EP2044623A4 - Method and system for isolated and discretized process sequence integration - Google Patents
Method and system for isolated and discretized process sequence integrationInfo
- Publication number
- EP2044623A4 EP2044623A4 EP07840397A EP07840397A EP2044623A4 EP 2044623 A4 EP2044623 A4 EP 2044623A4 EP 07840397 A EP07840397 A EP 07840397A EP 07840397 A EP07840397 A EP 07840397A EP 2044623 A4 EP2044623 A4 EP 2044623A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- isolated
- process sequence
- sequence integration
- discretized
- discretized process
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US83224806P | 2006-07-19 | 2006-07-19 | |
US11/672,478 US7867904B2 (en) | 2006-07-19 | 2007-02-07 | Method and system for isolated and discretized process sequence integration |
US11/672,473 US8815013B2 (en) | 2006-07-19 | 2007-02-07 | Method and system for isolated and discretized process sequence integration |
PCT/US2007/073368 WO2008011329A2 (en) | 2006-07-19 | 2007-07-12 | Method and system for isolated and discretized process sequence integration |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2044623A2 EP2044623A2 (en) | 2009-04-08 |
EP2044623A4 true EP2044623A4 (en) | 2012-10-03 |
Family
ID=38957500
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP07840397A Withdrawn EP2044623A4 (en) | 2006-07-19 | 2007-07-12 | Method and system for isolated and discretized process sequence integration |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP2044623A4 (en) |
JP (1) | JP5389645B2 (en) |
KR (1) | KR101412398B1 (en) |
CN (1) | CN101490834A (en) |
WO (1) | WO2008011329A2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102075528B1 (en) * | 2013-05-16 | 2020-03-03 | 삼성디스플레이 주식회사 | Deposition apparatus, method for manufacturing organic light emitting display apparatus, and organic light emitting display apparatus |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0150129A2 (en) * | 1984-01-24 | 1985-07-31 | Hewlett-Packard Company | Method and apparatus for lithographic rotate and repeat processing |
US20020013022A1 (en) * | 2000-05-12 | 2002-01-31 | Shunpei Yamazaki | Method of manufacturing a semiconductor device |
US20020030443A1 (en) * | 2000-09-08 | 2002-03-14 | Toshimitsu Konuma | Light emitting device, method of manufacturing the same, and thin film forming apparatus |
US20050239294A1 (en) * | 2002-04-15 | 2005-10-27 | Rosenblum Martin P | Apparatus for depositing a multilayer coating on discrete sheets |
US20060012771A1 (en) * | 2004-07-19 | 2006-01-19 | Samsung Electronics Co., Ltd. | System and method for manufacturing a flat panel display |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6830663B2 (en) * | 1999-01-26 | 2004-12-14 | Symyx Technologies, Inc. | Method for creating radial profiles on a substrate |
US6675469B1 (en) * | 1999-08-11 | 2004-01-13 | Tessera, Inc. | Vapor phase connection techniques |
JP2004349508A (en) * | 2003-05-22 | 2004-12-09 | Applied Materials Inc | Substrate processing method, mask member set, substrate processing apparatus, element or semiconductor device manufacturing method, and element or semiconductor device manufacturing condition determining method |
JP2005294584A (en) * | 2004-03-31 | 2005-10-20 | Eudyna Devices Inc | Semiconductor device, method for manufacturing the same and mask for impurity introduction |
US7491431B2 (en) * | 2004-12-20 | 2009-02-17 | Nanogram Corporation | Dense coating formation by reactive deposition |
US20060130767A1 (en) * | 2004-12-22 | 2006-06-22 | Applied Materials, Inc. | Purged vacuum chuck with proximity pins |
-
2007
- 2007-07-12 EP EP07840397A patent/EP2044623A4/en not_active Withdrawn
- 2007-07-12 JP JP2009520905A patent/JP5389645B2/en not_active Expired - Fee Related
- 2007-07-12 CN CNA2007800265640A patent/CN101490834A/en active Pending
- 2007-07-12 KR KR1020097001016A patent/KR101412398B1/en active IP Right Grant
- 2007-07-12 WO PCT/US2007/073368 patent/WO2008011329A2/en active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0150129A2 (en) * | 1984-01-24 | 1985-07-31 | Hewlett-Packard Company | Method and apparatus for lithographic rotate and repeat processing |
US20020013022A1 (en) * | 2000-05-12 | 2002-01-31 | Shunpei Yamazaki | Method of manufacturing a semiconductor device |
US20020030443A1 (en) * | 2000-09-08 | 2002-03-14 | Toshimitsu Konuma | Light emitting device, method of manufacturing the same, and thin film forming apparatus |
US20050239294A1 (en) * | 2002-04-15 | 2005-10-27 | Rosenblum Martin P | Apparatus for depositing a multilayer coating on discrete sheets |
US20060012771A1 (en) * | 2004-07-19 | 2006-01-19 | Samsung Electronics Co., Ltd. | System and method for manufacturing a flat panel display |
Also Published As
Publication number | Publication date |
---|---|
EP2044623A2 (en) | 2009-04-08 |
WO2008011329A3 (en) | 2008-03-20 |
KR20090060261A (en) | 2009-06-11 |
WO2008011329A2 (en) | 2008-01-24 |
JP5389645B2 (en) | 2014-01-15 |
KR101412398B1 (en) | 2014-06-25 |
JP2009544173A (en) | 2009-12-10 |
CN101490834A (en) | 2009-07-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20090120 |
|
AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR |
|
AX | Request for extension of the european patent |
Extension state: AL BA HR MK RS |
|
DAX | Request for extension of the european patent (deleted) | ||
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: INTERMOLECULAR, INC. |
|
A4 | Supplementary search report drawn up and despatched |
Effective date: 20120905 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: H01L 51/52 20060101ALI20120830BHEP Ipc: C23C 14/56 20060101ALI20120830BHEP Ipc: B05D 3/06 20060101ALI20120830BHEP Ipc: H01L 21/67 20060101ALI20120830BHEP Ipc: H01L 27/32 20060101ALI20120830BHEP Ipc: H01L 21/20 20060101ALI20120830BHEP Ipc: C23C 16/00 20060101ALI20120830BHEP Ipc: H01L 21/677 20060101AFI20120830BHEP Ipc: H01L 29/49 20060101ALI20120830BHEP Ipc: H01L 27/12 20060101ALI20120830BHEP Ipc: H01L 51/56 20060101ALI20120830BHEP |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20170201 |