US20020011853A1 - Probe stylus - Google Patents
Probe stylus Download PDFInfo
- Publication number
- US20020011853A1 US20020011853A1 US09/330,155 US33015599A US2002011853A1 US 20020011853 A1 US20020011853 A1 US 20020011853A1 US 33015599 A US33015599 A US 33015599A US 2002011853 A1 US2002011853 A1 US 2002011853A1
- Authority
- US
- United States
- Prior art keywords
- electrically conductive
- probe
- probe stylus
- semiconductor device
- stylus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000523 sample Substances 0.000 title claims abstract description 652
- 239000004065 semiconductor Substances 0.000 claims abstract description 252
- 238000007689 inspection Methods 0.000 claims abstract description 79
- 239000000758 substrate Substances 0.000 description 30
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000005476 soldering Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/0675—Needle-like
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
- G01R1/06761—Material aspects related to layers
Abstract
The present invention relates to a probe stylus 1 for an inspection of semiconductor device in a state of wafer. When a large number of pad 5 are disposed in a semiconductor device, setting of the probe styluses 1 onto a probe card, on which a semiconductor to be inspected shall be mounted, is difficult. An objet of the present invention is to improve the form of the probe stylus to solve this problem.
The object is attained by a probe stylus according to the present invention. The probe stylus 1 is comprised of a first electrically conductive member 2, a second electrically conductive member 3, and an insulating member 4 disposed between the first and second electrically conductive members 2,3, wherein the first and second electrically conductive members 2,3 have a form of a needle and they form a single needle. In an embodiment, the first and second electrically conductive members have a half round cross section. In another embodiment, each of the first and second electrically conductive members has a resilient portion at their tip portion. In another embodiment, the first electrically conductive member is covered with the insulating member, and the insulating member is covered with the second electrically conductive member. In further another embodiment, a slit is disposed between the first and second electrically conductive members.
Description
- 1. Field of the Invention
- The present invention relates to a probe stylus for inspecting a semiconductor at a wafer state.
- 2. Description of the Prior Art
- A probe stylus in the prior art is constituted as a single electrically conductive needle. In a high precise inspection of a semiconductor device at a wafer state, probe styluses for forcing and probe styluses for sensing are connected to pads disposed in a semiconductor. And these probe styluses are connected to form a Kelvin connection. In such a probe stylus, a cantilever type probe stylus and a perpendicular type probe stylus are known. The cantilever type probe stylus contacts obliquely with a pad disposed in a semiconductor device, and the perpendicular type probe stylus contacts perpendicularly with a pad, at an inspection of a semiconductor.
- At an inspection of an I/O of a semiconductor device, for example, a high speed logic element, when an output data of a driver of a tester is inputted into a signal input terminal of a semiconductor, and the output from the output terminal of the semiconductor is received by a comparator of the tester, there is case that a dead band appears. For eliminating such a dead band, it is proposed to use a signal line specialized for transferring the data signal from the output terminal of the tester to the input terminal of the semiconductor and another signal line specialized for transferring the signal from the output terminal of the semiconductor to the comparator of the tester. A dead band means a period, in which the tester cannot judge the semiconductor, because of a conflict of the signals from the output terminal of the semiconductor and the data signal from the output terminal of the driver of the tester.
- Many probe styluses have already been known, which allows to inspect precisely a semiconductor device at a wafer state, even when a large number of pads are disposed in the semiconductor device. Such probe styluses are disclosed, for example, in Japanese Patent Applications JP-A-5-144895, JP-Utility-Model-A-1-174932, JP-A-Utility-Model-61-104380, JP-A-2-124469 and JP-A-4-288847.
- FIG. 62 is a perspective view of a probe stylus disclosed in JP-A-5-144895. FIG. 62 shows a state that a
probe stylus 201 contacts with apad 204 disposed in a semiconductor. Theprobe stylus 201 is a so-called cantilever type probe stylus constituted of a first electricallyconductive member 202 and a second electricallyconductive member 203, which are jointed to each other so as to form a branching structure. - FIG. 63 is a cross sectional view of a probe stylus disclosed in JP-Utility-Model-A-1-174932. FIG. 63 shows that a
probe stylus 211 contacts with apad 216 disposed in a semiconductor. Theprobe stylus 211 is a so-called perpendicular type probe stylus constituted of a first electricallyconductive member 212, a second electricallyconductive member 203 and aninsulating member 214 disposed between the first and second probe stylus. The first and second electricallyconductive members conductive members insulating member 214 are adhered to each other by an adhesive 215. - FIG. 64 is a cross sectional view of a probe stylus disclosed in JP-Utility-Model-A-61-104380. FIG. 64 shows that a
probe stylus 221 contacts with a pad disposed in a semiconductor. Theprobe stylus 221 is a so-called cantilever type probe stylus constituted of a first electricallyconductive member 222, a second electricallyconductive member 223, andinsulating member 224 disposed between and around the first and second electricallyconductive members conductive member 222 has a form of a conventional cantilever type probe stylus. The second electricallyconductive member 223 is thinner than the first electricallyconductive member 222. The first and second electricallyconductive members insulating member 224 so that they form a single body. - FIG. 65 (a) is a side view of a probe stylus disclosed in JP-A-2-124469, FIG. 65(b) is a E1-E1 cross sectional view of FIG. 65 (a). The
probe stylus 231 is a so-called cantilever type probe stylus constituted of a first electrically conductive member for forcing 232, a second electrically conductive member for sensing 233, and aninsulating member 234 disposed between the first and second electricallyconductive members conductive member 232 is covered with the insulatingmember 234, and the outside of the insulatingmember 234, in turn, is covered with the second electricallyconductive members 233. - Also, JP-A-4-288847 discloses a similar probe stylus constituted of a first electrically conductive member for forcing232, which has a form of a conventional cantilever type probe stylus and is covered with an
insulating member 234, and a second electrically conductive member for sensing 233, which covers the outside of the insulatingmember 234. - The probe stylus of the prior art, constituted as a single electrically conductive needle, has following drawbacks. In general, a large number of probe styluses are required for high precision inspection of a semiconductor in a wafer state, when a large number of pad is disposed in the semiconductor device. However, the setting of the probe styluses of the prior art onto a probe card are difficult, when a large number of pads are disposed in a semiconductor device.
- Another drawback is that a probe card tends to warp, when perpendicular type probe styluses contact with the pads disposed in a semiconductor device.
- An object of the present invention is to eliminate these drawbacks of the probe stylus of the prior art.
- Another object is to propose a probe stylus, which allows to inspect precisely a semiconductor at a wafer state, even when a large number of the pads are disposed in a semiconductor device.
- Another object is to propose a probe stylus, which does not cause a warp of the probe card, when the probe styluses contact with the pads, even when a large number of pads are disposed in a semiconductor device.
- The object is attained by a probe stylus according to
claim 1. - In an embodiment the probe stylus of the present invention, the cross section of each of the first and second electrically conductive members perpendicular to their longitudinal direction is half round.
- In another embodiment the probe stylus of the present invention, each of the first and second electrically conductive members has a resilient portion at their tip portion, where the probe stylus contacts with a pad disposed in a semiconductor device.
- In another embodiment the probe stylus of the present invention, the first electrically conductive member is covered with the insulating member, and the insulating member is covered with the second electrically insulating member, and the first and second electrically conductive members are electrically connected to each other at their tip portion.
- In another embodiment the probe stylus of the present invention, the first electrically conductive member is covered with the insulating member, and the insulating member is covered with the second electrically insulating member, and the first and second electrically conductive members are not electrically connected to each other at their tip portion, but are connected to each other through a pad disposed in a semiconductor device at an inspection of the semiconductor device.
- In another embodiment the probe stylus of the present invention, the probe stylus is a cantilever type probe stylus, and a slit is disposed between the first and second electrically conductive members at their tip portion, where the probe stylus contacts with a pad disposed in a semiconductor device, the slit opens when the probe stylus contacts with a pad disposed in the semiconductor device so that the first and second electrically conductive members separate from each other.
- FIG. 1 is a schematic side view of a probe stylus as a first embodiment of the present invention.
- FIG. 2 is a plan view of the probe stylus seen from the side A in FIG. 1.
- FIG. 3 is a cross sectional view of the probe stylus along B-B line in FIG. 1.
- FIG. 4 is a cross sectional view of a probe card having probe styluses according to the first embodiment of the present invention.
- FIG. 5 is a detailed cross sectional view of the a connecting portion of a probe stylus and the probe card of FIG. 4.
- FIG. 6 is a plan view of the connecting portion of a probe stylus and the probe card seen from the side D in FIG. 5.
- FIG. 7 is a schematic side view of a probe stylus as a second embodiment of the present invention.
- FIG. 8 is a cross sectional view of the probe stylus along E-E line in FIG. 7.
- FIG. 9 is a plan view of a probe stylus as a third embodiment of the present invention.
- FIG. 10 is a side view of the probe stylus seen from the side F in FIG. 9.
- FIG. 11 is a cross sectional view of the probe stylus along G-G line in FIG. 11.
- FIG. 12 is a plan view of the connecting portion of a probe stylus according to the third embodiment and a probe card seen from the bottom side.
- FIG. 13 is a plan view of a probe stylus according to the fourth embodiment.
- FIG. 14 is a cross sectional view of the probe stylus along H-H line in FIG. 13.
- FIG. 15 is a schematic side view of a probe stylus as a fifth embodiment of the present invention.
- FIG. 16 is a cross sectional view of the probe stylus along I-I line in FIG. 15.
- FIG. 17 is a cross sectional views of a probe card having probe styluses according to the fifth embodiment of the present invention.
- FIG. 18 is a detailed cross sectional view of the probe card at the connecting portion of a probe card and a probe stylus according to the fifth embodiment, showing an example of the connection between them.
- FIG. 19 a detailed cross sectional view of the probe card at the connecting portion of a probe card and a probe stylus according to the fifth embodiment, showing another example of the connection between them.
- FIG. 20 is a schematic side view of a probe stylus as a sixth embodiment of the present invention.
- FIG. 21 is a cross sectional view of the probe stylus along K-K line in FIG. 20.
- FIG. 22 is a schematic side view of a probe stylus as a seventh embodiment of the present invention.
- FIG. 23 is a cross sectional view of the probe stylus along L-L line in FIG. 22.
- FIG. 24 is a schematic side view of a probe stylus as an eighth embodiment of the present invention.
- FIG. 25 is a cross sectional view of the probe stylus along M-M line in FIG. 24.
- FIG. 26 is a schematic side view of a probe stylus as a ninth embodiment of the present invention.
- FIG. 27 is a cross sectional view of the probe stylus along N-N line in FIG. 26.
- FIG. 28 is a schematic side view of a probe stylus as a tenth embodiment of the present invention.
- FIG. 29 is a cross sectional view of the probe stylus along O-O line in FIG. 28.
- FIG. 30 is a schematic side view of a probe stylus as an eleventh embodiment of the present invention.
- FIG. 31 is a cross sectional view of the probe stylus along P-P line in FIG. 30.
- FIG. 32 is a schematic side view of a probe stylus as a twelfth embodiment of the present invention.
- FIG. 33 is a cross sectional view of the probe stylus along Q-Q line in FIG. 32.
- FIG. 34 is a schematic side view of a probe stylus as a thirteenth embodiment of the present invention.
- FIG. 35 is a cross sectional view of the probe stylus along R-R line in FIG. 34.
- FIG. 36 is a schematic side view of a probe stylus as a fourteenth embodiment of the present invention.
- FIG. 37 is a cross sectional view of the probe stylus along S-S line in FIG. 36.
- FIG. 38 is a schematic side view of a probe stylus as a fifteenth embodiment of the present invention.
- FIG. 39 is a cross sectional view of the probe stylus along T-T line in FIG. 38.
- FIG. 40 is a schematic side view of a probe stylus as a sixteenth embodiment of the present invention.
- FIG. 41 is a cross sectional view of the probe stylus along U-U line in FIG. 40.
- FIG. 42 is a schematic side view of a probe stylus as a seventeenth embodiment of the present invention.
- FIG. 43 is a cross sectional view of the probe stylus along V-V line in FIG. 42.
- FIG. 44 is a cross sectional views of a connecting portion between a probe card a probe stylus according to the seventeenth embodiment of the present invention.
- FIG. 45 is a schematic side view of a probe stylus as a eighteenth embodiment of the present invention.
- FIG. 46 is a cross sectional view of the probe stylus along W-W line in FIG. 45.
- FIG. 47 is a schematic side view of a probe stylus as a nineteenth embodiment of the present invention.
- FIG. 48 is a cross sectional view of the probe stylus along X-X line in FIG. 47.
- FIG. 49 is a detailed cross sectional view of an example of the connecting portion between the probe card and a substrate of a probe stylus according to the nineteenth embodiment.
- FIG. 50 is a detailed cross sectional view of another example of the connecting portion between the probe card and a substrate of a probe stylus according to the nineteenth embodiment.
- FIG. 51 is a schematic side view of a probe stylus as a twentieth embodiment of the present invention.
- FIG. 52 is a cross sectional view of the probe stylus along Y-Y line in FIG. 51.
- FIG. 53 is a schematic side view of a probe stylus as a twenty-first embodiment of the present invention.
- FIG. 54 is a cross sectional view of the probe stylus along Z-Z line in FIG. 53.
- FIG. 55 is a schematic side view of a probe stylus as a twenty-second embodiment of the present invention.
- FIG. 56 is a cross sectional view of the probe stylus along A1-A1 line in FIG. 55.
- FIG. 57 is a schematic plan view of a probe stylus according to the twenty-third embodiment at a state that the probe stylus is not contacting with a pad disposed in a semiconductor.
- FIG. 58 is a schematic plan view of a probe stylus according to the twenty-third embodiment at a state that the probe stylus is contacting with a pad disposed in a semiconductor.
- FIG. 59 is a side view of a probe stylus seen from the side B1 in FIG. 57.
- FIG. 60 is a cross sectional view of an example of a probe stylus, (a) shows a cross section along the line C1-C1 in FIG. 57, (b) shows a cross section along the line D1-D1 in FIG. 57.
- FIG. 61 is a cross sectional view of another example of a probe stylus, which has a form different from that of FIG. 60, (a) shows a cross section along the line C1-C1 in FIG. 57, (b) shows a cross section along the line D1-D1 in FIG. 57.
- FIG. 62 is a perspective view of a probe stylus disclosed in JP-A-5-144895.
- FIG. 63 is a cross sectional view of a probe stylus disclosed in JP-Utility-Model-A-5-144895.
- FIG. 64 is a cross sectional view of a probe stylus disclosed in JP-Utility-Model-A-61-104380.
- FIG. 65 (a) is a side view of a probe stylus disclosed in JP-A-61-104380, FIG. 65(b) is a E1-E1 cross sectional view of FIG. 65 (a).
- FIRST EMBODIMENT
- The first embodiment of the probe stylus according to the present invention is explained below, referring to FIG. 1-6. FIGS. 1 and 2 show that the
probe stylus 1 is contacting with apad 5 disposed in a semiconductor device. - The
probe stylus 1 of the first embodiment of the present invention is a so-called cantilever type probe stylus. Each of the first and second electricallyconductive members conductive members probe stylus 1 contacts with apad 5 disposed in a semiconductor device. In this embodiment, the first and second electricallyconductive members - Referring to FIG. 4, a
base substrate 12 of theprobe card 11 has acenter hole 13, and aprobe stylus 1 is fixed to aring 14 by asynthetic resin 15. FIG. 5 shows a detailed cross sectional view of the part C in FIG. 4 framed by a broken line. FIG. 6 is a plan view of the connecting portion of a probe stylus and the probe card seen from the side D in FIG. 5. Referring to FIG. 6, first andsecond lands base substrate 12 of theprobe card 1. And the first electricallyconductive member 2 contacts with afirst land 16, the second electricallyconductive member 3 contacts with asecond land 17.Reference numeral 18 denotes soldering portion connecting the first and second electricallyconductive members second land - The function of the probe card and the probe stylus is explained below.
- At a precise inspection of a semiconductor device at a wafer state, a
probe stylus 1 is brought in contact with apad 5 disposed in a semiconductor device. And one of the first and second electricallyconductive member probe stylus 1, when a Kelvin connection is formed at the tips of the first and second electricallyconductive members - At an inspection of an I/O of a semiconductor device at a wafer state, the
probe stylus 1 is brought in contact with apad 5 disposed in the semiconductor device, and one of the first and second electricallyconductive member pad 5 disposed in the semiconductor device, and the line specialized for transferring the output data signal from thepad 5 to the comparator of the tester are assured up to the tip of the probe stylus. - As explained, the
probe stylus 1 according to the first embodiment of the present invention has a first electricallyconductive member 2 and a second electricallyconductive member 3. Therefore, such a probe stylus functions equivalent to two probe styluses of the prior art. As a result, by contacting one probe stylus to one of the pads disposed in a semiconductor device, it is possible to eliminate so-called dead band in the comparator in a precise inspection of a semiconductor device at a wafer state, or in an inspection of an I/O of a semiconductor device at a wafer state. Also in a case that a large number of pads are disposed in a semiconductor device, corresponding large number of probe styluses can be disposed on a probe card, so that so-called dead band in the comparator can be eliminated in such a precise inspection of a semiconductor device at a wafer state, or in an inspection of an I/O of a semiconductor device at a wafer state. - A probe stylus according to the first embodiment of the present invention functions equivalently to two probe styluses of the prior art, hence, the number of
probe styluses 1 to be attached to a probe card and/or the area required for the arrangement of the probe stylus in a probe card can be reduced, as a result, the fabrication cost can be reduced. - Additionally, according to the first embodiment of the present invention, each of the first and second electrically conductive members has a half round cross section perpendicular to the longitudinal direction. Therefore, the thickness of the probe stylus according to the first embodiment is smaller than that of bundled two probe styluses of the prior art. As a result, also in a case that a large number of pads are disposed in a semiconductor device, a corresponding number of the
probe styluses 1 can be attached onto a probe card. - SECOND EMBODIMENT
- In a probe stylus according to the first embodiment, the first and second electrically
conductive members - FIG. 7 shows that the probe stylus1 a is contacting with a
pad 5 disposed in a semiconductor device. Referring to the figure,reference numerals conductive members member 4 a arranged between them.Reference numeral 5 denotes a pad disposed in a semiconductor. - The structure of a probe card having probe stylus1 a according to the second embodiment is similar to that of the probe card shown in FIG. 4. The connection between a probe stylus 1 a and the substrate of a probe card is similar to that shown in FIGS. 5, 6.
- The function of the probe card and the probe stylus is explained below.
- At a precise inspection of a semiconductor device at a wafer state, a probe stylus1 a is brought in contact with a
pad 5 disposed in the semiconductor device. And one of the first and second electricallyconductive member pad 5, therefore, the value of voltage and/or electric current can be compensated up to thepad 5, when a Kelvin connection are formed on thepad 5. - At an inspection of an I/O of a semiconductor device at a wafer state, the probe stylus1 a is brought in contact with a
pad 5 disposed in the semiconductor device, and one of the first and second electricallyconductive member conductive member pad 5. Therefore, a line specialized for transferring output data signal from the driver to thepad 5 disposed in the semiconductor device (hereinafter referred to “a line for driver”), and a line specialized for transferring the output data signal from thepad 5 to the comparator of the tester (hereinafter referred to “a line for comparator) are assured up to thepad 5. - As explained, the first and second electrically
conductive members pad 5 disposed in the semiconductor at an inspection of a semiconductor device. Therefore, the value of voltage and/or electric current can be compensated up to thepad 5, at a precise inspection of a semiconductor device at a wafer state. And a line for driver and a line for comparator are assured up to thepad 5, at an inspection of an I/O of a semiconductor device at a wafer state. As a result, a higher precision inspection of a semiconductor device is possible. - A probe stylus according to the second embodiment has similar advantages to that of a probe stylus according to the first embodiment.
- THIRD EMBODIMENT
- The first and second electrically
conductive members - FIG. 9 and10 show that a probe stylus 1 b contacts with a
pad 5 disposed in a semiconductor device. Referring to the figures,reference numerals conductive members member 4 b arranged between them.Reference numeral 5 denotes a pad disposed in a semiconductor. - The structure of a probe card having probe stylus1 b according to the third embodiment is similar to that of the probe card shown in FIG. 4. FIG. 12 corresponds to FIG. 6. An element in FIG. 12 corresponding to an element in FIGS. 6, 9 are referred by the same reference numeral. The function of each element of a probe stylus according to the third embodiment is similar to that of a probe stylus according to the first embodiment.
- Because the first and second electrically
conductive members pad 5 disposed in a semiconductor. As a result, the structural reliability of the probe stylus is improved. - A probe stylus according to the third embodiment has similar advantages to that of a probe stylus according to the first embodiment.
- FOURTH EMBODIMENT
- In a probe stylus according to the third embodiment, the first and second electrically
conductive members - FIG. 13 shows that the
probe stylus 1 c is contacting with apad 5 disposed in a semiconductor device. Referring to the figures,reference numerals conductive members member 4 c arranged between them.Reference numeral 5 denotes a pad disposed in a semiconductor. - The structure of a probe card having
probe stylus 1 c according to the fourth embodiment is similar to that of the probe card shown in FIG. 4. The connection between aprobe stylus 1 c and the substrate of a probe card is similar to that shown in FIG. 12. The function of the probe stylus according to the fourth embodiment is similar to that of second embodiment. - As explained, the first and second electrically
conductive members pad 5 disposed in the semiconductor at an inspection of a semiconductor device. Therefore, the value of voltage and/or electric current can be compensated up to thepad 5, at a precise inspection of a semiconductor device at a wafer state. And a line for driver and a line for comparator are assured up to thepad 5, at an inspection of an I/O of a semiconductor device at a wafer state. As a result, a higher precision inspection of a semiconductor device becomes possible. - A probe stylus according to the fourth embodiment has similar advantages to that of a probe stylus according to the third embodiment.
- FIFTH EMBODIMENT
- FIG. 15 shows that the
probe stylus 21 is contacting with apad 5 disposed in a semiconductor device. Referring to the figure,reference numerals conductive members member 24 arranged between them.Reference numeral 5 denotes a pad disposed in a semiconductor device. - The
probe stylus 21 of the fifth embodiment of the present invention is a so-called perpendicular type probe stylus. Each of the first and second electricallyconductive members conductive member conductive members probe stylus 21 contacts with apad 5 disposed in a semiconductor device. - Referring to FIG. 17,
probe card 31 comprises afirst substrate 32, asecond substrate 33, athird substrate 34, aring 35 andwiring 36. FIG. 18 shows a detailed cross sectional view of the part J framed by a broken line in FIG. 17. As shown in FIG. 18, afirst land 37, asecond land 38 are formed at thesecond substrate 33. And a fixingring 39 fixes theprobe stylus 21 to thethird substrate 34. Thewiring 36 is fixed to thesecond substrate 33 by asoldering 40. The structure of other elements is similar to that of the elements referred by the same reference numeral in FIGS. 15 and 17. - FIG. 19 shows a different connection of the probe card and the probe stylus according to the fifth embodiment. FIG. 19 shows a detailed cross sectional view of the part J framed by a broken line in FIG. 17. Referring to FIG. 19, wiring36 is fixed to the
second substrate 33 through a first and secondsingle contactors spring 43 is disposed between the hole of the second substrate and each of the first and secondsingle contactors - The function of the probe stylus according to the fifth embodiment is identical to that of the first embodiment. And the advantage of the probe stylus according to the fifth embodiment is similar to that of third embodiment.
- SIXTH EMBODIMENT
- In a probe stylus according to the fifth embodiment, the first and second electrically
conductive members conductive members - FIG. 20 shows that the
probe stylus 21 a is contacting with apad 5 disposed in a semiconductor device. Referring to the figure,reference numerals conductive members member 24 a arranged between them.Reference numeral 5 denotes a pad disposed in a semiconductor. - The structure of a probe card having
probe styluses 21 a according to the sixth embodiment is similar to that of probe card shown in FIG. 17. The structure of the connecting part of a probe card and aprobe stylus 21 a according to the sixth embodiment is similar to that of shown in FIGS. 18, 19. - The function of the probe stylus according to the sixth embodiment is similar to that of the second embodiment of the present invention.
- And the advantage of the probe stylus according to the sixth embodiment is similar to that of fourth embodiment.
- SEVENTH EMBODIMENT
- FIG. 22 shows that the
probe stylus 51 is contacting with apad 5 disposed in a semiconductor device. Referring to the figure,reference numerals conductive members member 54 arranged between them.Reference numeral 5 denotes a pad disposed in a semiconductor. - The
probe stylus 51 of the seventh embodiment of the present invention is a so-called perpendicular type probe stylus. Each of the first and second electricallyconductive members conductive members probe stylus 1 contacts with apad 5 disposed in the semiconductor device. A probe stylus according to the seventh embodiment of the present invention has a circular resilient portion at the tip portion of the first and second electricallyconductive members probe stylus 1 contacts with apad 5 disposed in a semiconductor device. - The structure of a probe card having
probe styluses 51 according to the seventh embodiment is similar to that of probe card shown in FIG. 17. The structure of the connecting part of a probe card and aprobe stylus 51 according to the seventh embodiment is similar to that of shown in FIGS. 18, 19. - The function of the probe stylus according to the seventh embodiment is similar to that of the first embodiment of the present invention.
- As explained, the
probe stylus 51 according to the seventh embodiment of the present invention has a first electricallyconductive member 52 and a second electricallyconductive member 53. Therefore, the probe stylus functions equivalent to two probe styluses in the prior art. As a result, by contacting one probe stylus to each pad disposed in a semiconductor device, it is possible to eliminate so-called dead band in the comparator in a precise inspection of a semiconductor device at a wafer state, or in an inspection of an I/O of a semiconductor device at a wafer state. Also in a case that a large number of pads are disposed in a semiconductor device, corresponding large number of probe styluses can be disposed on a probe card, so that so-called dead band in the comparator can be eliminated in a precise inspection of a semiconductor device at a wafer state, or in an inspection of an I/O of a semiconductor device at a wafer state. - A probe stylus according to the seventh embodiment of the present invention functions equivalently to two probe stylus in the prior art, hence, the number of
probe styluses 51 to be attached to a probe card and/or the area required for the arrangement of the probe stylus in a probe card can be reduced, as a result, the fabrication cost can be reduced. - Because the
probe stylus 51 according to the seventh embodiment is a so-called perpendicular type probe stylus, a force urges the first and second electricallyconductive members probe stylus 51 contacts with apad 5 disposed in a semiconductor. As a result, the structural reliability of theprobe stylus 51 is improved. - In a probe stylus according to the seventh embodiment of the present invention, a circular resilient portion is formed at the tip portion of the first and second electrically
conductive members probe stylus 51 contacts with apad 5 disposed in the semiconductor device. As a result, the impact at the contact of the probe stylus and the pad disposed in the semiconductor is absorbed by the circular resilient portion. Therefore, a warp of a probe card, which may be caused by the contact of the probe styluses and the pads, can be avoided. - According to the seventh embodiment of the present invention, each of the first and second electrically
conductive members conductive members - EIGHTH EMBODIMENT
- In a probe stylus according to the seventh embodiment, the first and second electrically
conductive members - FIG. 24 shows that the
probe stylus 51 a is contacting with apad 5 disposed in a semiconductor device. Referring to the figures,reference numerals conductive members member 54 a arranged between them.Reference numeral 5 denotes a pad disposed in a semiconductor. - The structure of a probe card having
probe stylus 51 a according to the eighth embodiment is similar to that of the probe card shown in FIG. 17. The connection between aprobe stylus 51 a and the substrate of a probe card is similar to that shown in FIGS. 18, 19. The function of the probe stylus and the probe card is similar to that of the second embodiment. - As explained, in the probe stylus according to the eighth embodiment, the first and second electrically
conductive members pad 5 disposed in a semiconductor at an inspection of a semiconductor device. Therefore, the value of voltage and/or electric current can be compensated up to thepad 5, at a precise inspection of a semiconductor device at a wafer state. And a line for driver and a line for comparator are assured up to thepad 5, at an inspection of an I/O of a semiconductor device at a wafer state. As a result, a higher precision inspection of a semiconductor device becomes possible. A probe stylus according to the eighth embodiment has similar advantages to that of a probe stylus according to the seventh embodiment. - NINTH EMBODIMENT
- In a probe stylus according to the seventh embodiment, the cross section perpendicular to the longitudinal direction of the electrically
conductive members - FIG. 26 shows that the
probe stylus 51 a is contacting with apad 5 disposed in a semiconductor device. Referring to the figure,reference numerals conductive members member 54 a arranged between them.Reference numeral 5 denotes a pad disposed in a semiconductor. - The structure of a probe card having
probe stylus 51 b according to the ninth embodiment is similar to that of the probe card shown in FIG. 17. The connection between aprobe stylus 51 b and the substrate of a probe card is similar to that shown in FIGS. 18, 19. The function of the probe stylus and the probe card is similar to that of the first embodiment. - As explained, the
probe stylus 51 b according to the ninth embodiment of the present invention has a first electricallyconductive member 52 b and a second electricallyconductive member 53 b. Therefore, theprobe stylus 51 b functions equivalently to two probe styluses in the prior art. As a result, by contacting one probe stylus to each pad disposed in the semiconductor device, it is possible to eliminate so-called dead band in the comparator in a precise inspection of a semiconductor device at a wafer state, or in an inspection of an I/O of a semiconductor device at a wafer state. Hence, in a case that a large number of pads are disposed in a semiconductor device, corresponding large number ofprobe styluses 51 b can be disposed on a substrate of a probe card, so that so-called dead band in the comparator can be eliminated in a precise inspection of a semiconductor device at a wafer state, or in an inspection of an I/O of a semiconductor device at a wafer state. - Because the
probe stylus 51 b according to the ninth embodiment functions equivalently to two probe styluses in the prior art, the number ofprobe styluses 51 b to be attached to a probe card and/or the area required for the arrangement of theprobe stylus 51 b in a probe card can be reduced. As a result, the fabrication cost can be reduced. - Additionally, according to the ninth embodiment of the present invention, each of the first and second electrically
conductive members - Because the
probe stylus 51 b according to the ninth embodiment is a so-called perpendicular type probe stylus, a force urges the first and second electricallyconductive members probe stylus 51 b contacts with apad 5 disposed in a semiconductor. As a result, the structural reliability of theprobe stylus 51 b is improved. - In a probe stylus according to the ninth embodiment of the present invention, a circular resilient portion is formed at the tip portion of the first and second electrically
conductive members probe stylus 51 b contacts with apad 5 disposed in the semiconductor device. As a result, the impact at the contact of the probe stylus and the pad disposed in the semiconductor is absorbed by the circular resilient portion. Therefore, a warp of a probe card, which may be caused by the contact of the probe styluses and the pads, can be avoided. - TENTH EMBODIMENT
- In a probe stylus according to the ninth embodiment, the first and second electrically
conductive members - FIG. 28 shows that the
probe stylus 51 a is contacting with apad 5 disposed in a semiconductor device. Referring to the figure,reference numerals conductive members member 54 a arranged between them.Reference numeral 5 denotes a pad disposed in a semiconductor. - The structure of a probe card having
probe stylus 51 c according to the tenth embodiment is similar to that of the probe card shown in FIG. 17. The connection between aprobe stylus 51 c and the substrate of a probe card is similar to that shown in FIGS. 18, 19. The function of the probe stylus and the probe card is similar to that of the second embodiment. - As explained, the first and second electrically
conductive members pad 5 disposed in the semiconductor at an inspection of a semiconductor device. Therefore, the value of voltage and/or electric current can be compensated up to thepad 5, at a precise inspection of a semiconductor device at a wafer state. And a line for driver and a line for comparator are assured up to thepad 5, at an inspection of an I/O of a semiconductor device at a wafer state. As a result, a higher precision inspection of a semiconductor device becomes possible. - A probe stylus according to the tenth embodiment has similar advantages to that of a probe stylus according to the ninth embodiment.
- ELEVENTH EMBODIMENT
- FIG. 30 shows that the
probe stylus 61 is contacting with apad 5 disposed in a semiconductor device. Referring to the figure,reference numerals conductive members member 64 arranged between them.Reference numeral 5 denotes a pad disposed in a semiconductor. - The
probe stylus 61 of the eleventh embodiment of the present invention is a so-called perpendicular type probe stylus. Each of the first and second electricallyconductive members conductive member - A probe stylus according to the eleventh embodiment of the present invention has a Y-formed resilient portion at the tip portion of the first and second electrically
conductive members probe stylus 61 contacts with apad 5 disposed in a semiconductor device. The first and second electrically conductive members 6 are connected to each other through a third electrically conductive member 65, which is disposed between the tip of the electrically conductive members, where the probe stylus contacts with a pad disposed in a semiconductor device. - The structure of a probe card having
probe stylus 61 according to the eleventh embodiment is similar to that of the probe card shown in FIG. 17. The connection between aprobe stylus 61 and the substrate of a probe card is similar to that shown in FIGS. 18, 19. The function of the probe stylus and the probe card is similar to that of the second embodiment. - As explained, according to the eleventh embodiment, the tip portion of a
probe stylus 61, where the probe stylus contacts with a pad disposed in a semiconductor device, is widened, therefore aprobe stylus 61 contacts with apad 5 at two points. As a result, the electric resistance at the contact between the probe stylus and the pad is small. A probe stylus according to the eleventh embodiment has advantages similar to that of the seventh embodiment. - TWELFTH EMBODIMENT
- In a probe stylus according to the eleventh embodiment, the first and second electrically
conductive members conductive members - FIG. 32 shows that the
probe stylus 61 a is contacting with apad 5 disposed in a semiconductor device. Referring to the figure,reference numerals conductive members member 64 a arranged between them.Reference numeral 5 denotes a pad disposed in a semiconductor. - The structure of a probe card having
probe stylus 61 a according to the twelfth embodiment is similar to that of the probe card shown in FIG. 17. The connection between aprobe stylus 61 a and the substrate of a probe card is similar to that shown in FIGS. 18, 19. The function of the probe stylus and the probe card is similar to that of the second embodiment. - As explained, according to the twelfth embodiment, the tip portion of a
probe stylus 61 a, where the probe stylus contacts with the pad disposed in a semiconductor device, is widened, therefore aprobe stylus 61 contacts with apad 5 at two points. As a result, the electric resistance at the contact between the probe stylus and the pad is small. A probe stylus according to the twelfth embodiment has advantages similar to that of the eighth embodiment. - THIRTEENTH EMBODIMENT
- In a probe stylus according to the eleventh embodiment, the cross section perpendicular to the longitudinal direction of the electrically
conductive members - FIG. 34 shows that the
probe stylus 61 b is contacting with apad 5 disposed in a semiconductor device. Referring to the figure,reference numerals conductive members member 64 a arranged between them. The firsts and second electricallyconductive members conductive member 65 b.Reference numeral 5 denotes a pad disposed in a semiconductor. - The structure of a probe card having
probe stylus 61 b according to the thirteenth embodiment is similar to that of the probe card shown in FIG. 17. The connection between aprobe stylus 61 b and the substrate of a probe card is similar to that shown in FIGS. 18, 19. The function of the probe stylus and the probe card is similar to that of the first embodiment. - A probe stylus according to the thirteenth embodiment has advantages similar to that of the ninth embodiment.
- FOURTEENTH EMBODIMENT
- In a probe stylus according to the thirteenth embodiment, the first and second electrically
conductive members conductive member 65 b disposed near to their tip. On the other hand, in a probe stylus according to the fourteenth embodiment of the present invention, no such a third electrically conductive member for connecting the first aid second electrically conductive members are disposed. And at an inspection of a semiconductor device, they are connected to each other through a pad disposed in a semiconductor device. The other feature is similar to that of the thirteenth embodiment. - FIG. 36 shows that the probe stylus is contacting with a pad disposed in a semiconductor device. Referring to the figure,
reference numerals conductive members member 64 c arranged between them.Reference numeral 5 denotes a pad disposed in a semiconductor. - The structure of a probe card having
probe stylus 61 c according to the fourteenth embodiment is similar to that of the probe card shown in FIG. 17. The connection between aprobe stylus 61 c and the substrate of a probe card is similar to that shown in FIGS. 18, 19. The function of the probe stylus and the probe card is similar to that of the second embodiment. - A probe stylus according to the fourteenth embodiment has advantages similar to that of the tenth embodiment.
- FIFTEENTH EMBODIMENT
- FIG. 38 shows that the probe stylus is contacting with a pad disposed in a semiconductor device. Referring to the figure,
reference numerals conductive members member 74 arranged between them.Reference numeral 5 denotes a pad disposed in a semiconductor. - The
probe stylus 71 of the fifteen embodiment of the present invention is a so-called perpendicular type probe stylus. Each of the first and second electricallyconductive members conductive member 72 is smaller than that of the first electricallyconductive member 73. Namely, the assembly of the probe stylus of the fifteenth embodiment has a thickness substantially equal to the conventional probe stylus. A probe stylus according to the fifteenth embodiment of the present invention has an arc or jack-knifed resilient portion at the tip portion of the first and second electricallyconductive members pad 5 disposed in a semiconductor device. The first and second electricallyconductive members pad 5 disposed in the semiconductor device. - The structure of a probe card having
probe styluses 71 according to the fifteenth embodiment is similar to that of probe card shown in FIG. 17. The structure of the connecting part of a probe card and aprobe stylus 71 according to the seventh embodiment is similar to that of shown in FIGS. 18, 19. The function of the probe stylus according to the fifteenth embodiment is similar to that of the first embodiment of the present invention. - As explained, the
probe stylus 71 according to the fifteenth embodiment of the present invention has a first electricallyconductive member 72 and a second electricallyconductive member 73. Therefore, the probe stylus functions equivalent to two probe styluses in the prior art. As a result, by contacting one probe stylus to each pad disposed in the semiconductor device, it is possible to eliminate so-called dead band in the comparator in a precise inspection of a semiconductor device at a wafer state, or in an inspection of an I/O of a semiconductor device at a wafer state. Also in a case that a large number of pads are disposed in a semiconductor device, corresponding large number of probe styluses can be disposed on a probe card, so that so-called dead band in the comparator can be eliminated in a precise inspection of a semiconductor device at a wafer state, or in an inspection of an I/O of a semiconductor device at a wafer state. - A probe stylus according to the fifteenth embodiment of the present invention functions equivalently to two probe stylus in the prior art, hence, the number of
probe styluses 71 to be attached to a probe card and/or the area required for the arrangement of the probe stylus in a probe card can be reduced, as a result, the fabrication cost can be reduced. - According to the fifteenth embodiment of the present invention, the diameter of the second electrically
conductive member 73 is smaller than that of the first electricallyconductive member 72. And the diameter of theprobe stylus 71 is substantially equal to that of a probe stylus of the prior art. Therefore, the thickness of theprobe stylus 71 according to the fifteenth embodiment is smaller than that of bundled two probe styluses in the prior art. As a result, also in a case that a large number of pads are disposed in a semiconductor device, a corresponding number of theprobe styluses 1 can be attached onto a probe card. - In a probe stylus according to the fifteenth embodiment of the present invention, an arc or jack-knifed resilient portion is formed at the tip portion of the first and second electrically
conductive members probe stylus 71 contacts with apad 5 disposed in the semiconductor device. As a result, the impact at the contact of the probe stylus and the pad disposed in the semiconductor is absorbed by the resilient portion. Therefore, a warp of a probe card, which may be caused by the contact of the probe styluses and the pads, can be avoided. - According to the fifteenth embodiment, the first electrically
conductive member 72 has a round cross section perpendicular to the longitudinal direction. And the diameter of the first electrically conductive members is substantially equal to that of a probe stylus in the prior art. Therefore, a current capacity of an electrically conductive member for forcing at a precise inspection of I/O of a semiconductor device at a wafer state can be assured to be equal to that of probe stylus for forcing in the prior art. - SIXTEENTH EMBODIMENT
- In a probe stylus according to the fifteenth embodiment, the first and second electrically
conductive members - FIG. 40 shows that the probe stylus is contacting with a pad disposed in a semiconductor device. Referring to the figure, reference numerals71 c, 72 c, 73 c denote a probe stylus, a first electrically conductive member, and a second electrically conductive member, respectively. The first and second electrically
conductive members Reference numeral 5 denotes a pad disposed in a semiconductor. - The structure of a probe card having probe stylus71 c according to the sixteenth embodiment is similar to that of the probe card shown in FIG. 17. The connection between a probe stylus 71 c and the substrate of a probe card is similar to that shown in FIGS. 18, 19. The function of the probe stylus and the probe card is similar to that of the second embodiment.
- As explained, the first and second electrically
conductive members pad 5 disposed in a semiconductor at an inspection of a semiconductor device. Therefore, the value of voltage and/or electric current can be compensated up to thepad 5, at a precise inspection of a semiconductor device at a wafer state. And a line for driver and a line for comparator are assured up to thepad 5, at an inspection of an I/O of a semiconductor device at a wafer state. As a result, a higher precision inspection of a semiconductor device becomes possible. - A probe stylus according to the sixteenth embodiment has advantages similar to that of the fifteenth embodiment.
- SEVENTEENTH EMBODIMENT
- FIG. 42 shows that the probe stylus is contacting with a pad disposed in a semiconductor device. Referring to the figure,
reference numerals conductive members member 84 arranged between them.Reference numeral 5 denotes a pad disposed in a semiconductor. - The
probe stylus 81 of the seventeenth embodiment of the present invention is a so-called cantilever type probe stylus. The first electricallyconductive members 82 has a form of needle. The cross section perpendicular to the longitudinal direction of the needle is round. The second electricallyconductive member 83 has a form of cylinder covering the first electricallyconductive member 82. In this embodiment, the first electricallyconductive member 82 has a thickness equal to that of a cantilever type probe stylus in the prior art, and the outer side of the first electrically conductive member is covered with an insulatingmember 84. Further, the outside of the insulatingmember 84 is covered with the second electricallyconductive member 83. Thus, the assembly of the probe stylus of the seventeenth embodiment has a thickness substantially equal to a cantilever type probe stylus in the prior art. The first and second electricallyconductive members - The structure of a probe card having
probe stylus 81 according to the seventeenth embodiment is similar to that of the probe card shown in FIG. 4. FIG. 44 is a detailed cross sectional view of the connecting portion between the probe card and a probe stylus according to the seventeenth embodiment. FIG. 44 corresponds to FIG. 5. Each element in FIG. 44 corresponding to an element in FIGS. 5 and/or 42 is referred by the same reference numeral. The function of the probe stylus and the probe card is similar to that of the first embodiment. - As explained, the
probe stylus 81 according to the seventeenth embodiment of the present invention has a first electricallyconductive member 82 and a second electricallyconductive member 83. Therefore, such a probe stylus functions equivalent to two probe styluses in the prior art. As a result, by contacting one probe stylus to each pad disposed in the semiconductor device, it is possible to eliminate so-called dead band in the comparator in a precise inspection of a semiconductor device at a wafer state, or in an inspection of an I/O of a semiconductor device at a wafer state. Also in a case that a large number of pads are disposed in a semiconductor device, corresponding large number of probe styluses can be disposed on a probe card, so that so-called dead band in the comparator can be eliminated in a precise inspection of a semiconductor device at a wafer state, or in an inspection of an I/O of a semiconductor device at a wafer state. - A probe stylus according to the seventeenth embodiment of the present invention functions equivalently to two probe stylus in the prior art, hence, the number of
probe styluses 81 to be attached to a probe card and/or the area required for the arrangement of the probe stylus in a probe card can be reduced, as a result, the fabrication cost can be reduced. - In this embodiment, the assembly of the probe stylus of the seventeenth embodiment has a thickness substantially equal to a cantilever type probe stylus in the prior art. Therefore, the thickness of the
probe stylus 81 according to the seventeenth embodiment is smaller than that of bundled two probe styluses in the prior art. As a result, also in a case that a large number of pads are disposed in a semiconductor device, a corresponding number of the probe styluses 81 can be attached onto a probe card. - According to the seventeenth embodiment of the present invention, the first electrically
conductive members 82 has a round cross section perpendicular to the longitudinal direction. And the diameter of the first electrically conductive members is substantially equal to that of a probe stylus in the prior art. Therefore, a current capacity of an electrically conductive member for forcing can be assured to be equal to that of probe stylus for forcing in the prior art, when the first electricallyconductive members 82 is used as an electrically conductive member for forcing at a precise inspection of I/O of a semiconductor device at a wafer state. - According to the seventeenth embodiment, the first electrically
conductive member 82 is covered with an insulatingmember 84, and the insulatingmember 84, in turn, is covered with the second electricallyconductive member 83. Therefore, when the first electricallyconductive member 82 is used for sensing, the electrically conductive member for sensing can be protected from external noises. - EIGHTEENTH EMBODIMENT
- In a probe stylus according to the seventeenth embodiment, the first and second electrically
conductive members - Fig. 45 shows that the probe stylus is contacting with a pad disposed in a semiconductor device. Referring to the figure,
reference numerals conductive members member 84 a arranged between them.Reference numeral 5 denotes a pad disposed in a semiconductor. - The structure of a probe card having
probe stylus 81 a according to the eighteenth embodiment is similar to that of the probe card shown in FIG. 4. The connection between aprobe stylus 81 a and the substrate of a probe card is similar to that shown in FIG. 44. The function of the probe card and the probe stylus is similar to that of the second embodiment. - As explained, the first and second electrically
conductive members pad 5 disposed in the semiconductor at an inspection of a semiconductor device. Therefore, the value of voltage and/or electric current can be compensated up to thepad 5, at a precise inspection of a semiconductor device at a wafer state. And a line for driver and a line for comparator are assured up to thepad 5, at an inspection of an I/O of a semiconductor device at a wafer state. As a result, a higher precision inspection of a semiconductor device becomes possible. - A probe stylus according to the eighteenth embodiment has advantages similar to that of the seventeenth embodiment.
- NINETEENTH EMBODIMENT
- FIG. 47 shows that the probe stylus is contacting with a pad disposed in a semiconductor device. Referring to the figure,
reference numerals conductive members member 94 arranged between them.Reference numeral 5 denotes a pad disposed in a semiconductor. - The
probe stylus 91 of the nineteenth embodiment of the present invention is a so-called perpendicular type probe stylus. The first electricallyconductive members 92 has a form of needle and its cross section perpendicular to the longitudinal direction of the needle is round. The second electricallyconductive member 93 has a form of a cylinder, and covers the first electricallyconductive member 92. In this embodiment, the first electricallyconductive member 92 has a thickness substantially equal to that of a perpendicular type probe stylus in the prior art, and the outer side of the first electrically conductive member is covered with an insulatingmember 94. Further, the outside of the insulatingmember 94 is covered with the second electricallyconductive member 93. Thus, the assembly of the probe stylus of the nineteenth embodiment has a thickness substantially equal to a perpendicular type probe stylus in the prior art. The first and second electricallyconductive members pad 5 disposed in a semiconductor device. - The structure of a probe card having
probe stylus 91 according to the nineteenth embodiment is similar to that of the probe card shown in FIG. 17. - FIG. 49 is a detailed cross sectional view of an example of the connecting portion between the probe card and a substrate of a
probe stylus 91 according to the nineteenth embodiment. FIG. 49 corresponds to FIG. 18. In the figure,reference numeral 96 denotes a electrically conductive boss. Andreference numeral 97 denotes a spring. The other element corresponding to an element in FIG. 47 is referred by the same reference numeral. - FIG. 50 is a detailed cross sectional view of another example of the connecting portion between the probe card and a substrate of a
probe stylus 91 according to the nineteenth embodiment. FIG. 50 corresponds to FIG. 19. In the figure,reference numerals - TWENTIETH EMBODIMENT
- In a probe stylus according to the nineteenth embodiment, the first and second electrically
conductive members - FIG. 51 shows that the probe stylus is contacting with a pad disposed in a semiconductor device. Referring to the figure,
reference numerals conductive members member 94 a arranged between them.Reference numeral 5 denotes a pad disposed in a semiconductor. - The structure of a probe card having
probe stylus 91 a according to the twentieth embodiment is similar to that of the probe card shown in FIG. 17. The connection between aprobe stylus 91 a and the substrate of a probe card is similar to that shown in FIGS. 49 and 50. The function of the probe card and the probe stylus is similar to that of the second embodiment. The probe stylus according to the twentieth embodiment has advantages similar to that of the eighteenth embodiment. - TWENTY-FIRST EMBODIMENT
- FIG. 53 shows that the probe stylus is contacting with a pad disposed in a semiconductor device. Referring to the figure,
reference numerals conductive members member 104 arranged between them.Reference numeral 5 denotes a pad disposed in a semiconductor. - The
probe stylus 101 of the twenty-first embodiment of the present invention is a so-called perpendicular type probe stylus. The first electricallyconductive members 102 has a form of needle and its cross section perpendicular to the longitudinal direction of the needle is round. The second electricallyconductive member 103 has a form of cylinder, and covers the first electricallyconductive member 102. In this embodiment, the first electricallyconductive member 102 has a thickness equal to that of a perpendicular type probe stylus in the prior art, and the outer side of the first electrically conductive member is covered with an insulatingmember 104. Further, the outside of the insulatingmember 104 is covered with the second electricallyconductive member 103. Thus, the assembly of the probe stylus of the twenty-first embodiment has a thickness substantially equal to a perpendicular type probe stylus in the prior art. - A
probe stylus 101 according to the twenty-first embodiment of the present invention has an arc or jack-knifed resilient portion at the tip portion of the first and second electricallyconductive members probe stylus 101 contacts with apad 5 disposed in the semiconductor device. The first and second electricallyconductive members probe stylus 101 contacts with apad 5 disposed in the semiconductor device. - The structure of a probe card having
probe stylus 101 according to the twenty-first embodiment is similar to that of the probe card shown in FIG. 17. The connection between aprobe stylus 101 and the substrate of a probe card is similar to that shown in FIGS. 49 and 50. The function of the probe card and the probe stylus is similar to that of the first embodiment. - In a probe stylus according to the twenty-first embodiment of the present invention, an arc or jack-knifed resilient portion is formed at the tip portion of the first and second electrically
conductive members pad 5, which is disposed in a semiconductor device. As a result, the impact at the contact of the probe stylus and the pad disposed in the semiconductor is absorbed by the resilient portion. Therefore, a warp of a probe card, which may be caused by the contact of the probe styluses and the pads, can be avoided. The probe stylus according to the twenty-first embodiment has advantages similar to that of the seventeenth embodiment. - TWENTY-SECOND EMBODIMENT
- In a probe stylus according to the twenty-first embodiment, the first and second electrically
conductive members - FIG. 55 shows that the probe stylus is contacting with a pad disposed in a semiconductor device. Referring to the figure,
reference numerals conductive members member 104 a arranged between them.Reference numeral 5 denotes a pad disposed in a semiconductor. - The structure of a probe card having
probe stylus 101 a according to the twenty-second embodiment is similar to that of the probe card shown in FIG. 17. The connection between aprobe stylus 101 a and the substrate of a probe card is similar to that shown in FIGS. 49, 50. The function of the probe card and the probe stylus is similar to that of the second embodiment. - In a probe stylus according to the twenty-second embodiment of the present invention, an arc or jack-knifed resilient portion is formed at the tip portion of the first and second electrically
conductive members pad 5, which is disposed in a semiconductor device. As a result, the impact at the contact of the probe stylus and the pad disposed in the semiconductor is absorbed by the resilient portion. Therefore, a warp of a probe card, which may be caused by the contact of theprobe styluses 101 a and the pads, can be avoided. The probe stylus according to the twenty-second embodiment has advantages similar to that of the eighteenth embodiment. - TWENTY-THIRD EMBODIMENT
- FIG. 57, 58 are schematic plan views of a probe stylus according to the twenty-third embodiment. FIG. 57 shows a state that the probe stylus is not contacting with a pad disposed in a semiconductor. And FIG. 58 shows a state that the probe stylus is contacting with a pad disposed in a semiconductor. FIG. 59 is a side view of a probe stylus seen from the side B1 in FIG. 57. FIG. 60 is a cross sectional view of an example of a probe stylus. FIG. 60(a) shows a cross section along the line C1-C1 in FIG. 57. FIG. 60(b) shows a cross section along the line D1-D1 in FIG. 57. FIG. 61 is a cross sectional view of another example of a probe stylus, which has a form different from that of FIG. 60. FIG. 61(a) shows a cross section along the line C1-C1 in FIG. 57. FIG. 61(b) shows a cross section along the line D1-D1 in FIG. 57.
- Referring to the figures,
reference numerals conductive members member 114 arranged between them.Reference numeral 5 denotes a pad disposed in a semiconductor - A probe stylus according to the twenty third embodiment of the present invention is a so-called perpendicular type probe stylus. The first and second electrically
conductive members pad 5 disposed in a semiconductor device, the thinner their thickness is. According to the twenty-third embodiment, a slit is disposed in the tip portion of the probe stylus, where the probe stylus contacts with a pad disposed in a semiconductor stylus. When the probe stylus does not contact with apad 5, the slit closes so that the first and second electricallyconductive members pad 5, the slit opens so that the first and second electricallyconductive members - The structure of a probe card having
probe stylus 111 according to the twenty-third embodiment is similar to that of the probe card shown in FIG. 4. The connection between aprobe stylus 111 and the substrate of a probe card is similar to that shown in FIG. 12. The function of the probe card and the probe stylus is similar to that of the second embodiment. - As explained, the
probe stylus 1 according to the twenty-third embodiment of the present invention has a first electricallyconductive member 112 and a second electricallyconductive member 113. Therefore, such a probe stylus functions equivalent to two probe styluses in the prior art. As a result, by contacting one probe stylus to each pad disposed in the semiconductor device, it is possible to eliminate so-called dead band in the comparator in a precise inspection of a semiconductor device at a wafer state, or in an inspection of an I/O of a semiconductor device at a wafer state. Also in a case that a large number of pads are disposed in a semiconductor device, corresponding large number of probe styluses can be disposed on a probe card, so that so-called dead band in the comparator can be eliminated in a precise inspection of a semiconductor device at a wafer state, or in an inspection of an I/O of a semiconductor device at a wafer state. - A probe stylus according to the twenty-third embodiment of the present invention functions equivalently to two probe stylus in the prior art, hence, the number of
probe styluses 111 to be attached to a probe card and/or the area required for the arrangement of the probe stylus in a probe card can be reduced, as a result, the fabrication cost can be reduced. - Because the first and second electrically
conductive members probe stylus 111 contacts with apad 5 disposed in a semiconductor. As a result, the structural reliability of the probe stylus is improved. - In a probe stylus according to the twenty-third embodiment of the present invention, a slit is disposed between the tip portion of the first and second electrically
conductive members probe stylus 111 contacts with apad 5 disposed in the semiconductor device. As a result, the impact at the contact of theprobe stylus 111 and thepad 5 disposed in the semiconductor is absorbed by the slit portion. Therefore, a warp of a probe card, which may be caused by the contact of the probe styluses and the pads, can be avoided. - The first and second electrically
conductive members probe stylus 111 according to the twenty-third embodiment separate from each other, when theprobe stylus 111 contacts with apad 5 disposed in a semiconductor. Therefore, the value of voltage and/or electric current can be compensated up to thepad 5, at a precise inspection of a semiconductor device at a wafer state. And a line for driver and a line for comparator are assured up to thepad 5, at an inspection of an I/O of a semiconductor device at a wafer state. As a result, a higher precision inspection of a semiconductor device becomes possible.
Claims (20)
1. A probe stylus for inspecting a semiconductor device, which contacts with a pad disposed in a semiconductor device at an inspection of the semiconductor device, wherein the probe stylus comprises a first electrically conductive member formed as a needle, a second electrically conductive member formed as a needle, and an insulating member arranged between them and connecting them so that the first and second electrically conductive members and the insulating member form a single needle.
2. A probe stylus for inspecting a semiconductor device according to claim 1 , wherein the cross section of each of the first and second electrically conductive members perpendicular to their longitudinal direction is half round.
3. A probe stylus for inspecting a semiconductor device according to claim 2 , wherein the first and second electrically conductive members are electrically connected to each other at their tip portion.
4. A probe stylus for inspecting a semiconductor device according to claim 2 , wherein the first and second electrically conductive members are not electrically connected to each other at their tip portion, but are connected to each other through a pad disposed in a semiconductor device at an inspection of the semiconductor device.
5. A probe stylus for inspecting a semiconductor device according to claim 2 , wherein the probe stylus is a cantilever type probe stylus.
6. A probe stylus for inspecting a semiconductor device according to claim 2 , wherein the probe stylus is a perpendicular type probe stylus.
7. A probe stylus for inspecting a semiconductor device according to claim 1 , wherein each of the first and second electrically conductive members has a resilient portion at their tip portion, where the probe stylus contacts with a pad disposed in a semiconductor device.
8. A probe stylus for inspecting a semiconductor device according to claim 7 , wherein the resilient portion of the first and second electrically conductive member form a round resilient portion.
9. A probe stylus for inspecting a semiconductor device according to claim 7 , wherein the resilient portion of the first and second electrically conductive portion form a Y-formed resilient portion.
10. A probe stylus for inspecting a semiconductor device according to claim 7 , wherein the resilient portion of the first and second electrically conductive member form an arc or jack-knifed resilient portion.
11. A probe stylus for inspecting a semiconductor device according to claim 7 , wherein the first and second electrically conductive members are electrically connected to each other at their tip portion.
12. A probe stylus for inspecting a semiconductor device according to claim 7 , wherein the first and second electrically conductive members are not electrically connected to each other at their tip portion, but are connected to each other through the pad disposed in a semiconductor device at an inspection of the semiconductor device.
13. A probe stylus for inspecting a semiconductor device according to claim 7 , wherein the cross section of each of the first and second electrically conductive members is half round.
14. A probe stylus for inspecting a semiconductor device according to claim 7 , wherein the cross section of each of the first and second electrically conductive members is round.
15. A probe stylus for inspecting a semiconductor device according to claim 14 , wherein the diameter of the cross section of one of the first and second electrically conductive members is smaller than that of the other.
16. A probe stylus for inspecting a semiconductor device according to claim 7 , wherein the first electrically conductive member is covered with the insulating member, and the insulating member is covered with the second electrically insulating member.
17. A probe stylus for inspecting a semiconductor device according to claim 1 , wherein the first electrically conductive member is covered with the insulating member, and the insulating member is covered with the second electrically insulating member, and the first and second electrically conductive members are electrically connected to each other at their tip portion.
18. A probe stylus for inspecting a semiconductor device according to claim 1 , wherein the first electrically conductive member is covered with the insulating member, and the insulating member is covered with the second electrically insulating member, and the first and second electrically conductive members are not electrically connected to each other at their tip portion, but are connected to each other through a pad disposed in a semiconductor device at an inspection of the semiconductor device.
19. A probe stylus for inspecting a semiconductor device according to claim 1 , wherein the probe stylus is a cantilever type probe stylus, and a slit is disposed between the first and second electrically conductive members at their tip portion, where the probe stylus contacts with a pad disposed in a semiconductor device, the slit opens when the probe stylus contacts with a pad disposed in a semiconductor device so that the first and second electrically conductive members separate from each other.
20. A probe stylus for inspecting a semiconductor device according to claim 19 , wherein the cross section of each of the first and second electrically conductive members to their longitudinal direction are an arc or a quadrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/131,181 US6529024B2 (en) | 1999-01-19 | 2002-04-25 | Probe stylus |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11011208A JP2000206146A (en) | 1999-01-19 | 1999-01-19 | Probe needle |
JP11-11208 | 1999-01-19 | ||
JP11-011208 | 1999-01-19 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/131,181 Division US6529024B2 (en) | 1999-01-19 | 2002-04-25 | Probe stylus |
Publications (2)
Publication Number | Publication Date |
---|---|
US20020011853A1 true US20020011853A1 (en) | 2002-01-31 |
US6404213B2 US6404213B2 (en) | 2002-06-11 |
Family
ID=11771599
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/330,155 Expired - Fee Related US6404213B2 (en) | 1999-01-19 | 1999-06-11 | Probe stylus |
US10/131,181 Expired - Fee Related US6529024B2 (en) | 1999-01-19 | 2002-04-25 | Probe stylus |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/131,181 Expired - Fee Related US6529024B2 (en) | 1999-01-19 | 2002-04-25 | Probe stylus |
Country Status (2)
Country | Link |
---|---|
US (2) | US6404213B2 (en) |
JP (1) | JP2000206146A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050057235A1 (en) * | 2003-09-16 | 2005-03-17 | Shinobu Watanabe | Operation voltage supply apparatus and operation voltage supply method for semiconductor device |
DE202014105151U1 (en) * | 2014-10-28 | 2016-01-29 | Ptr Messtechnik Gmbh & Co. Kommanditgesellschaft | Spring contact device |
US10067164B2 (en) | 2015-08-24 | 2018-09-04 | Johnstech International Corporation | Testing apparatus and method for microcircuit testing with conical bias pad and conductive test pin rings |
US20220178969A1 (en) * | 2020-12-03 | 2022-06-09 | Star Technologies, Inc. | Probe device and method of assembling the same |
US20220229091A1 (en) * | 2021-01-15 | 2022-07-21 | Lumentum Operations Llc | Probe tip assembly |
Families Citing this family (51)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5914613A (en) | 1996-08-08 | 1999-06-22 | Cascade Microtech, Inc. | Membrane probing system with local contact scrub |
US6256882B1 (en) | 1998-07-14 | 2001-07-10 | Cascade Microtech, Inc. | Membrane probing system |
JP2000206146A (en) * | 1999-01-19 | 2000-07-28 | Mitsubishi Electric Corp | Probe needle |
JP4526626B2 (en) * | 1999-12-20 | 2010-08-18 | 独立行政法人科学技術振興機構 | Electrical property evaluation equipment |
US6914423B2 (en) | 2000-09-05 | 2005-07-05 | Cascade Microtech, Inc. | Probe station |
US6965226B2 (en) | 2000-09-05 | 2005-11-15 | Cascade Microtech, Inc. | Chuck for holding a device under test |
DE20114544U1 (en) | 2000-12-04 | 2002-02-21 | Cascade Microtech Inc | wafer probe |
US7064564B2 (en) * | 2001-02-01 | 2006-06-20 | Antares Contech, Inc. | Bundled probe apparatus for multiple terminal contacting |
WO2003012828A2 (en) * | 2001-04-09 | 2003-02-13 | Kla-Tencor, Inc. | Systems and methods for measuring properties of conductive layers |
US7355420B2 (en) | 2001-08-21 | 2008-04-08 | Cascade Microtech, Inc. | Membrane probing system |
US6911834B2 (en) * | 2002-01-25 | 2005-06-28 | Texas Instruments Incorporated | Multiple contact vertical probe solution enabling Kelvin connection benefits for conductive bump probing |
US7492172B2 (en) | 2003-05-23 | 2009-02-17 | Cascade Microtech, Inc. | Chuck for holding a device under test |
US7057404B2 (en) | 2003-05-23 | 2006-06-06 | Sharp Laboratories Of America, Inc. | Shielded probe for testing a device under test |
JP2004347565A (en) * | 2003-05-26 | 2004-12-09 | Nec Electronics Corp | Inspection method for probe card and semiconductor device |
WO2004109301A1 (en) * | 2003-06-11 | 2004-12-16 | Ismeca Semiconductor Holding Sa | Connector |
US7250626B2 (en) | 2003-10-22 | 2007-07-31 | Cascade Microtech, Inc. | Probe testing structure |
WO2005060719A2 (en) * | 2003-12-18 | 2005-07-07 | Lecroy Corporation | Resistive probe tips |
US7321234B2 (en) * | 2003-12-18 | 2008-01-22 | Lecroy Corporation | Resistive test probe tips and applications therefor |
US7187188B2 (en) | 2003-12-24 | 2007-03-06 | Cascade Microtech, Inc. | Chuck with integrated wafer support |
WO2005065258A2 (en) | 2003-12-24 | 2005-07-21 | Cascade Microtech, Inc. | Active wafer probe |
US20050162177A1 (en) * | 2004-01-28 | 2005-07-28 | Chou Arlen L. | Multi-signal single beam probe |
WO2005075647A1 (en) * | 2004-02-06 | 2005-08-18 | Nymox Corporation | Humanized antibody |
JP2008512680A (en) | 2004-09-13 | 2008-04-24 | カスケード マイクロテック インコーポレイテッド | Double-sided probing structure |
WO2006068156A1 (en) * | 2004-12-22 | 2006-06-29 | Opto System Co., Ltd. | Kelvin probe |
US7535247B2 (en) | 2005-01-31 | 2009-05-19 | Cascade Microtech, Inc. | Interface for testing semiconductors |
US7656172B2 (en) | 2005-01-31 | 2010-02-02 | Cascade Microtech, Inc. | System for testing semiconductors |
CN101501509B (en) * | 2005-06-10 | 2013-08-14 | 特拉华资本组成公司 | Electrical contact probe with compliant internal interconnect |
US7279912B2 (en) * | 2005-10-13 | 2007-10-09 | Hewlett-Packard Development Company, L.P. | Dual arcuate blade probe tip |
US7403028B2 (en) | 2006-06-12 | 2008-07-22 | Cascade Microtech, Inc. | Test structure and probe for differential signals |
US7764072B2 (en) | 2006-06-12 | 2010-07-27 | Cascade Microtech, Inc. | Differential signal probing system |
US7723999B2 (en) | 2006-06-12 | 2010-05-25 | Cascade Microtech, Inc. | Calibration structures for differential signal probing |
JP4831614B2 (en) * | 2006-08-15 | 2011-12-07 | 株式会社ヨコオ | Kelvin inspection jig |
JP4847907B2 (en) * | 2007-03-29 | 2011-12-28 | ルネサスエレクトロニクス株式会社 | Semiconductor inspection equipment |
US7876114B2 (en) | 2007-08-08 | 2011-01-25 | Cascade Microtech, Inc. | Differential waveguide probe |
JP5144997B2 (en) * | 2007-09-21 | 2013-02-13 | 東京特殊電線株式会社 | Contact probe unit and manufacturing method thereof |
JP2008241722A (en) * | 2008-06-02 | 2008-10-09 | Oki Electric Ind Co Ltd | Probe card and method of manufacturing semiconductor device |
US7888957B2 (en) | 2008-10-06 | 2011-02-15 | Cascade Microtech, Inc. | Probing apparatus with impedance optimized interface |
WO2010059247A2 (en) | 2008-11-21 | 2010-05-27 | Cascade Microtech, Inc. | Replaceable coupon for a probing apparatus |
US8319503B2 (en) | 2008-11-24 | 2012-11-27 | Cascade Microtech, Inc. | Test apparatus for measuring a characteristic of a device under test |
US8441272B2 (en) * | 2008-12-30 | 2013-05-14 | Stmicroelectronics S.R.L. | MEMS probe for probe cards for integrated circuits |
US8026734B2 (en) * | 2009-06-24 | 2011-09-27 | Sv Probe Pte. Ltd. | Dual tip test probe assembly |
JP5486866B2 (en) * | 2009-07-29 | 2014-05-07 | ルネサスエレクトロニクス株式会社 | Manufacturing method of semiconductor device |
US8451015B2 (en) * | 2009-07-30 | 2013-05-28 | Medtronic, Inc. | Method for making electrical test probe contacts |
JP5296117B2 (en) | 2010-03-12 | 2013-09-25 | 東京エレクトロン株式会社 | Probe device |
US9529014B1 (en) * | 2013-03-15 | 2016-12-27 | Insight Photonic Solutions, Inc. | System and method for acquiring electrical measurements of an electronic device |
US10006943B2 (en) * | 2014-10-30 | 2018-06-26 | Tongfu Microelectronics Co., Ltd. | Semiconductor testing fixture and fabrication method thereof |
US10067162B2 (en) * | 2014-10-30 | 2018-09-04 | Tongfu Microelectronics Co., Ltd. | Testing probe, semiconductor testing fixture and fabrication method thereof |
US10001509B2 (en) * | 2014-10-30 | 2018-06-19 | Tongfu Microelectronics Co., Ltd. | Semiconductor testing fixture and fabrication method thereof |
JP2016151573A (en) * | 2015-02-19 | 2016-08-22 | ルネサスエレクトロニクス株式会社 | Method of manufacturing semiconductor device and probe card |
EP3385726B1 (en) * | 2017-04-07 | 2024-01-10 | Melexis Technologies NV | Kelvin connection with positional accuracy |
EP3599471A1 (en) * | 2018-07-26 | 2020-01-29 | IMEC vzw | A device for measuring surface characteristics of a material |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4423373A (en) * | 1981-03-16 | 1983-12-27 | Lecroy Research Systems Corporation | Test probe |
JPS61104380A (en) | 1984-10-22 | 1986-05-22 | Fuji Photo Film Co Ltd | Disk cartridge |
US4894612A (en) * | 1987-08-13 | 1990-01-16 | Hypres, Incorporated | Soft probe for providing high speed on-wafer connections to a circuit |
JPH01132975A (en) | 1987-11-18 | 1989-05-25 | Yazaki Corp | Evaluating method for junction part |
JPH01174932A (en) | 1987-12-29 | 1989-07-11 | Shimadzu Corp | Multi-point simultaneous monitor system of component in fluid |
JPH02124469A (en) | 1988-11-01 | 1990-05-11 | Nec Kyushu Ltd | Probe card |
ATE85133T1 (en) * | 1989-02-16 | 1993-02-15 | Mania Gmbh | CIRCUIT FOR MEASURING RESISTANCES OF TEST PIECES. |
JPH04288847A (en) | 1991-03-08 | 1992-10-13 | Mitsubishi Electric Corp | Semiconductor test device |
JPH0562865A (en) | 1991-08-29 | 1993-03-12 | Elna Co Ltd | Electrolytic capacitor for acoustic use |
US5334931A (en) * | 1991-11-12 | 1994-08-02 | International Business Machines Corporation | Molded test probe assembly |
JPH05144895A (en) | 1991-11-20 | 1993-06-11 | Nec Yamagata Ltd | Probe card |
US6023171A (en) * | 1997-08-13 | 2000-02-08 | International Business Machines Corporation | Dual-contact probe tip for flying probe tester |
US6127832A (en) * | 1998-01-06 | 2000-10-03 | International Business Machines Corporation | Electrical test tool having easily replaceable electrical probe |
JP2000206146A (en) * | 1999-01-19 | 2000-07-28 | Mitsubishi Electric Corp | Probe needle |
-
1999
- 1999-01-19 JP JP11011208A patent/JP2000206146A/en active Pending
- 1999-06-11 US US09/330,155 patent/US6404213B2/en not_active Expired - Fee Related
-
2002
- 2002-04-25 US US10/131,181 patent/US6529024B2/en not_active Expired - Fee Related
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050057235A1 (en) * | 2003-09-16 | 2005-03-17 | Shinobu Watanabe | Operation voltage supply apparatus and operation voltage supply method for semiconductor device |
US7307434B2 (en) | 2003-09-16 | 2007-12-11 | Oki Electric Industry Co., Ltd | Operation voltage supply apparatus and operation voltage supply method for semiconductor device |
US20080084226A1 (en) * | 2003-09-16 | 2008-04-10 | Shinobu Watanabe | Operation voltage supply apparatus and operation voltage supply method for semiconductor device |
US7579851B2 (en) * | 2003-09-16 | 2009-08-25 | Oki Semiconductor Co., Ltd. | Operation voltage supply apparatus and operation voltage supply method for semiconductor device |
US20090322363A1 (en) * | 2003-09-16 | 2009-12-31 | Shinobu Watanabe | Operation voltage supply method for semiconductor device |
US7960987B2 (en) | 2003-09-16 | 2011-06-14 | Oki Semiconductor Co., Ltd. | Operation voltage supply method for semiconductor device |
US20110215824A1 (en) * | 2003-09-16 | 2011-09-08 | Shinobu Watanabe | Operation voltage supply apparatus |
DE202014105151U1 (en) * | 2014-10-28 | 2016-01-29 | Ptr Messtechnik Gmbh & Co. Kommanditgesellschaft | Spring contact device |
US10067164B2 (en) | 2015-08-24 | 2018-09-04 | Johnstech International Corporation | Testing apparatus and method for microcircuit testing with conical bias pad and conductive test pin rings |
US10928423B2 (en) | 2015-08-24 | 2021-02-23 | Johnstech International Corporation | Testing apparatus and method for microcircuit testing with conical bias pad and conductive test pin rings |
US20220178969A1 (en) * | 2020-12-03 | 2022-06-09 | Star Technologies, Inc. | Probe device and method of assembling the same |
US20220229091A1 (en) * | 2021-01-15 | 2022-07-21 | Lumentum Operations Llc | Probe tip assembly |
US11885830B2 (en) * | 2021-01-15 | 2024-01-30 | Lumentum Operations Llc | Probe tip assembly for testing optical components |
Also Published As
Publication number | Publication date |
---|---|
US20020113609A1 (en) | 2002-08-22 |
US6404213B2 (en) | 2002-06-11 |
JP2000206146A (en) | 2000-07-28 |
US6529024B2 (en) | 2003-03-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20020011853A1 (en) | Probe stylus | |
US4480223A (en) | Unitary probe assembly | |
JP6174172B2 (en) | Contact probe | |
US6373267B1 (en) | Ball grid array-integrated circuit testing device | |
JP4252491B2 (en) | Module with inspection function and inspection method thereof. | |
EP0305076B1 (en) | Personality board | |
JP3443011B2 (en) | Film carrier tape and test method therefor | |
US11394148B2 (en) | Contact probe and inspection socket provided with contact probe | |
CN112582388A (en) | Optical semiconductor device and method of assembling optical semiconductor device | |
JP2021105547A (en) | Contact probe | |
KR102538834B1 (en) | Probe pin | |
KR100347863B1 (en) | Probe card | |
JPH0143269B2 (en) | ||
US20010054904A1 (en) | Monitoring resistor element and measuring method of relative preciseness of resistor elements | |
JPH0661321A (en) | Contact probe pin and semiconductor inspection device | |
TWI806083B (en) | Electrical contact structure of electrical contactor and electrical connecting apparatus | |
JPS6080772A (en) | Probe needle | |
KR100232714B1 (en) | Connector for semiconductor device tester | |
US10845384B2 (en) | Surface-mountable apparatus for coupling a test and measurement instrument to a device under test | |
JPH05240877A (en) | Prober for measuring semiconductor integrated circuit | |
JPH07111280A (en) | Probe card | |
JPH11352149A (en) | Probing card | |
TW202332917A (en) | Contact probe, probe holder and probe unit | |
JPH0547866A (en) | Probe card for ic chip test | |
JPH1145917A (en) | Logic tester |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: MITSUBISHI DENKI KABUSHIKI KAISHA, JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:NODA, HIROSHI;REEL/FRAME:010047/0855 Effective date: 19990531 |
|
FEPP | Fee payment procedure |
Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
FPAY | Fee payment |
Year of fee payment: 4 |
|
REMI | Maintenance fee reminder mailed | ||
LAPS | Lapse for failure to pay maintenance fees | ||
STCH | Information on status: patent discontinuation |
Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
|
FP | Lapsed due to failure to pay maintenance fee |
Effective date: 20100611 |