US20020030480A1 - Apparatus for the automated testing, calibration and characterization of test adapters - Google Patents
Apparatus for the automated testing, calibration and characterization of test adapters Download PDFInfo
- Publication number
- US20020030480A1 US20020030480A1 US09/931,686 US93168601A US2002030480A1 US 20020030480 A1 US20020030480 A1 US 20020030480A1 US 93168601 A US93168601 A US 93168601A US 2002030480 A1 US2002030480 A1 US 2002030480A1
- Authority
- US
- United States
- Prior art keywords
- test
- contact
- holder
- probe head
- contact pins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
- G01R31/2834—Automated test systems [ATE]; using microprocessors or computers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
Definitions
- the present invention relates to an apparatus for automatically testing, calibrating and characterizing test adapters for semiconductor devices.
- the semiconductor devices are preferably integrated semiconductor circuits.
- a test adapter may be, for example, what is referred to as a test card, by means of which semiconductor chips are tested at wafer level.
- a test adapter is a socket board, into which individual modules are introduced for testing.
- test cards are used, as is known, as test adapters. These test cards produce the electrical connection between contact points on the semiconductor chips in a wafer to be tested and at least one test channel in the test system.
- FIG. 9 shows a plan view of one possible exemplary arrangement of contact surfaces 2 in an edge area 3 of a motherboard of a test card 1 . It should be understood, however, that other configurations of a test card are also feasible as an example of a test adapter.
- the contact surfaces 2 produce a contact with the test channels in the test system, and are preferably located on a number of circles with different radii in the edge region 3 .
- a large number of contact needles are provided on the lower face of the test card 1 , and are to fit such that they reliably make contact with the contact points on the chip at wafer level to be tested. These contact needles are preferably located in the inner area of the test card. In this case, each contact surface 2 has at least one associated contact needle. This means that the contact needles are electrically related with the associated contact surfaces 2 in a precisely defined manner.
- the contact surfaces 2 are arranged in the form of a square, rather than in the circular configuration above.
- test adapters such as test cards are matched to different semiconductor devices to be tested, that is, to their contact points.
- the appropriate different test adapters are therefore required for different types of semiconductor devices.
- the test adapters therefore make it possible to use the same test system even for different types of semiconductor devices.
- test adapters used for testing semiconductor devices have a considerable influence on the test results, and hence also on the test yield.
- electrical calibration and/or characterization of test adapters is an important element, which should not be underestimated, in the analysis of an overall test system.
- test adapters In the past, scarcely any investigations have been carried out into the influence of test adapters on various electrical parameters, such as line impedance, signal delay times, signal rise times or crosstalk between their various channels in different test systems, due to the large number of channels, which is currently around 1600 for test cards and will amount to 3200 in the near future. In other words, the influence of test adapters on signal performance and signal integrity in test systems has scarcely been considered so far.
- an apparatus for automated testing, calibration and characterization of test adapters for semiconductor devices comprises:
- At least one probe head adjustably disposed relative to the holder, the probe head having two or more contact pins whose with an adjustable spacing distance therebetween;
- an adjustment device configured to adjust the probe head relative to the holder.
- the objects of the invention are achieved in the context of an apparatus of the type mentioned initially, by a holder for the test adapter and at least one probe head, which can be adjusted with respect to the holder and has at least two contact pins (whose spacing is adjustable).
- the distance between the at least two contact pins on a probe head can be matched to the distance, which differs with different test adapters to be calibrated or wherein, between the contact surfaces for signals and the associated shields.
- the holder can in this case hold test adapters with different diameters.
- the apparatus according to the invention thus has, in particular, the holder which can rotate to hold test adapters with different diameters.
- This holders allows the test adapter to be rotated in a defined manner in the apparatus.
- a stepping motor or the like may be used as the drive for this rotation of the holder.
- the apparatus according to the invention has one or more robot arms, which can be moved in a horizontal direction, running parallel to the plane of the test adapter, and also in a direction at right angles to this.
- a probe head is fit on each robot arm.
- the apparatus can be matched directly to widely differing test adapters by appropriately controlling the position of the robot arms.
- the apparatus according to the invention can thus be matched directly to different test adapters and measurement tasks. Since, furthermore, it operates in a fully automated manner, it can carry out any desired electrical calibration and characterization of test adapters of widely differing types.
- FIG. 1 is a plan view of a first exemplary embodiment of the apparatus according to the invention, having a robot arm with at least one probe head;
- FIG. 2 is a schematic side view of the apparatus of FIG. 1;
- FIG. 3 is a plan view of a second exemplary embodiment of the apparatus according to the invention, having two robot arms, each having at least one probe head;
- FIG. 4 is a schematic side view of the apparatus in FIG. 3;
- FIG. 5 is a schematic illustration to explain the configuration of contact pins for making contact with contact surfaces
- FIG. 6 is a schematic illustration to explain the configuration of contact pins for making contact with contact needles
- FIG. 7 is a plan view of a third exemplary embodiment of the apparatus according to the invention.
- FIG. 8 is a schematic side view of the apparatus in FIG. 7;
- FIG. 9 is a plan view of contact surfaces in the edge area of a conventional test card.
- a test card 1 as an example of a test adapter with contact surfaces 2 on its upper face and contact needles 5 on its lower face.
- the test card 1 is placed on a holder 4 of the apparatus, which can rotate as shown by a double arrow 6 .
- the apparatus also has a robot arm 7 , which can be moved as shown by a double arrow 8 in elevation and in its distance from the test card 1 .
- a probe head 9 on this robot arm 7 can be moved in two directions, as shown by the double arrow 10 .
- This probe head 9 has two contact pins 11 , which can make contact with the contact surfaces 2 on the test card 1 . The distance between these contact pins 11 can be adjusted, so that the apparatus can be matched to different types of test cards with different distances between the contact surfaces 2 . If required, another probe head can also be provided on the robot arm 7 .
- the probe head 9 may also have more than two contact pins 10 , if required. For example, it can thus be provided with four contact pins 11 . It is even possible to equip the contact head 11 with enough contact pins 11 for it to be able to simultaneously touch all the contact surfaces 2 which are located one behind the other in the radial direction. In the example in FIG. 1, this would be six contact pins 11 .
- the holder 4 can be driven via a stepping motor 12 .
- the stepping motor 12 is controlled by a central control unit 13 , which also makes it possible to control and adjust the movement of the robot arm 7 and the position of the probe head 9 , as well as the distance between the contact pins 11 .
- the holder 4 has an edge 14 which can be moved in the lateral direction, so that it is suitable for holding test cards with different diameters or else different test adapters.
- the apparatus shown in FIGS. 1 and 2 is particularly suitable for measuring signal delay times and line impedances: this is because only the one robot arm 7 is required in this case.
- the probe head 9 together with the two contact pins 11 which is fit on the robot arm 7 allows automatic measurement of all the channels on the test card 1 by moving the one contact pin 11 for a test signal into contact with a contact surface 2 , while the other contact pin 11 , which is used for grounding, is in contact, for example, with an adjacent contact surface 11 .
- the desired electrical parameters such as electrical losses, can be deduced from the delay time of the test signal reflected at the channel end, and from the magnitude of the reflected signal.
- FIGS. 3 and 4 show a further exemplary embodiment of the present invention, wherein a second robot arm 7 ′ is provided with a second probe head 9 ′ and with two further contact pins 11 ′.
- This second robot arm 7 ′ can be adjusted in elevation (see the double arrow 8 ′) in the same way as the robot arm 7 , and can likewise be driven from the central control unit 13 .
- the position of the second robot arm 7 ′ can be rotated with respect to the holder 4 , as is indicated by a double arrow 6 ′.
- the control device 13 thus controls the stepping motor 12 , the upward and downward movement of the robot arms 7 and 7 ′ (see the double arrows 8 and 8 ′), the rotational movement of the robot arm 7 ′ (see the double arrow 6 ′ in FIG. 3) and the radial movement of the probe heads 9 and 9 ′ (see the double arrows 10 and 10 ′).
- the exemplary embodiment in FIGS. 3 and 4 is particularly suitable for measuring crosstalk effects between different channels on the test card 1 . This is because the aim of this measurement is to investigate the influence of the signals in two different channels on one another, wherein case each channel is intended to be considered together with every other channel, which leads to well over a million measurements when there are a large number of channels.
- the robot arm 7 which cannot rotate, with the probe head 9 is connected in a case such as this via the contact pins 11 to at least one channel to be investigated.
- the robot arm 7 ′, which can rotate, with the probe head 9 ′ is then connected via the contact pins 11 ′ to all the other channels, so that the influence of all the channels on the channels mentioned above of the robot arm 7 can be investigated in one run.
- the probe head 9 is then connected via its contact pins 11 to the next channels, and the contact pins 10 ′, on the probe head 9 ′ are moved into contact with all the other channels. In this way, it is possible to measure successive crosstalk effects between each individual channel and all the other channels.
- test card 1 can be rotated independently of the rotational movement of the robot arm 7 ′. If required, it is also possible to couple the rotary movement of the probe head 7 ′ to the rotary movement of the holder 4 .
- the holder 4 is preferably designed such that it is suitable for holding different test adapters and test cards.
- the holder 4 may, for example, have adjustable outer edges 14 so that test adapters and test cards of different diameters can be inserted into the holder 4 .
- FIGS. 5 and 6 show examples of possible configurations of the contact pins 11 : as shown in FIG. 5, these may have pointed ends and may be sprung, so that these ends rest on the contact surfaces 2 .
- contact pins 11 a, 11 b with flat ends (see FIG. 6), so that these flat ends can be moved into contact with the contact needles 5 of the test card 1 which is then inserted “reversed” into the holder 4 .
- the contact pins 11 a, 11 b may have a curved profile (see reference symbols 11 and 11 a in FIGS. 5 and 6), or may be provided with a separate spring (see reference symbol 11 b in FIG. 6).
- FIGS. 7 and 8 show an exemplary embodiment wherein signals are supplied from a test system with an interface board 17 via contact pins 16 to the contact surfaces 2 of the test card 1 , which has now been inserted “reversed”, and are passed to the contact needles 5 .
- the signals which are otherwise present on the chip are tapped off for analysis on these contact needles 5 by means of the springs illustrated in FIG. 6.
- the radial polar-coordinate robot arms 7 are replaced by a Cartesian (xyz) robot system which can be adjusted as shown by the arrows 10 , 15 and 18 .
- Such a configuration provides a square arrangement for the contact needles 5 . This intrinsically allows the entire system to be analyzed.
Abstract
The apparatus enables the automated testing, calibration and characterization of test adapters for semiconductor devices. A holder for the test adapter can be rotated in a defined manner. At least one probe head is provided which can be adjusted radially with respect to the holder. The probe head has two or more contact pins whose spacing distance is adjustable.
Description
- The present invention relates to an apparatus for automatically testing, calibrating and characterizing test adapters for semiconductor devices. The semiconductor devices are preferably integrated semiconductor circuits.
- During the testing, calibration and characterization processes, the radio-frequency characteristics of the test adapters are investigated, in particular. However, it is also possible to investigate direct-current characteristics.
- A test adapter may be, for example, what is referred to as a test card, by means of which semiconductor chips are tested at wafer level. Another example of a test adapter is a socket board, into which individual modules are introduced for testing.
- In test systems for testing, say, semiconductor chips at wafer level, test cards are used, as is known, as test adapters. These test cards produce the electrical connection between contact points on the semiconductor chips in a wafer to be tested and at least one test channel in the test system. Reference is had, in this context, to FIG. 9 which shows a plan view of one possible exemplary arrangement of
contact surfaces 2 in anedge area 3 of a motherboard of atest card 1. It should be understood, however, that other configurations of a test card are also feasible as an example of a test adapter. Thecontact surfaces 2 produce a contact with the test channels in the test system, and are preferably located on a number of circles with different radii in theedge region 3. A large number of contact needles are provided on the lower face of thetest card 1, and are to fit such that they reliably make contact with the contact points on the chip at wafer level to be tested. These contact needles are preferably located in the inner area of the test card. In this case, eachcontact surface 2 has at least one associated contact needle. This means that the contact needles are electrically related with the associatedcontact surfaces 2 in a precisely defined manner. - In the socket boards mentioned initially, the
contact surfaces 2 are arranged in the form of a square, rather than in the circular configuration above. - In general, test adapters such as test cards are matched to different semiconductor devices to be tested, that is, to their contact points. The appropriate different test adapters are therefore required for different types of semiconductor devices. The test adapters therefore make it possible to use the same test system even for different types of semiconductor devices.
- We have, however, identified the fact that the electrical characteristics of the test adapters used for testing semiconductor devices have a considerable influence on the test results, and hence also on the test yield. In other words, the electrical calibration and/or characterization of test adapters is an important element, which should not be underestimated, in the analysis of an overall test system.
- In the past, scarcely any investigations have been carried out into the influence of test adapters on various electrical parameters, such as line impedance, signal delay times, signal rise times or crosstalk between their various channels in different test systems, due to the large number of channels, which is currently around 1600 for test cards and will amount to 3200 in the near future. In other words, the influence of test adapters on signal performance and signal integrity in test systems has scarcely been considered so far.
- In the current state of the art only a single appliance exists, which has not yet been described in any great detail, on the market, which allows semiautomatic measurement of the line impedance and of the signal delay times in test cards. In that case, electrical contact is made with the test card to be investigated via an interface board, which produces the connection between a test head of a test system and the test card even during normal operation of the test card. That appliance can therefore be used only with test systems provided with this interface board and not in general form for test cards for test systems with a different type of interface board, as well. Furthermore, only a relatively small subset of the channels can be measured automatically with the known appliance, as well. If it is intended to evaluate the channels of a different subset, then a manual change must be made to contact plugs for this subset. The measurement of crosstalk effects between the channels of different subsets is thus likewise impossible with the known appliance. Thus, until now, such a measurement could be carried out only manually and, due to the large number of channels, this was associated with an extremely long time penalty.
- It is accordingly an object of the invention to provide an apparatus for automated testing, calibration and characterization of different test adapters, which overcomes the above-mentioned disadvantages of the heretofore-known devices and methods of this general type and which allows for any desired channels of the test adapter to be measured automatically.
- With the foregoing and other objects in view there is provided, in accordance with the invention, an apparatus for automated testing, calibration and characterization of test adapters for semiconductor devices. The novel apparatus comprises:
- a holder for holding a test adapter;
- at least one probe head adjustably disposed relative to the holder, the probe head having two or more contact pins whose with an adjustable spacing distance therebetween; and
- an adjustment device configured to adjust the probe head relative to the holder.
- In other words, the objects of the invention are achieved in the context of an apparatus of the type mentioned initially, by a holder for the test adapter and at least one probe head, which can be adjusted with respect to the holder and has at least two contact pins (whose spacing is adjustable).
- The distance between the at least two contact pins on a probe head can be matched to the distance, which differs with different test adapters to be calibrated or wherein, between the contact surfaces for signals and the associated shields.
- The holder can in this case hold test adapters with different diameters.
- The apparatus according to the invention thus has, in particular, the holder which can rotate to hold test adapters with different diameters. This holders allows the test adapter to be rotated in a defined manner in the apparatus. A stepping motor or the like may be used as the drive for this rotation of the holder.
- Furthermore, the apparatus according to the invention has one or more robot arms, which can be moved in a horizontal direction, running parallel to the plane of the test adapter, and also in a direction at right angles to this. In this case, a probe head is fit on each robot arm.
- These robot arms and the rotation of the holder allow the probe heads and their contact pins to be positioned on the contact surfaces of the test adapter.
- The apparatus can be matched directly to widely differing test adapters by appropriately controlling the position of the robot arms.
- The rotation of the holder and the position of the robot arms and probe heads can be controlled from a central computer. This allows fully automated contact to be made with all channels, and a corresponding fully automated investigation to be carried out of the various electrical parameters of the test adapter.
- The apparatus according to the invention can thus be matched directly to different test adapters and measurement tasks. Since, furthermore, it operates in a fully automated manner, it can carry out any desired electrical calibration and characterization of test adapters of widely differing types.
- Other features which are considered as characteristic for the invention are set forth in the appended claims.
- Although the invention is illustrated and described herein as embodied in an apparatus for automated testing, calibration and characterization of test adapters, it is nevertheless not intended to be limited to the details shown, since various modifications and structural changes may be made therein without departing from the spirit of the invention and within the scope and range of equivalents of the claims.
- The construction and method of operation of the invention, however, together with additional objects and advantages thereof will be best understood from the following description of specific embodiments when read in connection with the accompanying drawings.
- FIG. 1 is a plan view of a first exemplary embodiment of the apparatus according to the invention, having a robot arm with at least one probe head;
- FIG. 2 is a schematic side view of the apparatus of FIG. 1;
- FIG. 3 is a plan view of a second exemplary embodiment of the apparatus according to the invention, having two robot arms, each having at least one probe head;
- FIG. 4 is a schematic side view of the apparatus in FIG. 3;
- FIG. 5 is a schematic illustration to explain the configuration of contact pins for making contact with contact surfaces;
- FIG. 6 is a schematic illustration to explain the configuration of contact pins for making contact with contact needles;
- FIG. 7 is a plan view of a third exemplary embodiment of the apparatus according to the invention;
- FIG. 8 is a schematic side view of the apparatus in FIG. 7; and
- FIG. 9 is a plan view of contact surfaces in the edge area of a conventional test card.
- Reference is had to the detailed description of FIG. 9 appearing in the introductory text. The same reference symbols are used to identify the same and mutually corresponding components in the figures.
- Referring now to the figures of the drawing in detail and first, particularly, to FIGS. 1 and 2 thereof, there is shown a
test card 1, as an example of a test adapter withcontact surfaces 2 on its upper face and contact needles 5 on its lower face. Thetest card 1 is placed on aholder 4 of the apparatus, which can rotate as shown by adouble arrow 6. The apparatus also has arobot arm 7, which can be moved as shown by adouble arrow 8 in elevation and in its distance from thetest card 1. Aprobe head 9 on thisrobot arm 7 can be moved in two directions, as shown by thedouble arrow 10. Thisprobe head 9 has twocontact pins 11, which can make contact with the contact surfaces 2 on thetest card 1. The distance between these contact pins 11 can be adjusted, so that the apparatus can be matched to different types of test cards with different distances between the contact surfaces 2. If required, another probe head can also be provided on therobot arm 7. - The
probe head 9 may also have more than twocontact pins 10, if required. For example, it can thus be provided with four contact pins 11. It is even possible to equip thecontact head 11 with enough contact pins 11 for it to be able to simultaneously touch all the contact surfaces 2 which are located one behind the other in the radial direction. In the example in FIG. 1, this would be six contact pins 11. - The
holder 4 can be driven via a steppingmotor 12. The steppingmotor 12 is controlled by acentral control unit 13, which also makes it possible to control and adjust the movement of therobot arm 7 and the position of theprobe head 9, as well as the distance between the contact pins 11. - The
holder 4 has anedge 14 which can be moved in the lateral direction, so that it is suitable for holding test cards with different diameters or else different test adapters. - The apparatus shown in FIGS. 1 and 2 is particularly suitable for measuring signal delay times and line impedances: this is because only the one
robot arm 7 is required in this case. The measurement devices used for these measurements, such as network analyzers, oscilloscopes with TDR function (TDR=Time Domain Reflexion) and the like, generally have two channels, each with a signal and shield. Theprobe head 9 together with the twocontact pins 11 which is fit on therobot arm 7 allows automatic measurement of all the channels on thetest card 1 by moving the onecontact pin 11 for a test signal into contact with acontact surface 2, while theother contact pin 11, which is used for grounding, is in contact, for example, with anadjacent contact surface 11. The desired electrical parameters, such as electrical losses, can be deduced from the delay time of the test signal reflected at the channel end, and from the magnitude of the reflected signal. - FIGS. 3 and 4 show a further exemplary embodiment of the present invention, wherein a
second robot arm 7′ is provided with asecond probe head 9′ and with two further contact pins 11′. Thissecond robot arm 7′ can be adjusted in elevation (see thedouble arrow 8′) in the same way as therobot arm 7, and can likewise be driven from thecentral control unit 13. - In addition, the position of the
second robot arm 7′ can be rotated with respect to theholder 4, as is indicated by adouble arrow 6′. - In the exemplary embodiment shown in FIGS. 3 and 4, the
control device 13 thus controls the steppingmotor 12, the upward and downward movement of therobot arms double arrows robot arm 7′ (see thedouble arrow 6′ in FIG. 3) and the radial movement of the probe heads 9 and 9′ (see thedouble arrows - The exemplary embodiment in FIGS. 3 and 4 is particularly suitable for measuring crosstalk effects between different channels on the
test card 1. This is because the aim of this measurement is to investigate the influence of the signals in two different channels on one another, wherein case each channel is intended to be considered together with every other channel, which leads to well over a million measurements when there are a large number of channels. Therobot arm 7, which cannot rotate, with theprobe head 9 is connected in a case such as this via the contact pins 11 to at least one channel to be investigated. Therobot arm 7′, which can rotate, with theprobe head 9′ is then connected via the contact pins 11′ to all the other channels, so that the influence of all the channels on the channels mentioned above of therobot arm 7 can be investigated in one run. Theprobe head 9 is then connected via its contact pins 11 to the next channels, and the contact pins 10′, on theprobe head 9′ are moved into contact with all the other channels. In this way, it is possible to measure successive crosstalk effects between each individual channel and all the other channels. - In the exemplary embodiment in FIGS. 3 and 4, the
test card 1 can be rotated independently of the rotational movement of therobot arm 7′. If required, it is also possible to couple the rotary movement of theprobe head 7′ to the rotary movement of theholder 4. - The
holder 4 is preferably designed such that it is suitable for holding different test adapters and test cards. To this end, theholder 4 may, for example, have adjustableouter edges 14 so that test adapters and test cards of different diameters can be inserted into theholder 4. - FIGS. 5 and 6 show examples of possible configurations of the contact pins11: as shown in FIG. 5, these may have pointed ends and may be sprung, so that these ends rest on the contact surfaces 2. However, it is also possible to provide
contact pins test card 1 which is then inserted “reversed” into theholder 4. In order to spring out, the contact pins 11 a, 11 b may have a curved profile (seereference symbols reference symbol 11 b in FIG. 6). - FIGS. 7 and 8 show an exemplary embodiment wherein signals are supplied from a test system with an
interface board 17 via contact pins 16 to the contact surfaces 2 of thetest card 1, which has now been inserted “reversed”, and are passed to the contact needles 5. The signals which are otherwise present on the chip are tapped off for analysis on thesecontact needles 5 by means of the springs illustrated in FIG. 6. In the present exemplary embodiment, the radial polar-coordinaterobot arms 7 are replaced by a Cartesian (xyz) robot system which can be adjusted as shown by thearrows
Claims (19)
1. An apparatus for automated testing, calibration and characterization of test adapters for semiconductor devices, comprising:
a holder for holding a test adapter;
at least one probe head adjustably disposed relative to said holder, said probe head having at least two contact pins with an adjustable spacing distance therebetween; and
an adjustment device configured to adjust said probe head relative to said holder.
2. The apparatus according to claim 1 , wherein said at least one probe head is one of a plurality of probe heads.
3. The apparatus according to claim 1 , wherein said probe head is movably disposed in elevation perpendicularly to a surface of said holder.
4. The apparatus according to claim 1 , wherein said adjustment device is a robot arm and said probe head is mounted on said robot arm.
5. The apparatus according to claim 1 , which comprises a control device connected to control a position of said probe head and a rotation of said holder.
6. The apparatus according to claim 1 , wherein said holder is configured to hold test adapters with different diameters.
7. The apparatus according to claim 1 , which comprises a stepping motor disposed to selectively move said holder.
8. The apparatus according to claim 1 , which comprises a control device connected for controlling a distance between said contact pins.
9. The apparatus according to claim 7 , which comprises a control device connected to said stepping motor and wherein said stepping motor is controlled by said control device.
10. The apparatus according to claim 1 , wherein the test adapter is a test card.
11. The apparatus according to claim 1 , wherein the test adapter is formed with a number of contact surfaces one behind the other in a radial direction of the test adapter, and said probe head has a number of said contact pins corresponding to the number of contact surfaces on the test adapter.
12. The apparatus according to claim 1 , wherein said contact pins are formed with pointed ends.
13. The apparatus according to claim 1 , wherein said contact pins are formed with flat ends, configured to enable contact to be made with contact needles on the test adapter.
14. The apparatus according to claim 1 , wherein said contact pins are spring-biased contact pins.
15. The apparatus according to claim 14 , wherein said contact pins have a profile defining the spring-biased configuration thereof.
16. The apparatus according to claim 14 , wherein said contact pins have a separate spring.
17. The apparatus according to claim 1 , wherein said holder is configured to be rotatable or movable with respect to said adjustment device.
18. The apparatus according to claim 1 , wherein said probe head is adjustable within a coordinate system selected from the group consisting of a polar coordinate system and a cartesian coordinate system.
19. The apparatus according to claim 1 , which comprises an interface board and contact pins configured to contact contact surfaces on the test adapter.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/965,513 US6970006B2 (en) | 2000-08-16 | 2004-10-14 | Apparatus for the automated testing, calibration and characterization of test adapters |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10039928A DE10039928B4 (en) | 2000-08-16 | 2000-08-16 | Device for automated testing, calibration and characterization of test adapters |
DE10039928.2 | 2000-08-16 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/965,513 Continuation US6970006B2 (en) | 2000-08-16 | 2004-10-14 | Apparatus for the automated testing, calibration and characterization of test adapters |
US10/965,513 Division US6970006B2 (en) | 2000-08-16 | 2004-10-14 | Apparatus for the automated testing, calibration and characterization of test adapters |
Publications (1)
Publication Number | Publication Date |
---|---|
US20020030480A1 true US20020030480A1 (en) | 2002-03-14 |
Family
ID=7652550
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/931,686 Abandoned US20020030480A1 (en) | 2000-08-16 | 2001-08-16 | Apparatus for the automated testing, calibration and characterization of test adapters |
US10/965,513 Expired - Fee Related US6970006B2 (en) | 2000-08-16 | 2004-10-14 | Apparatus for the automated testing, calibration and characterization of test adapters |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/965,513 Expired - Fee Related US6970006B2 (en) | 2000-08-16 | 2004-10-14 | Apparatus for the automated testing, calibration and characterization of test adapters |
Country Status (2)
Country | Link |
---|---|
US (2) | US20020030480A1 (en) |
DE (1) | DE10039928B4 (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1498942A1 (en) * | 2002-04-17 | 2005-01-19 | Tokyo Electron Limited | Signal detection contactor and signal correcting system |
US20080012591A1 (en) * | 2006-06-09 | 2008-01-17 | Richard Campbell | Differential signal probe with integral balun |
US20080045028A1 (en) * | 2000-12-04 | 2008-02-21 | Cascade Microtech, Inc. | Wafer probe |
US20080246498A1 (en) * | 2006-06-12 | 2008-10-09 | Cascade Microtech, Inc. | Test structure and probe for differential signals |
US7723999B2 (en) | 2006-06-12 | 2010-05-25 | Cascade Microtech, Inc. | Calibration structures for differential signal probing |
US7759953B2 (en) | 2003-12-24 | 2010-07-20 | Cascade Microtech, Inc. | Active wafer probe |
US7764072B2 (en) | 2006-06-12 | 2010-07-27 | Cascade Microtech, Inc. | Differential signal probing system |
US20100295552A1 (en) * | 2009-05-25 | 2010-11-25 | Hon Hai Precision Industry Co., Ltd. | Signal testing system and method of a printed circuit board |
US7898273B2 (en) | 2003-05-23 | 2011-03-01 | Cascade Microtech, Inc. | Probe for testing a device under test |
US8013623B2 (en) * | 2004-09-13 | 2011-09-06 | Cascade Microtech, Inc. | Double sided probing structures |
CN109444478A (en) * | 2018-10-29 | 2019-03-08 | 河南平高电气股份有限公司 | Arrangements of electric connection is used in a kind of test of three-phase high-voltage electric appliance |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7323897B2 (en) * | 2004-12-16 | 2008-01-29 | Verigy (Singapore) Pte. Ltd. | Mock wafer, system calibrated using mock wafer, and method for calibrating automated test equipment |
KR102038102B1 (en) * | 2013-03-07 | 2019-10-30 | 삼성디스플레이 주식회사 | Resistance measuring apparatus for inspecting compression quality and measuring method using the same |
WO2015078887A1 (en) * | 2013-11-26 | 2015-06-04 | Tyco Electronics Uk Ltd. | Balunless test fixture |
US20220349937A1 (en) * | 2021-04-30 | 2022-11-03 | Xcerra Corporation | Calibration System |
US11747394B1 (en) * | 2022-03-09 | 2023-09-05 | Nanya Technology Corporation | Probe apparatus with a track |
US11668745B1 (en) * | 2022-03-09 | 2023-06-06 | Nanya Technology Corporation | Probe apparatus having a track and wafer inspection method using the same |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4471298A (en) * | 1981-12-11 | 1984-09-11 | Cirdyne, Inc. | Apparatus for automatically electrically testing printed circuit boards |
US4677474A (en) * | 1984-07-02 | 1987-06-30 | Canon Kabushiki Kaisha | Wafer prober |
US4904934A (en) * | 1987-10-21 | 1990-02-27 | Mitsubishi Denki Kabushiki Kaisha | Testing apparatus for semiconductor devices |
US4923407A (en) * | 1989-10-02 | 1990-05-08 | Tektronix, Inc. | Adjustable low inductance probe |
US4985676A (en) * | 1989-02-17 | 1991-01-15 | Tokyo Electron Limited | Method and apparatus of performing probing test for electrically and sequentially testing semiconductor device patterns |
US5952843A (en) * | 1998-03-24 | 1999-09-14 | Vinh; Nguyen T. | Variable contact pressure probe |
US6137303A (en) * | 1998-12-14 | 2000-10-24 | Sony Corporation | Integrated testing method and apparatus for semiconductor test operations processing |
US6276956B1 (en) * | 1999-04-12 | 2001-08-21 | Sencore, Inc. | Dual point test probe for surface mount type circuit board connections |
US6356093B2 (en) * | 1998-06-02 | 2002-03-12 | Nidec-Read Corporation | Printed circuit board testing apparatus |
US6462556B2 (en) * | 1997-10-30 | 2002-10-08 | Nidec-Read Corporation | Circuit board testing apparatus and method |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2240435A (en) * | 1990-01-05 | 1991-07-31 | Colin Graham Barker | Testing test fixtures for pcb's |
JPH06334004A (en) * | 1993-05-25 | 1994-12-02 | Mitsubishi Electric Corp | Probing apparatus for microwave band |
DE4441347C2 (en) * | 1994-11-21 | 1998-10-29 | Peter Fritzsche | Method for testing electronic circuits on printed circuit boards and device for carrying out the method |
DE19700505A1 (en) * | 1997-01-09 | 1998-07-16 | Atg Test Systems Gmbh | Process for testing printed circuit boards |
GB9722998D0 (en) * | 1997-11-01 | 1998-01-07 | Matrix Test Limited | A contacting device |
JP2000338167A (en) * | 1999-05-31 | 2000-12-08 | Nidec-Read Corp | Circuit board inspection device |
US6504378B1 (en) * | 1999-11-24 | 2003-01-07 | Micron Technology, Inc. | Apparatus for evaluating contact pin integrity of electronic components having multiple contact pins |
US6856156B2 (en) * | 2003-03-26 | 2005-02-15 | Taiwan Semiconductor Manufacturing Co., Ltd | Automatically adjustable wafer probe card |
-
2000
- 2000-08-16 DE DE10039928A patent/DE10039928B4/en not_active Expired - Fee Related
-
2001
- 2001-08-16 US US09/931,686 patent/US20020030480A1/en not_active Abandoned
-
2004
- 2004-10-14 US US10/965,513 patent/US6970006B2/en not_active Expired - Fee Related
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4471298A (en) * | 1981-12-11 | 1984-09-11 | Cirdyne, Inc. | Apparatus for automatically electrically testing printed circuit boards |
US4677474A (en) * | 1984-07-02 | 1987-06-30 | Canon Kabushiki Kaisha | Wafer prober |
US4904934A (en) * | 1987-10-21 | 1990-02-27 | Mitsubishi Denki Kabushiki Kaisha | Testing apparatus for semiconductor devices |
US4985676A (en) * | 1989-02-17 | 1991-01-15 | Tokyo Electron Limited | Method and apparatus of performing probing test for electrically and sequentially testing semiconductor device patterns |
US4923407A (en) * | 1989-10-02 | 1990-05-08 | Tektronix, Inc. | Adjustable low inductance probe |
US6462556B2 (en) * | 1997-10-30 | 2002-10-08 | Nidec-Read Corporation | Circuit board testing apparatus and method |
US5952843A (en) * | 1998-03-24 | 1999-09-14 | Vinh; Nguyen T. | Variable contact pressure probe |
US6356093B2 (en) * | 1998-06-02 | 2002-03-12 | Nidec-Read Corporation | Printed circuit board testing apparatus |
US6137303A (en) * | 1998-12-14 | 2000-10-24 | Sony Corporation | Integrated testing method and apparatus for semiconductor test operations processing |
US6276956B1 (en) * | 1999-04-12 | 2001-08-21 | Sencore, Inc. | Dual point test probe for surface mount type circuit board connections |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7761983B2 (en) | 2000-12-04 | 2010-07-27 | Cascade Microtech, Inc. | Method of assembling a wafer probe |
US20080045028A1 (en) * | 2000-12-04 | 2008-02-21 | Cascade Microtech, Inc. | Wafer probe |
US7688097B2 (en) | 2000-12-04 | 2010-03-30 | Cascade Microtech, Inc. | Wafer probe |
US20060006859A1 (en) * | 2002-04-17 | 2006-01-12 | Tokyo Electron Limited | Signal detection contactor and signal calibration system |
EP1498942A4 (en) * | 2002-04-17 | 2006-05-17 | Tokyo Electron Ltd | Signal detection contactor and signal correcting system |
US7414390B2 (en) | 2002-04-17 | 2008-08-19 | Tokyo Electron Limited | Signal detection contactor and signal calibration system |
EP1498942A1 (en) * | 2002-04-17 | 2005-01-19 | Tokyo Electron Limited | Signal detection contactor and signal correcting system |
US7898273B2 (en) | 2003-05-23 | 2011-03-01 | Cascade Microtech, Inc. | Probe for testing a device under test |
US7759953B2 (en) | 2003-12-24 | 2010-07-20 | Cascade Microtech, Inc. | Active wafer probe |
US8013623B2 (en) * | 2004-09-13 | 2011-09-06 | Cascade Microtech, Inc. | Double sided probing structures |
US20080012591A1 (en) * | 2006-06-09 | 2008-01-17 | Richard Campbell | Differential signal probe with integral balun |
US7723999B2 (en) | 2006-06-12 | 2010-05-25 | Cascade Microtech, Inc. | Calibration structures for differential signal probing |
US7764072B2 (en) | 2006-06-12 | 2010-07-27 | Cascade Microtech, Inc. | Differential signal probing system |
US7750652B2 (en) | 2006-06-12 | 2010-07-06 | Cascade Microtech, Inc. | Test structure and probe for differential signals |
US20080246498A1 (en) * | 2006-06-12 | 2008-10-09 | Cascade Microtech, Inc. | Test structure and probe for differential signals |
US20100295552A1 (en) * | 2009-05-25 | 2010-11-25 | Hon Hai Precision Industry Co., Ltd. | Signal testing system and method of a printed circuit board |
US8242798B2 (en) * | 2009-05-25 | 2012-08-14 | Hon Hai Precision Industry Co., Ltd. | Signal testing system and method of a printed circuit board |
CN109444478A (en) * | 2018-10-29 | 2019-03-08 | 河南平高电气股份有限公司 | Arrangements of electric connection is used in a kind of test of three-phase high-voltage electric appliance |
Also Published As
Publication number | Publication date |
---|---|
DE10039928B4 (en) | 2004-07-15 |
DE10039928A1 (en) | 2002-03-21 |
US6970006B2 (en) | 2005-11-29 |
US20050046412A1 (en) | 2005-03-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6970006B2 (en) | Apparatus for the automated testing, calibration and characterization of test adapters | |
JP4024324B2 (en) | Probe measurement network evaluation system | |
US11175309B2 (en) | Semi-automatic prober | |
US7420381B2 (en) | Double sided probing structures | |
US7211997B2 (en) | Planarity diagnostic system, E.G., for microelectronic component test systems | |
US6043668A (en) | Planarity verification system for integrated circuit test probes | |
GB2282230A (en) | P.C.B. test system | |
US20030020506A1 (en) | Testing device for printed circuit boards | |
CN103809100B (en) | Wafer Auto-Test System | |
CN101173970B (en) | Chip-based prober for high frequency measurements and methods of measuring | |
US6724181B2 (en) | Method of calibrating a test system for semiconductor components, and test substrate | |
US7888949B2 (en) | Electrical tester setup and calibration device | |
EP2389594B1 (en) | Prober cleaning block assembly | |
KR100638330B1 (en) | Adapter For Testing Conductor Arrangements | |
US6255827B1 (en) | Search routine for 2-point electrical tester | |
US20080088330A1 (en) | Nonconductive substrate with imbedded conductive pin(s) for contacting probe(s) | |
US6191600B1 (en) | Scan test apparatus for continuity testing of bare printed circuit boards | |
KR100301060B1 (en) | Wafer Probing System and Wafer Probing Needle Calibrating Method Using Those | |
JPH04206753A (en) | Semiconductor wafer and inspecting method for semiconductor element thereof | |
JPH01265175A (en) | Probe device | |
JPS6376447A (en) | Probe card and probe device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |