US20010050553A1 - Apparatus and method for testing a substrate having a plurality of terminals - Google Patents
Apparatus and method for testing a substrate having a plurality of terminals Download PDFInfo
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- US20010050553A1 US20010050553A1 US09/350,510 US35051099A US2001050553A1 US 20010050553 A1 US20010050553 A1 US 20010050553A1 US 35051099 A US35051099 A US 35051099A US 2001050553 A1 US2001050553 A1 US 2001050553A1
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- arrangement
- planes
- terminals
- probe card
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
Definitions
- This invention relates to an apparatus for testing a substrate having a plurality of terminals, and to a method of testing a substrate having a plurality of terminals.
- Electronic circuits are often made by manufacturing a plurality of electronic devices such as transistors, capacitors, diodes, etc. in and on a semiconductor wafer.
- the devices are interconnected with one another in an integrated circuit by metal lines that are deposited on the wafer.
- a plurality of terminals are formed on a surface of the wafer and are connected to the metal lines. Electric signals can be provided to or received from the integrated circuit through the terminals.
- a number of the integrated circuits are usually formed in and on a single wafer.
- the integrated circuits are located in the form of dice in rows and columns on the wafer. The wafer is subsequently sawed so that the dice are singulated from one another.
- a probe card having a plurality of probes is used for making an electrical connection to the terminals.
- Each probe has a contact region which contacts a respective one of the terminals.
- the probes are connected to an electrical tester.
- the electrical tester provides signals through the probes and the terminals to the integrated circuit, and receives signals from the integrated circuit through the terminals and the probes.
- the invention provides an apparatus for testing a substrate having a plurality of terminals.
- the apparatus includes a frame, a first arrangement secured to the frame, a mounting arrangement secured to the frame, and a second arrangement secured to the mounting arrangement.
- One of the first and second arrangements is a holder capable of holding the substrate so that the terminals are located in the first plane.
- the other one of the first and second arrangements is a probe card including a probe card backing member and a plurality of probes extending from the probe card backing member, the probes having contact regions located in a second plane.
- the mounting apparatus includes at least a first member which is adjustable relative to the frame so as to pivot the second arrangement relative to the first arrangement between an orientation wherein there is an angle between the first and second planes and an orientation wherein the first and second planes are substantially parallel to one another.
- the second arrangement is movable relative to the frame between a position wherein the contact regions are spaced from the terminals and a position wherein each contact region contacts a respective one of the terminals.
- the apparatus preferably includes a controller which receives a signal indicating an orientation of the first plane while the second arrangement is moved towards the position wherein each contact region contacts a respective one of the terminals.
- the controller controls the first member so as to maintain the orientation of the first plane parallel to the orientation of the second plane while the second arrangement is moved towards the position wherein each contact region contacts a respective one of the terminals.
- the second arrangement preferably pivots about a first axis and the mounting arrangement preferably further includes at least a second member which is adjustable relative to the frame so as to pivot the second arrangement, relative to the first arrangement, about a second axis which is at an angle relative to the first axis, between an orientation wherein there is an angle between the first and second planes and an orientation wherein the first and second planes are substantially parallel to one another.
- the apparatus may further include a member which is adjustable so as to rotate the second arrangement relative to the first arrangement without necessarily changing an angle between the first and second planes.
- the mounting arrangement may move the second arrangement towards the first arrangement so as to bring the contact regions into contact with the terminals.
- the apparatus may further include an electrical tester within communication with the probes so as to be capable of testing the substrate by providing electrical signals through the probes and the terminals to the substrate.
- the apparatus may further include at least one detector capable of detecting the location of the first plane, and detecting the location of the second plane.
- a controller may form part of the apparatus and may receive information from the detector of the locations of the first and second planes.
- the controller may be capable of adjusting the first member relative to the frame so as to adjust the first and second planes relative to one another between the orientation wherein there is an angle between the first and second planes and the orientation wherein the first and second planes are substantially parallel.
- the first arrangement is preferably the probe card and the second arrangement is preferably the holder.
- the invention also provides an apparatus for testing a substrate having a plurality of terminals, the apparatus including a frame, a probe card, a mounting arrangement, and a holder.
- the probe card is secured to the frame and has a probe card backing member and a plurality of probes extending from the probe card backing member.
- the probes have contact regions located in a first plane.
- the mounting arrangement includes at least a first member which is adjustable relative to the frame so as to pivot the holder relative to the frame between a first orientation wherein there is an angle between the first and second planes and an orientation wherein the first and second planes are substantially parallel to one another.
- the probe card and the holder are movable relative to one another between a position wherein the contact regions re spaced from the terminals and a position wherein each contact regions contacts a respective one of the terminals.
- the holder may be movable relative to the frame between the position wherein the contact regions are spaced from the terminals and the position wherein each contact region contacts a respective one of the terminals.
- the invention also provides an apparatus for testing a substrate having a plurality of terminals.
- the apparatus includes a frame, a first arrangement secured to the frame, a plurality of members secured to the frame, each member being adjustable relative to the frame, and a second arrangement secured to the members.
- One of the first and second arrangements is a holder capable of holding the substrate so that the terminals are located in a first plane.
- the other one of the first and second arrangements is a probe card including a probe card backing member and a plurality of terminals extending from the probe card backing member, the probes having contact regions located in a second plane.
- the members are selectively adjustable so as to be capable of pivoting the second arrangement about a first axis between an orientation wherein there is an angle between the first and second planes and an orientation wherein the first and second planes are substantially parallel to one another, pivoting the second arrangement about a second axis, which is at an angle relative to the first axis, between an orientation wherein there is an angle between the first and second planes and an orientation wherein the first and second planes are substantially parallel to one another, rotating the second arrangement without necessarily changing an angle between the planes, moving the second arrangement so that the first and second planes move past one another in a first direction, moving the second arrangement so that the first and second planes move past one another in a second direction which is transverse to the first direction, and moving the second arrangement towards and away from the first arrangement without necessarily changing an angle between the planes.
- Each member is preferably an extensible arm.
- At least six extensible arms may be provided.
- Extension of all the arms may cause movement of the second arrangement towards the first arrangement.
- the first arrangement is the probe card and the second arrangement is the holder.
- the apparatus may further include an electrical tester which is in communication with the probes so as to be capable of testing the substrate by providing electrical signals through the probes and the terminals to the substrate.
- the apparatus may further include at least one detector capable of detecting the location of the first plane and capable of detecting the location of the second plane.
- a controller may form part of the apparatus and is capable of receiving information from the detector of the locations of the first and second planes.
- the controller is capable of adjusting the first member relative to the frame so as to adjust the first and second planes relative to one another between the orientation wherein there is an angle between the first and second planes and the orientation wherein the first and second planes are substantially parallel.
- the invention also provides an apparatus for testing a substrate having a plurality of terminals, including a frame, a first arrangement, six extensible arms, and a second arrangement.
- the first arrangement is secured to the frame.
- Each one of the six extensible arms has a first end secured to the frame for pivotal movement in more than one direction.
- the second arrangement is secured to second ends, opposing the first ends, of each of the six extensible arms, for pivotal movement in more than one direction relative to each respective arm.
- One of the first arrangement and the second arrangement is a holder capable of holding the substrate.
- the other one of the first arrangement and the second arrangement is a probe card including a probe card backing member and a plurality of probes extending from the backing member.
- the members are selectively adjustable so as to be capable of moving the second arrangement relative to the first arrangement.
- the first and second arrangements are movable relative to one another between a position wherein contact regions of the probes are spaced from the terminals, and a position wherein each one of the contact regions contacts a respective one of the terminals.
- the invention also provides an apparatus for testing a substrate having a plurality of terminals, including a frame, a first arrangement secured to the frame, six extensible arms, each arm having a first end secured to the frame for pivotal movement in more than one direction, a second arrangement secured to second ends, opposing the first ends, of each of the six extensible arms for pivotal movement in more than one direction relative to each respective arm, at least one detector, and a controller.
- One of the first and second arrangements is a holder capable of holding the substrate so that the terminals are located in a first plane
- the other one of the first and second arrangements is a probe card including a probe card backing member and a plurality of probes extending from the probe card backing member.
- the probes have contact regions located in a second plane.
- the members are selectibly adjustable relative to one another so as to be capable of pivoting the second arrangement about a first axis between an orientation wherein there is an angle between the first and second planes and an orientation wherein the first and second planes are substantially parallel to one another, pivoting the second arrangement about a second axis, which is at an angle relative to the first axis, between an orientation wherein there is an angle between the first and second planes and an orientation wherein the first and second planes are substantially parallel to one another, rotating the second member without necessarily changing an angle between the planes, moving the second arrangement so that the first and second planes move past one another in a first direction, moving the second arrangement so that the first and second planes move past one another in a second direction which is transverse to the first direction, and moving the second arrangement towards and away from the first arrangement without necessarily changing an angle between the planes.
- the detector is capable of detecting the location of the first plane and the location of the second plane.
- the controller receives data from the detector of the location of the first and second planes.
- the controller is capable of controlling the six extensible arms so that the extensible arms pivot the second arrangement so as to position the first and second planes parallel to one another, rotate the first and second planes relative to one another, move the first and second planes past one another so as to position a selected group of the terminals over the probes, the rotation ensuring alignment between selected ones of the probes and selected ones of the terminals, and the pivoting ensuring that the probes are substantially equidistantly spaced from the terminals, and moving the first and second planes toward one another so that a respective one of the contact regions contacts a respective one of the terminals.
- the invention also provides a method of testing a substrate having a plurality of terminals.
- the method includes moving a member, thereby pivoting a probe card and the substrate relative to one another between an orientation wherein there is an angle between a first plane in which contact regions of the probe cards are located and a second plane in which the terminals are located, and an orientation wherein the first and second planes are substantially parallel to one another, and again moving the member thereby moving the probe card and the substrate towards one another until each contact region contacts a respective one of the terminals.
- the method may further include rotating the probe card and the substrate relative to one another.
- the probe card and the substrate may be rotated relative to one another without changing an angle between the planes.
- the method may further include moving the probe card and the substrate past one another in a first direction.
- the method may further include moving the probe card and the substrate past one another in a second direction which is transversed to the first direction.
- FIG. 1 is a side view illustrating an apparatus, according to an embodiment of the invention, which is used for testing a substrate having a plurality of terminals;
- FIG. 2 is a perspective view of a base plate, a hexapodal mounting arrangement, a support plate, and a holder forming part of the apparatus of FIG. 1;
- FIG. 3 is a plan view of the components shown in FIG. 2;
- FIG. 4 is a perspective view illustrating how the holder can be pivoted about a horizontal axis
- FIG. 5 is a perspective view illustrating how the holder can be rotated about a vertical axis
- FIG. 6 is a perspective view illustrating how the holder can be moved in a horizontal direction
- FIG. 7 is a perspective view illustrating how the holder can be elevated
- FIG. 8 is a side view illustrating one extensible arm forming part of the mounting arrangement
- FIG. 9 is a sectioned side view of the extensible arm
- FIG. 10 is a block diagram illustrating control features of the apparatus
- FIG. 11 is a side view of probes forming part of the apparatus and a wafer having a plurality of terminals;
- FIG. 12 is a view similar to FIG. 11 after the wafer is pivoted about at least one horizontal axis;
- FIG. 14 is a view similar to FIG. 13 after the wafer is moved towards the probes;
- FIG. 15 is a view similar to FIG. 14 after the wafer is moved away from the probes;
- FIG. 16 is a view similar to FIG. 14 after the wafer is moved so that another one of a number of dice of the wafer is aligned with the probe;
- FIG. 17 is a view similar to FIG. 16 after the wafer is moved towards the probes.
- the frame 22 includes a base plate 35 , pillars 38 , and a shelf 40 .
- the base plate 35 is located in a stationary position on a floor.
- Each pillar 38 has a lower end secured to the base plate 35 and extends upwardly therefrom.
- the shelf 40 is secured to upper ends of the pillars 38 .
- An opening 42 is formed in a central region of the shelf 40 .
- the probe card 24 includes a probe card backing member 44 and probes 46 which are secured to the probe card backing member 44 .
- Each probe 46 has a contact region 48 at a tip thereof which is slightly lower than a lower surface of a probe card backing member 44 .
- Each probe 46 can bend under spring action so that the contact region 48 thereof can be depressed against spring action.
- the probe card backing member 44 is secured to a lower surface of a mounting plate 50 .
- the electrical tester 32 is secured on top of the mounting plate 50 .
- An electrical wire 52 interconnects a respective one of the probes 46 with the electrical tester 32 .
- the electrical wires 52 may for example be in a bundle which is about 15 centimeters in diameter. Because of the large number of electrical wires 52 , the probe card 24 is preferably maintained stationary.
- the mounting plate 50 is located on top of the shelf 40 with the probe card 24 located within the opening 42 . The mounting plate 50 is then secured to the shelf 40 .
- the contact regions 48 of the probes 46 are usually located within the same plane.
- the plane of the contact regions 48 is not necessarily horizontal and is largely dependent on the way the probes 46 are formed, the way in which the probe card backing member 44 is secured to the mounting plate 50 , and the way in which the mounting plate 50 is secured to the shelf 40 .
- Other factors may also influence the positioning and orientation of the plane in which the contact regions 48 are located. Suffice to say that the plane in which the contact regions 48 are located is largely indeterminate after the mounting plate 50 is secured to the shelf 40 .
- FIG. 2 and FIG. 3 illustrate the base plate 35 , the mounting arrangement 26 , the support plate 28 , and the holder 30 in more detail.
- the mounting arrangement 26 includes a first extensible arm to a sixth extensible arm, 60 a to 60 f respectively.
- Each extensible arm 60 includes a tubular member 62 and an elongate member 64 which is located within the tubular member 62 . The elongate member can be extended from and retracted into the tubular member 62 .
- a lower end of the tubular member 62 is mounted to the base plate 35 by means of a universal joint 66 .
- the universal joint 66 allows for pivoting of the tubular member 62 relative to the base plate 35 in all directions.
- Each tubular member 62 of each extensible arm 60 is mounted to the base plate 35 in a similar manner.
- each elongate member 64 is mounted to the support plate 28 by means of a universal joint 68 .
- the support plate 28 can thus pivot to relative to the elongate member 64 in all directions.
- the holder 30 is secured on top of the support plate 28 .
- the holder 30 includes a number of suction passages 70 . Lower ends of the suction passages 70 can be connected to a vacuum pump (not shown). A substrate such as a wafer can be located on top of the holder 30 .
- the vacuum pump can then be switched on so that air flows through the suction passages 70 and a vacuum is created on a lower surface of the wafer. The vacuum ensures nonslip engagement between the wafer and the holder 30 .
- Lower ends of the first and second extensible arms 60 a and 60 b are located next to one another.
- Lower ends of the third and fourth extensible arms 60 c and 60 d are located next to one another.
- Lower ends of the fifth and sixth extensible arms 60 e and 60 f are located next to one another.
- Upper ends of the second and third extensible arms 60 b and 60 c are located next to one another.
- Upper ends of the fourth and fifth extensible arms 60 d and 60 e are located next to one another.
- Upper ends of the sixth and first extensible arms 60 f and 60 a are located next to one another.
- the upper ends of the extensible arms 60 a to 60 f are on average located closer to one another than lower ends of the extensible arms 60 a to 60 f.
- a wafer located on the holder 30 can be moved by extending or retracting the elongate members 64 of the extensible arms 60 a to 60 f .
- the wafer can be moved in any desired plane or about any desired axis.
- FIG. 4 to FIG. 7 illustrate examples of how the wafer can be moved by selectively extending or retracting selected ones of the elongate members 64 .
- FIG. 4 illustrates one example of how the wafer can be pivoted about a horizontal axis.
- the elongate members of the third and fourth extensible arms 60 c and 60 d are retracted while the elongate members of the first, second, fifth and sixth extensible arms 60 a , 60 b , 60 e , and 60 f remain stationary.
- the wafer pivots about a horizontal axis 72 .
- the horizontal axis 72 extends from the upper ends of the first and second extensible arms 60 a and 60 b to upper ends of the fifth and sixth extensible arms 60 e and 60 f.
- the elongate members of the first and second extensible arms 60 a and 60 b can be retracted while the elongate members of the third, fourth, fifth, and sixth extensible arms 60 c , 60 d , 60 e , and 60 f remain stationary.
- the wafer will then pivot about a horizontal axis extending from near upper ends of the third and fourth extensible arms 60 c and 60 d to near upper ends of the fifth and sixth extensible arms 60 e and 60 f .
- the wafer By selectively extending or retracting selected ones of the elongate members of the extensible arms 60 a to 60 f , the wafer can therefore be pivoted about any horizontal axis, located transversely relative to one another, so that a plane of the wafer can be moved to any desired orientation relative to a horizontal plane.
- FIG. 5 illustrates how the wafer can be rotated.
- the wafer is rotated by retracting the elongate members of the first, third, and fifth extensible arms 60 a , 60 c , and 60 e , while extending the elongate members of the second, fourth, and sixth extensible arms 60 b , 60 d , and 60 f .
- the wafer rotates about a vertical axis 74 without necessarily pivoting about any horizontal axis or movement in any other direction.
- FIG. 6 illustrates how the wafer can be moved in a horizontal direction.
- the elongate members of the first, second, fifth, and sixth extensible arms 60 a , 60 b , 60 e , and 60 f are extended while the elongate members of the third and fourth extensible arms 60 c and 60 d are retracted.
- the wafer moves in a horizontal direction 76 .
- the direction is from between the first and sixth extensible arms 60 a and 60 f to between the third and fourth extensible arms 60 c and 60 d.
- the wafer can be moved in any other direction as required.
- the elongate members of the first and second extensible arms 60 a and 60 b can be retracted while the elongate members of the third, fourth, fifth, and sixth extensible arms 60 c , 60 d , 60 e , and 60 f are retracted.
- the wafer will then move in a horizontal direction from between the first and second extensible arms 60 a and 60 b to between the fourth and fifth extensible arms 60 d and 60 e .
- the wafer can thus be moved in any desired direction, located transversely relative to one another, in a plane of the wafer without necessarily rotating the wafer about a vertical axis or pivoting the wafer about a horizontal axis.
- FIG. 7 illustrates how the wafer can be elevated or lowered.
- the elongate members of all the extensible arms 60 a to 60 f are extended to cause movement of the wafer in an upward direction 78 .
- the wafer can be lowered.
- FIG. 4, FIG. 5, FIG. 6, and FIG. 7 illustrate only some examples of how the wafer can be moved. In addition, it should be understood that any combination of the movements discussed with reference to FIG. 4, FIG. 5, FIG. 6, and FIG. 7 is also possible.
- FIG. 8 and FIG. 9 illustrate one of the extensible arms 60 in more detail.
- the extensible arm 60 also includes a motor housing 80 , an electric motor 82 located within the motor housing, a threaded spindle 84 , a bearing nut 86 , an apparatus 88 for detecting rotation of the threaded spindle 84 .
- the electric motor 82 includes a stator 92 and a rotor 94 located within the stator 92 .
- the rotor 94 can be rotated by supplying electric power to the stator 92 .
- the threaded spindle 84 has one end that is secured to the rotor 94 and rotates together with the rotor 94 .
- the nut 86 is mounted to the tubular member 62 for sliding movement along the tubular member 62 without rotation.
- the threaded spindle 84 and the nut 86 are in a ballscrew arrangement.
- the threaded spindle 84 has thread on an outer surface thereof and the nut 86 has ball bearings (not shown) on a inner surface thereof. When the threaded spindle 84 rotates, the thread on the outer surface thereof rolls on the ball bearings on the inner surface of the nut 86 and causes movement of the nut 86 along the tubular member 62 .
- An end of the elongate member 64 is secured to the nut 86 so that the elongate member 64 extends from or retracts into the tubular member 62 when the nut 86 moves along the tubular member 62 .
- the elongate member 64 extends from the tubular member 62 and when the voltage is reversed, the elongate member 64 retracts into the tubular member 62 .
- the apparatus 88 includes a disk 100 and a detector 102 which is located adjacent to the disk 100 .
- the disk 100 is secured to and revolves together with the threaded spindle 84 .
- the detector 102 is located next to an edge of the disk 100 . Markings (not shown) are formed around an edge of the disk 100 which can be detected by the detector 102 .
- a signal is sent to a controller 110 .
- the signal sent by the detector 102 to the controller 110 is indicative of rotation of the disk 100 and the threaded spindle 84 , and therefore also indicative of extension or retraction of the elongate member 64 out of or into the tubular member 62 .
- the controller 110 controls a power supply 112 which supplies power to the stator 92 .
- the controller can make the elongate member 64 extend out of or retract into the tubular member 62 . Because of feedback from the detector 102 , the controller can switch the power supply 112 off when the elongate member 64 has extended or retracted by a certain predetermined distance.
- FIG. 10 illustrates the arrangement of the controller 110 together with a power supply 112 a to 112 f and a respective extensible arm 60 a to 60 f.
- the controller 110 is typically a computer.
- a software program provided on a computer readable medium such as a disk is loaded into memory into the computer.
- the program is executable from memory by a processor of the computer.
- the controller is connected to the power supplies 112 a to 112 f by a serial port, universal serial bus, firewire or any other communication channel.
- the controller 110 can control a respective one of the power supplies 112 a to 112 f independently from another.
- a respective one of the power supplies 112 a to 112 f provides power to a respective one of the extensible arms 60 a to 60 f .
- Each extensible arm has a respective detector ( 102 in FIG. 9) which provides feedback to the controller 110 .
- the controller 110 also receives input from the probe card camera 34 and the substrate camera 36 .
- the controller 110 is connected to cameras by a serial port, universal serial bus, firewire or any other communication channel.
- the probe card camera 34 is secured to the support plate 28 .
- the mounting arrangement 26 can be operated so that the probe card camera 34 moves to respective ones of the probes 46 .
- the probe card camera 34 can then detect the positioning of a respective contact region 48 of respective ones of the probes 46 .
- the probe card camera 34 can also measure the distance from the probe card camera 34 to a respective one of the contact regions 48 . The exact coordinates of each contact region 48 can therefore be determined in three dimensional space.
- each contact region 48 is provided to the controller 110 . If the location in three dimensional space of each contact region 48 can be determined, the controller can calculate a plane in which the contact regions 48 of the probes 46 are located. The locations of the contact regions 48 and the plane of the contact regions 48 is determined relative to the positioning of the probe card camera 34 . Details of the probe card camera 34 and how a plane is determined can be found in the specification of U.S. patent application Ser. No. 08/980,595 filed Dec. 1, 1997 and assigned to the assignee of the present application and incorporated herein by reference.
- the substrate camera 36 is mounted to a boom 116 .
- the boom 116 is mounted to the frame 22 for pivotal movement in a horizontal plane.
- the substrate camera 36 is swept over the wafer by pivoting the boom 116 relative to the frame 22 .
- the wafer typically has a plurality to the terminals on a surface thereof.
- the substrate camera 36 operates the same as the probe card camera 34 in that the substrate camera 36 determines the positioning of each one of a number of the terminals in three dimensional space, and provides the coordinates of the terminals to the controller 110 .
- the controller 110 can then determine the plane, or at least an approximate plane, in which the terminals are located. The locations in three dimensional space of the terminals and the plane of the terminals are determined relative to the location of the substrate camera 36 .
- a detector 118 detects the pivotal positioning of the boom 116 and provides feedback to the controller 110 of the exact positioning of the boom 116 . Because the boom 116 is mounted to the frame 22 and the detector 118 detects the pivotal position of the boom 116 , the positioning of the substrate camera 36 can thus be determined with respect to the frame 22 .
- the probe card camera 34 is initially aligned with the substrate camera 36 for calibration purposes.
- the positioning of the probe card camera 34 and the substrate camera 36 can be determined relative to one another.
- the absolute positioning of the substrate camera 36 relative to the frame 22 is known, the absolute positioning of the probe card camera 34 relative to the frame 22 is also known.
- the absolute positioning of the contact regions 48 and the plane of the contact regions 48 (as detected by the probe card camera 34 ), and the absolute positioning of the terminals of the wafer and the plane of the terminals (as detected by the substrate camera 36 ) relative to the frame 22 to are therefore also known by the controller 110 .
- the controller 110 can then calculate the position of the terminals and the contact regions 48 relative to one another and control the mounting arrangement 26 by moving the wafer so that the terminals are in required locations relative to the contact regions 48 .
- FIG. 11 to FIG. 17 illustrate how a wafer can be moved.
- FIG. 11 illustrates the probes 46 and a wafer 120 .
- the contact regions 48 of the probes 46 are located in a first plane 122 .
- the wafer 120 has a plurality of dice 124 .
- the dice 124 are arranged in rows and columns.
- Each die 124 has a plurality of contact terminals 126 on a surface thereof.
- the contact terminals 126 of the dice 124 are located in a second plane 128 .
- the wafer 120 is then moved so that respective one of the contact regions 48 are located over the respective ones of the terminals 126 of one of the dice 124 .
- the wafer is then rotated, pivoted as shown in FIG. 12, and moved in a plane of the wafer 120 as shown in FIG. 13.
- Rotation of the wafer is described hereinbefore with reference to FIG. 5. Rotation of the wafer 120 ensures that the contact regions 48 are not rotationally misaligned with the terminals 126 .
- the wafer 120 is then pivoted in a direction 130 so that the first and second planes 122 and 128 are parallel to one another. Pivoting of the wafer 120 should be evident from the description hereinbefore with reference to FIG. 4. It should therefore be understood that the first and second planes 122 and 128 are parallel to one another in all directions.
- the wafer 120 is then moved in a direction 132 which is in a plane of the wafer 120 .
- the wafer 120 can be moved in any direction in a plane of the wafer 120 .
- the contact regions 48 can therefore be aligned with terminals 126 on a selected one of the dice 124 which are located in row and columns on the wafer 120 .
- the contact regions 48 are equidistantly spaced from the terminals 126 .
- the wafer 120 is then moved in a direction 134 so that a respective one of the terminals 126 contacts a respective one of the contact regions.
- the controller 110 controls extension of the extensible arms 60 a to 60 f so that the planes 122 and 128 remain parallel to one another while the wafer 120 moves towards the probes 46 .
- the terminals 126 therefore contact all of the contact regions 48 at substantially the same moment in time.
- the wafer 120 is then further moved in the direction 134 to cause deflection of the contact regions 48 against spring action of the probes 46 . While so being moved, the plane 128 of the terminals 126 is maintained in its original orientation by the controller 110 .
- each contact region 48 is originally parallel to the plane of the contact regions 48 , and maintained in such an orientation, an equal amount of pressure is applied by each contact region 48 to a respective terminal 126 . Proper contact between the terminals 126 and the contact regions 48 is ensured.
- the electrical tester 32 can then provide electrical signals through the electrical wires 52 and the probes 46 to the terminals 126 .
- the terminals 126 are connected to an integrated circuit of semiconductor electronic devices in the wafer 120 . Signals can also be provided by the integrated circuit through the terminals 126 and the probes 46 to the electrical tester 32 .
- the electrical tester 32 can thus test the integrated circuit in the die 124 .
- the wafer can then be moved in a direction 136 so that the terminals 126 are again spaced from the contact regions 48 .
- the wafer 120 is then moved in a direction 138 so that the contact regions 48 are aligned with terminals 126 on another one of the dice 124 in the same row as the die which was tested in FIG. 14.
- the wafer 120 can again be moved so that the terminals 126 of the die 124 is brought into contact with the contact regions 48 for purposes of testing the die 124 .
- the process as shown in FIG. 14 to FIG. 17 can be repeated until each die in a row is tested.
- the wafer 120 can then be moved so that the contact regions 48 are aligned with a die in another column. All the dice in the new column can then be tested in a similar manner, whereafter dice in a further column can be tested, and so on.
- the apparatus 20 provides probing of a substrate wherein a plane of contact regions of probes is automatically adjusted to be substantially parallel to a plane of terminals on a substrate, or “planarized” relative to one another. Proper, uniform contact is ensured between the probes and the terminals.
- Such a feature is very useful for an efficient, fast setup, especially when types of probe cards and substrates are continually being interchanged, and for continually re-adjusting planarity as needed.
- the co-planarity of the two planes e.g. how close to being parallel the two planes are
- the height of each extensible arm may be monitored during a probing operation (e.g.
- each extensible arm may be adjusted automatically during the probing operation in order to keep both planes substantially parallel to each other. That is, the planes may be kept substantially parallel while the one plane is caused to be pressed toward the other plane (e.g. the plane of probes is pressed onto the wafer's surface).
- Extension of the arms of the mounting arrangement will cause engagement between probes of the probe card and terminals on a substrate. It may also be possible for a holder to be at the top and a probe card to be at the bottom. One skilled in the art would appreciate from the teachings of the aforegoing description that other arrangements are also possible. One skilled in the art would however also appreciate the benefits of the present invention, in particular in that the probe card is stationary because of connection to the electrical tester, and that the holder is at the bottom for more convenient handling of a substrate.
Abstract
Description
- 1. Field of the Invention
- This invention relates to an apparatus for testing a substrate having a plurality of terminals, and to a method of testing a substrate having a plurality of terminals.
- 2. Discussion of Related Art
- Electronic circuits are often made by manufacturing a plurality of electronic devices such as transistors, capacitors, diodes, etc. in and on a semiconductor wafer. The devices are interconnected with one another in an integrated circuit by metal lines that are deposited on the wafer. A plurality of terminals are formed on a surface of the wafer and are connected to the metal lines. Electric signals can be provided to or received from the integrated circuit through the terminals.
- A number of the integrated circuits are usually formed in and on a single wafer. The integrated circuits are located in the form of dice in rows and columns on the wafer. The wafer is subsequently sawed so that the dice are singulated from one another.
- Before the wafer is sawed, the integrated circuit of each die is tested for defects. A probe card having a plurality of probes is used for making an electrical connection to the terminals. Each probe has a contact region which contacts a respective one of the terminals. The probes are connected to an electrical tester. The electrical tester provides signals through the probes and the terminals to the integrated circuit, and receives signals from the integrated circuit through the terminals and the probes.
- Due to many factors, some of which are discussed hereinbelow, proper contact between the probes and the terminals is often difficult to obtain. Contact regions of the probes may, for example, be located in one plane and the terminals may be located in another plane which is not parallel to the plane of the contact regions. When the terminals and the contact regions are moved into engagement with the terminals, some probes may create more force on some terminals than others. In more extreme situations proper contact between a probe and a terminal is not provided. Other problems such as rotational or positional misalignment may also occur.
- The invention provides an apparatus for testing a substrate having a plurality of terminals. The apparatus includes a frame, a first arrangement secured to the frame, a mounting arrangement secured to the frame, and a second arrangement secured to the mounting arrangement. One of the first and second arrangements is a holder capable of holding the substrate so that the terminals are located in the first plane. The other one of the first and second arrangements is a probe card including a probe card backing member and a plurality of probes extending from the probe card backing member, the probes having contact regions located in a second plane. The mounting apparatus includes at least a first member which is adjustable relative to the frame so as to pivot the second arrangement relative to the first arrangement between an orientation wherein there is an angle between the first and second planes and an orientation wherein the first and second planes are substantially parallel to one another. The second arrangement is movable relative to the frame between a position wherein the contact regions are spaced from the terminals and a position wherein each contact region contacts a respective one of the terminals.
- The apparatus preferably includes a controller which receives a signal indicating an orientation of the first plane while the second arrangement is moved towards the position wherein each contact region contacts a respective one of the terminals. The controller controls the first member so as to maintain the orientation of the first plane parallel to the orientation of the second plane while the second arrangement is moved towards the position wherein each contact region contacts a respective one of the terminals.
- The second arrangement preferably pivots about a first axis and the mounting arrangement preferably further includes at least a second member which is adjustable relative to the frame so as to pivot the second arrangement, relative to the first arrangement, about a second axis which is at an angle relative to the first axis, between an orientation wherein there is an angle between the first and second planes and an orientation wherein the first and second planes are substantially parallel to one another.
- The apparatus may further include a member which is adjustable so as to rotate the second arrangement relative to the first arrangement without necessarily changing an angle between the first and second planes.
- The mounting arrangement may move the second arrangement towards the first arrangement so as to bring the contact regions into contact with the terminals.
- The apparatus may further include an electrical tester within communication with the probes so as to be capable of testing the substrate by providing electrical signals through the probes and the terminals to the substrate.
- The apparatus may further include at least one detector capable of detecting the location of the first plane, and detecting the location of the second plane. A controller may form part of the apparatus and may receive information from the detector of the locations of the first and second planes. The controller may be capable of adjusting the first member relative to the frame so as to adjust the first and second planes relative to one another between the orientation wherein there is an angle between the first and second planes and the orientation wherein the first and second planes are substantially parallel.
- The first arrangement is preferably the probe card and the second arrangement is preferably the holder.
- The invention also provides an apparatus for testing a substrate having a plurality of terminals, the apparatus including a frame, a probe card, a mounting arrangement, and a holder. The probe card is secured to the frame and has a probe card backing member and a plurality of probes extending from the probe card backing member. The probes have contact regions located in a first plane. The mounting arrangement includes at least a first member which is adjustable relative to the frame so as to pivot the holder relative to the frame between a first orientation wherein there is an angle between the first and second planes and an orientation wherein the first and second planes are substantially parallel to one another. The probe card and the holder are movable relative to one another between a position wherein the contact regions re spaced from the terminals and a position wherein each contact regions contacts a respective one of the terminals.
- The holder may be movable relative to the frame between the position wherein the contact regions are spaced from the terminals and the position wherein each contact region contacts a respective one of the terminals.
- The invention also provides an apparatus for testing a substrate having a plurality of terminals. The apparatus includes a frame, a first arrangement secured to the frame, a plurality of members secured to the frame, each member being adjustable relative to the frame, and a second arrangement secured to the members. One of the first and second arrangements is a holder capable of holding the substrate so that the terminals are located in a first plane. The other one of the first and second arrangements is a probe card including a probe card backing member and a plurality of terminals extending from the probe card backing member, the probes having contact regions located in a second plane. The members are selectively adjustable so as to be capable of pivoting the second arrangement about a first axis between an orientation wherein there is an angle between the first and second planes and an orientation wherein the first and second planes are substantially parallel to one another, pivoting the second arrangement about a second axis, which is at an angle relative to the first axis, between an orientation wherein there is an angle between the first and second planes and an orientation wherein the first and second planes are substantially parallel to one another, rotating the second arrangement without necessarily changing an angle between the planes, moving the second arrangement so that the first and second planes move past one another in a first direction, moving the second arrangement so that the first and second planes move past one another in a second direction which is transverse to the first direction, and moving the second arrangement towards and away from the first arrangement without necessarily changing an angle between the planes.
- Each member is preferably an extensible arm.
- At least six extensible arms may be provided.
- Extension of all the arms may cause movement of the second arrangement towards the first arrangement.
- Preferably, the first arrangement is the probe card and the second arrangement is the holder.
- The apparatus may further include an electrical tester which is in communication with the probes so as to be capable of testing the substrate by providing electrical signals through the probes and the terminals to the substrate.
- The apparatus may further include at least one detector capable of detecting the location of the first plane and capable of detecting the location of the second plane. A controller may form part of the apparatus and is capable of receiving information from the detector of the locations of the first and second planes. The controller is capable of adjusting the first member relative to the frame so as to adjust the first and second planes relative to one another between the orientation wherein there is an angle between the first and second planes and the orientation wherein the first and second planes are substantially parallel.
- The invention also provides an apparatus for testing a substrate having a plurality of terminals, including a frame, a first arrangement, six extensible arms, and a second arrangement. The first arrangement is secured to the frame. Each one of the six extensible arms has a first end secured to the frame for pivotal movement in more than one direction. The second arrangement is secured to second ends, opposing the first ends, of each of the six extensible arms, for pivotal movement in more than one direction relative to each respective arm. One of the first arrangement and the second arrangement is a holder capable of holding the substrate. The other one of the first arrangement and the second arrangement is a probe card including a probe card backing member and a plurality of probes extending from the backing member. The members are selectively adjustable so as to be capable of moving the second arrangement relative to the first arrangement. The first and second arrangements are movable relative to one another between a position wherein contact regions of the probes are spaced from the terminals, and a position wherein each one of the contact regions contacts a respective one of the terminals.
- The invention also provides an apparatus for testing a substrate having a plurality of terminals, including a frame, a first arrangement secured to the frame, six extensible arms, each arm having a first end secured to the frame for pivotal movement in more than one direction, a second arrangement secured to second ends, opposing the first ends, of each of the six extensible arms for pivotal movement in more than one direction relative to each respective arm, at least one detector, and a controller. One of the first and second arrangements is a holder capable of holding the substrate so that the terminals are located in a first plane, and the other one of the first and second arrangements is a probe card including a probe card backing member and a plurality of probes extending from the probe card backing member. The probes have contact regions located in a second plane. The members are selectibly adjustable relative to one another so as to be capable of pivoting the second arrangement about a first axis between an orientation wherein there is an angle between the first and second planes and an orientation wherein the first and second planes are substantially parallel to one another, pivoting the second arrangement about a second axis, which is at an angle relative to the first axis, between an orientation wherein there is an angle between the first and second planes and an orientation wherein the first and second planes are substantially parallel to one another, rotating the second member without necessarily changing an angle between the planes, moving the second arrangement so that the first and second planes move past one another in a first direction, moving the second arrangement so that the first and second planes move past one another in a second direction which is transverse to the first direction, and moving the second arrangement towards and away from the first arrangement without necessarily changing an angle between the planes. The detector is capable of detecting the location of the first plane and the location of the second plane. The controller receives data from the detector of the location of the first and second planes. The controller is capable of controlling the six extensible arms so that the extensible arms pivot the second arrangement so as to position the first and second planes parallel to one another, rotate the first and second planes relative to one another, move the first and second planes past one another so as to position a selected group of the terminals over the probes, the rotation ensuring alignment between selected ones of the probes and selected ones of the terminals, and the pivoting ensuring that the probes are substantially equidistantly spaced from the terminals, and moving the first and second planes toward one another so that a respective one of the contact regions contacts a respective one of the terminals.
- The invention also provides a method of testing a substrate having a plurality of terminals. The method includes moving a member, thereby pivoting a probe card and the substrate relative to one another between an orientation wherein there is an angle between a first plane in which contact regions of the probe cards are located and a second plane in which the terminals are located, and an orientation wherein the first and second planes are substantially parallel to one another, and again moving the member thereby moving the probe card and the substrate towards one another until each contact region contacts a respective one of the terminals.
- The method may further include rotating the probe card and the substrate relative to one another. The probe card and the substrate may be rotated relative to one another without changing an angle between the planes.
- The method may further include moving the probe card and the substrate past one another in a first direction.
- The method may further include moving the probe card and the substrate past one another in a second direction which is transversed to the first direction.
- The invention is further described by way of example with reference to the accompanying drawings wherein:
- FIG. 1 is a side view illustrating an apparatus, according to an embodiment of the invention, which is used for testing a substrate having a plurality of terminals;
- FIG. 2 is a perspective view of a base plate, a hexapodal mounting arrangement, a support plate, and a holder forming part of the apparatus of FIG. 1;
- FIG. 3 is a plan view of the components shown in FIG. 2;
- FIG. 4 is a perspective view illustrating how the holder can be pivoted about a horizontal axis;
- FIG. 5 is a perspective view illustrating how the holder can be rotated about a vertical axis; FIG. 6 is a perspective view illustrating how the holder can be moved in a horizontal direction;
- FIG. 7 is a perspective view illustrating how the holder can be elevated;
- FIG. 8 is a side view illustrating one extensible arm forming part of the mounting arrangement;
- FIG. 9 is a sectioned side view of the extensible arm;
- FIG. 10 is a block diagram illustrating control features of the apparatus;
- FIG. 11 is a side view of probes forming part of the apparatus and a wafer having a plurality of terminals;
- FIG. 12 is a view similar to FIG. 11 after the wafer is pivoted about at least one horizontal axis;
- FIG. 13 is a view similar to FIG. 12 after the wafer is moved in a plane of the wafer;
- FIG. 14 is a view similar to FIG. 13 after the wafer is moved towards the probes;
- FIG. 15 is a view similar to FIG. 14 after the wafer is moved away from the probes;
- FIG. 16 is a view similar to FIG. 14 after the wafer is moved so that another one of a number of dice of the wafer is aligned with the probe; and
- FIG. 17 is a view similar to FIG. 16 after the wafer is moved towards the probes.
- FIG. 1 of the accompanying drawings illustrates an
apparatus 20, according to an embodiment of the invention, which is used for testing a substrate having a plurality of terminals. Theapparatus 20 includes aframe 22, aprobe card 24, ahexapodal mounting arrangement 26, asupport plate 28, aholder 30, anelectrical tester 32, aprobe card camera 34, and asubstrate camera 36. - The
frame 22 includes abase plate 35,pillars 38, and ashelf 40. Thebase plate 35 is located in a stationary position on a floor. Eachpillar 38 has a lower end secured to thebase plate 35 and extends upwardly therefrom. Theshelf 40 is secured to upper ends of thepillars 38. Anopening 42 is formed in a central region of theshelf 40. - The
probe card 24 includes a probecard backing member 44 and probes 46 which are secured to the probecard backing member 44. Eachprobe 46 has acontact region 48 at a tip thereof which is slightly lower than a lower surface of a probecard backing member 44. Eachprobe 46 can bend under spring action so that thecontact region 48 thereof can be depressed against spring action. - The probe
card backing member 44 is secured to a lower surface of a mountingplate 50. Theelectrical tester 32 is secured on top of the mountingplate 50. Anelectrical wire 52 interconnects a respective one of theprobes 46 with theelectrical tester 32. Although only twoelectrical wires 52 are shown, it should be understood that there may be hundreds ofprobes 46 and a large number of wires may be provided so as to interconnect theprobes 46 with theelectrical tester 32. Theelectrical wires 52 may for example be in a bundle which is about 15 centimeters in diameter. Because of the large number ofelectrical wires 52, theprobe card 24 is preferably maintained stationary. - The mounting
plate 50 is located on top of theshelf 40 with theprobe card 24 located within theopening 42. The mountingplate 50 is then secured to theshelf 40. - The
contact regions 48 of theprobes 46 are usually located within the same plane. However, the plane of thecontact regions 48 is not necessarily horizontal and is largely dependent on the way theprobes 46 are formed, the way in which the probecard backing member 44 is secured to the mountingplate 50, and the way in which the mountingplate 50 is secured to theshelf 40. Other factors may also influence the positioning and orientation of the plane in which thecontact regions 48 are located. Suffice to say that the plane in which thecontact regions 48 are located is largely indeterminate after the mountingplate 50 is secured to theshelf 40. - FIG. 2 and FIG. 3 illustrate the
base plate 35, the mountingarrangement 26, thesupport plate 28, and theholder 30 in more detail. The mountingarrangement 26 includes a first extensible arm to a sixth extensible arm, 60 a to 60 f respectively. Eachextensible arm 60 includes atubular member 62 and anelongate member 64 which is located within thetubular member 62. The elongate member can be extended from and retracted into thetubular member 62. - A lower end of the
tubular member 62 is mounted to thebase plate 35 by means of auniversal joint 66. Theuniversal joint 66 allows for pivoting of thetubular member 62 relative to thebase plate 35 in all directions. Eachtubular member 62 of eachextensible arm 60 is mounted to thebase plate 35 in a similar manner. - An upper end of each
elongate member 64 is mounted to thesupport plate 28 by means of auniversal joint 68. Thesupport plate 28 can thus pivot to relative to theelongate member 64 in all directions. - The
holder 30 is secured on top of thesupport plate 28. Theholder 30 includes a number of suction passages 70. Lower ends of the suction passages 70 can be connected to a vacuum pump (not shown). A substrate such as a wafer can be located on top of theholder 30. The vacuum pump can then be switched on so that air flows through the suction passages 70 and a vacuum is created on a lower surface of the wafer. The vacuum ensures nonslip engagement between the wafer and theholder 30. - Lower ends of the first and second
extensible arms extensible arms 60 c and 60 d are located next to one another. Lower ends of the fifth and sixthextensible arms extensible arms extensible arms 60 d and 60 e are located next to one another. Upper ends of the sixth and firstextensible arms extensible arms 60 a to 60 f are on average located closer to one another than lower ends of theextensible arms 60 a to 60 f. - A wafer located on the
holder 30 can be moved by extending or retracting theelongate members 64 of theextensible arms 60 a to 60 f. By selectively extending or retracting selected ones of theelongate members 64, the wafer can be moved in any desired plane or about any desired axis. FIG. 4 to FIG. 7 illustrate examples of how the wafer can be moved by selectively extending or retracting selected ones of theelongate members 64. - FIG. 4 illustrates one example of how the wafer can be pivoted about a horizontal axis. The elongate members of the third and fourth
extensible arms 60 c and 60 d are retracted while the elongate members of the first, second, fifth and sixthextensible arms extensible arms extensible arms - In a similar manner, for example, the elongate members of the first and second
extensible arms extensible arms extensible arms 60 c and 60 d to near upper ends of the fifth and sixthextensible arms extensible arms 60 a to 60 f, the wafer can therefore be pivoted about any horizontal axis, located transversely relative to one another, so that a plane of the wafer can be moved to any desired orientation relative to a horizontal plane. - FIG. 5 illustrates how the wafer can be rotated. The wafer is rotated by retracting the elongate members of the first, third, and fifth
extensible arms extensible arms - FIG. 6 illustrates how the wafer can be moved in a horizontal direction. The elongate members of the first, second, fifth, and sixth
extensible arms extensible arms 60 c and 60 d are retracted. The wafer moves in ahorizontal direction 76. The direction is from between the first and sixthextensible arms extensible arms 60 c and 60 d. - The wafer can be moved in any other direction as required. For example, the elongate members of the first and second
extensible arms extensible arms extensible arms extensible arms 60 d and 60 e. The wafer can thus be moved in any desired direction, located transversely relative to one another, in a plane of the wafer without necessarily rotating the wafer about a vertical axis or pivoting the wafer about a horizontal axis. - FIG. 7 illustrates how the wafer can be elevated or lowered. The elongate members of all the
extensible arms 60 a to 60 f are extended to cause movement of the wafer in an upward direction 78. By retracting the elongate members of all theextensible arms 60 a to 60 f, the wafer can be lowered. - FIG. 4, FIG. 5, FIG. 6, and FIG. 7 illustrate only some examples of how the wafer can be moved. In addition, it should be understood that any combination of the movements discussed with reference to FIG. 4, FIG. 5, FIG. 6, and FIG. 7 is also possible.
- FIG. 8 and FIG. 9 illustrate one of the
extensible arms 60 in more detail. In addition to thetubular member 62 and theelongate member 64, theextensible arm 60 also includes amotor housing 80, anelectric motor 82 located within the motor housing, a threadedspindle 84, a bearingnut 86, anapparatus 88 for detecting rotation of the threadedspindle 84. - An end of the
tubular member 62 is secured to the motor housing which, in turn, is secured to theuniversal joint 66. Theelectric motor 82 includes astator 92 and arotor 94 located within thestator 92. Therotor 94 can be rotated by supplying electric power to thestator 92. - The threaded
spindle 84 has one end that is secured to therotor 94 and rotates together with therotor 94. Thenut 86 is mounted to thetubular member 62 for sliding movement along thetubular member 62 without rotation. The threadedspindle 84 and thenut 86 are in a ballscrew arrangement. The threadedspindle 84 has thread on an outer surface thereof and thenut 86 has ball bearings (not shown) on a inner surface thereof. When the threadedspindle 84 rotates, the thread on the outer surface thereof rolls on the ball bearings on the inner surface of thenut 86 and causes movement of thenut 86 along thetubular member 62. An end of theelongate member 64 is secured to thenut 86 so that theelongate member 64 extends from or retracts into thetubular member 62 when thenut 86 moves along thetubular member 62. When one voltage is supplied to thestator 92, theelongate member 64 extends from thetubular member 62 and when the voltage is reversed, theelongate member 64 retracts into thetubular member 62. - Because of a screw engagement between the threaded
spindle 84 and thenut 86, rotation of therotor 94 translates into very exact translation of theelongate member 64 relative to the tubular member 62 (as opposed to, for example, the use of pneumatics or hydraulics). - The
apparatus 88 includes adisk 100 and adetector 102 which is located adjacent to thedisk 100. Thedisk 100 is secured to and revolves together with the threadedspindle 84. Thedetector 102 is located next to an edge of thedisk 100. Markings (not shown) are formed around an edge of thedisk 100 which can be detected by thedetector 102. Each time a marking is detected by the detector 102 a signal is sent to acontroller 110. The signal sent by thedetector 102 to thecontroller 110 is indicative of rotation of thedisk 100 and the threadedspindle 84, and therefore also indicative of extension or retraction of theelongate member 64 out of or into thetubular member 62. - The
controller 110 controls apower supply 112 which supplies power to thestator 92. By controlling power supplied to thestator 92, the controller can make theelongate member 64 extend out of or retract into thetubular member 62. Because of feedback from thedetector 102, the controller can switch thepower supply 112 off when theelongate member 64 has extended or retracted by a certain predetermined distance. - FIG. 10 illustrates the arrangement of the
controller 110 together with a power supply 112 a to 112 f and a respectiveextensible arm 60 a to 60 f. - The
controller 110 is typically a computer. A software program provided on a computer readable medium such as a disk is loaded into memory into the computer. The program is executable from memory by a processor of the computer. - The controller is connected to the power supplies112 a to 112 f by a serial port, universal serial bus, firewire or any other communication channel. The
controller 110 can control a respective one of the power supplies 112 a to 112 f independently from another. A respective one of the power supplies 112 a to 112 f provides power to a respective one of theextensible arms 60 a to 60 f. Each extensible arm has a respective detector (102 in FIG. 9) which provides feedback to thecontroller 110. - The
controller 110 also receives input from theprobe card camera 34 and thesubstrate camera 36. Thecontroller 110 is connected to cameras by a serial port, universal serial bus, firewire or any other communication channel. Referring again to FIG. 1, theprobe card camera 34 is secured to thesupport plate 28. The mountingarrangement 26 can be operated so that theprobe card camera 34 moves to respective ones of theprobes 46. Theprobe card camera 34 can then detect the positioning of arespective contact region 48 of respective ones of theprobes 46. Utilizing autofocus and other techniques, theprobe card camera 34 can also measure the distance from theprobe card camera 34 to a respective one of thecontact regions 48. The exact coordinates of eachcontact region 48 can therefore be determined in three dimensional space. The coordinates of eachcontact region 48 is provided to thecontroller 110. If the location in three dimensional space of eachcontact region 48 can be determined, the controller can calculate a plane in which thecontact regions 48 of theprobes 46 are located. The locations of thecontact regions 48 and the plane of thecontact regions 48 is determined relative to the positioning of theprobe card camera 34. Details of theprobe card camera 34 and how a plane is determined can be found in the specification of U.S. patent application Ser. No. 08/980,595 filed Dec. 1, 1997 and assigned to the assignee of the present application and incorporated herein by reference. - The
substrate camera 36 is mounted to a boom 116. The boom 116 is mounted to theframe 22 for pivotal movement in a horizontal plane. Once a wafer (or other substrate) is located on theholder 30, thesubstrate camera 36 is swept over the wafer by pivoting the boom 116 relative to theframe 22. The wafer typically has a plurality to the terminals on a surface thereof. Thesubstrate camera 36 operates the same as theprobe card camera 34 in that thesubstrate camera 36 determines the positioning of each one of a number of the terminals in three dimensional space, and provides the coordinates of the terminals to thecontroller 110. Thecontroller 110 can then determine the plane, or at least an approximate plane, in which the terminals are located. The locations in three dimensional space of the terminals and the plane of the terminals are determined relative to the location of thesubstrate camera 36. - A detector118 detects the pivotal positioning of the boom 116 and provides feedback to the
controller 110 of the exact positioning of the boom 116. Because the boom 116 is mounted to theframe 22 and the detector 118 detects the pivotal position of the boom 116, the positioning of thesubstrate camera 36 can thus be determined with respect to theframe 22. - The
probe card camera 34 is initially aligned with thesubstrate camera 36 for calibration purposes. When theprobe card camera 34 is detected by thesubstrate camera 36, the positioning of theprobe card camera 34 and thesubstrate camera 36 can be determined relative to one another. Because the absolute positioning of thesubstrate camera 36 relative to theframe 22 is known, the absolute positioning of theprobe card camera 34 relative to theframe 22 is also known. The absolute positioning of thecontact regions 48 and the plane of the contact regions 48 (as detected by the probe card camera 34), and the absolute positioning of the terminals of the wafer and the plane of the terminals (as detected by the substrate camera 36) relative to theframe 22 to are therefore also known by thecontroller 110. Thecontroller 110 can then calculate the position of the terminals and thecontact regions 48 relative to one another and control the mountingarrangement 26 by moving the wafer so that the terminals are in required locations relative to thecontact regions 48. - FIG. 11 to FIG. 17 illustrate how a wafer can be moved.
- FIG. 11 illustrates the
probes 46 and awafer 120. Thecontact regions 48 of theprobes 46 are located in afirst plane 122. Thewafer 120 has a plurality ofdice 124. Thedice 124 are arranged in rows and columns. Each die 124 has a plurality ofcontact terminals 126 on a surface thereof. Thecontact terminals 126 of thedice 124 are located in asecond plane 128. - The
wafer 120 is then moved so that respective one of thecontact regions 48 are located over the respective ones of theterminals 126 of one of thedice 124. The wafer is then rotated, pivoted as shown in FIG. 12, and moved in a plane of thewafer 120 as shown in FIG. 13. - Rotation of the wafer is described hereinbefore with reference to FIG. 5. Rotation of the
wafer 120 ensures that thecontact regions 48 are not rotationally misaligned with theterminals 126. - Referring now to FIG. 12, the
wafer 120 is then pivoted in a direction 130 so that the first andsecond planes wafer 120 should be evident from the description hereinbefore with reference to FIG. 4. It should therefore be understood that the first andsecond planes - As shown in FIG. 13, the
wafer 120 is then moved in adirection 132 which is in a plane of thewafer 120. As discussed with reference to FIG. 6, thewafer 120 can be moved in any direction in a plane of thewafer 120. Thecontact regions 48 can therefore be aligned withterminals 126 on a selected one of thedice 124 which are located in row and columns on thewafer 120. Thecontact regions 48 are equidistantly spaced from theterminals 126. - As shown in FIG. 14, the
wafer 120 is then moved in a direction 134 so that a respective one of theterminals 126 contacts a respective one of the contact regions. Thecontroller 110 controls extension of theextensible arms 60 a to 60 f so that theplanes wafer 120 moves towards theprobes 46. Theterminals 126 therefore contact all of thecontact regions 48 at substantially the same moment in time. Thewafer 120 is then further moved in the direction 134 to cause deflection of thecontact regions 48 against spring action of theprobes 46. While so being moved, theplane 128 of theterminals 126 is maintained in its original orientation by thecontroller 110. Because the plane of theterminals 126 is originally parallel to the plane of thecontact regions 48, and maintained in such an orientation, an equal amount of pressure is applied by eachcontact region 48 to arespective terminal 126. Proper contact between theterminals 126 and thecontact regions 48 is ensured. - The
electrical tester 32 can then provide electrical signals through theelectrical wires 52 and theprobes 46 to theterminals 126. Theterminals 126 are connected to an integrated circuit of semiconductor electronic devices in thewafer 120. Signals can also be provided by the integrated circuit through theterminals 126 and theprobes 46 to theelectrical tester 32. Theelectrical tester 32 can thus test the integrated circuit in thedie 124. - As shown in FIG. 15, the wafer can then be moved in a
direction 136 so that theterminals 126 are again spaced from thecontact regions 48. - The
wafer 120 is then moved in adirection 138 so that thecontact regions 48 are aligned withterminals 126 on another one of thedice 124 in the same row as the die which was tested in FIG. 14. - As shown in FIG. 17, the
wafer 120 can again be moved so that theterminals 126 of thedie 124 is brought into contact with thecontact regions 48 for purposes of testing thedie 124. - The process as shown in FIG. 14 to FIG. 17 can be repeated until each die in a row is tested. The
wafer 120 can then be moved so that thecontact regions 48 are aligned with a die in another column. All the dice in the new column can then be tested in a similar manner, whereafter dice in a further column can be tested, and so on. - It can be seen from the aforegoing description that the
apparatus 20 provides probing of a substrate wherein a plane of contact regions of probes is automatically adjusted to be substantially parallel to a plane of terminals on a substrate, or “planarized” relative to one another. Proper, uniform contact is ensured between the probes and the terminals. Such a feature is very useful for an efficient, fast setup, especially when types of probe cards and substrates are continually being interchanged, and for continually re-adjusting planarity as needed. Further, the co-planarity of the two planes (e.g. how close to being parallel the two planes are) or the height of each extensible arm may be monitored during a probing operation (e.g. while a force from a probe card is pressing against the wafer) and each extensible arm may be adjusted automatically during the probing operation in order to keep both planes substantially parallel to each other. That is, the planes may be kept substantially parallel while the one plane is caused to be pressed toward the other plane (e.g. the plane of probes is pressed onto the wafer's surface). - While certain exemplary embodiments have been described and shown in the accompanying drawings, it s to be understood that such embodiments are merely illustrative and not restrictive of the current invention, and that this invention is not restricted to the specific constructions and arrangements shown and described since modifications may occur to those ordinarily skilled in the art. For example, it may be possible for upper ends of extensible arms of a hexapodal mounting arrangement to extend upwardly past a holder for a substrate and connect to a probe card. The probe card can then be moved by the extensible arms instead of the holder. Retraction of the extensible arms will cause engagement between probes of the probe card and terminals on the substrate. In another embodiment it may also be possible to hang a probe card from a hexapodal mounting arrangement. Extension of the arms of the mounting arrangement will cause engagement between probes of the probe card and terminals on a substrate. It may also be possible for a holder to be at the top and a probe card to be at the bottom. One skilled in the art would appreciate from the teachings of the aforegoing description that other arrangements are also possible. One skilled in the art would however also appreciate the benefits of the present invention, in particular in that the probe card is stationary because of connection to the electrical tester, and that the holder is at the bottom for more convenient handling of a substrate.
Claims (24)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US09/350,510 US6320372B1 (en) | 1999-07-09 | 1999-07-09 | Apparatus and method for testing a substrate having a plurality of terminals |
Applications Claiming Priority (1)
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US09/350,510 US6320372B1 (en) | 1999-07-09 | 1999-07-09 | Apparatus and method for testing a substrate having a plurality of terminals |
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US20010050553A1 true US20010050553A1 (en) | 2001-12-13 |
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KR20160048301A (en) * | 2014-10-23 | 2016-05-04 | 삼성전자주식회사 | bonding apparatus and substrate manufacturing equipment including the same |
CN110587583A (en) * | 2019-10-24 | 2019-12-20 | 上海隐冠半导体技术有限公司 | Six-freedom-degree movement device based on Stewart parallel mechanism and telescopic mechanism thereof |
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