EP2484787A4 - Cu-Ni-Si-Co COPPER ALLOY FOR ELECTRONIC MATERIAL AND PROCESS FOR PRODUCING SAME - Google Patents

Cu-Ni-Si-Co COPPER ALLOY FOR ELECTRONIC MATERIAL AND PROCESS FOR PRODUCING SAME

Info

Publication number
EP2484787A4
EP2484787A4 EP09849834.8A EP09849834A EP2484787A4 EP 2484787 A4 EP2484787 A4 EP 2484787A4 EP 09849834 A EP09849834 A EP 09849834A EP 2484787 A4 EP2484787 A4 EP 2484787A4
Authority
EP
European Patent Office
Prior art keywords
copper alloy
electronic material
producing same
producing
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP09849834.8A
Other languages
German (de)
French (fr)
Other versions
EP2484787B1 (en
EP2484787A1 (en
Inventor
Hiroshi Kuwagaki
Naohiko Era
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Publication of EP2484787A1 publication Critical patent/EP2484787A1/en
Publication of EP2484787A4 publication Critical patent/EP2484787A4/en
Application granted granted Critical
Publication of EP2484787B1 publication Critical patent/EP2484787B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • C22C9/06Alloys based on copper with nickel or cobalt as the next major constituent
EP09849834.8A 2009-09-28 2009-09-28 Cu-Ni-Si-Co COPPER ALLOY FOR ELECTRONIC MATERIAL AND PROCESS FOR PRODUCING SAME Active EP2484787B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2009/066794 WO2011036804A1 (en) 2009-09-28 2009-09-28 Cu-Ni-Si-Co COPPER ALLOY FOR ELECTRONIC MATERIAL AND PROCESS FOR PRODUCING SAME

Publications (3)

Publication Number Publication Date
EP2484787A1 EP2484787A1 (en) 2012-08-08
EP2484787A4 true EP2484787A4 (en) 2013-06-05
EP2484787B1 EP2484787B1 (en) 2015-01-07

Family

ID=43795574

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09849834.8A Active EP2484787B1 (en) 2009-09-28 2009-09-28 Cu-Ni-Si-Co COPPER ALLOY FOR ELECTRONIC MATERIAL AND PROCESS FOR PRODUCING SAME

Country Status (5)

Country Link
EP (1) EP2484787B1 (en)
JP (1) JP5506806B2 (en)
KR (1) KR20120054099A (en)
CN (1) CN102549180A (en)
WO (1) WO2011036804A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8821477B2 (en) 2007-08-06 2014-09-02 Boston Scientific Scimed, Inc. Alternative micromachined structures
US8795254B2 (en) 2008-12-10 2014-08-05 Boston Scientific Scimed, Inc. Medical devices with a slotted tubular member having improved stress distribution
US8551021B2 (en) 2010-03-31 2013-10-08 Boston Scientific Scimed, Inc. Guidewire with an improved flexural rigidity profile
JP6246454B2 (en) * 2011-11-02 2017-12-13 Jx金属株式会社 Cu-Ni-Si alloy and method for producing the same
JP5770113B2 (en) * 2012-01-13 2015-08-26 Jx日鉱日石金属株式会社 Metal foil composite, molded body and method for producing the same
US9901706B2 (en) 2014-04-11 2018-02-27 Boston Scientific Scimed, Inc. Catheters and catheter shafts
JP6310004B2 (en) * 2016-05-27 2018-04-11 Jx金属株式会社 Cu-Co-Ni-Si alloy for electronic parts
CN106244849A (en) * 2016-10-13 2016-12-21 龙岩学院 A kind of preparation method of intensified by ultrasonic wave high property copper alloy
CN108642419A (en) * 2018-05-31 2018-10-12 太原晋西春雷铜业有限公司 A kind of corson alloy band and preparation method thereof that bending is excellent
JP7451964B2 (en) 2019-01-16 2024-03-19 株式会社プロテリアル Cu alloy plate and its manufacturing method
CN110195166A (en) * 2019-04-17 2019-09-03 宁波兴业盛泰集团有限公司 A kind of warping resistance CuNiCoSi used for lead frame system's alloy and its manufacturing method
CN112410646A (en) * 2020-10-16 2021-02-26 扬州千裕电气有限公司 Electronic composite material
CN113234958A (en) * 2021-04-25 2021-08-10 江苏青益金属科技股份有限公司 Alloy wire suitable for constant-temperature sheath of petroleum delivery pipeline and preparation method thereof

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040079456A1 (en) * 2002-07-02 2004-04-29 Onlin Corporation Copper alloy containing cobalt, nickel and silicon
EP1876250A1 (en) * 2005-03-31 2008-01-09 Nippon Mining & Metals Co., Ltd. Cu-Ni-Si-Co-Cr BASED COPPER ALLOY FOR ELECTRONIC MATERIAL AND METHOD FOR PRODUCTION THEREOF
JP2008106356A (en) * 2006-09-27 2008-05-08 Dowa Metaltech Kk Copper alloy sheet and its manufacturing method
US20080190524A1 (en) * 2007-02-13 2008-08-14 Weilin Gao Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same
JP2008266783A (en) * 2007-03-26 2008-11-06 Furukawa Electric Co Ltd:The Copper alloy for electrical/electronic device and method for manufacturing the same
JP2009007666A (en) * 2007-05-31 2009-01-15 Furukawa Electric Co Ltd:The Copper alloy for electrical and electronic equipment
WO2009082695A1 (en) * 2007-12-21 2009-07-02 Gbc Metals Llc Copper-nickel-silicon alloys

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01122264A (en) 1987-11-05 1989-05-15 Nec Corp Image output device
JP3408021B2 (en) 1995-06-30 2003-05-19 古河電気工業株式会社 Copper alloy for electronic and electric parts and method for producing the same
JP5475230B2 (en) 2005-03-24 2014-04-16 Jx日鉱日石金属株式会社 Copper alloy for electronic materials
JP4596490B2 (en) * 2008-03-31 2010-12-08 Jx日鉱日石金属株式会社 Cu-Ni-Si-Co-based copper alloy for electronic materials and method for producing the same

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040079456A1 (en) * 2002-07-02 2004-04-29 Onlin Corporation Copper alloy containing cobalt, nickel and silicon
EP1876250A1 (en) * 2005-03-31 2008-01-09 Nippon Mining & Metals Co., Ltd. Cu-Ni-Si-Co-Cr BASED COPPER ALLOY FOR ELECTRONIC MATERIAL AND METHOD FOR PRODUCTION THEREOF
JP2008106356A (en) * 2006-09-27 2008-05-08 Dowa Metaltech Kk Copper alloy sheet and its manufacturing method
US20080190524A1 (en) * 2007-02-13 2008-08-14 Weilin Gao Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same
JP2008266783A (en) * 2007-03-26 2008-11-06 Furukawa Electric Co Ltd:The Copper alloy for electrical/electronic device and method for manufacturing the same
JP2009007666A (en) * 2007-05-31 2009-01-15 Furukawa Electric Co Ltd:The Copper alloy for electrical and electronic equipment
WO2009082695A1 (en) * 2007-12-21 2009-07-02 Gbc Metals Llc Copper-nickel-silicon alloys

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
H.-A. KUHN ET AL: "A new high performance copper based alloy for electro-mechanical connectors", MATERIALWISSENSCHAFT UND WERKSTOFFTECHNIK, vol. 38, no. 8, 1 August 2007 (2007-08-01), pages 624 - 634, XP055060686, ISSN: 0933-5137, DOI: 10.1002/mawe.200700152 *
See also references of WO2011036804A1 *

Also Published As

Publication number Publication date
EP2484787B1 (en) 2015-01-07
KR20120054099A (en) 2012-05-29
CN102549180A (en) 2012-07-04
WO2011036804A1 (en) 2011-03-31
EP2484787A1 (en) 2012-08-08
JP5506806B2 (en) 2014-05-28
JPWO2011036804A1 (en) 2013-02-14

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