EP2150987A2 - Use of polyamide as an encapsulating material for photovoltaic modules - Google Patents

Use of polyamide as an encapsulating material for photovoltaic modules

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Publication number
EP2150987A2
EP2150987A2 EP08733261A EP08733261A EP2150987A2 EP 2150987 A2 EP2150987 A2 EP 2150987A2 EP 08733261 A EP08733261 A EP 08733261A EP 08733261 A EP08733261 A EP 08733261A EP 2150987 A2 EP2150987 A2 EP 2150987A2
Authority
EP
European Patent Office
Prior art keywords
polyamide
use according
film
adhesive
encapsulating material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08733261A
Other languages
German (de)
French (fr)
Inventor
Harald Muckenhuber
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Isovoltaic AG
Original Assignee
Isovolta AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Isovolta AG filed Critical Isovolta AG
Publication of EP2150987A2 publication Critical patent/EP2150987A2/en
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H01L31/049—Protective back sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2377/00—Polyamides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B10/00—Integration of renewable energy sources in buildings
    • Y02B10/10—Photovoltaic [PV]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y10T428/31562—Next to polyamide [nylon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y10T428/31565—Next to polyester [polyethylene terephthalate, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31725—Of polyamide
    • Y10T428/31736—Next to polyester
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31725—Of polyamide
    • Y10T428/3175—Next to addition polymer from unsaturated monomer[s]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31786—Of polyester [e.g., alkyd, etc.]

Definitions

  • the invention relates to the use of polyamide as encapsulating material for photovoltaic modules.
  • Photovoltaic modules are used to generate electricity.
  • Part of the structure of photovoltaic modules are solar cells, which generate by irradiation with sunlight electric charges that can be derived as electricity.
  • these solar cells are to varying degrees sensitive to mechanical influences or weather influences.
  • encapsulating materials are used. These may consist of one or more layers of glass and / or plastic composites.
  • composites of fluoropolymer materials and polyester (PET) are currently used for these encapsulants.
  • a fluoropolymer layer on the outside guarantees the weather stability
  • the PET film in the core guarantees the mechanical stability and the electrical insulation and another fluoropolymer layer on the inside the connection to the embedding material of the solar cells.
  • EVA Ethyl vinyl acetate
  • the invention aims to remedy this situation.
  • the use of polyamide as an encapsulating material for the production of photovoltaic modules is proposed.
  • polyamide as a film or as a film composite comprising polyamide (PA) is advantageously carried out. Furthermore, the advantageous use of a plastic composite which comprises a support material selected from the group consisting of polyethylene terephthalate (PET), polyethylene naphthenate (PEN) or ethylene tetrafluoroethylene copolymer (ETFE) and polyamide 12 layers adjoining the support material on both sides.
  • PET polyethylene terephthalate
  • PEN polyethylene naphthenate
  • ETFE ethylene tetrafluoroethylene copolymer
  • polyamide 12 layers adjoining the support material on both sides.
  • the use of polyamide allows a very good adhesion to the embedding material, which, as described above, for example, can be EVA.
  • electrical insulation can be significantly improved by using a single polyamide film at the same thickness as compared to a fluoropolymer layer and PET composite. The flow of punctiform high currents over defects or inclusions in the adhesive layers is not possible.
  • Polyamide films can also be weather- and UV-stabilized, so that comparable values are achieved with respect to these properties as with the use of fluoropolymers. By means of pigmentation also different color combinations can be adjusted. Furthermore, two production steps, namely the production of the composite PET / fluoropolymer layer, as well as the composite fluoropolymer layer / PET / fluoropolymer layer can be saved.
  • Figure 1 shows the exemplary structure of a photovoltaic module, which is encapsulated with the material 1 used in the invention.
  • the encapsulating material 1 is a weather-resistant film, which at the same time serves as a bonding agent for embedding material 2.
  • the embedding material 2 establishes the frictional connection to the solar cells 3 and the embedding material 2 '.
  • the embedding material 2 ' further ensures the frictional connection to the encapsulation material 4.
  • Figure 2 shows the exemplary structure of a photovoltaic module, which is encapsulated with the material 1 used in the invention.
  • the encapsulation material 1 is used on both sides of the solar cells 3 in this exemplary structure.
  • Figure 3 shows the exemplary structure of a photovoltaic module, which is encapsulated with the material 1 used in the invention.
  • a fluoropolymer layer 5 is used as an additional layer to the encapsulating material 1 on the side facing away from the solar cell 3.
  • the fluoropolymer layer 5 and the encapsulation material 4 thus represent the outermost layer of the photovoltaic module in this exemplary embodiment.
  • Figure 4 shows the inventive use of a KunststoffVerbundes 1, l ⁇ with the polyamide 12 layers 12, which are arranged on both sides of the substrate 13.
  • the substrate 13 is made of polyethylene terephthalate or polyethylene naphthenate or ethylene tetrafluoroethylene copolymer.
  • FIG. 5 shows a possible laminating device for producing a frictional bond 6 from the materials 1 and 5 according to FIG. 3.
  • the encapsulating material 1 which is selected according to the exemplary embodiment is coated with adhesive by means of the applicator 7 and, after passing through a dryer 10, glued to the fluoropolymer layer 5. The contact between the two films is controlled by the pressing pressure between the rollers 11.
  • the material 1 can be pre-treated by means of physical media 9 before each production step.
  • the frictional connection between the encapsulating material 1 and the fluoropolymer layer 5 can also be produced by coextrusion. It is also possible to use an adhesive layer between the materials 1 and 5 and thus a three-layer coextrudate manufacture.
  • the encapsulation material 1 itself can be a monolayer or likewise a coextrudate of several layers.
  • the material 1 Before the use of the encapsulation material 1 according to the invention or even before the bonding with the fluoropolymer layer 5, the material 1 can be pretreated by means of chemical or physical media. This pretreatment can be carried out on one or on both sides of the encapsulating material 1.
  • the following exemplary embodiment shows possible variants for the selection of the components in the respective layers:
  • Encapsulating material 1 as a film polyamides (PA) of the type polyamide 6, polyamide 66, polyamide 7, polyamide 9, polyamide 10, polyamide 11, polyamide 12, polyamide 69, polyamide 6 10, polyamide 6 12, PA-6-3-T , PA 61, polyphthalamide (PPA) and other possible aromatic, partially aromatic and co-polyamides of these types.
  • PA polyamides
  • PA polyphthalamide
  • Embedding material 2, 2 ' ethyl vinyl acetate (EVA), polyvinyl butyral (PVB), ionomers, polymethyl methacrylate (PMMA), polyurethane, polyester, hotmelt or silicone elastomers.
  • Encapsulating material 4 glass
  • Fluoropolymer layer 5 as a film polyvinyl fluoride (PVF), polyvinylidene fluoride (PVDF), ethylene chlorotrifluoroethylene (ECTFE), polychlorotrifluoroethylene (PCTFE), ethylene tetrafluoroethylene (ETFE), polytetrafluoroethylene (PTFE), tetrafluoroethylene-hexafluoropropylene-vinylidene fluoride (THV), tetrafluoroethylene-perfluoroalkoxy Vinyl ether copolymer (PFA), perfluoroethylene-propylene (FEP).
  • PVDF polyvinyl fluoride
  • ECTFE ethylene chlorotrifluoroethylene
  • PCTFE polychlorotrifluoroethylene
  • ETFE ethylene tetrafluoroethylene
  • PTFE polytetrafluoroethylene
  • TSV tetrafluoroethylene-hexafluoropropylene-vinyliden
  • Fluoropolymer layer 5 as a coating fluoropolymer from the group of selectively soluble fluoropolymers.
  • the built-up of the aforementioned components photovoltaic modules are extremely stable when used outdoors, which is due among other things to the good adhesion of polyamide to the embedding material.

Abstract

The invention relates to the use of polyamide as an encapsulating material for producing photovoltaic modules.

Description

Verwendung von Polyamid als Einkapselungsmaterial für photovoltaische Module Use of polyamide as encapsulating material for photovoltaic modules
Die Erfindung betrifft die Verwendung von Polyamid als Einkapselungsmaterial für photovoltaische Module.The invention relates to the use of polyamide as encapsulating material for photovoltaic modules.
Photovoltaische Module dienen zur Erzeugung von elektrischem Strom. Teil des Aufbaus von photovoltaischen Modulen sind dabei Solarzellen, welche durch Bestrahlung mit Sonnenlicht elektrische Ladungen erzeugen, die als Strom abgeleitet werden können. Je nach Type sind diese Solarzellen in unterschiedlichem Ausmaß empfindlich gegenüber mechanischen Einflüssen bzw. Witterungseinflüssen. Um sie vor diesen Einflüssen zu schützen, werden Einkapselungsmaterialien verwendet. Diese können aus einer oder mehreren Schicht (en), aus Glas und/ oder Kunststoffverbunden bestehen.Photovoltaic modules are used to generate electricity. Part of the structure of photovoltaic modules are solar cells, which generate by irradiation with sunlight electric charges that can be derived as electricity. Depending on the type, these solar cells are to varying degrees sensitive to mechanical influences or weather influences. To protect them from these influences, encapsulating materials are used. These may consist of one or more layers of glass and / or plastic composites.
Standardmäßig werden für diese Einkapselungsmaterialien derzeit Verbünde aus Fluorpolymermaterialien und Polyester (PET) verwendet. Eine Fluorpolymerschicht auf der Außenseite garantiert die Witterungsstabilität, die PET-Folie im Kern die mechanische Stabilität und die elektrische Isolierung und eine weitere Fluorpolymerschicht auf der Innenseite die Anbindung an das Einbettungsmaterial der Solarzellen.By default, composites of fluoropolymer materials and polyester (PET) are currently used for these encapsulants. A fluoropolymer layer on the outside guarantees the weather stability, the PET film in the core guarantees the mechanical stability and the electrical insulation and another fluoropolymer layer on the inside the connection to the embedding material of the solar cells.
Bei diesen Materialien zeigt sich, daß die Haftung zum Einbettungsmaterial, z.B. Ethylvinylacetat (EVA) gering ist. Weiters sind relativ dicke Verbünde erforderlich, um die gewünschte elektrische Isolierung zu gewährleisten. Das liegt einerseits an der geringen Isolationsfähigkeit von Fluorpolymerschichten, andererseits an den Klebeschichten, die standardmäßig zwischen den Folien eingesetzt werden. Kleinste Unregelmäßigkeiten bzw. Einschlüsse in den Klebeschichten führen dazu, daß punktförmig hohe Ströme fließen. Diesem Phänomen muß durch eine vorsorglich größere Dicke der PET-Folie im Kern entgegengewirkt werden.These materials show that adhesion to the potting material, e.g. Ethyl vinyl acetate (EVA) is low. Furthermore, relatively thick composites are required to ensure the desired electrical insulation. This is due on the one hand to the low insulating ability of fluoropolymer layers, on the other hand to the adhesive layers, which are used as standard between the films. The smallest irregularities or inclusions in the adhesive layers cause punctiform high currents to flow. This phenomenon must be counteracted by a precautionary greater thickness of the PET film in the core.
Hier will die Erfindung Abhilfe schaffen. Erfindungsgemäß wird die Verwendung von Polyamid als Einkapselungsmaterial zur Herstellung photovoltaischer Module vorgeschlagen .The invention aims to remedy this situation. According to the invention, the use of polyamide as an encapsulating material for the production of photovoltaic modules is proposed.
Vorteilhafterweise erfolgt wird die Verwendung von Polyamid als Folie oder als Folienverbund enthaltend Polyamid (PA) . Weiters wird die vorteilhafte Vewendung eines Kunststoffverbundes vorgeschlagen, welcher ein Trägermaterial, ausgewählt aus der Gruppe Polyethylenterephthalat (PET), Polyethylennaphthenat (PEN) oder Ethylentetrafluor-ethylencopolymer (ETFE) , sowie beidseitig an das Trägermaterial angrenzende Polyamid 12-Schichten umfasst. Die Verwendung von Polyamid ermöglicht eine sehr gute Haftung zum Einbettungsmaterial, welches, wie oben beschrieben, z.B. EVA sein kann. Im Besonderen kann die elektrische Isolierung durch Verwendung einer Polyamid-Einzelfolie bei gleicher Dicke im Vergleich zu einem Verbund mit Fluorpolymerschichten und PET signifikant verbessert werden. Das Fließen von punktförmig hohen Strömen über Defekte bzw. Einschlüsse in den Klebeschichten ist nicht möglich.The use of polyamide as a film or as a film composite comprising polyamide (PA) is advantageously carried out. Furthermore, the advantageous use of a plastic composite which comprises a support material selected from the group consisting of polyethylene terephthalate (PET), polyethylene naphthenate (PEN) or ethylene tetrafluoroethylene copolymer (ETFE) and polyamide 12 layers adjoining the support material on both sides. The use of polyamide allows a very good adhesion to the embedding material, which, as described above, for example, can be EVA. In particular, electrical insulation can be significantly improved by using a single polyamide film at the same thickness as compared to a fluoropolymer layer and PET composite. The flow of punctiform high currents over defects or inclusions in the adhesive layers is not possible.
Polyamid-Folien können dabei ebenfalls witterungs- und UV- stabilisiert ausgeführt sein, sodass auch hinsichtlich dieser Eigenschaften vergleichbare Werte wie bei der Verwendung von Fluorpolymeren erzielt werden. Mittels Pigmentierung können auch verschiedenen Farbkombinationen eingestellt werden. Desweiteren können zwei Produktionsschritte, nämlich die Herstellung des Verbundes PET/Fluorpolymerschicht, sowie des Verbundes Fluorpolymerschicht/ PET/ Fluorpolymerschicht, eingespart werden.Polyamide films can also be weather- and UV-stabilized, so that comparable values are achieved with respect to these properties as with the use of fluoropolymers. By means of pigmentation also different color combinations can be adjusted. Furthermore, two production steps, namely the production of the composite PET / fluoropolymer layer, as well as the composite fluoropolymer layer / PET / fluoropolymer layer can be saved.
Für photovoltaische Module, im Besonderen im Bereich der Aufdach-Montage sowie der Gebäudeintegration, können spezielle Normen bezüglich Flammbeständigkeit Anwendung finden. Detaillierte Ausführungen dazu finden sich in den Normen der Underwriter Laboratories UL94 und UL790. Um die erfindungsgemäßen Vorteile von Polyamid unter diesen Voraussetzungen ebenfalls nutzen zu können, ist die Herstellung eines Verbundes mit einer Fluorpolymerschicht als flammbeständige Schicht auf der Außenseite erforderlich. Spezialanwendungen können auch die zusätzliche Verwendung einer weiteren Folie, z.B. aus Polyethylenterephtalat, zwischen der Fluorpolymerschicht und der PA-Folie erfordern.For photovoltaic modules, in particular in the field of on-roof installation and building integration, special standards regarding flame resistance can be applied. Detailed explanations can be found in the Underwriter Laboratories UL94 and UL790 standards. In order to be able to use the advantages of polyamide according to the invention under these conditions as well, it is necessary to produce a composite with a fluoropolymer layer as a flame-resistant layer on the outside. Special applications may also include the additional use of another film, e.g. polyethylene terephthalate, between the fluoropolymer layer and the PA film.
Weitere Ausführungsformen der erfindungsgemäßen Verwendung sind in den Patentansprüchen offenbart.Further embodiments of the use according to the invention are disclosed in the patent claims.
Im Folgenden wird die Erfindung anhand möglicher Ausführungsformen - siehe Figuren 1 bis 5 - sowie eines möglichen Ausführungsbeispiels näher erläutert.In the following the invention with reference to possible embodiments - see Figures 1 to 5 - and a possible embodiment explained in more detail.
Figur 1 zeigt den beispielhaften Aufbau eines photovoltaischen Moduls, das mit dem erfindungsgemäß verwendeten Material 1 eingekapselt ist. Beim Einkapselungsmaterial 1 handelt es sich um eine witterungsbeständige Folie, die gleichzeitig auch als Haftvermittler zum Einbettungsmaterial 2 dient. Das Einbettungsmaterial 2 stellt die kraftschlüssige Verbindung zu den Solarzellen 3 und zum Einbettungsmaterial 2' her. Das Einbettungsmaterial 2' gewährleistet weiters die kraftschlüssige Verbindung zum Einkapselungsmaterial 4.Figure 1 shows the exemplary structure of a photovoltaic module, which is encapsulated with the material 1 used in the invention. The encapsulating material 1 is a weather-resistant film, which at the same time serves as a bonding agent for embedding material 2. The embedding material 2 establishes the frictional connection to the solar cells 3 and the embedding material 2 '. The embedding material 2 'further ensures the frictional connection to the encapsulation material 4.
Figur 2 zeigt den beispielhaften Aufbau eines photovoltaischen Moduls, das mit dem erfindungsgemäß verwendeten Material 1 eingekapselt ist. Im Unterschied zu Figur 1 wird das Einkapselungsmaterial 1 bei diesem beispielhaften Aufbau beiderseits der Solarzellen 3 verwendet.Figure 2 shows the exemplary structure of a photovoltaic module, which is encapsulated with the material 1 used in the invention. In contrast to FIG. 1, the encapsulation material 1 is used on both sides of the solar cells 3 in this exemplary structure.
Figur 3 zeigt den beispielhaften Aufbau eines photovoltaischen Moduls, das mit dem erfindungsgemäß verwendeten Material 1 eingekapselt ist. Um zusätzlich höhere Anforderungen an die Flammbeständigkeit, wie sie z.B. in den entsprechenden Normen UL94 und UL790 vorgegeben sind, zu erfüllen, wird auf der den Solarzellen 3 abgewandten Seite eine Fluorpolymerschicht 5 als zusätzliche Schicht zum Einkapselungs-material 1 verwendet. Die Fluorpolymerschicht 5 und das Einkapselungsmaterial 4 stellen somit in dieser beispielhaften Ausführung die jeweils äußerste Schicht des photovoltaischen Moduls dar.Figure 3 shows the exemplary structure of a photovoltaic module, which is encapsulated with the material 1 used in the invention. In addition, higher flame retardance requirements, such as e.g. are specified in the respective standards UL94 and UL790, a fluoropolymer layer 5 is used as an additional layer to the encapsulating material 1 on the side facing away from the solar cell 3. The fluoropolymer layer 5 and the encapsulation material 4 thus represent the outermost layer of the photovoltaic module in this exemplary embodiment.
Figur 4 zeigt die erfindungsgemäße Verwendung eines KunststoffVerbundes 1, lλ mit den Polyamid 12-Schichten 12, welche beidseitig an das Trägermaterial 13 angeordnet sind. Das Trägermaterial 13 besteht aus Polyethylenterephthalat oder Polyethylennaphthenat oder Ethylentetrafluorethylencopolymer.Figure 4 shows the inventive use of a KunststoffVerbundes 1, l λ with the polyamide 12 layers 12, which are arranged on both sides of the substrate 13. The substrate 13 is made of polyethylene terephthalate or polyethylene naphthenate or ethylene tetrafluoroethylene copolymer.
Figur 5 zeigt eine mögliche Laminiereinrichtung zur Herstellung eines kraftschlüssigen Verbundes 6 aus den Materialien 1 und 5 gemäß Figur 3. Das Einkapselungsmaterial 1, welches gemäß dem Ausführungsbeispiel ausgewählt wird, wird mittels des Auftragswerks 7 mit Klebstoff beschichtet und, nach dem Durchlaufen eines Trockners 10, mit der Fluorpolymerschicht 5 verklebt. Der Kontakt zwischen den beiden Folien wird durch den Pressdruck zwischen den Walzen 11 gesteuert. Das Material 1 kann dabei vor jedem Produktionsschritt auch mittels physikalischer Medien 9 vorbehandelt werden.FIG. 5 shows a possible laminating device for producing a frictional bond 6 from the materials 1 and 5 according to FIG. 3. The encapsulating material 1 which is selected according to the exemplary embodiment is coated with adhesive by means of the applicator 7 and, after passing through a dryer 10, glued to the fluoropolymer layer 5. The contact between the two films is controlled by the pressing pressure between the rollers 11. The material 1 can be pre-treated by means of physical media 9 before each production step.
Die kraftschlüssige Verbindung zwischen dem Einkapselungsmaterial 1 und der Fluorpolymerschicht 5 kann auch durch Coextrusion hergestellt werden. Dabei besteht auch die Möglichkeit eine Haftvermittlungsschicht zwischen den Materialien 1 und 5 einzusetzen und somit ein dreischichtiges Coextrudat herzustellen. Beim Einkapselungsmaterial 1 selbst kann es sich um einen Monolayer bzw. ebenfalls um ein Coextrudat aus mehreren Schichten handeln.The frictional connection between the encapsulating material 1 and the fluoropolymer layer 5 can also be produced by coextrusion. It is also possible to use an adhesive layer between the materials 1 and 5 and thus a three-layer coextrudate manufacture. The encapsulation material 1 itself can be a monolayer or likewise a coextrudate of several layers.
Vor der Verwendung des erfindungsgemäßen Einkapselungsmaterials 1 bzw. auch vor der Verklebung mit der Fluorpolymerschicht 5 kann das Material 1 mittels chemischer oder physikalischer Medien vorbehandelt werden. Diese Vorbehandlung kann auf einer bzw. auch auf beiden Seiten des Einkapselungsmaterial 1 durchgeführt werden. Das folgende Ausführungsbeispiel gibt mögliche Varianten für die Auswahl der Komponenten in den jeweiligen Schichten wieder:Before the use of the encapsulation material 1 according to the invention or even before the bonding with the fluoropolymer layer 5, the material 1 can be pretreated by means of chemical or physical media. This pretreatment can be carried out on one or on both sides of the encapsulating material 1. The following exemplary embodiment shows possible variants for the selection of the components in the respective layers:
Einkapselungsmaterial 1 als Folie: Polyamide (PA) vom Typ Polyamid 6, Polyamid 66, Polyamid 7, Polyamid 9, Polyamid 10, Polyamid 11, Polyamid 12, Polyamid 69, Polyamid 6 10, Polyamid 6 12, PA-6-3-T, PA 61, Polyphtalamid (PPA) sowie andere mögliche aromatische, teilaromatische und Co-Polyamide aus diesen Typen.Encapsulating material 1 as a film: polyamides (PA) of the type polyamide 6, polyamide 66, polyamide 7, polyamide 9, polyamide 10, polyamide 11, polyamide 12, polyamide 69, polyamide 6 10, polyamide 6 12, PA-6-3-T , PA 61, polyphthalamide (PPA) and other possible aromatic, partially aromatic and co-polyamides of these types.
Einbettungsmaterial 2, 2': Ethylvinylacetat (EVA), Polyvinylbutyral (PVB) , Ionomere, Polymethylmethacrylat (PMMA) , Polyurethan, Polyester, Hotmelt oder Silikonelastomere. Einkapselungsmaterial 4: GlasEmbedding material 2, 2 ': ethyl vinyl acetate (EVA), polyvinyl butyral (PVB), ionomers, polymethyl methacrylate (PMMA), polyurethane, polyester, hotmelt or silicone elastomers. Encapsulating material 4: glass
Fluorpolymerschicht 5 als Folie: Polyvinylfluorid (PVF) , Polyvinylidenfluorid (PVDF) , Ethylenchlortrifluorethylen (ECTFE) , Polychlortrifluorethylen (PCTFE) , Ethylentretra-fluorethylen (ETFE), Polytetrafluorethylen (PTFE), Tetrafluorethylen- Hexafluorpropylen-Vinylidenfluorid (THV) , Tetrafluorethylen- Perfluoralkoxy-Vinylether-Copolymerisat (PFA), Perfluor-Ethylen- Propylen (FEP) .Fluoropolymer layer 5 as a film: polyvinyl fluoride (PVF), polyvinylidene fluoride (PVDF), ethylene chlorotrifluoroethylene (ECTFE), polychlorotrifluoroethylene (PCTFE), ethylene tetrafluoroethylene (ETFE), polytetrafluoroethylene (PTFE), tetrafluoroethylene-hexafluoropropylene-vinylidene fluoride (THV), tetrafluoroethylene-perfluoroalkoxy Vinyl ether copolymer (PFA), perfluoroethylene-propylene (FEP).
Fluorpolymerschicht 5 als Beschichtung: Fluorpolymer aus der Gruppe selektiv löslicher Fluorpolymere. Die aus den vorgenannten Komponenten aufgebauten photovoltaischen Module sind bei deren Anwendung im Außenbereich äußerst stabil, was unter anderem auf die gute Haftung von Polyamid zum Einbettungsmaterial zurückzuführen ist. Fluoropolymer layer 5 as a coating: fluoropolymer from the group of selectively soluble fluoropolymers. The built-up of the aforementioned components photovoltaic modules are extremely stable when used outdoors, which is due among other things to the good adhesion of polyamide to the embedding material.

Claims

Ansprüche claims
1. Verwendung von Polyamid als Einkapselungsmaterial zur1. Use of polyamide as encapsulating material for
Herstellung photovoltaischer Module. 2. Verwendung nach Anspruch 1, dadurch gekennzeichnet, dass dasProduction of photovoltaic modules. 2. Use according to claim 1, characterized in that the
Polyamid aus der Gruppe Polyamid 6, Polyamid 66, Polyamid 7,Polyamide from the group polyamide 6, polyamide 66, polyamide 7,
Polyamid 9, Polyamid 10, Polyamid 11, Polyamid 12, Polyamid 69,Polyamide 9, Polyamide 10, Polyamide 11, Polyamide 12, Polyamide 69,
Polyamid 6 10, Polyamid 6 12, PA-6-3-T, PA 61, PolyphthalamidPolyamide 6 10, polyamide 6 12, PA-6-3-T, PA 61, polyphthalamide
(PPA) ausgewählt wird. 3. Verwendung nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass das Polyamid ein Copolymer aus unterschiedlichen aromatischen oder teilaromatischen Monomeren ist.(PPA) is selected. 3. Use according to claim 1 or 2, characterized in that the polyamide is a copolymer of different aromatic or partially aromatic monomers.
4. Verwendung nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, dass das Polyamid als Monofolie verwendet wird. 5. Verwendung nach einem der Ansprüche 1 bis 3,, dadurch gekennzeichnet, dass das Polyamid in einem Folienverbund enthalten ist.4. Use according to one of claims 1 to 3, characterized in that the polyamide is used as monofilm. 5. Use according to one of claims 1 to 3, characterized in that the polyamide is contained in a film composite.
6. Verwendung nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, dass die Polyamid-Folie oder der Polyamid- Folienverbund eingefärbt ist.6. Use according to one of claims 1 to 5, characterized in that the polyamide film or the polyamide film composite is colored.
7. Verwendung nach einem der Ansprüche 1 bis 6, dadurch gekennzeichnet, dass der Polyamid-Folie oder dem Polyamid- Folienverbund Additive, vorzugsweise UV-Stabili-satoren, Hydrolysestabilisatoren, Antioxidantien, Hitzestabilisatoren oder Flammschutzmittel, zugesetzt werden.7. Use according to one of claims 1 to 6, characterized in that the polyamide film or the polyamide film composite additives, preferably UV stabilizers, hydrolysis stabilizers, antioxidants, heat stabilizers or flame retardants are added.
8. Verwendung nach einem der Ansprüche 1 bis 7, dadurch gekennzeichnet, dass die Polyamid-Folie oder der Polyamid- Folienverbund Füllstoffe enthält.8. Use according to one of claims 1 to 7, characterized in that the polyamide film or the polyamide film composite contains fillers.
9. Verwendung nach einem der Ansprüche 1 bis 8, dadurch gekennzeichnet, dass die Polyamid-Folie mittels physikalischer9. Use according to one of claims 1 to 8, characterized in that the polyamide film by means of physical
Medien vorbehandelt wird.Media is pretreated.
10. Verwendung nach einem der Ansprüche 1 bis 9, dadurch gekennzeichnet, dass der Folienverbund eine Polyamidfolie und eine Fluorpolymerfolie' enthält. 11. Verwendung eines Folienverbundes nach Anspruch 10, dadurch gekennzeichnet, dass die Fluorpolymere aus der Gruppe Polyvinylfluorid (PVF), Polyvinylidenfluorid (PVDF), Ethylenchlortrifluorethylen (ECTFE) , Polychlortrifluorethylen (PCTFE) , Ethylentretra-fluorethylen (ETFE) , Polytetrafluorethylen (PTFE), Tetrafluorethylen-Hexafluorpropylen-Vinylidenfluorid (THV), Tetrafluorethylen-Perfluoralkoxy-Vinylether-Copolymerisat (PFA) bzw. Perfluor-Ethylen-Propylen (FEP) ausgewählt sind. 12. Verwendung nach einem der Ansprüche 10 oder 11, dadurch gekennzeichnet, dass die Fluorpolymerfolie eingefärbt ist. 13. Verwendung nach einem der Ansprüche 10 bis 12, dadurch gekennzeichnet, dass die kraftschlüssige Verbindung zwischen den Folien durch eine Klebeschicht hergestellt wird.10. Use according to one of claims 1 to 9, characterized in that the film composite contains a polyamide film and a fluoropolymer film '. 11. Use of a film composite according to claim 10, characterized in that the fluoropolymers from the group polyvinyl fluoride (PVF), polyvinylidene fluoride (PVDF), ethylene chlorotrifluoroethylene (ECTFE), polychlorotrifluoroethylene (PCTFE), ethylene tetrafluoroethylene (ETFE), polytetrafluoroethylene (PTFE), Tetrafluoroethylene-hexafluoropropylene-vinylidene fluoride (THV), Tetrafluoroethylene-perfluoroalkoxy-vinyl ether copolymer (PFA) or perfluoro-ethylene-propylene (FEP) are selected. 12. Use according to one of claims 10 or 11, characterized in that the fluoropolymer film is colored. 13. Use according to one of claims 10 to 12, characterized in that the frictional connection between the films is produced by an adhesive layer.
14. Verwendung nach Anspruch 13, dadurch gekennzeichnet, dass es sich bei der Klebeschicht um einen Polyurethan- oder Polyesterkleber handelt.14. Use according to claim 13, characterized in that the adhesive layer is a polyurethane or polyester adhesive.
15. Verwendung einem der Ansprüche 10 bis 12, dadurch gekennzeichnet, daß die kraftschlüssige Verbindung zwischen den Folien mittels Coextrusion hergestellt wird.15. Use according to one of claims 10 to 12, characterized in that the frictional connection between the films is produced by means of coextrusion.
16. Verwendung nach Anspruch 15, dadurch gekennzeichnet, dass bei der Coextrusion zwischen den Folien zusätzlich zumindest ein16. Use according to claim 15, characterized in that in the coextrusion between the films additionally at least one
Haftvermittler extrudiert wird.Adhesive is extruded.
17. Verwendung nach einem der Ansprüche 1 bis 16, dadurch gekennzeichnet, dass die Polyamid-Folie zusätzlich eine Fluorpolymerschicht aufweist. 18. Verwendung nach Anspruch 17, dadurch gekennzeichnet, dass die Fluorpolyrαerschicht selektiv lösliche Fluorpolymere enthält. IS. Verwendung nach Anspruch 17 oder 18, dadurch gekennzeichnet, dass die Fluorpolymerschicht eingefärbt ist.17. Use according to one of claims 1 to 16, characterized in that the polyamide film additionally comprises a fluoropolymer layer. 18. Use according to claim 17, characterized in that the Fluoropolyrαerschicht contains selectively soluble fluoropolymers. IS. Use according to claim 17 or 18, characterized in that the fluoropolymer layer is colored.
20. Verwendung nach einem der Ansprüche 17 bis 19, dadurch gekennzeichnet, dass sich zwischen der Polyamidfolie und der20. Use according to any one of claims 17 to 19, characterized in that between the polyamide film and the
Fluorpolymerschicht eine Haftvermittlungsschicht befindet.Fluoropolymer layer is located an adhesive layer.
21. Verwendung nach Anspruch 20, dadurch gekennzeichnet, dass der Haftvermittler Polyurethan und/ oder Polyester und/ oder Polyacrylat ist. 22. Verwendung nach einem der Ansprüche 17 bis 19, dadurch gekennzeichnet, dass zwischen der Polyamidfolie und der Fluorpolymerschicht zusätzlich eine Folie aus Polyethylenterephtalat (PET) oder Polybutylenterephtalat (PBT) vorliegt. 23. Verwendung nach Anspruch 22, dadurch gekennzeichnet, dass die kraftschlüssige Verbindung durch Klebeschichten hergestellt wird.21. Use according to claim 20, characterized in that the adhesion promoter is polyurethane and / or polyester and / or polyacrylate. 22. Use according to one of claims 17 to 19, characterized in that between the polyamide film and the fluoropolymer layer additionally a film of polyethylene terephthalate (PET) or polybutylene terephthalate (PBT) is present. 23. Use according to claim 22, characterized in that the frictional connection is produced by adhesive layers.
24. Verwendung nach Anspruch 23, dadurch gekennzeichnet, dass der Kleber ein Polyurethan- oder Polyesterkleber ist.24. Use according to claim 23, characterized in that the adhesive is a polyurethane or polyester adhesive.
25. Verwendung nach Anspruch 22, dadurch gekennzeichnet, dass die kraftschlüssige Verbindung mittels Coextrusion hergestellt wird. 25. Use according to claim 22, characterized in that the frictional connection is produced by means of coextrusion.
26. Verwendung nach Anspruch 25, dadurch gekennzeichnet, dass bei der Coextrusion zusätzlich zumindest ein Haftvermittler extrudiert wird.26. Use according to claim 25, characterized in that in the coextrusion additionally at least one adhesion promoter is extruded.
27. Verwendung eines Einkapselungsmaterials nach einem der Ansprüche 1 bis 26 in Kombination mit einem Einbettungsmaterial, ausgewählt aus der Gruppe Ethylvinylacetat (EVA) , Polyvinylbutyral (PVB) , Ionomere, Polymethylmethacrylat (PMMA) , Polyurethan, Polyester, Hotmelt oder Silikonelastomere, zur Herstellung von photovoltaischen Modulen. 28. Verwendung nach Anspruch 27, dadurch gekennzeichnet, dass das Einbettungsmaterial mittels Coextrusion auf das Einkapselungsmaterial aufgebracht wird.27. Use of an encapsulating material according to one of claims 1 to 26 in combination with an embedding material selected from the group consisting of ethylvinylacetate (EVA), polyvinyl butyral (PVB), ionomers, polymethyl methacrylate (PMMA), polyurethane, polyester, hotmelt or silicone elastomers, for the production of photovoltaic modules. 28. Use according to claim 27, characterized in that the embedding material is applied by means of coextrusion to the encapsulating material.
29. Verwendung nach Anspruch 28, dadurch gekennzeichnet, dass sich zwischen dem Einkapselungsmaterial und dem Einbettungsmaterial eine Haftvermittlungsschicht befindet.29. Use according to claim 28, characterized in that there is an adhesion-promoting layer between the encapsulating material and the embedding material.
30. Verwendung nach Anspruch 29, dadurch gekennzeichnet, dass der Haftvermittler ein- oder mehrlagig ist und aus Polyurethan und/ oder Polyester und/ oder Polyacrylat besteht.30. Use according to claim 29, characterized in that the bonding agent is one or more layers and consists of polyurethane and / or polyester and / or polyacrylate.
31. Verwendung eines Kunststoffverbundes umfassend ein Trägermaterial ausgewählt aus der Gruppe Polyethylenterephthalat,31. Use of a plastic composite comprising a carrier material selected from the group of polyethylene terephthalate,
Polyethylennaphthenat oder Ethylen-tetrafluorethlencopolymer sowie beidseitig an das Trägermaterial angrenzende Polyamid 12-Schichten als Einkapselungsmaterial zur Herstellung photovoltaischer Module. Polyethylene naphthenate or ethylene-tetrafluoroethylene copolymer as well as on both sides of the substrate adjacent polyamide 12 layers as encapsulating material for the production of photovoltaic modules.
EP08733261A 2007-05-10 2008-05-08 Use of polyamide as an encapsulating material for photovoltaic modules Withdrawn EP2150987A2 (en)

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AT0208707A AT505199A1 (en) 2007-05-10 2007-12-20 USE OF POLYAMIDE AS A PACKAGING MATERIAL FOR PHOTOVOLTAIC MODULES
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