US20010005311A1 - Heat sink for chip stacking applications - Google Patents
Heat sink for chip stacking applications Download PDFInfo
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- US20010005311A1 US20010005311A1 US09/741,822 US74182200A US2001005311A1 US 20010005311 A1 US20010005311 A1 US 20010005311A1 US 74182200 A US74182200 A US 74182200A US 2001005311 A1 US2001005311 A1 US 2001005311A1
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- heat sink
- integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to the field of integrated circuits. More particularly, the invention provides a heat sink for use with stacks of integrated circuits.
- chip stacks As computer manufacturers have attempted to build more powerful machines, the use of chip stacks in modern computing applications has become increasingly desirable.
- the term ‘chips’ used with the present invention is intended to include any packaged integrated circuit device including processing devices e.g. microprocessors etc., memory devices e.g. DRAMS, SRAMS, etc., and the like.
- a chip stack comprises multiple integrated circuit packages which are stacked together (back-to-front or back-to-back).
- the chip stacks may be oriented either in face up position or in a side-to-side orientation with chip edges down.
- chip stack configuration there are a number of advantages to the chip stack configuration over conventional single chip mounting arrangements.
- the chip stacks provide a more compact circuit arrangement for computers and other high speed electronic systems.
- chip stacks particularly allow for more efficient use of space on circuit boards.
- the stack takes advantage of relatively less valuable space above the circuit board, while at the same time leaving a small footprint on a circuit board or card, thereby increasing the space available for other components or chip stacks.
- the present invention is generally directed at providing a relatively low cost heat sink for dissipating heat generated within chip stacks (sometimes referred to as ‘chip cubes’, although a cubic structure is not necessary).
- the invention provides a heat absorbing surface between at least a first and second chip within a chip stack which is connected to a heat dissipating surface located outside the stack.
- the heat sink includes one or more heat absorbing sections for respective insertion between chips within one or more chip stacks; a heat transfer section for transferring heat away from the absorbing sections; and a heat dissipating section for commonly dissipating heat transferred from the heat absorbing sections.
- FIG. 1 is a plan view of a heat sink of a first embodiment of the invention.
- FIG. 2 is a side view of the heat sink shown in FIG. 1.
- FIG. 3 is a perspective view of the heat sink of FIG. 1 secured to chips on a chip mounting surface.
- FIG. 4 is a side view of the heat sink configuration shown in FIG. 3.
- FIG. 5 is a side view of a first alternative heat sink configuration of the invention.
- FIG. 6 is a side view of a second alternative heat sink configuration of the invention.
- FIG. 7 is a side view of a third alternative heat sink configuration of the invention.
- FIG. 8 is a perspective view of a preferred embodiment of the invention.
- FIG. 9 is a perspective view of a fourth alternative embodiment of the invention.
- FIG. 10 is a perspective view of a fifth alternative embodiment of the invention.
- FIG. 11 is a perspective view of a sixth alternative embodiment of the invention.
- FIG. 12 is a perspective view of a second preferred embodiment of the invention.
- FIG. 13 is a sideview of the second preferred embodiment shown in FIG. 12.
- FIG. 14 is a side view of an alternative embodiment of the second preferred embodiment shown in FIGS. 12 and 13.
- FIG. 15 is a block diagram of a processor system in which the invention may be utilized.
- FIG. 1 a planar heat sink 20 in accordance with a preferred embodiment of the invention will now be described.
- Heat sink 20 is shown including three interconnected co-planar sections: a heat absorbing section 22 , a heat transfer section 24 , and a heat dissipating section 26 .
- FIG. 2 is a side view of heat sink 20 showing the relative lateral dimensions of the heat absorbing section 22 , heat transfer section 24 , and heat dissipating section 26 .
- Heat absorbing section 22 includes one or more fingers 22 a - 22 h, each of which is configured to be insertable between chips of a chip stack.
- Heat transfer section 24 includes heat transfer elements 24 a - 24 h .
- the fingers 22 a - 22 h remove heat from the chip stack, which flows through respective heat transfer sections 24 a - 24 h to dissipation section 26 .
- fingers 22 a - 22 h are of a generally rectangular shape and sized to maximize heat absorption from a target chip's surface. As shown in FIG. 1, the width of the fingers 22 a - 22 h is larger than the width of the heat transfer elements 24 a - 24 h . Alternatively, the width of the fingers 22 a - 22 h may be the same, narrower or wider than the width of the heat transfer elements 24 a - 24 h.
- heat sink 20 is comprised of a thermally conductive material having a thermal rate of expansion approximately equal to the thermal expansion rate of the stacked chips.
- heat sink 20 is comprised of a metal such as aluminum or copper and may be easily stamped out of plate metal.
- heat sink 20 is utilized by placing each heat absorbing finger 22 a - 22 h over a first layer chip 30 secured on a mounting surface 28 such as a plug-in board having edge connectors 27 .
- a second layer of chips is then secured over each heat absorbing finger 22 a - 22 h .
- Each finger 22 a - 22 h may be affixed to the first and second layer chips 30 , 32 using thermally conductivity enhancing mediums such as a thermal paste or epoxy.
- heat sink 20 is shown with each finger 22 a - 22 h placed over a respective first layer chip 30 with the heat transfer elements 24 a - 24 h and heat dissipating section 26 extending away from the location of the chips 30 , 32 .
- a second layer of chips 32 is provided over the first layer of chips 30 with each respective finger 22 a - 22 h positioned between each pair of first and second layer chips 30 , 32 .
- the heat transfer elements 24 a - 24 h and heat dissipating section 26 are provided outside the chip stack 33 created by the first and second layers of chips 30 , 32 .
- the heat transfer elements 24 a - 24 h may be provide so that at least a portion of the heat transfer elements 24 a - 24 h lie within the chip stack 33 .
- the heat transfer and heat dissipating sections 24 , 26 are shown provided coplanar with heat absorbing section 22 . As shown in FIGS. 5 - 7 , the heat transfer and heat dissipating sections 24 , 26 may extend from the heat absorbing section 22 at any angle necessary to take advantage of unused space above and below the chip stack. With reference to FIG. 5, an alternative embodiment is shown in which heat dissipating section 26 is at approximately a 45 degree angle to the heat absorbing section 22 . With reference to FIG. 6, an alternative embodiment is shown in which the heat dissipating section 26 is orthogonal to the heat absorbing section 22 . With reference to FIG. 7, an alternative embodiment is shown in which the heat dissipating section 26 is initially orthogonal to the heat absorbing section 22 and then is bent again be in parallel with the heat absorbing section 22 at a point above the heat absorbing section.
- the heat dissipating section 26 is comprised of heat dissipating fins 34 in order to further enhance heat dissipation by enlarging the surface area of section 26 .
- the heat dissipating section 26 is formed as corrugation waves 36 in order to increase surface area and heat dissipation.
- heat sink 27 includes a heat dissipating section 26 in thermal contact with a pair of heat transfer sections 24 , 25 and a pair of heat absorbing sections 22 , 23 , which extend along both sides of heat dissipating section 26 .
- heat transfer sections 24 and 25 respectively contain heat transfer elements 24 a - 24 h and 25 a - 25 h
- heat absorbing sections 22 and 23 respectively contain heat absorbing elements 22 a - 22 h and 23 a - 23 h.
- FIGS. 12 and 13 a second preferred embodiment is shown in which a pair of planar heat sinks 37 , 39 are used together to dissipate heat from chip stacks 33 , 35 positioned on each side of mounting surface 28 .
- a single continuous heat sink 41 may be used to dissipate heat from chip stacks 33 , 35 positioned on each side of mounting surface 28 .
- the integrated circuits 30 , 32 may be integrated circuit memory devices such as DRAMS, SRAMS, EEPROM, etc. and the mounting surface 28 may be constructed as a plug-in board such as a SIMM (Single In-Line Memory Module), DIMM (Dual In-Line Memory Module), SO-SIMM (Small Outline-Single In-Line Memory Module), SO-DIMM (Small Outline-Dual In-Line Memory Module), RIMM (Rambus In-Line Memory Module) or other plug-in module, for receipt in a system memory socket.
- SIMM Single In-Line Memory Module
- DIMM Dual In-Line Memory Module
- SO-SIMM Small Outline-Single In-Line Memory Module
- SO-DIMM Small Outline-Dual In-Line Memory Module
- RIMM RaMM
- a typical processor-based system which includes the present invention formed as a memory module, is illustrated generally at 640 in FIG. 15.
- a processor-based system typically includes a processor, which connects through a bus structure with memory modules, which contain data and instructions. The data in the memory modules is accessed during operation of the processor.
- This type of processor-based system is used in general purpose computer systems and in other types of dedicated processing systems, e.g. radio systems, television systems, GPS receiver systems, telephones and telephone systems to name a few.
- such a processor-based system generally comprises a central processing unit (CPU) 644 , e.g. microprocessor, that conmmunicates to at least one input/output (I/O) device 642 over a bus 652 .
- a second (I/O) device 646 is illustrated, but may not be necessary depending upon the system requirements.
- the processor-based system 640 also may include a static or dynamic random access memory (SRAM, DRAM) 648 in the form of memory modules of the kind described and illustrated above, a read only memory (ROM) 650 which may also be formed in the form of memory modules of the kind described above.
- SRAM static or dynamic random access memory
- ROM read only memory
- the processor-based system may also include peripheral devices such as a floppy disk drive 654 and a compact disk (CD) ROM drive 656 , which also communicate with CPU 644 over the bus 652 . It must be noted that the exact architecture of the processor-based system 600 is not important and that any combination of processor compatible devices may be incorporated into the system.
- Each of the memories 648 and 650 may be constructed as plug-in modules employing a heat sink constructed in accordance with the teachings of the invention.
Abstract
A heat sink is provided for use with stacks of integrated chips. The heat sink includes a thermally conductive body having a heat absorbing section which is inserted within the chip stack, and heat transfer and dissipating sections which are located outside of the chip stack.
Description
- 1. Field of the Invention
- The present invention relates to the field of integrated circuits. More particularly, the invention provides a heat sink for use with stacks of integrated circuits.
- 2. Description of the Related Art
- As computer manufacturers have attempted to build more powerful machines, the use of chip stacks in modern computing applications has become increasingly desirable. The term ‘chips’ used with the present invention is intended to include any packaged integrated circuit device including processing devices e.g. microprocessors etc., memory devices e.g. DRAMS, SRAMS, etc., and the like. In essence, a chip stack comprises multiple integrated circuit packages which are stacked together (back-to-front or back-to-back). The chip stacks may be oriented either in face up position or in a side-to-side orientation with chip edges down.
- There are a number of advantages to the chip stack configuration over conventional single chip mounting arrangements. In particular, the chip stacks provide a more compact circuit arrangement for computers and other high speed electronic systems.
- In addition, chip stacks particularly allow for more efficient use of space on circuit boards. The stack takes advantage of relatively less valuable space above the circuit board, while at the same time leaving a small footprint on a circuit board or card, thereby increasing the space available for other components or chip stacks.
- While there are numerous advantages to a stacked chip configuration, there are also associated problems. Specifically, larger and larger chip stacks create unique cooling problems. Because the chip stacks contain multiple chips, they generate more heat per unit volume, requiring greater heat dissipation, while at the same time providing significantly smaller surface areas which may be used as a heat sink. In view of this problem, the general response in the industry to the need for cooling chip-stacks has been to immerse the entire chip-stack in liquid or to operate at greatly reduced power levels. This is often an unwelcome solution because of technical concerns and also because of customer and user preferences.
- The present invention is generally directed at providing a relatively low cost heat sink for dissipating heat generated within chip stacks (sometimes referred to as ‘chip cubes’, although a cubic structure is not necessary). The invention provides a heat absorbing surface between at least a first and second chip within a chip stack which is connected to a heat dissipating surface located outside the stack. According to a preferred embodiment, the heat sink includes one or more heat absorbing sections for respective insertion between chips within one or more chip stacks; a heat transfer section for transferring heat away from the absorbing sections; and a heat dissipating section for commonly dissipating heat transferred from the heat absorbing sections.
- These and other features and advantages of the invention will become more readily apparent from the following detailed description of preferred embodiments of the invention which are provided in connection with the accompanying drawings.
- FIG. 1 is a plan view of a heat sink of a first embodiment of the invention.
- FIG. 2 is a side view of the heat sink shown in FIG. 1.
- FIG. 3 is a perspective view of the heat sink of FIG. 1 secured to chips on a chip mounting surface.
- FIG. 4 is a side view of the heat sink configuration shown in FIG. 3.
- FIG. 5 is a side view of a first alternative heat sink configuration of the invention.
- FIG. 6 is a side view of a second alternative heat sink configuration of the invention.
- FIG. 7 is a side view of a third alternative heat sink configuration of the invention.
- FIG. 8 is a perspective view of a preferred embodiment of the invention.
- FIG. 9 is a perspective view of a fourth alternative embodiment of the invention.
- FIG. 10 is a perspective view of a fifth alternative embodiment of the invention.
- FIG. 11 is a perspective view of a sixth alternative embodiment of the invention.
- FIG. 12 is a perspective view of a second preferred embodiment of the invention.
- FIG. 13 is a sideview of the second preferred embodiment shown in FIG. 12.
- FIG. 14 is a side view of an alternative embodiment of the second preferred embodiment shown in FIGS. 12 and 13.
- FIG. 15 is a block diagram of a processor system in which the invention may be utilized.
- Referring to FIG. 1, a
planar heat sink 20 in accordance with a preferred embodiment of the invention will now be described.Heat sink 20 is shown including three interconnected co-planar sections: aheat absorbing section 22, aheat transfer section 24, and aheat dissipating section 26. FIG. 2 is a side view ofheat sink 20 showing the relative lateral dimensions of theheat absorbing section 22,heat transfer section 24, andheat dissipating section 26. -
Heat absorbing section 22 includes one ormore fingers 22 a-22 h, each of which is configured to be insertable between chips of a chip stack.Heat transfer section 24 includesheat transfer elements 24 a-24 h. Thefingers 22 a-22 h remove heat from the chip stack, which flows through respectiveheat transfer sections 24 a-24 h todissipation section 26. Preferably,fingers 22 a-22 h are of a generally rectangular shape and sized to maximize heat absorption from a target chip's surface. As shown in FIG. 1, the width of thefingers 22 a-22 h is larger than the width of theheat transfer elements 24 a-24 h. Alternatively, the width of thefingers 22 a-22 h may be the same, narrower or wider than the width of theheat transfer elements 24 a-24 h. - Preferably,
heat sink 20 is comprised of a thermally conductive material having a thermal rate of expansion approximately equal to the thermal expansion rate of the stacked chips. In accordance with a preferred embodiment,heat sink 20 is comprised of a metal such as aluminum or copper and may be easily stamped out of plate metal. In alternative embodiments, it is possible for each of the three sections ofheat sink 20 to be formed of different materials in accordance with each section's functional constraints. - With reference to FIGS. 3, 4, and8,
heat sink 20 is utilized by placing eachheat absorbing finger 22 a-22 h over afirst layer chip 30 secured on amounting surface 28 such as a plug-in board havingedge connectors 27. A second layer of chips is then secured over eachheat absorbing finger 22 a-22 h. Eachfinger 22 a-22 h may be affixed to the first andsecond layer chips heat sink 20 is shown with eachfinger 22 a-22 h placed over a respectivefirst layer chip 30 with theheat transfer elements 24 a-24 h andheat dissipating section 26 extending away from the location of thechips chips 32 is provided over the first layer ofchips 30 with eachrespective finger 22 a-22 h positioned between each pair of first andsecond layer chips heat transfer elements 24 a-24 h andheat dissipating section 26 are provided outside thechip stack 33 created by the first and second layers ofchips heat transfer elements 24 a-24 h may be provide so that at least a portion of theheat transfer elements 24 a-24 h lie within thechip stack 33. - With reference to FIGS. 3, 4, and8, the heat transfer and
heat dissipating sections heat absorbing section 22. As shown in FIGS. 5-7, the heat transfer andheat dissipating sections heat absorbing section 22 at any angle necessary to take advantage of unused space above and below the chip stack. With reference to FIG. 5, an alternative embodiment is shown in whichheat dissipating section 26 is at approximately a 45 degree angle to theheat absorbing section 22. With reference to FIG. 6, an alternative embodiment is shown in which theheat dissipating section 26 is orthogonal to theheat absorbing section 22. With reference to FIG. 7, an alternative embodiment is shown in which theheat dissipating section 26 is initially orthogonal to theheat absorbing section 22 and then is bent again be in parallel with theheat absorbing section 22 at a point above the heat absorbing section. - With reference to FIG. 9, an alternative embodiment is shown in which the
heat dissipating section 26 is comprised ofheat dissipating fins 34 in order to further enhance heat dissipation by enlarging the surface area ofsection 26. With reference to FIG. 10, an additional alternative embodiment is shown in which theheat dissipating section 26 is formed as corrugation waves 36 in order to increase surface area and heat dissipation. - With reference to FIG. 11, an alternative embodiment is shown in which
heat sink 27 includes aheat dissipating section 26 in thermal contact with a pair ofheat transfer sections heat absorbing sections heat dissipating section 26. As shown in FIG. 11,heat transfer sections heat transfer elements 24 a-24 h and 25 a-25 h, andheat absorbing sections heat absorbing elements 22 a-22 h and 23 a-23 h. - With reference to FIGS. 12 and 13, a second preferred embodiment is shown in which a pair of
planar heat sinks chip stacks surface 28. Alternatively, as shown in FIG. 14, a singlecontinuous heat sink 41 may be used to dissipate heat fromchip stacks surface 28. - One particular environment in which the heat sink of the invention may be used is within a memory module for a processor-based system. In this case, the
integrated circuits surface 28 may be constructed as a plug-in board such as a SIMM (Single In-Line Memory Module), DIMM (Dual In-Line Memory Module), SO-SIMM (Small Outline-Single In-Line Memory Module), SO-DIMM (Small Outline-Dual In-Line Memory Module), RIMM (Rambus In-Line Memory Module) or other plug-in module, for receipt in a system memory socket. - A typical processor-based system, which includes the present invention formed as a memory module, is illustrated generally at640 in FIG. 15. A processor-based system typically includes a processor, which connects through a bus structure with memory modules, which contain data and instructions. The data in the memory modules is accessed during operation of the processor. This type of processor-based system is used in general purpose computer systems and in other types of dedicated processing systems, e.g. radio systems, television systems, GPS receiver systems, telephones and telephone systems to name a few.
- Referring to FIG. 15, such a processor-based system generally comprises a central processing unit (CPU)644, e.g. microprocessor, that conmmunicates to at least one input/output (I/O)
device 642 over abus 652. A second (I/O)device 646 is illustrated, but may not be necessary depending upon the system requirements. The processor-basedsystem 640 also may include a static or dynamic random access memory (SRAM, DRAM) 648 in the form of memory modules of the kind described and illustrated above, a read only memory (ROM) 650 which may also be formed in the form of memory modules of the kind described above. The processor-based system may also include peripheral devices such as afloppy disk drive 654 and a compact disk (CD)ROM drive 656, which also communicate withCPU 644 over thebus 652. It must be noted that the exact architecture of the processor-based system 600 is not important and that any combination of processor compatible devices may be incorporated into the system. Each of thememories - The above description and accompanying drawings are only illustrative of preferred embodiments, which can achieve and provide the features and advantages of the present invention. It is not intended that the invention be limited to the embodiments shown and described in detail herein. For instance, the present invention is described only with respect to stack of two chips stacked vertically. Alternatively, the present invention may be used with any number of stacked chips, which may be stacked in a vertical, horizontal, or in side-by-side fashion. Accordingly, the invention is not limited by the foregoing description but is limited only by the spirit and scope of the appended claims.
- What is claimed as new and desired to be protected by Letters Patent of the United States is:
Claims (104)
1. A heat sink for stacked integrated circuits, said heat sink comprising:
at least one heat absorbing section; said heat absorbing section having at least one planar extending element configured to be interposed between stacked integrated circuits;
a heat dissipation section; and,
a heat transfer section interconnecting said heat absorbing section and said heat dissipating section, said heat transfer section having at least one heat transfer element connected to a respective planar extending element.
2. The heat sink of , wherein said heat dissipating section contains a plurality of outwardly extended fins.
claim 1
3. The heat sink of , wherein said plurality of outwardly extending fins extend the length of said heat dissipating section.
claim 2
4. The heat sink of , wherein said heat dissipating section contains corrugations.
claim 1
5. The heat sink of , wherein said corrugations extend along the length of said heat dissipating section.
claim 4
6. The heat sink of , wherein said heat absorbing section is comprised of a plurality of planar extending elements each configured to be interposed between stacked integrated circuits, and said heat transfer section is comprised of a plurality of heat transfer elements respectively connected to said plurality of planar extending elements.
claim 1
7. The heat sink of , wherein said heat sink is plurality of planar extending elements extend from opposite sides of said heat dissipating section.
claim 6
8. The heat sink of , wherein said absorbing section is comprised of a thermally conductive material having a thermal rate of expansion approximately equal to the thermal expansion rate of the stacked integrated circuits.
claim 7
9. The heat sink of , wherein at least one heat transfer element is the same width as at least one of said planar extending elements.
claim 6
10. The heat sink of , wherein at least one heat transfer element is narrower than at least one of said planar extending elements.
claim 6
11. The heat sink of , wherein at least one of said plurality of planar extending elements is rectangular.
claim 10
12. The heat sink of , wherein said heat absorbing section, said heat transfer section, and said heat dissipating section are coplanar.
claim 6
13. The heat sink of , wherein said heat absorbing section, said heat transfer section, and said heat dissipating section are not coplanar.
claim 6
14. The heat sink of , wherein said heat dissipating section is orthogonal to said heat absorbing section.
claim 13
15. The heat sink of , wherein at least one of said heat transfer elements is configured so that in use it is located outside said stacked integrated circuits.
claim 6
16. The heat sink of , wherein at least one of said heat transfer elements is configured so that in use it is located within said stacked integrated circuits.
claim 6
17. A heat sink for a stacked integrated circuit, said heat sink comprising:
a first portion configured to be interposed between two stacked integrated circuits; and,
a second portion connected to said first portion for dissipating heat.
18. The heat sink of , wherein said second portion includes a plurality of outwardly extended fins configured to remove heat from said heat sink.
claim 17
19. The heat sink of , wherein said second portion contains areas of corrugation.
claim 17
20. The heat sink of , wherein said heat sink is comprised of a thermally conductive material having a thermal rate of expansion approximately equal to the thermal expansion rate of the stacked integrated circuits.
claim 17
21. The heat sink of , wherein said first portion is comprised of a plurality of rectangular elements.
claim 17
22. The heat sink of , wherein said heat sink is substantially flat.
claim 17
23. The heat sink of , wherein said heat sink is not substantially flat.
claim 17
24. The heat sink of , wherein said heat sink is configured so that in use at least of portion of said heat sink is located outside said stacked integrated circuit.
claim 17
25. The heat sink of , wherein said heat sink is configured so that in use at least of portion of said heat sink is located within said stacked integrated circuit.
claim 17
26. A method of removing heat from stacked integrated circuits, said method comprising:
providing at least one heat absorbing section; said heat absorbing section having at least one planar extending element interposed between stacked integrated circuits;
providing a heat dissipation section; and,
providing a heat transfer section interconnecting said heat absorbing section and said heat dissipating section, said heat transfer section having at least one heat transfer element connected to a respective planar extending element.
27. The method of , wherein said heat dissipating section contains a plurality of outwardly extended fins.
claim 26
28. The method of , wherein said plurality of outwardly extending fins extend the length of said heat dissipating section.
claim 27
29. The method of , wherein said heat dissipating section contains corrugations.
claim 26
30. The method of , wherein said corrugations extend along the length of said heat dissipating section.
claim 29
31. The method of , wherein said heat absorbing section is comprised of a plurality of planar extending elements each configured to be interposed between stacked integrated circuits, and said heat transfer section is comprised of a plurality of heat transfer elements respectively connected to said plurality of planar extending elements.
claim 26
32. The method of , wherein said plurality of planar extending elements extend from opposite sides of said heat dissipating section.
claim 31
33. The method of , wherein said heat absorbing section is comprised of a thermally conductive material having a thermal rate of expansion approximately equal to the thermal expansion rate of the stacked integrated circuits.
claim 32
34. The method of , wherein at least one heat transfer element is the same width as at least one of said planar extending elements.
claim 31
35. The method of , wherein at least one heat transfer element is narrower than at least one of said planar extending elements.
claim 31
36. The method of , wherein at least one of said plurality of planar extending elements is rectangular.
claim 35
37. The method of , wherein said heat absorbing section, said heat transfer section, and said heat dissipating section are coplanar.
claim 31
38. The method of , wherein said heat absorbing section, said heat transfer section, and said heat dissipating section are not coplanar.
claim 31
39. The method of , wherein said heat dissipating section is orthogonal to said heat absorbing section.
claim 38
40. The method of , wherein at least one of said heat transfer elements is configured so that in use it is located outside said stacked integrated circuits.
claim 31
41. The method of , wherein at least one of said heat transfer elements is configured so that in use it is located within said stacked integrated circuits.
claim 31
42. A method for removing heat from a stacked integrated circuit, said method comprising:
providing a heat sink having a first portion configured to be interposed between two stacked integrated circuits and a second portion connected to said first portion for dissipating heat.
43. The method of , wherein said second portion includes a plurality of outwardly extended fins configured to remove heat from said heat sink.
claim 42
44. The method of , wherein said second portion contains areas of corrugation.
claim 42
45. The method of , wherein said heat sink is comprised of a thermally conductive material having a thermal rate of expansion approximately equal to the thermal expansion rate of the stacked integrated circuits.
claim 42
46. The method of , wherein said first portion is comprised of a plurality of rectangular elements.
claim 42
47. The method of , wherein said heat sink is substantially flat.
claim 42
48. The method of , wherein said heat sink is not substantially flat.
claim 42
49. The method of , wherein said heat sink is configured so that in use at least of portion of said heat sink is located outside said stacked integrated circuits.
claim 42
50. The method of , wherein said heat sink is configured so that in use at least of portion of said heat sink is located within said stacked integrated circuits.
claim 42
51. A memory module comprising a printed circuit board mounting memory devices, wherein said printed circuit board comprises a heat sink for stacked integrated circuits, wherein said heat sink comprises:
at least one heat absorbing section; said heat absorbing section having at least one planar extending element configured to be interposed between stacked integrated circuits;
a heat dissipation section; and,
a heat transfer section interconnecting said heat absorbing section and said heat dissipating section, said heat transfer section having at least one heat transfer element connected to a respective planar extending element.
52. The memory module of , wherein said heat dissipating section contains a plurality of outwardly extended fins.
claim 51
53. The memory module of , wherein said plurality of outwardly extending fins extend the length of said heat dissipating section.
claim 52
54. The memory module of , wherein said heat dissipating section contains corrugations.
claim 51
55. The memory module of , wherein said corrugations extend along the length of said heat dissipating section.
claim 54
56. The memory module of , wherein said heat absorbing section is comprised of a plurality of planar extending elements each configured to be interposed between stacked integrated circuits, and said heat transfer section is comprised of a plurality of heat transfer elements respectively connected to said plurality of planar extending elements.
claim 51
57. The memory module of , wherein said heat sink is plurality of planar extending elements extend from opposite sides of said heat dissipating section.
claim 56
58. The memory module of , wherein said heat absorbing section is comprised of a thermally conductive material having a thermal rate of expansion approximately equal to the thermal expansion rate of the stacked integrated circuits.
claim 57
59. The memory module of , wherein at least one heat transfer element is the same width as at least one of said planar extending elements.
claim 56
60. The memory module of , wherein at least one heat transfer element is narrower than at least one of said planar extending elements.
claim 56
61. The memory module of , wherein at least one of said plurality of planar extending elements is rectangular.
claim 60
62. The memory module of , wherein said heat absorbing section, said heat transfer section, and said heat dissipating section are coplanar.
claim 56
63. The memory module of , wherein said heat absorbing section, said heat transfer section, and said heat dissipating section are not coplanar.
claim 56
64. The memory module of , wherein said heat dissipating section is orthogonal to said heat absorbing section.
claim 63
65. The memory module of , wherein at least one of said heat transfer elements is configured so that in use it is located outside said stacked integrated circuits.
claim 56
66. The memory module of , wherein at least one of said heat transfer elements is configured so that in use it is located within said stacked integrated circuits.
claim 56
67. A memory module for a stacked integrated circuit, said memory module comprising:
a heat sink including a first portion configured to be interposed between two stacked integrated circuits and a second portion connected to said first portion for dissipating heat.
68. The memory module of , wherein said second portion includes a plurality of outwardly extended fins configured to remove heat from said heat sink.
claim 67
69. The memory module of , wherein said second portion contains areas of corrugation.
claim 67
70. The memory module of , wherein said heat sink is comprised of a thermally conductive material having a thermal rate of expansion approximately equal to the thermal expansion rate of the stacked integrated circuits.
claim 67
71. The memory module of , wherein said first portion is comprised of a plurality of rectangular elements.
claim 67
72. The memory module of , wherein said heat sink is substantially flat.
claim 67
73. The memory module of , wherein said heat sink is not substantially flat.
claim 67
74. The memory module of , wherein said heat sink is configured so that in use at least of portion of said heat sink is located outside said stacked integrated circuits.
claim 67
75. The memory module of , wherein said heat sink is configured so that in use at least of portion of said heat sink is located within said stacked integrated circuits.
claim 67
76. An electronic system comprising a printed circuit board mounting electronic devices, wherein said printed circuit board comprises a heat sink for stacked integrated circuits, wherein said heat sink comprises:
at least one heat absorbing section; said heat absorbing section having at least one planar extending element configured to be interposed between stacked integrated circuits;
a heat dissipation section; and,
a heat transfer section, wherein said heat transfer section is comprised of at least one heat transfer element coupled to said heat absorbing section.
77. The system of , wherein said heat dissipating section contains a plurality of outwardly extended fins.
claim 76
78. The system of , wherein said plurality of outwardly extending fins extend the length of said heat dissipating section.
claim 77
79. The system of , wherein said heat dissipating section contains corrugations.
claim 76
80. The system of , wherein said corrugations extend along the length of said heat dissipating section.
claim 79
81. The system of , wherein said heat absorbing section is comprised of a plurality of planar extending elements each configured to be interposed between stacked integrated circuits, and said heat transfer section is comprised of a plurality of heat transfer elements respectively connected to said plurality of planar extending elements.
claim 76
82. The system of , wherein said heat sink is plurality of planar extending elements extend from opposite sides of said heat dissipating section.
claim 81
83. The system of , wherein said heat absorbing section is comprised of a thermally conductive material having a thermal rate of expansion approximately equal to the thermal expansion rate of the stacked integrated circuits.
claim 82
84. The system of , wherein at least one heat transfer element is the same width as at least one of said planar extending elements.
claim 81
85. The system of , wherein at least one heat transfer element is narrower than at least one of said planar extending elements.
claim 81
86. The system of , wherein at least one of said plurality of planar extending elements is rectangular.
claim 85
87. The system of , wherein said heat absorbing section, said heat transfer section, and said heat dissipating section are coplanar.
claim 81
88. The system of , wherein said heat absorbing section, said heat transfer section, and said heat dissipating section are not coplanar.
claim 81
89. The system of , wherein said heat dissipating section is orthogonal to said heat absorbing section.
claim 88
90. The system of , wherein at least one of said heat transfer elements is configured so that in use it is located outside said stacked integrated circuits.
claim 81
91. The system of , wherein at least one of said heat transfer elements is configured so that in use it is located within said stacked integrated circuits.
claim 81
92. An electronic system comprising a printed circuit board mounting electronic devices, wherein said printed circuit board comprises a heat sink for a stacked integrated circuit, wherein said heat sink comprises a first portion configured to be interposed between two stacked integrated circuits and a second portion connected to said first portion for dissipating heat.
93. The system of , wherein said second portion includes a plurality of outwardly extended fins configured to remove heat from said heat sink.
claim 92
94. The system of , wherein said second portion contains areas of corrugation.
claim 92
95. The system of , wherein said heat sink is comprised of a thermally conductive material having a thermal rate of expansion approximately equal to the thermal expansion rate of the stacked integrated circuits.
claim 92
96. The system of , wherein said first portion is comprised of a plurality of rectangular elements.
claim 92
97. The system of , wherein said heat sink is substantially flat.
claim 92
98. The system of , wherein said heat sink is not substantially flat.
claim 92
99. The system of , wherein said heat sink is configured so that in use at least of portion of said heat sink is located outside said stacked integrated circuits.
claim 92
100. The system of , wherein said heat sink is configured so that in use at least of portion of said heat sink is located within said stacked integrated circuits.
claim 92
101. A memory module comprising a printed circuit board having at least a first side and a second side each mounting stacked integrated circuits, wherein said printed circuit board comprises at least a first heat sink for removing heat from stacked integrated circuits mounted on said first side and a second heat sink for removing heat from stacked integrated circuits mounted on said second side, wherein at least one of said first and second heat sinks comprises:
at least one heat absorbing section; said heat absorbing section having at least one planar extending element configured to be interposed between stacked integrated circuits;
a heat dissipation section; and,
a heat transfer section interconnecting said heat absorbing section and said heat dissipating section, said heat transfer section having at least one heat transfer element connected to a respective planar extending element.
102. The memory module of , wherein at least one first heat sink is connected to at least one second heat sink.
claim 101
103. An electronic system comprising a printed circuit board having at least a first side and a second side each mounting stacked integrated circuits, wherein said printed circuit board comprises at least a first heat sink for removing heat from stacked integrated circuits mounted on said first side and a second heat sink for removing heat from stacked integrated circuits mounted on said second side, wherein at least one of said first and second heat sinks comprises:
at least one heat absorbing section; said heat absorbing section having at least one planar extending element configured to be interposed between stacked integrated circuits;
a heat dissipation section; and,
a heat transfer section, wherein said heat transfer section is comprised of at least one heat transfer element coupled to said heat absorbing section.
104. The system of , wherein at least one first heat sink is connected to at least one second heat sink.
claim 103
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/741,822 US6319756B2 (en) | 1998-10-26 | 2000-12-22 | Heat sink for chip stacking applications |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/178,480 US6201695B1 (en) | 1998-10-26 | 1998-10-26 | Heat sink for chip stacking applications |
US09/741,822 US6319756B2 (en) | 1998-10-26 | 2000-12-22 | Heat sink for chip stacking applications |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/178,480 Division US6201695B1 (en) | 1998-10-26 | 1998-10-26 | Heat sink for chip stacking applications |
Publications (2)
Publication Number | Publication Date |
---|---|
US20010005311A1 true US20010005311A1 (en) | 2001-06-28 |
US6319756B2 US6319756B2 (en) | 2001-11-20 |
Family
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Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
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US09/741,820 Expired - Lifetime US6449161B2 (en) | 1998-10-26 | 2000-12-22 | Heat sink for chip stacking applications |
US09/741,822 Expired - Fee Related US6319756B2 (en) | 1998-10-26 | 2000-12-22 | Heat sink for chip stacking applications |
US10/206,043 Expired - Lifetime US6707673B2 (en) | 1998-10-26 | 2002-07-29 | Heat sink for chip stacking applications |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
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US09/178,480 Expired - Lifetime US6201695B1 (en) | 1998-10-26 | 1998-10-26 | Heat sink for chip stacking applications |
US09/741,820 Expired - Lifetime US6449161B2 (en) | 1998-10-26 | 2000-12-22 | Heat sink for chip stacking applications |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
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US10/206,043 Expired - Lifetime US6707673B2 (en) | 1998-10-26 | 2002-07-29 | Heat sink for chip stacking applications |
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Also Published As
Publication number | Publication date |
---|---|
US6319756B2 (en) | 2001-11-20 |
US20010000684A1 (en) | 2001-05-03 |
US6707673B2 (en) | 2004-03-16 |
US20020186539A1 (en) | 2002-12-12 |
US6449161B2 (en) | 2002-09-10 |
US6201695B1 (en) | 2001-03-13 |
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