EP1865540A4 - Exposure apparatus, exposure method, and device producing method - Google Patents

Exposure apparatus, exposure method, and device producing method

Info

Publication number
EP1865540A4
EP1865540A4 EP06730625A EP06730625A EP1865540A4 EP 1865540 A4 EP1865540 A4 EP 1865540A4 EP 06730625 A EP06730625 A EP 06730625A EP 06730625 A EP06730625 A EP 06730625A EP 1865540 A4 EP1865540 A4 EP 1865540A4
Authority
EP
European Patent Office
Prior art keywords
exposure
device producing
exposure apparatus
producing method
exposure method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP06730625A
Other languages
German (de)
French (fr)
Other versions
EP1865540A1 (en
Inventor
Katsushi Nakano
Masato Hamatani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of EP1865540A1 publication Critical patent/EP1865540A1/en
Publication of EP1865540A4 publication Critical patent/EP1865540A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
EP06730625A 2005-03-30 2006-03-30 Exposure apparatus, exposure method, and device producing method Withdrawn EP1865540A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005098051 2005-03-30
PCT/JP2006/306677 WO2006106833A1 (en) 2005-03-30 2006-03-30 Exposure apparatus, exposure method, and device producing method

Publications (2)

Publication Number Publication Date
EP1865540A1 EP1865540A1 (en) 2007-12-12
EP1865540A4 true EP1865540A4 (en) 2010-03-17

Family

ID=37073389

Family Applications (1)

Application Number Title Priority Date Filing Date
EP06730625A Withdrawn EP1865540A4 (en) 2005-03-30 2006-03-30 Exposure apparatus, exposure method, and device producing method

Country Status (5)

Country Link
US (1) US20090226846A1 (en)
EP (1) EP1865540A4 (en)
JP (1) JP4544303B2 (en)
KR (1) KR20070115860A (en)
WO (1) WO2006106833A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8941810B2 (en) 2005-12-30 2015-01-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8975599B2 (en) 2007-05-03 2015-03-10 Asml Netherlands B.V. Image sensor, lithographic apparatus comprising an image sensor and use of an image sensor in a lithographic apparatus
EP2131242A1 (en) * 2008-06-02 2009-12-09 ASML Netherlands B.V. Substrate table, lithographic apparatus and device manufacturing method
US20130169944A1 (en) * 2011-12-28 2013-07-04 Nikon Corporation Exposure apparatus, exposure method, device manufacturing method, program, and recording medium
JP6684792B2 (en) * 2015-07-06 2020-04-22 株式会社Ｆｕｊｉ Mounting device, imaging processing method, and imaging unit

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005020299A1 (en) * 2003-08-21 2005-03-03 Nikon Corporation Exposure apparatus, exposure method, and device producing method
EP1717845A1 (en) * 2004-02-19 2006-11-02 Nikon Corporation Exposure apparatus and exposure method, and device producing method

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US4346164A (en) * 1980-10-06 1982-08-24 Werner Tabarelli Photolithographic method for the manufacture of integrated circuits
JPS57117238A (en) * 1981-01-14 1982-07-21 Nippon Kogaku Kk <Nikon> Exposing and baking device for manufacturing integrated circuit with illuminometer
JPS57153433A (en) * 1981-03-18 1982-09-22 Hitachi Ltd Manufacturing device for semiconductor
JPH0782981B2 (en) * 1986-02-07 1995-09-06 株式会社ニコン Projection exposure method and apparatus
JP2897355B2 (en) * 1990-07-05 1999-05-31 株式会社ニコン Alignment method, exposure apparatus, and position detection method and apparatus
US5243195A (en) * 1991-04-25 1993-09-07 Nikon Corporation Projection exposure apparatus having an off-axis alignment system and method of alignment therefor
JP2753930B2 (en) * 1992-11-27 1998-05-20 キヤノン株式会社 Immersion type projection exposure equipment
JP3412704B2 (en) * 1993-02-26 2003-06-03 株式会社ニコン Projection exposure method and apparatus, and exposure apparatus
US6721034B1 (en) * 1994-06-16 2004-04-13 Nikon Corporation Stage unit, drive table, and scanning exposure apparatus using the same
JPH08316124A (en) * 1995-05-19 1996-11-29 Hitachi Ltd Method and apparatus for projection exposing
US5825043A (en) * 1996-10-07 1998-10-20 Nikon Precision Inc. Focusing and tilting adjustment system for lithography aligner, manufacturing apparatus or inspection apparatus
EP0951054B1 (en) * 1996-11-28 2008-08-13 Nikon Corporation Aligner and method for exposure
WO1998028665A1 (en) * 1996-12-24 1998-07-02 Koninklijke Philips Electronics N.V. Two-dimensionally balanced positioning device with two object holders, and lithographic device provided with such a positioning device
JPH1116816A (en) * 1997-06-25 1999-01-22 Nikon Corp Projection aligner, method for exposure with the device, and method for manufacturing circuit device using the device
US6897963B1 (en) * 1997-12-18 2005-05-24 Nikon Corporation Stage device and exposure apparatus
US6208407B1 (en) * 1997-12-22 2001-03-27 Asm Lithography B.V. Method and apparatus for repetitively projecting a mask pattern on a substrate, using a time-saving height measurement
US6819414B1 (en) * 1998-05-19 2004-11-16 Nikon Corporation Aberration measuring apparatus, aberration measuring method, projection exposure apparatus having the same measuring apparatus, device manufacturing method using the same measuring method, and exposure method
JP2001267239A (en) * 2000-01-14 2001-09-28 Nikon Corp Exposure method, exposure device and manufacturing method of device
US20020041377A1 (en) * 2000-04-25 2002-04-11 Nikon Corporation Aerial image measurement method and unit, optical properties measurement method and unit, adjustment method of projection optical system, exposure method and apparatus, making method of exposure apparatus, and device manufacturing method
EP1231514A1 (en) * 2001-02-13 2002-08-14 Asm Lithography B.V. Measurement of wavefront aberrations in a lithographic projection apparatus
JP4714403B2 (en) * 2001-02-27 2011-06-29 エーエスエムエル ユーエス，インコーポレイテッド Method and apparatus for exposing a dual reticle image
TW529172B (en) * 2001-07-24 2003-04-21 Asml Netherlands Bv Imaging apparatus
US6788477B2 (en) * 2002-10-22 2004-09-07 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus for method for immersion lithography
CN101424881B (en) * 2002-11-12 2011-11-30 Asml荷兰有限公司 Lithography projection apparatus
CN101872135B (en) * 2002-12-10 2013-07-31 株式会社尼康 Exposure system and device producing method
KR101533206B1 (en) * 2003-04-11 2015-07-01 가부시키가이샤 니콘 Apparatus and method for maintaining immersion fluid in the gap under the projection lens during wafer exchange in an immersion lithography machine
JP4444920B2 (en) * 2003-09-19 2010-03-31 株式会社ニコン Exposure apparatus and device manufacturing method
EP1519231B1 (en) * 2003-09-29 2005-12-21 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4524601B2 (en) * 2003-10-09 2010-08-18 株式会社ニコン Exposure apparatus, exposure method, and device manufacturing method
DE602004027162D1 (en) * 2004-01-05 2010-06-24 Nippon Kogaku Kk EXPOSURE DEVICE, EXPOSURE METHOD AND COMPONENT MANUFACTURING METHOD
US7034917B2 (en) * 2004-04-01 2006-04-25 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufactured thereby
JP4192118B2 (en) * 2004-05-31 2008-12-03 株式会社日立ハイテクノロジーズ Defect inspection apparatus and defect inspection system
US7119876B2 (en) * 2004-10-18 2006-10-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2006210408A (en) * 2005-01-25 2006-08-10 Nikon Corp Inspection apparatus and manufacturing method of projection optical system

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005020299A1 (en) * 2003-08-21 2005-03-03 Nikon Corporation Exposure apparatus, exposure method, and device producing method
EP1662554A1 (en) * 2003-08-21 2006-05-31 Nikon Corporation Exposure apparatus, exposure method, and device producing method
EP1717845A1 (en) * 2004-02-19 2006-11-02 Nikon Corporation Exposure apparatus and exposure method, and device producing method

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2006106833A1 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8941810B2 (en) 2005-12-30 2015-01-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8947631B2 (en) 2005-12-30 2015-02-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9436096B2 (en) 2005-12-30 2016-09-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method

Also Published As

Publication number Publication date
JP4544303B2 (en) 2010-09-15
EP1865540A1 (en) 2007-12-12
KR20070115860A (en) 2007-12-06
US20090226846A1 (en) 2009-09-10
WO2006106833A1 (en) 2006-10-12
JPWO2006106833A1 (en) 2008-09-11

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Inventor name: NAKANO, KATSUSHI,

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