EP2415887A4 - Cu-co-si copper alloy for use in electronics, and manufacturing method therefor - Google Patents

Cu-co-si copper alloy for use in electronics, and manufacturing method therefor

Info

Publication number
EP2415887A4
EP2415887A4 EP10758330.4A EP10758330A EP2415887A4 EP 2415887 A4 EP2415887 A4 EP 2415887A4 EP 10758330 A EP10758330 A EP 10758330A EP 2415887 A4 EP2415887 A4 EP 2415887A4
Authority
EP
European Patent Office
Prior art keywords
electronics
manufacturing
copper alloy
method therefor
therefor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP10758330.4A
Other languages
German (de)
French (fr)
Other versions
EP2415887A1 (en
EP2415887B1 (en
Inventor
Takuma Onda
Hiroshi Kuwagaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Publication of EP2415887A1 publication Critical patent/EP2415887A1/en
Publication of EP2415887A4 publication Critical patent/EP2415887A4/en
Application granted granted Critical
Publication of EP2415887B1 publication Critical patent/EP2415887B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/02—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working in inert or controlled atmosphere or vacuum
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
EP10758330.4A 2009-03-31 2010-02-17 Cu-co-si copper alloy for use in electronics, and manufacturing method therefor Active EP2415887B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009088287A JP4708485B2 (en) 2009-03-31 2009-03-31 Cu-Co-Si based copper alloy for electronic materials and method for producing the same
PCT/JP2010/052375 WO2010113553A1 (en) 2009-03-31 2010-02-17 Cu-co-si copper alloy for use in electronics, and manufacturing method therefor

Publications (3)

Publication Number Publication Date
EP2415887A1 EP2415887A1 (en) 2012-02-08
EP2415887A4 true EP2415887A4 (en) 2013-06-05
EP2415887B1 EP2415887B1 (en) 2016-02-10

Family

ID=42827857

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10758330.4A Active EP2415887B1 (en) 2009-03-31 2010-02-17 Cu-co-si copper alloy for use in electronics, and manufacturing method therefor

Country Status (7)

Country Link
US (1) US20120031533A1 (en)
EP (1) EP2415887B1 (en)
JP (1) JP4708485B2 (en)
KR (1) KR101317096B1 (en)
CN (1) CN102099499B (en)
TW (1) TWI422692B (en)
WO (1) WO2010113553A1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4677505B1 (en) 2010-03-31 2011-04-27 Ｊｘ日鉱日石金属株式会社 Cu-Ni-Si-Co-based copper alloy for electronic materials and method for producing the same
JP4830035B2 (en) 2010-04-14 2011-12-07 Ｊｘ日鉱日石金属株式会社 Cu-Si-Co alloy for electronic materials and method for producing the same
JP5325178B2 (en) * 2010-08-12 2013-10-23 Ｊｘ日鉱日石金属株式会社 Cu-Co-Si based copper alloy excellent in strength, electrical conductivity and bending workability and method for producing the same
JP5508326B2 (en) * 2011-03-24 2014-05-28 Ｊｘ日鉱日石金属株式会社 Co-Si copper alloy sheet
JP5451674B2 (en) 2011-03-28 2014-03-26 Ｊｘ日鉱日石金属株式会社 Cu-Si-Co based copper alloy for electronic materials and method for producing the same
JP4799701B1 (en) 2011-03-29 2011-10-26 Ｊｘ日鉱日石金属株式会社 Cu-Co-Si based copper alloy strip for electronic materials and method for producing the same
CN102644005A (en) * 2011-06-15 2012-08-22 上海飞驰铜铝材有限公司 Copper material for manufacturing motor and manufacturing method thereof
JP5437520B1 (en) * 2013-07-31 2014-03-12 Ｊｘ日鉱日石金属株式会社 Cu-Co-Si-based copper alloy strip and method for producing the same
DE102014105823A1 (en) * 2014-04-25 2015-10-29 Harting Kgaa Post-cleaning process of metallic contact elements
JP6385383B2 (en) * 2016-03-31 2018-09-05 Ｊｘ金属株式会社 Copper alloy sheet and method for producing copper alloy sheet
JP6306632B2 (en) * 2016-03-31 2018-04-04 Ｊｘ金属株式会社 Copper alloy for electronic materials
WO2020112158A1 (en) 2018-11-30 2020-06-04 Amerilab Technologies, Inc. Effervescent tablets that include crystalline sugar binder and methods of making the same
KR102005332B1 (en) 2019-04-09 2019-10-01 주식회사 풍산 Method for manufacturing Cu-Co-Si-Fe-P alloy having Excellent Bending Formability
CN115652132B (en) * 2022-11-14 2023-03-31 宁波兴业盛泰集团有限公司 Copper alloy material and application and preparation method thereof

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0920943A (en) * 1995-06-30 1997-01-21 Furukawa Electric Co Ltd:The Copper alloy for electronic and electrical parts and its production
US20040079456A1 (en) * 2002-07-02 2004-04-29 Onlin Corporation Copper alloy containing cobalt, nickel and silicon
JP2007246931A (en) * 2006-03-13 2007-09-27 Furukawa Electric Co Ltd:The Copper alloy for electrical and electronic equipment parts having excellent electric conductivity
EP1873267A1 (en) * 2005-03-24 2008-01-02 Nippon Mining & Metals Co., Ltd. Copper alloy for electronic material
JP2008088512A (en) * 2006-10-03 2008-04-17 Nikko Kinzoku Kk Method for producing copper alloy for electronic material
JP2008266783A (en) * 2007-03-26 2008-11-06 Furukawa Electric Co Ltd:The Copper alloy for electrical/electronic device and method for manufacturing the same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3510469B2 (en) 1998-01-30 2004-03-29 古河電気工業株式会社 Copper alloy for conductive spring and method for producing the same
JP3520034B2 (en) * 2000-07-25 2004-04-19 古河電気工業株式会社 Copper alloy materials for electronic and electrical equipment parts
WO2006109801A1 (en) * 2005-04-12 2006-10-19 Sumitomo Metal Industries, Ltd. Copper alloy and process for producing the same
JP4937815B2 (en) 2007-03-30 2012-05-23 Ｊｘ日鉱日石金属株式会社 Cu-Ni-Si-Co-based copper alloy for electronic materials and method for producing the same
EP2298945B1 (en) * 2008-06-03 2014-08-20 The Furukawa Electric Co., Ltd. Copper alloy sheet material and manufacturing method thereof
JP5619389B2 (en) * 2008-08-05 2014-11-05 古河電気工業株式会社 Copper alloy material

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0920943A (en) * 1995-06-30 1997-01-21 Furukawa Electric Co Ltd:The Copper alloy for electronic and electrical parts and its production
US20040079456A1 (en) * 2002-07-02 2004-04-29 Onlin Corporation Copper alloy containing cobalt, nickel and silicon
EP1873267A1 (en) * 2005-03-24 2008-01-02 Nippon Mining & Metals Co., Ltd. Copper alloy for electronic material
JP2007246931A (en) * 2006-03-13 2007-09-27 Furukawa Electric Co Ltd:The Copper alloy for electrical and electronic equipment parts having excellent electric conductivity
JP2008088512A (en) * 2006-10-03 2008-04-17 Nikko Kinzoku Kk Method for producing copper alloy for electronic material
JP2008266783A (en) * 2007-03-26 2008-11-06 Furukawa Electric Co Ltd:The Copper alloy for electrical/electronic device and method for manufacturing the same

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
See also references of WO2010113553A1 *
VARSCHAVSKY ARI ET AL: "Influence of microstructure on the subcritical crack growth in Cu-Co-Si alloys", CONGRESSO ANUAL - ASSOCIACAO BRASILEIRA DE METALURGIA E MATERIAIS,, vol. 2, 1 January 1995 (1995-01-01), pages 503 - 510, XP009168540 *

Also Published As

Publication number Publication date
TWI422692B (en) 2014-01-11
CN102099499A (en) 2011-06-15
EP2415887A1 (en) 2012-02-08
TW201035338A (en) 2010-10-01
CN102099499B (en) 2013-12-18
KR101317096B1 (en) 2013-10-11
EP2415887B1 (en) 2016-02-10
KR20110071020A (en) 2011-06-27
US20120031533A1 (en) 2012-02-09
JP2010236071A (en) 2010-10-21
WO2010113553A1 (en) 2010-10-07
JP4708485B2 (en) 2011-06-22

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