EP1689907A4 - Plasma production device and method and rf driver circuit with adjustable duty cycle - Google Patents

Plasma production device and method and rf driver circuit with adjustable duty cycle

Info

Publication number
EP1689907A4
EP1689907A4 EP04755834A EP04755834A EP1689907A4 EP 1689907 A4 EP1689907 A4 EP 1689907A4 EP 04755834 A EP04755834 A EP 04755834A EP 04755834 A EP04755834 A EP 04755834A EP 1689907 A4 EP1689907 A4 EP 1689907A4
Authority
EP
European Patent Office
Prior art keywords
driver circuit
duty cycle
production device
plasma production
adjustable duty
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP04755834A
Other languages
German (de)
French (fr)
Other versions
EP1689907A2 (en
Inventor
Patrick Pribyl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Plasma Control Systems LLC
Original Assignee
Plasma Control Systems LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Plasma Control Systems LLC filed Critical Plasma Control Systems LLC
Publication of EP1689907A2 publication Critical patent/EP1689907A2/en
Publication of EP1689907A4 publication Critical patent/EP1689907A4/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/26—Plasma torches
    • H05H1/32—Plasma torches using an arc
    • H05H1/34—Details, e.g. electrodes, nozzles
    • H05H1/36—Circuit arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/26—Supports; Mounting means by structural association with other equipment or articles with electric discharge tube
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B31/00—Electric arc lamps
    • H05B31/02—Details
    • H05B31/26—Influencing the shape of arc discharge by gas blowing devices

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Electromagnetism (AREA)
  • Plasma Technology (AREA)
  • Physical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
EP04755834A 2003-06-19 2004-06-21 Plasma production device and method and rf driver circuit with adjustable duty cycle Ceased EP1689907A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US48033803P 2003-06-19 2003-06-19
PCT/US2004/019931 WO2004114461A2 (en) 2003-06-19 2004-06-21 Plasma production device and method and rf driver circuit with adjustable duty cycle

Publications (2)

Publication Number Publication Date
EP1689907A2 EP1689907A2 (en) 2006-08-16
EP1689907A4 true EP1689907A4 (en) 2008-07-23

Family

ID=33539287

Family Applications (1)

Application Number Title Priority Date Filing Date
EP04755834A Ceased EP1689907A4 (en) 2003-06-19 2004-06-21 Plasma production device and method and rf driver circuit with adjustable duty cycle

Country Status (6)

Country Link
EP (1) EP1689907A4 (en)
JP (1) JP2007524963A (en)
KR (1) KR20060029621A (en)
CN (1) CN1871373A (en)
CA (1) CA2529794A1 (en)
WO (1) WO2004114461A2 (en)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4773165B2 (en) * 2005-08-31 2011-09-14 株式会社ダイヘン High frequency power supply
CN100411496C (en) * 2005-09-21 2008-08-13 大连理工大学 Method for realizing matchment between pulse power supply and plasma loading
JP5241578B2 (en) * 2009-03-19 2013-07-17 株式会社日清製粉グループ本社 Induction thermal plasma generation method and apparatus
KR101757922B1 (en) 2009-10-27 2017-07-14 도쿄엘렉트론가부시키가이샤 Plamsa processing apparatus
CN102056395B (en) 2009-10-27 2014-05-07 东京毅力科创株式会社 Plasma processing apparatus and plasma processing method
JP5851681B2 (en) * 2009-10-27 2016-02-03 東京エレクトロン株式会社 Plasma processing equipment
JP5592098B2 (en) 2009-10-27 2014-09-17 東京エレクトロン株式会社 Plasma processing apparatus and plasma processing method
JP5957816B2 (en) * 2011-02-23 2016-07-27 株式会社村田製作所 Impedance conversion device, antenna device, and communication terminal device
CN103456591B (en) * 2012-05-31 2016-04-06 中微半导体设备(上海)有限公司 The inductively coupled plasma process chamber of automatic frequency tuning source and biased radio-frequency power supply
JP6267989B2 (en) * 2013-02-18 2018-01-24 東京エレクトロン株式会社 Plasma processing method and capacitively coupled plasma processing apparatus
CN103311648B (en) * 2013-06-18 2015-04-29 浙江大学 Ultra-wide-band plasma emission antenna device
JP2016046391A (en) * 2014-08-22 2016-04-04 株式会社アルバック Plasma etching device
EP3322258A4 (en) * 2015-07-03 2019-03-27 Toyo Seikan Group Holdings, Ltd. High-frequency dielectric heating device
CN105228330B (en) * 2015-09-01 2018-09-14 沈阳拓荆科技有限公司 A kind of radio frequency plasma equipment adaptation
US10211522B2 (en) * 2016-07-26 2019-02-19 Smartsky Networks LLC Density and power controlled plasma antenna
US10734195B2 (en) * 2017-06-08 2020-08-04 Lam Research Corporation Systems and methods for transformer coupled plasma pulsing with transformer coupled capacitive tuning switching
US20190108976A1 (en) * 2017-10-11 2019-04-11 Advanced Energy Industries, Inc. Matched source impedance driving system and method of operating the same
CN111788655B (en) 2017-11-17 2024-04-05 先进工程解决方案全球控股私人有限公司 Spatial and temporal control of ion bias voltage for plasma processing
US11437221B2 (en) 2017-11-17 2022-09-06 Advanced Energy Industries, Inc. Spatial monitoring and control of plasma processing environments
US10672590B2 (en) * 2018-03-14 2020-06-02 Lam Research Corporation Frequency tuning for a matchless plasma source
JP2023530678A (en) * 2020-06-17 2023-07-19 ラム リサーチ コーポレーション Protection system for switches in direct drive circuits of substrate processing systems
WO2022173626A1 (en) * 2021-02-09 2022-08-18 Advanced Energy Industries, Inc. Spatial monitoring and control of plasma processing environments
US11670487B1 (en) 2022-01-26 2023-06-06 Advanced Energy Industries, Inc. Bias supply control and data processing
US11942309B2 (en) 2022-01-26 2024-03-26 Advanced Energy Industries, Inc. Bias supply with resonant switching

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5654679A (en) * 1996-06-13 1997-08-05 Rf Power Products, Inc. Apparatus for matching a variable load impedance with an RF power generator impedance
US5747935A (en) * 1992-04-16 1998-05-05 Advanced Energy Industries, Inc. Method and apparatus for stabilizing switch-mode powered RF plasma processing
US6264812B1 (en) * 1995-11-15 2001-07-24 Applied Materials, Inc. Method and apparatus for generating a plasma
US6305316B1 (en) * 2000-07-20 2001-10-23 Axcelis Technologies, Inc. Integrated power oscillator RF source of plasma immersion ion implantation system
WO2003032434A1 (en) * 2001-10-09 2003-04-17 Plasma Devices And Instrumentation, Llc Plasma production device and method and rf driver circuit

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0773105B2 (en) * 1987-02-16 1995-08-02 日電アネルバ株式会社 Plasma processing device
JP3283476B2 (en) * 1989-09-22 2002-05-20 株式会社日立製作所 Discharge state fluctuation monitor
US5473291A (en) * 1994-11-16 1995-12-05 Brounley Associates, Inc. Solid state plasma chamber tuner
JP2884056B2 (en) * 1995-12-07 1999-04-19 パール工業株式会社 High frequency power supply for generating discharge plasma and semiconductor manufacturing apparatus
JP2001073149A (en) * 1999-09-01 2001-03-21 Shimadzu Corp Ecr film forming system
JP2001332534A (en) * 2000-05-25 2001-11-30 Matsushita Electric Ind Co Ltd Plasma processing method and plasma processing apparatus
JP4711543B2 (en) * 2001-05-22 2011-06-29 キヤノンアネルバ株式会社 Method and apparatus for detecting discharge in processing apparatus using discharge
JP3574104B2 (en) * 2001-11-27 2004-10-06 三容真空工業株式会社 Plasma generation driving device using matching circuit for plasma generation

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5747935A (en) * 1992-04-16 1998-05-05 Advanced Energy Industries, Inc. Method and apparatus for stabilizing switch-mode powered RF plasma processing
US6264812B1 (en) * 1995-11-15 2001-07-24 Applied Materials, Inc. Method and apparatus for generating a plasma
US5654679A (en) * 1996-06-13 1997-08-05 Rf Power Products, Inc. Apparatus for matching a variable load impedance with an RF power generator impedance
US6305316B1 (en) * 2000-07-20 2001-10-23 Axcelis Technologies, Inc. Integrated power oscillator RF source of plasma immersion ion implantation system
WO2003032434A1 (en) * 2001-10-09 2003-04-17 Plasma Devices And Instrumentation, Llc Plasma production device and method and rf driver circuit

Also Published As

Publication number Publication date
WO2004114461A2 (en) 2004-12-29
EP1689907A2 (en) 2006-08-16
WO2004114461A3 (en) 2006-07-06
JP2007524963A (en) 2007-08-30
CN1871373A (en) 2006-11-29
CA2529794A1 (en) 2004-12-29
KR20060029621A (en) 2006-04-06

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Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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17P Request for examination filed

Effective date: 20060112

AK Designated contracting states

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Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL HR LT LV MK

DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20080620

RIC1 Information provided on ipc code assigned before grant

Ipc: H05H 1/46 20060101ALI20080616BHEP

Ipc: C23F 1/02 20060101ALI20080616BHEP

Ipc: C23C 16/00 20060101AFI20060713BHEP

STAA Information on the status of an ep patent application or granted ep patent

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Effective date: 20081203