EP1631396A4 - Megasonic cleaning using supersaturated cleaning solution - Google Patents

Megasonic cleaning using supersaturated cleaning solution

Info

Publication number
EP1631396A4
EP1631396A4 EP04776442.8A EP04776442A EP1631396A4 EP 1631396 A4 EP1631396 A4 EP 1631396A4 EP 04776442 A EP04776442 A EP 04776442A EP 1631396 A4 EP1631396 A4 EP 1631396A4
Authority
EP
European Patent Office
Prior art keywords
cleaning
supersaturated
megasonic
solution
cleaning solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP04776442.8A
Other languages
German (de)
French (fr)
Other versions
EP1631396A2 (en
Inventor
Cole S Franklin
Yi Wu
Brian Fraser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Akrion Technologies Inc
Original Assignee
Akrion Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Akrion Technologies Inc filed Critical Akrion Technologies Inc
Publication of EP1631396A2 publication Critical patent/EP1631396A2/en
Publication of EP1631396A4 publication Critical patent/EP1631396A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
EP04776442.8A 2003-06-11 2004-06-10 Megasonic cleaning using supersaturated cleaning solution Withdrawn EP1631396A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US47760203P 2003-06-11 2003-06-11
PCT/US2004/018464 WO2005006396A2 (en) 2003-06-11 2004-06-10 Megasonic cleaning using supersaturated cleaning solution

Publications (2)

Publication Number Publication Date
EP1631396A2 EP1631396A2 (en) 2006-03-08
EP1631396A4 true EP1631396A4 (en) 2013-08-14

Family

ID=34061915

Family Applications (1)

Application Number Title Priority Date Filing Date
EP04776442.8A Withdrawn EP1631396A4 (en) 2003-06-11 2004-06-10 Megasonic cleaning using supersaturated cleaning solution

Country Status (6)

Country Link
EP (1) EP1631396A4 (en)
JP (1) JP4643582B2 (en)
KR (1) KR101110905B1 (en)
CN (1) CN1849182A (en)
TW (1) TWI330552B (en)
WO (1) WO2005006396A2 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010108641A (en) * 2000-05-30 2001-12-08 강병근 Healthy beverage with radish and manufacturing method thereof
KR20020037177A (en) * 2000-11-13 2002-05-18 김용현 Honey drink added radish
KR100827618B1 (en) * 2006-05-11 2008-05-07 한국기계연구원 Ultrasonic device for cleaning and ultrasonic cleaning system using the same
US7969548B2 (en) * 2006-05-22 2011-06-28 Asml Netherlands B.V. Lithographic apparatus and lithographic apparatus cleaning method
WO2008050832A1 (en) * 2006-10-27 2008-05-02 Tokyo Electron Limited Substrate cleaning apparatus, substrate cleaning method, program and recording medium
KR100748480B1 (en) * 2007-06-27 2007-08-10 한국기계연구원 Ultrasonic device for cleaning and ultrasonic cleaning system using the same
JP4532580B2 (en) * 2008-08-20 2010-08-25 株式会社カイジョー Ultrasonic cleaning equipment
JP4915455B2 (en) * 2010-02-25 2012-04-11 トヨタ自動車株式会社 Degreasing system using microbubbles for large products such as vehicles
JP2014130881A (en) * 2012-12-28 2014-07-10 Ebara Corp Polishing device
JP6678448B2 (en) * 2015-12-22 2020-04-08 株式会社Ｓｃｒｅｅｎホールディングス Substrate cleaning method and substrate cleaning apparatus
WO2020095091A1 (en) * 2018-11-06 2020-05-14 Arcelormittal Equipment improving the ultrasound cleaning
JP7233691B2 (en) 2019-03-28 2023-03-07 株式会社エアレックス Decontamination method for low-temperature goods and pass box used for this

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5562778A (en) * 1993-12-17 1996-10-08 International Business Machines Corporation Ultrasonic jet semiconductor wafer cleaning method
US20010009155A1 (en) * 1999-12-24 2001-07-26 m . FSI LTD. Substrate treatment process and apparatus
US6290777B1 (en) * 1996-08-20 2001-09-18 Organo Corp. Method and device for washing electronic parts member, or the like
WO2003033178A1 (en) * 2001-10-18 2003-04-24 The Procter & Gamble Company Ultrasonic cleaning products comprising cleaning composition having dissolved gas

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1022246A (en) 1996-07-04 1998-01-23 Tadahiro Omi Cleaning method
US5800626A (en) 1997-02-18 1998-09-01 International Business Machines Corporation Control of gas content in process liquids for improved megasonic cleaning of semiconductor wafers and microelectronics substrates
US5849091A (en) 1997-06-02 1998-12-15 Micron Technology, Inc. Megasonic cleaning methods and apparatus
US6167891B1 (en) * 1999-05-25 2001-01-02 Infineon Technologies North America Corp. Temperature controlled degassification of deionized water for megasonic cleaning of semiconductor wafers
JP3322853B2 (en) * 1999-08-10 2002-09-09 株式会社プレテック Substrate drying device and cleaning device, and drying method and cleaning method
US6684890B2 (en) 2001-07-16 2004-02-03 Verteq, Inc. Megasonic cleaner probe system with gasified fluid

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5562778A (en) * 1993-12-17 1996-10-08 International Business Machines Corporation Ultrasonic jet semiconductor wafer cleaning method
US6290777B1 (en) * 1996-08-20 2001-09-18 Organo Corp. Method and device for washing electronic parts member, or the like
US20010009155A1 (en) * 1999-12-24 2001-07-26 m . FSI LTD. Substrate treatment process and apparatus
WO2003033178A1 (en) * 2001-10-18 2003-04-24 The Procter & Gamble Company Ultrasonic cleaning products comprising cleaning composition having dissolved gas

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2005006396A2 *

Also Published As

Publication number Publication date
TW200507954A (en) 2005-03-01
WO2005006396A2 (en) 2005-01-20
JP2007502032A (en) 2007-02-01
CN1849182A (en) 2006-10-18
TWI330552B (en) 2010-09-21
EP1631396A2 (en) 2006-03-08
JP4643582B2 (en) 2011-03-02
KR101110905B1 (en) 2012-02-20
KR20060037270A (en) 2006-05-03
WO2005006396A3 (en) 2005-09-15

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Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20051216

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL HR LT LV MK

DAX Request for extension of the european patent (deleted)
RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: AKRION TECHNOLOGIES, INC.

RIN1 Information on inventor provided before grant (corrected)

Inventor name: FRASER, BRIAN

Inventor name: WU, YI

Inventor name: FRANKLIN, COLE, S.

A4 Supplementary search report drawn up and despatched

Effective date: 20130715

RIC1 Information provided on ipc code assigned before grant

Ipc: H01L 21/67 20060101ALI20130709BHEP

Ipc: B08B 3/12 20060101AFI20130709BHEP

17Q First examination report despatched

Effective date: 20131024

GRAP Despatch of communication of intention to grant a patent

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INTG Intention to grant announced

Effective date: 20151014

STAA Information on the status of an ep patent application or granted ep patent

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18D Application deemed to be withdrawn

Effective date: 20160225