US20020046001A1 - Method, computer readable medium and apparatus for accessing a defect knowledge library of a defect source identification system - Google Patents

Method, computer readable medium and apparatus for accessing a defect knowledge library of a defect source identification system Download PDF

Info

Publication number
US20020046001A1
US20020046001A1 US09/905,514 US90551401A US2002046001A1 US 20020046001 A1 US20020046001 A1 US 20020046001A1 US 90551401 A US90551401 A US 90551401A US 2002046001 A1 US2002046001 A1 US 2002046001A1
Authority
US
United States
Prior art keywords
information
defect
subscribers
access
particular subscriber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US09/905,514
Inventor
Amos Dor
Maya Radzinski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to US09/905,514 priority Critical patent/US20020046001A1/en
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: DOR, AMOS, RADZINSKI, MAYA
Publication of US20020046001A1 publication Critical patent/US20020046001A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06QINFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q30/00Commerce
    • G06Q30/02Marketing; Price estimation or determination; Fundraising
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06QINFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q50/00Systems or methods specially adapted for specific business sectors, e.g. utilities or tourism
    • G06Q50/04Manufacturing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/30Computing systems specially adapted for manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Business, Economics & Management (AREA)
  • Strategic Management (AREA)
  • Development Economics (AREA)
  • Manufacturing & Machinery (AREA)
  • Finance (AREA)
  • Theoretical Computer Science (AREA)
  • Accounting & Taxation (AREA)
  • Economics (AREA)
  • Marketing (AREA)
  • Physics & Mathematics (AREA)
  • General Business, Economics & Management (AREA)
  • General Physics & Mathematics (AREA)
  • Game Theory and Decision Science (AREA)
  • Entrepreneurship & Innovation (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Human Resources & Organizations (AREA)
  • Primary Health Care (AREA)
  • Tourism & Hospitality (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • General Factory Administration (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)

Abstract

A method, computer readable medium and apparatus comprising a defect knowledge library (DKL), subscriber equipment and a communications network that connects the subscriber equipment t the DKL. The DKL contains a partitioned database of defect, defect source and defect mitigation information that is arranged by participating integrated circuit fabricator (referred to herein as a subscriber). The subscribers can identify the amount and type of information that they wish to share with other subscribers and whether their identity will be disclosed. The subscribers may share the data with specific “partners” or with other departments within their company, without sharing with other subscribers. The DKL system administrator charges a fee for the access rights. The more information that a subscriber shares with other subscribers, the lower the access fee. As such, subscribers are given financial incentive to share their information with other subscribers. Additionally, if a subscriber shares with others, then the other subscriber's data is made available to the sharing subscriber. As such, by sharing data, a particular subscriber has access to an expended library of DSI data without the need to accumulate the data themselves.

Description

    CROSS REFERENCE TO RELATED APPLICATIONS
  • This application claims benefit of United States provisional patent application Ser. No. 60/240,631, filed Oct. 16, 2000, which is herein incorporated by reference. This application contains subject matter that is related to the subject matter described in U.S. patent application Ser. Nos. ______, ______, and ______, (Attorney dockets 4744 FET/MDR, 4747 FET/MDR, and 4748 FET/MDR), filed simultaneously herewith, which are each incorporated herein by reference in their entireties.[0001]
  • BACKGROUND OF THE INVENTION
  • 1. Field of the Invention [0002]
  • This application claims the benefit of U.S. Provisional Application No. 60/240,631 filed on Oct. 17, 2000, which is herein incorporated by reference. [0003]
  • The present invention relates to semiconductor wafer processing systems and, more particularly, the invention relates to systems that identify the source of defects for semiconductor wafers as the wafers are processed in a semiconductor wafer processing system. [0004]
  • 2. Background of the Related Art [0005]
  • Semiconductor wafers are prone to defects that occur during processing. Defects may occur at any stage of the processing of the wafers as integrated circuits are formed thereupon. Generally each fabricator of integrated circuits maintains a database of the causes of defects that occur on a regular basis. If the defect occurs often and a solution is apparent, the database may contain a correlation between the defect, the defect's cause and the solution to the defect. For example, certain defects may occur when a particular chamber becomes dirty. When these defects occur, the database would indicate the solution to be to execute a cleaning cycle for the particular chamber. [0006]
  • The various integrated circuit fabricators develop their own, proprietary databases of defect information. As such, substantial funds are expended to produce the databases over time. [0007]
  • Therefore, there is a need in the art for a method for pooling the confidential defect information of multiple integrated circuit fabricators and anonymously sharing the defect information amongst the integrated circuit fabricators. Such sharing of information would substantially reduce the amount of resources consumed in preparing the defect source identification database. [0008]
  • SUMMARY OF THE INVENTION
  • The present invention is a method of accessing defect source identification data from multiple integrated circuit manufacturers (database subscribers), fairly compensating the participants for their efforts, and anonymously sharing the data amongst the participants in a manner that protects confidential information. Subscribers that do not share information (non-participants) may also access the defect data for a fee. [0009]
  • More specifically, the defect source identification (DSI) system comprises a defect knowledge library (DKL), subscriber equipment and a communications network that connects the subscriber equipment to the DKL. The DKL contains a partitioned database of defect, defect source and defect mitigation information that is arranged by participating integrated circuit fabricator (referred to herein as a subscriber). The subscribers can identify the amount and type of information that they wish to share with other subscribers and whether their identity will be disclosed. The subscribers may share the data with specific “partners” or with other departments within their company, without sharing with other subscribers. The DKL system administrator charges a fee for the access rights. The more information that a subscriber shares with other subscribers, the lower the access fee. As such, subscribers are given financial incentive to share their information with other subscribers. Additionally, if a subscriber shares with others, then the other subscriber's data is made available to the sharing subscriber. As such, by sharing data, a particular subscriber has access to an expended library of DSI data without the need to accumulate the data themselves. [0010]
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • So that the manner in which the above recited features, advantages and objects of the present invention are attained and can be understood in detail, a more particular description of the invention, briefly summarized above, may be had by reference to the embodiments thereof which are illustrated in the appended drawings. [0011]
  • It is to be noted, however, that the appended drawings illustrate only typical embodiments of this invention and are therefore not to be considered limiting of its scope, for the invention may admit to other equally effective embodiments. [0012]
  • FIG. 1 depicts an illustrative defect source identification (DSI) system that uses the method of the present invention; [0013]
  • FIG. 2 depicts a flow diagram of a setup method for the system of FIG. 1; and [0014]
  • FIG. 3 depicts a flow diagram of a method of accessing information in the system of FIG. 1.[0015]
  • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
  • The present invention is a method for accessing a defect knowledge library (DKL) of a defect source identification (DSI) system. The DKL stores defect related information from a plurality of DKL subscribers. The access control for each subscriber is facilitated by setting access pricing and access levels, where the access pricing is the price paid by a subscriber to access the information in the DKL and the access level is the amount of information that the subscriber is allowed to access within the DKL. The access pricing and level depends upon the amount of information that the subscriber shares with other subscribers. [0016]
  • FIG. 1 is a block diagram of a [0017] DSI system 100 that utilizes the method of the present invention. The DSI system 100 comprises DKL 102, a communications network 104 and a plurality of subscriber equipment 106 1, 106 2 through 106 n (together referred to as subscriber equipment 106, where n is an integer greater than zero). The DKL 102 comprises a database 108 (physically stored in a computer memory) and a server computer 110. The server computer 110 comprises a central processing unit (CPU) 118, memory 120 and well-known support circuits 122. The CPU 118 may be any one of the available computer processors that are available. The memory 120 may be random access memory, read only memory, disk drive storage, removable storage, or any combination of these memory devices. As described with respect to FIGS. 2 and 3, the memory 120 stores the software 124 that, when executed by the CPU 118, embodies the methods of the present invention. The support circuits 122 comprise well-known circuits and devices including, but not limited to, cache, power supplies, clocks, network interface cards, input-output circuits, and the like.
  • The [0018] subscriber equipment 106 comprises a client computer 112 n and a local database 114 n. The client computer 112 n has a similar physical structure as that of the server computer, i.e., a CPU, memory and support circuits. For clarity, these well known elements are not specifically depicted.
  • The [0019] server computer 110 operates as a conventional “server” computer and the client computer operates as a conventional “client” computer such that a server-client relationship is formed between the DKL 102 and the subscriber equipment 106. In this manner, the database 108 of defect data forms a relational database that receives information from the client computer 112. The communications network 104 couples the DKL 102 to the subscriber equipment 106. The communications network may be an ETHERNET local area network, (LAN), a token ring LAN, an INTERNET based wide area network (WAN), a virtual private network, or a combination of these commonly used network topologies. Generally, any form of communications network that enables the client and server computers to communicate with one another is sufficient for practicing the present invention.
  • The [0020] client computer 110 operates to collect defect, defect source, and defect mitigation data from a semiconductor wafer processing system 116 n. The system 116 n is coupled to the subscriber equipment 106. The semiconductor wafer processing system 100 contains one or more metrology chambers or stations within which defect and defect source information is generated. The local database 114 n stores this defect and defect source data. The information from the client database 114, either all or a subset thereof, is communicated to the DKL 102 via the network 104. The subscriber controls the specific amount of data that is communicated to the DKL 102. A distributed defect source analysis system such as the one depicted in FIG. 1 is disclosed in U.S. patent application Ser. No. ______, filed simultaneously herewith, (Attorney Docket 4748) and incorporated herein by reference in its entirety.
  • Some or all of the local database information is communicated to the DKL database [0021] 108 where the DKL database is updated with all of the subscriber's information. Each subscriber has access to a specific partition of the database 110, e.g., partitions P1, P2 through Pn. The database 110 stores defect data, defect source identification data, and defect mitigation information in each partition. As such, a common database can be accessed by the subscribers to find solutions for their defects. For example, the subscriber may be having the same defect occur within their semiconductor wafer processing system. The system administrator may have a solution to the defect and make that solution available. The subscriber can be given access to a common partition, e.g., partition C, where all subscribers can access various defect analysis tools and information that are supplied by the system administrator.
  • The present invention concerns a method of charging for access to the [0022] database 110 in a tiered manner depending upon a subscriber's willingness to share defect information with other subscribers. Specifically, subscribers are provided different pricing levels and access levels depending on the level of sharing that the subscriber authorizes.
  • FIG. 2 is a flow diagram of an [0023] account setup method 200 for the system 100 of FIG. 1. The method 200 is embodied in a software routine that is stored in the server computer memory and, when the CPU executes the software, causes the system to operate in a manner that is outlined by the method 200.
  • The method begins at [0024] step 202 and proceeds to step 204 wherein the subscriber sets up an account on the server computer. Within the setup process, the subscriber is supplied with passwords and user identification codes that correspond to their level of access. In step 206, the subscriber identifies the level of sharing that they will allow for their defect information. This sharing level varies from none to all. For example, some subscribers may not share any of their data with other subscribers. Other subscribers may share all of their defect data, but none of their defect mitigation information or defect source identification data. Others may enable other subscribers to access all the data that the subscriber supplies to the database without restriction. Subscribers may also request certain data only be made available to “partners” or affiliated companies that are also subscribers.
  • At [0025] step 208, the method 200 establishes an access level that is commensurate with the sharing level, i.e., the subscriber is permitted access to other subscriber's defect data in the same degree that they permit access to their data. The system may enable a subscriber to “buy up” such that they can share at one level and access at a higher level by paying a higher price for the enhanced access.
  • At [0026] step 210, the method 200 sets the access price based upon the access level and sharing level. Generally, the more a subscriber shares, the less expensive the access price. The intent is to provide an incentive to subscribers to share defect information with other subscribers. The pricing can be an access fee, where the subscriber is charged for each use of the server, or as a monthly fee, where the subscriber may access the server as much as desired for a flat monthly rate.
  • The system administrator ensures that specific products and subscriber names are not made available to the other subscribers. As such, the defect information that is shared is available on an anonymous basis and does not contain confidential information. The point is to share defect data, defect source identification and defect mitigation information amongst subscribers without compromising the trade secrets of any of the subscribers. Additionally, the subscriber posts much of the information such that the subscriber directly controls what information will be shared. As such, the confidential information can be extracted from the posted information. Such sharing of information enables all subscribers to benefit from the defect research performed by the subscriber base as well as the system administrator. The [0027] method 200 steps at step 212.
  • FIG. 3 is a flow diagram of a [0028] method 300 of fulfilling a transaction using the system of FIG. 1. The method 300 is embodied in a software routine that is stored in the server computer memory and, when the CPU executes the software, causes the system to operate in a manner that is outlined by the method 300.
  • The [0029] method 300 begins at step 302 and proceeds to step 304 wherein the subscriber logs into the server computer through an interface on the client computer. The interface is generally a graphical user interface (GUI) that enables the subscriber to enter the userid and password. Assuming the correct userid and passwords are provided, the method proceeds to step 306 where access to the serve is granted. If incorrect userid or passwords are provided, the step 304 will invoke conventional error handling routines to request re-entry of the login information or block access to the system at step 308.
  • Once access is provided, at [0030] step 308, the subscriber may access the defect analysis tools of the DKL. These tools enable the subscriber to use an image based analysis suite that performs comparisons of the defects experienced by the subscriber to a defect database. Once the defects have been categorized, they are analyzed to identify the source of the defects. The source can then be used to determine certain defect mitigation techniques to be used to eliminate the defect. Such mitigation techniques may pinpoint certain chambers in the wafer processing system that may need cleaning, certain gases that are contaminated, certain operating parameters of the processing system that need adjustment, and so on. If the subscriber has a high access level, then the analysis tools will use the subscriber's own data plus the data of other subscribers and the system administrator to analyze the defect data. As such, the subscriber has access to a substantial amount of defect information to draw from to determine the source and mitigation techniques for specific defects. If new techniques are developed during the analysis session, they are stored in the database.
  • At [0031] step 310, a billing database is updated with information that the subscriber has accessed the database. The information that is updated depends upon the subscriber's billing arrangement. For example, if the subscriber is on a use based pricing plan, then the update must contain the duration of the connection and the type of information and tools that were accessed. For monthly subscription type pricing, the update would only require basic subscriber data to identify which subscriber had accessed the DKL. The system administrator may wish the billing database to contain other statistical information so the system utilization statistics can be accumulated. At the end of the session, the method 300 logs out the subscriber and stops at step 312
  • Access to the DKL may be automated such that the subscriber equipment automatically connects to the DKL, supplies defect data, performs an analysis, retrieves the defect mitigation solution, and applies the solution to the semiconductor wafer processing system that is coupled to the subscriber equipment. The only time a person would be notified is if a solution to correct the defect is not readily available from the database. [0032]
  • While foregoing is directed to the preferred embodiment of the present invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow. [0033]

Claims (18)

1. A method for accessing a defect knowledge library of a defect source identification system comprising:
supplying information to the defect knowledge library from a plurality of subscribers, where a particular subscriber establishes a data sharing level that defines an amount of the information that is supplied that can be shared with other subscribers; and
establishing, for the particular subscriber, an access price and an access level for accessing the defect knowledge library that is based upon a data sharing level of that particular subscriber.
2. The method of claim 1 wherein at least one of the plurality of subscribers is an integrated circuit manufacturer.
3. The method of claim 1 wherein the information comprises one or more of defect data, defect source data, defect mitigation information.
4. The method of claim 1 wherein the access price for the particular subscriber is decreased when the particular subscriber authorizes sharing of their information with other subscribers, where the more information that is shared correspondingly reduces the access price.
5. The method of claim 1 wherein the access level controls the amount of information the particular subscriber can access of other subscribers, where the higher the access level the more information that the particular subscriber can access.
6. The method of claim 5 wherein the access level for the particular subscriber is increased when the particular subscriber authorizes sharing of their information with other subscribers, where the more information that is shared correspondingly increases the access level.
7. A computer readable medium containing a software routine that, when executed by a processor, causes a system to perform a method for accessing a defect knowledge library of a defect source identification system, the method comprises:
supplying information to the defect knowledge library from a plurality of subscribers, where a particular subscriber establishes a data sharing level that defines an amount of the information that is supplied that can be shared with other subscribers; and
establishing, for the particular subscriber, an access price and an access level for accessing the defect knowledge library that is based upon a data sharing level of that particular subscriber.
8. The method of claim 7 wherein at least one of the plurality of subscribers is an integrated circuit manufacturer.
9. The method of claim 7 wherein the information comprises one or more of defect data, defect source data, defect mitigation information.
10. The method of claim 7 wherein the access price for the particular subscriber is decreased when the particular subscriber authorizes sharing of their information with other subscribers, where the more information that is shared correspondingly reduces the access price.
11. The method of claim 7 wherein the access level controls the amount of information the particular subscriber can access of other subscribers, where the higher the access level the more information that the particular subscriber can access.
12. The method of claim 11 wherein the access level for the particular subscriber is increased when the particular subscriber authorizes sharing of their information with other subscribers, where the more information that is shared correspondingly increases the access level.
13. Apparatus for accessing a defect knowledge library of a defect source identification system comprising:
subscriber equipment for supplying information to the defect knowledge library from a plurality of subscribers, where a particular subscriber establishes a data sharing level that defines an amount of the information that is supplied that can be shared with other subscribers; and
a server computer within the defect knowledge library for establishing, for the particular subscriber, an access price and an access level for accessing the defect knowledge library that is based upon a data sharing level of that particular subscriber.
14. The apparatus of claim 13 wherein at least one of the plurality of subscribers is an integrated circuit manufacturer.
15. The apparatus of claim 13 wherein the information comprises one or more of defect data, defect source data, defect mitigation information.
16. The apparatus of claim 15 wherein the access price for the particular subscriber is decreased when the particular subscriber authorizes sharing of their information with other subscribers, where the more information that is shared correspondingly reduces the access price.
17. The apparatus of claim 1 wherein the access level controls the amount of information the particular subscriber can access of other subscribers, where the higher the access level the more information that the particular subscriber can access.
18. The method of claim 17 wherein the access level for the particular subscriber is increased when the particular subscriber authorizes sharing of their information with other subscribers, where the more information that is shared correspondingly increases the access level.
US09/905,514 2000-10-16 2001-07-13 Method, computer readable medium and apparatus for accessing a defect knowledge library of a defect source identification system Abandoned US20020046001A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US09/905,514 US20020046001A1 (en) 2000-10-16 2001-07-13 Method, computer readable medium and apparatus for accessing a defect knowledge library of a defect source identification system

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US24063100P 2000-10-16 2000-10-16
US09/905,514 US20020046001A1 (en) 2000-10-16 2001-07-13 Method, computer readable medium and apparatus for accessing a defect knowledge library of a defect source identification system

Publications (1)

Publication Number Publication Date
US20020046001A1 true US20020046001A1 (en) 2002-04-18

Family

ID=22907299

Family Applications (2)

Application Number Title Priority Date Filing Date
US09/905,514 Abandoned US20020046001A1 (en) 2000-10-16 2001-07-13 Method, computer readable medium and apparatus for accessing a defect knowledge library of a defect source identification system
US09/978,300 Expired - Fee Related US6714884B2 (en) 2000-10-16 2001-10-15 Method and apparatus for providing communication between a defect source identifier and a tool data collection and control system

Family Applications After (1)

Application Number Title Priority Date Filing Date
US09/978,300 Expired - Fee Related US6714884B2 (en) 2000-10-16 2001-10-15 Method and apparatus for providing communication between a defect source identifier and a tool data collection and control system

Country Status (6)

Country Link
US (2) US20020046001A1 (en)
EP (1) EP1327262A2 (en)
CN (1) CN1205663C (en)
AU (1) AU2002224405A1 (en)
TW (1) TW521365B (en)
WO (1) WO2002033745A2 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6810337B1 (en) * 2002-03-07 2004-10-26 Bellsouth Intellectual Property Corporation Systems and methods for tracking the age of air pressure and flow alarm conditions within a pressurized cable network
ES2377521T3 (en) 2002-03-12 2012-03-28 Hamamatsu Photonics K.K. Method to divide a substrate
US7401066B2 (en) * 2002-03-21 2008-07-15 Applied Materials, Inc. Correlation of end-of-line data mining with process tool data mining
US7129694B2 (en) 2002-05-23 2006-10-31 Applied Materials, Inc. Large substrate test system
US20050004780A1 (en) * 2003-07-03 2005-01-06 Taiwan Semiconductor Manufacturing Co., Ltd Virtual assistant for semiconductor tool maintenance
TWI336823B (en) * 2004-07-10 2011-02-01 Onwafer Technologies Inc Methods of and apparatuses for maintenance, diagnosis, and optimization of processes
US7075323B2 (en) 2004-07-29 2006-07-11 Applied Materials, Inc. Large substrate test system
KR20170003710A (en) * 2004-10-12 2017-01-09 케이엘에이-텐코 코포레이션 Computer-implemented methods and systems for classifying defects on a specimen
US7494893B1 (en) * 2007-01-17 2009-02-24 Pdf Solutions, Inc. Identifying yield-relevant process parameters in integrated circuit device fabrication processes
JP6453805B2 (en) * 2016-04-25 2019-01-16 ファナック株式会社 Production system for setting judgment values for variables related to product abnormalities
US10031997B1 (en) * 2016-11-29 2018-07-24 Taiwan Semiconductor Manufacturing Co., Ltd. Forecasting wafer defects using frequency domain analysis
TWI632441B (en) 2017-01-20 2018-08-11 財團法人工業技術研究院 Prognostics method and device for processing apparatus
US10360671B2 (en) * 2017-07-11 2019-07-23 Kla-Tencor Corporation Tool health monitoring and matching

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5412757A (en) * 1990-11-28 1995-05-02 Kabushiki Kaisha Toshiba Fuzzy control system
US6324527B1 (en) * 1998-09-22 2001-11-27 International Business Machines Corporation Methodology for distinguishing the cost of products in a multiple part number, multiple technology, fully or partially loaded semiconductor fabricator
US6664897B2 (en) * 1998-03-09 2003-12-16 William R. Pape Method and system for livestock data collection and management

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5233191A (en) 1990-04-02 1993-08-03 Hitachi, Ltd. Method and apparatus of inspecting foreign matters during mass production start-up and mass production line in semiconductor production process
JPH06168863A (en) 1991-03-01 1994-06-14 Texas Instr Inc <Ti> Apparatus and method for execution of monitoring and control of semiconductor manufacturing apparatus
US5923430A (en) 1993-06-17 1999-07-13 Ultrapointe Corporation Method for characterizing defects on semiconductor wafers
US5544256A (en) 1993-10-22 1996-08-06 International Business Machines Corporation Automated defect classification system
KR960015001A (en) 1994-10-07 1996-05-22 가나이 쓰토무 Method and apparatus for manufacturing a semiconductor substrate and for inspecting pattern defects on an inspected object
US5598341A (en) 1995-03-10 1997-01-28 Advanced Micro Devices, Inc. Real-time in-line defect disposition and yield forecasting system
US5539752A (en) 1995-06-30 1996-07-23 Advanced Micro Devices, Inc. Method and system for automated analysis of semiconductor defect data
US5761064A (en) 1995-10-06 1998-06-02 Advanced Micro Devices, Inc. Defect management system for productivity and yield improvement
JPH09199551A (en) 1996-01-12 1997-07-31 Mitsubishi Electric Corp Inspection data analyzing/processing system for inline inspection
DE69738979D1 (en) 1996-03-19 2008-10-23 Hitachi Ltd PROCESS CONTROL SYSTEM
US5949901A (en) 1996-03-21 1999-09-07 Nichani; Sanjay Semiconductor device image inspection utilizing image subtraction and threshold imaging
US5959459A (en) 1996-12-10 1999-09-28 International Business Machines Corporation Defect monitor and method for automated contactless inline wafer inspection
TW331650B (en) * 1997-05-26 1998-05-11 Taiwan Semiconductor Mfg Co Ltd Integrated defect yield management system for semiconductor manufacturing
US5966459A (en) 1997-07-17 1999-10-12 Advanced Micro Devices, Inc. Automatic defect classification (ADC) reclassification engine
US5862055A (en) 1997-07-18 1999-01-19 Advanced Micro Devices, Inc. Automatic defect classification individual defect predicate value retention
EP0932194A1 (en) 1997-12-30 1999-07-28 International Business Machines Corporation Method and system for semiconductor wafer fabrication process real-time in-situ interactive supervision
US6408219B2 (en) * 1998-05-11 2002-06-18 Applied Materials, Inc. FAB yield enhancement system
US6167448A (en) 1998-06-11 2000-12-26 Compaq Computer Corporation Management event notification system using event notification messages written using a markup language
US6466314B1 (en) * 1998-09-17 2002-10-15 Applied Materials, Inc. Reticle design inspection system
US6469518B1 (en) 2000-01-07 2002-10-22 Advanced Micro Devices, Inc. Method and apparatus for determining measurement frequency based on hardware age and usage
US6458605B1 (en) * 2001-06-28 2002-10-01 Advanced Micro Devices, Inc. Method and apparatus for controlling photolithography overlay registration
US6562185B2 (en) * 2001-09-18 2003-05-13 Advanced Micro Devices, Inc. Wafer based temperature sensors for characterizing chemical mechanical polishing processes

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5412757A (en) * 1990-11-28 1995-05-02 Kabushiki Kaisha Toshiba Fuzzy control system
US6664897B2 (en) * 1998-03-09 2003-12-16 William R. Pape Method and system for livestock data collection and management
US6324527B1 (en) * 1998-09-22 2001-11-27 International Business Machines Corporation Methodology for distinguishing the cost of products in a multiple part number, multiple technology, fully or partially loaded semiconductor fabricator

Also Published As

Publication number Publication date
US6714884B2 (en) 2004-03-30
AU2002224405A1 (en) 2002-04-29
US20020069024A1 (en) 2002-06-06
CN1205663C (en) 2005-06-08
EP1327262A2 (en) 2003-07-16
TW521365B (en) 2003-02-21
CN1440569A (en) 2003-09-03
WO2002033745A3 (en) 2003-03-27
WO2002033745A2 (en) 2002-04-25

Similar Documents

Publication Publication Date Title
US20020046001A1 (en) Method, computer readable medium and apparatus for accessing a defect knowledge library of a defect source identification system
US9825965B2 (en) System, method and computer program product for publicly providing web content using a multi-tenant system
US10616352B2 (en) Integrating third-party vendors&#39; APIs
US7991643B2 (en) Request type grid computing
US9508092B1 (en) Systems and methods for providing a direct marketing campaign planning environment
CN101346696B (en) Load distribution in client server system
US20190230081A1 (en) Managing authorization tokens for calling third-party vendors
US20020002445A1 (en) System and method to determine the validity of an interaction on a network
CN1650263A (en) Method and system for problem determination in distributed enterprise applications
MXPA05000847A (en) Architecture for controlling access to a service by concurrent clients.
Mecella et al. Access control enforcement for conversation-based web services
WO2022060390A1 (en) System and method for data provider tracking and monetization
US7594231B2 (en) Apparatus and method for assuring recovery of temporary resources in a logically partitioned computer system
CA3138673A1 (en) Online payment system
EP2256675A1 (en) A method and system for sharing reputation knowledge across virtual communities
USH2214H1 (en) Method and system for accessing, managing and developing information regarding philanthropic organizations and donations
Furht et al. Internet architectures for application service providers
Chen et al. Adversarial learning for incentive optimization in mobile payment marketing
US7386615B1 (en) Method and system for reliably de-allocating resources in a networked computing environment
Klingenberg Simultaneous confidence bounds for relative risks in multiple comparisons to control
US7958014B2 (en) Method and apparatus for building commercial distributed computing networks via computer cost subsidization
US11120432B2 (en) Security tool for information exchange
US20020184100A1 (en) Casual access application with context sensitive pin authentication
KR102553083B1 (en) System and method for providing integrated services for public offering stocks
JP2000067310A (en) Method and device for processing prepaid charge and recording medium having recorded prepaid charge processing program thereon

Legal Events

Date Code Title Description
AS Assignment

Owner name: APPLIED MATERIALS, INC., CALIFORNIA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:DOR, AMOS;RADZINSKI, MAYA;REEL/FRAME:012009/0175

Effective date: 20010713

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION