circuit board 5, then begins.
- distance measurements can also be carried out during the electrical measurement of the board. If the non-contact distance Measuring device 25 used, it can, for example, continuously carry out distance measurements during the test operation. This enables the exact height of the board to be monitored during operation in order to correct the room coordinates if necessary. This can be necessary, for example, if a large number of needles contact the board 5 simultaneously from above and additionally bend them with their contacting force.
- the spatial coordinates can be corrected accordingly by means of distance measurement in order to compensate for deflections.
- circuit board test devices which contact a circuit board equipped on both sides simultaneously from above and from below.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Tests Of Electronic Circuits (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10320381A DE10320381B4 (de) | 2003-05-06 | 2003-05-06 | Platinentestvorrichtung mit schrägstehend angetriebenen Kontaktiernadeln |
PCT/EP2004/004671 WO2004099803A1 (de) | 2003-05-06 | 2004-05-03 | Platinentestvorrichtung mit schrägstehend angetriebenen kontaktiernadeln |
Publications (1)
Publication Number | Publication Date |
---|---|
EP1620738A1 true EP1620738A1 (de) | 2006-02-01 |
Family
ID=33426692
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP04730866A Withdrawn EP1620738A1 (de) | 2003-05-06 | 2004-05-03 | Platinentestvorrichtung mit schr gstehend angetriebenen kont aktiernadeln |
Country Status (4)
Country | Link |
---|---|
US (1) | US7336087B2 (de) |
EP (1) | EP1620738A1 (de) |
DE (1) | DE10320381B4 (de) |
WO (1) | WO2004099803A1 (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101236230A (zh) * | 2007-02-02 | 2008-08-06 | 深圳富泰宏精密工业有限公司 | 检测设备 |
JP2009192309A (ja) * | 2008-02-13 | 2009-08-27 | Shinko Electric Ind Co Ltd | 半導体検査装置 |
CA2664237C (en) | 2009-04-27 | 2016-12-06 | Joel Ferguson | Modular hand-held electronic device charging and monitoring system |
CN101907644B (zh) * | 2009-06-04 | 2013-11-06 | 鸿富锦精密工业(深圳)有限公司 | 电子探棒控制系统 |
CN105353296B (zh) * | 2015-12-15 | 2018-04-24 | 中北大学 | 采用平面电机的飞针测试机 |
CN105353179B (zh) * | 2015-12-15 | 2018-08-07 | 中北大学 | 一种pcb自动测试设备用高精度探针加载装置 |
CN105807212B (zh) * | 2016-05-26 | 2018-03-13 | 深圳市华星光电技术有限公司 | 电路板测试装置及电路板测试方法 |
US11255877B2 (en) | 2020-07-17 | 2022-02-22 | Acculogic Corporation | Method and apparatus for testing printed circuit boards |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02130477A (ja) * | 1988-11-11 | 1990-05-18 | Hitachi Ltd | プローピング方式 |
US5394100A (en) * | 1993-05-06 | 1995-02-28 | Karl Suss America, Incorporated | Probe system with automatic control of contact pressure and probe alignment |
DE4406538A1 (de) * | 1994-02-28 | 1995-08-31 | Mania Gmbh | Leiterplatten-Prüfeinrichtung mit Prüfadapter und Verfahren zum Einstellen desselben |
DE19503329C2 (de) * | 1995-02-02 | 2000-05-18 | Ita Ingb Testaufgaben Gmbh | Testvorrichtung für elektronische Flachbaugruppen |
KR0176627B1 (ko) * | 1995-12-30 | 1999-05-15 | 김광호 | 인쇄회로기판의 통전검사용 프로브 장치 |
JPH1058367A (ja) * | 1996-08-23 | 1998-03-03 | Advantest Corp | Ic搬送装置 |
EP1040316B1 (de) * | 1997-12-15 | 2007-10-03 | Astyx GmbH | Abstandsmessvorrichtung und verfahren zur bestimmung eines abstandes |
JP4408538B2 (ja) * | 2000-07-24 | 2010-02-03 | 株式会社日立製作所 | プローブ装置 |
US6870611B2 (en) * | 2001-07-26 | 2005-03-22 | Orbotech Ltd. | Electrical circuit conductor inspection |
DE10220343B4 (de) * | 2002-05-07 | 2007-04-05 | Atg Test Systems Gmbh & Co. Kg Reicholzheim | Vorrichtung und Verfahren zum Prüfen von Leiterplatten und Prüfsonde |
-
2003
- 2003-05-06 DE DE10320381A patent/DE10320381B4/de not_active Expired - Fee Related
-
2004
- 2004-05-03 WO PCT/EP2004/004671 patent/WO2004099803A1/de active Application Filing
- 2004-05-03 EP EP04730866A patent/EP1620738A1/de not_active Withdrawn
- 2004-05-03 US US10/555,514 patent/US7336087B2/en not_active Expired - Fee Related
Non-Patent Citations (1)
Title |
---|
See references of WO2004099803A1 * |
Also Published As
Publication number | Publication date |
---|---|
DE10320381B4 (de) | 2010-11-04 |
WO2004099803A1 (de) | 2004-11-18 |
US20060290368A1 (en) | 2006-12-28 |
US7336087B2 (en) | 2008-02-26 |
DE10320381A1 (de) | 2004-12-16 |
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Legal Events
Date | Code | Title | Description |
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PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
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17P | Request for examination filed |
Effective date: 20050922 |
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AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR |
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DAX | Request for extension of the european patent (deleted) | ||
RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: LUECK, THOMAS Inventor name: DEPUE, CLAYTON Inventor name: KOERTING, TORSTEN |
|
RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: DEPUE, CLAYTON Inventor name: KOERTING, TORSTEN Inventor name: LUECK, THOMAS |
|
17Q | First examination report despatched |
Effective date: 20110805 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
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18D | Application deemed to be withdrawn |
Effective date: 20131203 |