EP2569646A4 - Resilient probes for electrical testing - Google Patents

Resilient probes for electrical testing

Info

Publication number: EP2569646A4
Authority: EP; European Patent Office
Prior art keywords: electrical testing; resilient probes; probes; resilient; testing
Prior art date: 2005-03-28
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Ceased

Application number

EP06739525.1A

Other languages

German (de)

French (fr)

Other versions

EP2569646A2 (en

Inventor

Daniel J Stillman

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Texas Instruments Inc

Original Assignee

Texas Instruments Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2005-03-28

Filing date

2006-03-23

Publication date

2014-01-22

2005-04-27 Priority claimed from US11/116,884 external-priority patent/US8438645B2/en

2006-03-23 Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc

2013-03-20 Publication of EP2569646A2 publication Critical patent/EP2569646A2/en

2014-01-22 Publication of EP2569646A4 publication Critical patent/EP2569646A4/en

Status Ceased legal-status Critical Current

Links

Classifications

- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06744—Microprobes, i.e. having dimensions as IC details
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
- G01R1/07321—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support the probes being of different lengths
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

EP06739525.1A 2005-03-28 2006-03-23 Resilient probes for electrical testing Ceased EP2569646A4 (en)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
US66567605P	2005-03-28	2005-03-28
US11/116,884 US8438645B2 (en)	2005-04-27	2005-04-27	Secure clock with grace periods
PCT/US2006/010779 WO2006104886A2 (en)	2005-03-28	2006-03-23	Resilient probes for electrical testing

Publications (2)

Publication Number	Publication Date
EP2569646A2 EP2569646A2 (en)	2013-03-20
EP2569646A4 true EP2569646A4 (en)	2014-01-22

Family

ID=37053934

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP06739525.1A Ceased EP2569646A4 (en)	2005-03-28	2006-03-23	Resilient probes for electrical testing

Country Status (2)

Country	Link
EP (1)	EP2569646A4 (en)
WO (1)	WO2006104886A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TWI827809B (en) *	2019-04-04	2024-01-01	丹麥商卡普雷斯股份有限公司	Method for measuring an electric property of a test sample, and multilayer test sample

Citations (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5703494A (en) *	1994-11-09	1997-12-30	Tokyo Electron Limited	Probing test apparatus
US5828226A (en) *	1996-11-06	1998-10-27	Cerprobe Corporation	Probe card assembly for high density integrated circuits
US6204681B1 (en) *	1998-01-14	2001-03-20	Hitachi Electronics Engineering Co., Ltd.	IC device contactor
US6215321B1 (en) *	1997-11-25	2001-04-10	Matsushita Electric Industrial Co., Ltd.	Probe card for wafer-level measurement, multilayer ceramic wiring board, and fabricating methods therefor
US20020043980A1 (en) *	2000-08-24	2002-04-18	Rincon Reynaldo M.	Multiple-chip probe and universal tester contact assemblage
US6483328B1 (en) *	1995-11-09	2002-11-19	Formfactor, Inc.	Probe card for probing wafers with raised contact elements
US20040124519A1 (en) *	2002-10-10	2004-07-01	Yu Zhou	Contact structure and production method thereof and probe contact assembly using same
US6812718B1 (en) *	1999-05-27	2004-11-02	Nanonexus, Inc.	Massively parallel interface for electronic circuits

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5829128A (en) *	1993-11-16	1998-11-03	Formfactor, Inc.	Method of mounting resilient contact structures to semiconductor devices
US5914613A (en) *	1996-08-08	1999-06-22	Cascade Microtech, Inc.	Membrane probing system with local contact scrub

2006
- 2006-03-23 WO PCT/US2006/010779 patent/WO2006104886A2/en active Application Filing
- 2006-03-23 EP EP06739525.1A patent/EP2569646A4/en not_active Ceased

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5703494A (en) *	1994-11-09	1997-12-30	Tokyo Electron Limited	Probing test apparatus
US6483328B1 (en) *	1995-11-09	2002-11-19	Formfactor, Inc.	Probe card for probing wafers with raised contact elements
US5828226A (en) *	1996-11-06	1998-10-27	Cerprobe Corporation	Probe card assembly for high density integrated circuits
US6215321B1 (en) *	1997-11-25	2001-04-10	Matsushita Electric Industrial Co., Ltd.	Probe card for wafer-level measurement, multilayer ceramic wiring board, and fabricating methods therefor
US6204681B1 (en) *	1998-01-14	2001-03-20	Hitachi Electronics Engineering Co., Ltd.	IC device contactor
US6812718B1 (en) *	1999-05-27	2004-11-02	Nanonexus, Inc.	Massively parallel interface for electronic circuits
US20020043980A1 (en) *	2000-08-24	2002-04-18	Rincon Reynaldo M.	Multiple-chip probe and universal tester contact assemblage
US20040124519A1 (en) *	2002-10-10	2004-07-01	Yu Zhou	Contact structure and production method thereof and probe contact assembly using same

Also Published As

Publication number	Publication date
WO2006104886A3 (en)	2007-03-01
WO2006104886A2 (en)	2006-10-05
EP2569646A2 (en)	2013-03-20

Legal Events

Date	Code	Title	Description
2013-02-15	PUAI	Public reference made under article 153(3) epc to a published international application that has entered the european phase	Free format text: ORIGINAL CODE: 0009012
2013-03-20	17P	Request for examination filed	Effective date: 20071213
2013-03-20	AK	Designated contracting states	Kind code of ref document: A2 Designated state(s): DE FR GB
2014-01-22	A4	Supplementary search report drawn up and despatched	Effective date: 20131220
2014-01-22	RIC1	Information provided on ipc code assigned before grant	Ipc: H01L 21/66 20060101ALI20131216BHEP Ipc: G01R 31/26 20060101AFI20131216BHEP Ipc: G01R 1/067 20060101ALI20131216BHEP Ipc: G01R 1/073 20060101ALI20131216BHEP
2017-12-22	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: EXAMINATION IS IN PROGRESS
2018-01-24	17Q	First examination report despatched	Effective date: 20171222
2020-10-06	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: EXAMINATION IS IN PROGRESS
2023-04-14	REG	Reference to a national code	Ref country code: DE Ref legal event code: R003
2023-07-21	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: THE APPLICATION HAS BEEN REFUSED
2023-08-23	18R	Application refused	Effective date: 20230414

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